Datasheet MRFIC2403 Datasheet (Motorola)

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
SEMICONDUCTOR TECHNICAL DATA
The MRFIC Line
    
The MRFIC2403 is a two–stage class B GaAs power amplifier in a low–cost 16 lead plastic package designed for use in the 2.4 to 2.5 GHz Industrial– Scientific–Medical (ISM) band. The design is optimized for efficiency at 5.0 V olt operation at 2.5 GHz but is usable from 2.0 to 3.0 GHz in applications such as telemetry and Multichannel Multipoint Distribution System (MMDS) wireless cable TV systems. Performance is suitable for frequency hopping or direct sequence spread spectrum as well as single–frequency applications. Power control circuitry allows 20 dB dynamic range for setting the output power.
High Output Power = +23.5 dBm Typical
High Gain = 23 dB Typical
Excellent Efficiency = 55% Typical
Power Control = 20 dB Range
Low–Cost, Low Profile Plastic SOIC Package
Available in Tape and Reel by Adding R2 Suffix to Part Number.
R2 Suffix = 2,500 Units per 16 mm, 13 inch Reel.
Device Marking = M2403
Order this document
by MRFIC2403/D

2.4 GHz
POWER AMPLIFIER
GaAs MONOLITHIC
INTEGRATED CIRCUIT
CASE 751B-05
(SO–16)
ABSOLUTE MAXIMUM RATINGS
Supply Voltage V Power Control Voltage V Gate Bias Voltage VG1, V RF Input Power RF IN +10 dBm Ambient Operating Temperature T Storage Temperature T
(TA = 25_C unless otherwise noted)
Parameter Symbol Value Unit
6.0 Vdc
6.0 Vdc
–4.0 Vdc
–30 to +85
–65 to +125
RF OUT
N/C GND GND GND V
16
15 14 13 12 11 10 9
V
D2
G2
DD
CONTRL
G2
A
stg
GND V
G1
_
C
_
C
REV 1
Motorola, Inc. 1995
1
V
DD
2 3 4 5 6 7 8
GND PCNTRL GND GND RF IN GND N/C
Pin Connections and Functional Block Diagram
MRFIC2403MOTOROLA RF DEVICE DATA
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RECOMMENDED OPERATING CONDITIONS
Parameter Symbol Value Unit
Supply Voltage V Gate Bias Voltage, Input Stage V Gate Bias Voltage, Output Stage V Quiescent Drain Current, Stage One I Quiescent Drain Current, Stage Two I Operating Frequency Range f
DD G1
G2 DQ1 DQ2
OP
4.75 to 5.25 Vdc –1.0 Vdc –2.0 Vdc
12 mA 10 mA
2200 to 2700 MHz
ELECTRICAL CHARACTERISTICS (V
5.0 Vdc)
Characteristic
Small Signal Gain (Pin = –6.0 dBm) 23 dB Power Output (Pin = +4.0 dBm) 23 23.5 dBm Power Output, Saturation 23.5 dBm Power Output, 1.0 dB Compression 19 dBm 2nd Harmonic Output –20 dBc 3rd Harmonic Output –30 dBc Third Order Intermodulation Products (Pin = +4.0 dBm PEP) –15 dBc Reverse Isolation 32 dB Power Control Range, PCNTRL 20 dB Reverse Isolation 30 dB Supply Current 95 140 mA SLEEP Mode Supply Current (VG1 = VG2 = –3.0 Vdc, PCNTRL = 0 Vdc) 150
V
G1
= 5.0 V d c , TA = 25_C, RF = 2.45 GHz @ +4.0 dBm, VG1 = –1.0 Vdc, VG2 = –2.0 Vdc, PCNTRL =
DD
Min Typ Max Unit
9
10
8 7
m
A
RF OUT
MRFIC2403 2
V
V
G2
DD2
C3
C6
C5
L1
C4
11 12 13 14 15 16
6 5 4 3 2 1
C2
C1
RF IN
PCNTRL
V
D1
Figure 1. Applications Circuit Configuration
C1, C2, C3 – 0.01 µF C4 – 5.1 pF C5 – 15 pF C6 – 1.0 pF L1 – 6.8 nH Board Material – 30 MIL FR4 Connectors – SMA type
MOTOROLA RF DEVICE DATA
Page 3
(VDD = 5 V, I
T able 1. Class A Scattering Parameters
DQ1
= 24 mA, I
= 96 mA, TA = 25°C, 50 W System)
DQ2
f
(MHz) |S11| φ |S21| φ |S12| φ |S22| φ
