Datasheet MRFIC2004 Datasheet (Motorola)

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
SEMICONDUCTOR TECHNICAL DATA
The MRFIC Line
    
The MRFIC2004 is an integrated Driver and Ramp designed for transmitters operating in the 800 MHz to 1.0 GHz frequency range. The Ramp is an integrator which can be used for burst control for TDD/TDMA systems. The Driver uses a cascode configuration for high gain and reverse isolation. A power down control is provided to minimize current drain with minimum recovery/turn­on time. Also, an on-board inverter is included to provide complementary control for an antenna switch, such as the MRFIC2003. The design utilizes Motorola’s advanced MOSAIC 3 silicon bipolar RF process to yield superior performance in a cost effective monolithic device. Applications for the MRFIC2004 include CT1 and CT2 cordless telephones, GSM, remote controls, video and audio short range links, low cost cellular radios, and ISM band transmitters.
Small Signal Gain = 21.5 dB (Typ)
Small Signal Gain Control = 34 dB (Typ)
Po
On Board Ramp for Burst Control
Power Down Supply Current = 0.7 mA (Typ)
Low Operating Supply Voltage (2.7 to 4.0 Volts)
Input/Output VSWR Insensitive to Gain Control
Order MRFIC2004R2 for Tape and Reel.
R2 Suffix = 2,500 Units per 16 mm, 13 inch Reel.
Device Marking = M2004
= –1.0 dBm (Typ)
1.0 dB
Order this document
by MRFIC2004/D

900 MHz DRIVER
& RAMP
SILICON MONOLITHIC
INTEGRATED CIRCUIT
CASE 751B-05
(SO-16)
ABSOLUTE MAXIMUM RATINGS
Supply Voltages V
Control Voltages RXEN, TXEN, V Input Power, RF IN Port P Operating Ambient Temperature T Storage Temperature T
(TA = 25°C unless otherwise noted)
Rating Symbol Value Unit
CC1
V
CC2
RF
A
stg
GND
V
CC1
GND
V
RAMP
C INT
GND
1RX EN
2
3
4
DRIVER
5
6
RAMP
7
RX EN
16
GND
15
RF OUT/V
14
GND
13
GND
12
RF IN
11
GND
10
cont
CC2
4.5
6.0
6.0 Vdc
+10 dBm
–35 to +85 °C
–65 to +150 °C
Vdc
REV 2
Motorola, Inc. 1997
TX EN
8
9
Pin Connections and Functional Block Diagram
V
cont
(GAIN CONTROL)
MRFIC2004MOTOROLA RF DEVICE DATA
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RECOMMENDED OPERATING RANGES
Parameter Symbol Value Unit
Supply Voltage Ranges V Control Voltage Ranges TX EN, RX EN,
Frequency Range f 800 to 1000 MHz
ELECTRICAL CHARACTERISTICS (V
Characteristics (1)
Supply Current, TX EN High, RX EN Low 11 13 mA Supply Current, TX EN Low, RX EN High 0.7 1.5 mA
Driver Characteristics (1)
Gain (Small Signal) 19 21.5 24 dB Gain Control (Small Signal) 34 dB Power Out @ 1.0 dB Gain Compression –4.0 –1.0 dBm Third Order Intercept Point (out) +7.5 dBm Reverse Isolation 32 dB
Ramp Characteristics (1)
Ramp Up Delay Time
Rise Time Total Time
Ramp Down Delay Time
Fall Time Total Time
LOGIC LEVELS (V
High Low
High Low
NOTE:
1. All electrical characteristics measured in test circuit schematic shown in Figure 1 below.
= 2.7 to 4.0 V, TA = 25°C)
CC1
RX EN & TX EN Input Voltage
RX EN Output Voltage
CC1
, V
CC2
= 3.0 V, C
= 2.0 nF, TA = 25°C, f = 900 MHz, V
INT
V
V
, V
CC1
CC2
V
cont
Min Typ Max Unit
— — —
— — —
Min Typ Max Unit
– 0.8
CC1
– 0.2
CC1
4.0 18 22
4.0 18 22
— —
— —
2.7 to 4.0 Vdc
0 to V
CC1
= 1.3 V)
CONT
— — —
— — —
0.8
0.2
Vdc
µs
µs
V
V
MRFIC2004 2
MOTOROLA RF DEVICE DATA
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TX EN
f
V
cont
+
V
RAMP
C
C6
INT
+ –
D.U.T.
+ –
C9
C5 C7
12345678
161514131211109
L2
+
VCC 1
+
RX EN
+
RX EN
LINE
RF IN
50
C1, C7, C9 — 1000 pF Chip Capacitor C2, C5, C6, C10 — 100 pF Chip Capacitor C3 — 1.6 pF Chip Capacitor C
— 2000 pF Chip Capacitor
INT
50
C10C11
Figure 1. T ypical Biasing Configuration
Zo = 50
V
= 1.0 V
cont
1000
750
f = 500 MHz
L1 R1
+
VCC 2
C11 — 6.2 pF Chip Capacitor L1 — 4.7 nH Chip Inductor L2 — 150 nH Chip Inductor R1 — 330 Chip Resistor
C3
C2C1
LINE
50
RF Connectors — SMA Type Board Material — Epoxy/Glass εr= 4.5, Dielectric Thickness = 0.014 (0.36 mm)
Zo = 50
RF OUT
50
V
= 1.0 or 3.0 V
cont
f = 500 MHz
1000
750
V
= 3.0 V
cont
Figure 2. S11 versus Frequency versus V
S
f
V
cont
1.0 100 0.85 –11.3 10.48 171.5 0.0002 142.7 0.99 –2.9
(MHz)
300 0.83 –32.8 10.33 156.3 0.0020 129.0 0.99 –7.3 500 0.79 –56.9 10.15 140.5 0.0030 130.6 0.98 –15.9 550 0.79 –62.5 10.04 135.9 0.0030 132.6 0.98 –17.9 600 0.78 –68.5 9.85 130.2 0.0040 133.3 0.98 –20.0 650 0.77 –74 9.47 126.9 0.0040 135.9 0.98 –22.3 700 0.76 –79 9.23 123.6 0.0050 137.2 0.98 –24.7 750 0.76 –84.4 9.02 119.4 0.0050 138.1 0.97 –27.0 800 0.75 –89.6 8.69 113.8 0.0060 139.7 0.97 –29.3 850 0.74 –94.5 8.33 110.8 0.0070 140.3 0.97 –31.4 900 0.73 –99.1 8.13 108.9 0.0080 141.2 0.96 –33.2 950 0.73 –102 7.98 105.4 0.0090 138.3 0.96 –36.3
|S11| φ |S21| φ |S12| φ |S22| φ
11
cont
S
21
Figure 3. S22 versus Frequency
S
12
S
22
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1000 0.72 –106.9 7.70 101.0 0.0100 133.7 0.95 –38.4
1.9 100 0.85 –11.3 0.53 –173.5 0.0002 104.3 0.99 –2.9 300 0.86 –33.5 0.69 –169.7 0.0009 118.7 0.98 –8.7 500 0.87 –59.3 0.89 –179.5 0.0010 134.3 0.98 –15.5 550 0.87 –65.7 0.96 175.1 0.0020 136.3 0.98 –17.5 600 0.88 –73.1 1.02 169.9 0.0020 138.9 0.97 –19.6 650 0.88 –78.7 1.04 167.3 0.