2000 0.377 –157.00 27.625 57.40 0.004 –74.70 0.740 –102.10 2050 0.218 –171.70 28.938 36.80 0.006 –101.60 0.763 –115.30 2100 0.075 –178.80 29.088 17.20 0.007 –130.70 0.724 –126.80 2150 0.049 –96.10 27.904 –0.20 0.007 –163.20 0.663 –135.80 2200 0.104 –56.60 26.930 –14.90 0.008 –169.60 0.601 –141.80 2250 0.130 –60.60 24.246 –27.80 0.009 173.50 0.550 –146.30 2300 0.125 –65.40 24.286 –39.40 0.010 165.00 0.504 –149.10 2350 0.106 –67.60 22.287 –49.60 0.010 157.70 0.471 –151.60 2400 0.083 –56.10 21.867 –59.80 0.009 140.70 0.444 –153.80 2450 0.064 –27.00 21.837 –68.90 0.011 141.40 0.422 –155.90 2500 0.072 26.20 20.113 –78.00 0.012 139.80 0.401 –158.60 2550 0.110 44.60 19.828 –86.40 0.009 140.00 0.385 –161.20 2600 0.160 44.50 18.941 –94.30 0.007 124.50 0.364 –164.50 2650 0.194 40.60 18.001 –101.90 0.012 128.30 0.350 –167.70 2700 0.237 36.60 17.268 –109.20 0.011 102.30 0.335 –171.40 2750 0.269 31.30 16.379 –116.30 0.010 110.90 0.317 –174.50 2800 0.304 25.50 15.826 –123.40 0.009 105.80 0.311 –178.60 2850 0.325 19.80 15.125 –130.40 0.010 103.60 0.292 177.50 2900 0.345 14.50 14.611 –137.50 0.008 99.70 0.279 172.80 2950 0.356 9.40 14.048 –143.60 0.009 92.80 0.271 168.90 3000 0.370 2.40 13.663 –150.40 0.011 88.20 0.259 163.80
S
11
S
21
S
12
S
22
MRFIC2403MOTOROLA RF DEVICE DATA
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(VDD = 5 V, I
T able 2. Class B Scattering Parameters
DQ1
= 12 mA, I
= 10 mA, TA = 25°C, 50 W System)
DQ2
f
(MHz) |S11| φ |S21| φ |S12| φ |S22| φ
2000 0.634 –149.00 12.40 88.00 0.007 –59.00 0.893 –81.00 2050 0.554 –170.00 14.76 72.00 0.013 –81.00 0.966 –89.00 2100 0.456 163.00 17.00 53.00 0.015 –95.00 0.990 –100.00 2150 0.362 129.00 18.09 32.00 0.017 –1 17.00 0.955 –110.00 2200 0.310 91.00 18.81 12.00 0.020 –138.00 0.870 –119.00 2250 0.298 58.00 17.37 –5.00 0.021 –156.00 0.771 –125.00 2300 0.298 30.00 17.22 –21.00 0.021 –169.00 0.681 –128.00 2350 0.289 11.00 15.89 –34.00 0.020 179.00 0.612 –130.00 2400 0.275 0.00 14.74 –45.00 0.020 168.00 0.562 –130.00 2450 0.248 –8.00 15.35 –56.00 0.021 155.00 0.528 –131.00 2500 0.216 –10.00 13.62 –66.00 0.019 147.00 0.498 –131.00 2550 0.199 –8.00 13.46 –75.00 0.021 143.00 0.473 –132.00 2600 0.187 –2.00 12.95 –83.00 0.020 134.00 0.447 –132.00 2650 0.185 4.00 12.32 –91.00 0.020 129.00 0.426 –134.00 2700 0.202 10.00 11.78 –99.00 0.021 123.00 0.405 –135.00 2750 0.218 13.00 11.25 –107.00 0.021 115.00 0.384 –136.00 2800 0.244 14.00 10.83 –114.00 0.018 106.00 0.373 –137.00 2850 0.268 13.00 10.34 –121.00 0.019 98.00 0.353 –139.00 2900 0.285 10.00 10.05 –129.00 0.019 99.00 0.332 –140.00 2950 0.301 7.00 9.61 –135.00 0.018 102.00 0.316 –143.00 3000 0.317 3.00 9.46 –142.00 0.018 90.00 0.302 –145.00
S
11
S
21
S
12
S
22
MRFIC2403 4
MOTOROLA RF DEVICE DATA
Page 5
25
23
21
19
17
15
out
P , OUTPUT POWER (dBm)
13 11
–10
P
OUT
–6
PIN, INPUT POWER (dBm)
EFFICIENCY
f = 2.45 GHz VDD = 5.0 Vdc VG1 = –1.0 Vdc VG2 = –2.0 Vdc
0
TYPICAL CHARACTERISTICS
70
60
50
40
30
20
10
0
6
26 25 24 23 22 21
20
out
P , OUTPUT POWER (dBm)
POWER ADDED EFFICIENCY (%)
19 18
2.1 2.3 2.5 2.7 2.9–8 –4 –2 2 4
TA = – 30°C
25°C
85°C
Pin = +4.0 dBm VDD = 5.0 Vdc VG1 = –1.0 Vdc VG2 = –2.0 Vdc
3.02.82.22.0 2.62.4
f, FREQUENCY (GHz)
Figure 2. Output Power and Efficiency versus
Input Power
25
20
15
10
5
, OUTPUT POWER (dBm)
out
P
0
–5
1
PCNTRL, (VOLTS)
Figure 4. Output Power versus PCNTRL Voltage
DESIGN AND APPLICATIONS INFORMATION
The MRFIC2403 is a two–stage power amplifier designed using Motorola’s MAFET planar, refractory gate MESFET IC process. The RF MESFETs are power, depletion mode devices and, therefore, require negative bias on the MESFET gates. For class B operation, –1.0 Vdc is applied to VG1 and –2.0 Vdc is applied to VG2. Class A biasing will yield slightly higher gain and 1.0 dB compression point and can be accom­plished by adjusting the bias on VG1 for I VG2 for I
= 96 mA. Where negative voltages are not
DQ2
= 24 mA and
DQ1
already available, Motorola’s MC33128 Power Management IC can produce –2.5 Vdc from a single positive supply .
The device is capable of better than +23 dBm saturated output power in the 2.4 to 2.5 GHz ISM band with the output matching circuit shown in Figure 1. The device can be operated at other frequencies in the 2.0 GHz to 3.0 GHz range with this circuit but performance can be improved with tuning for the specific frequency of use. Input match­ing is provided on chip. This circuit provides the best gain, saturated output power and efficiency tradeoff. Saturated operation has the advantage of best efficiency with less variation in performance over frequency and temperature. Operation in saturation is acceptable for constant enve­lope modulation schemes such as 2 and 4 level FM as spe ­cified for frequency hopping (FHSS) radios in the proposed IEEE 802.11 PHY layer specification. For direct sequence
Figure 3. Output Power versus Frequency
f = 2.45 GHz Pin = +4.0 dBm VDD = 5.0 Vdc VG1 = –1.0 Vdc VG2 = –2.0 Vdc
3
4
520
(DSSS) IEEE 802.11 operation, where differential binary phase shift keying (DBPSK) and differential quadrature phase shift keying (DQPSK) are specified, the amplifier will have to be “backed off” from saturation by 5.0 dB or more to avoid spectral regrowth. Care must be taken in the layout of the circuit and controlled impedance lines must be used at the RF pins. Capacitive bypassing as shown in the Applica­tions Circuit must be implemented as close to the chip as possible to avoid amplifier instability. Additionally, the supply voltage should be supported by sufficient “stiffening” capaci­tance, typically electrolytic or tantalum bypass capacitors, to eliminate noise from digital circuits.
Output power control is accomplished by varying the volt­age on the PCNTRL pin. 0 Vdc gives minimum output and reduces the current drawn by the amplifier to the quiescent value. The amplifier can be put into “sleep” mode by decreasing the voltage on the gate bias pins to –3.0 Vdc and the current drain is reduced to a few hundred microamps.
EVALUATION BOARDS
Evaluation boards are available for RF Monolithic Inte­grated Circuits by adding a “TF” suffix to the device type. For a complete list of currently available boards and ones in development for newly introduced poduct, please con­tact your local Motorola Distributor or Sales Office.
MRFIC2403MOTOROLA RF DEVICE DATA
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P ACKAGE DIMENSIONS
–T–
–A–
16 9
–B–
18
8 PLP
0.25 (0.010) B
G
K
C
SEATING
PLANE
D
16 PL
0.25 (0.010) A
M
S
B
T
M
S
CASE 751B–05
ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
M
S
R
X 45
_
F
J
5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.
DIM MIN MAX MIN MAX
A 9.80 10.00 0.386 0.393 B 3.80 4.00 0.150 0.157 C 1.35 1.75 0.054 0.068 D 0.35 0.49 0.014 0.019
F 0.40 1.25 0.016 0.049 G 1.27 BSC 0.050 BSC J 0.19 0.25 0.008 0.009 K 0.10 0.25 0.004 0.009 M 0 7 0 7
____
P 5.80 6.20 0.229 0.244 R 0.25 0.50 0.010 0.019
INCHESMILLIMETERS
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “T ypical” parameters can and do vary in different applications. All operating parameters, including “T ypicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Af firmative Action Employer.
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MRFIC2403 6
MOTOROLA RF DEVICE DATA
*MRFIC2403/D*
MRFIC2403/D
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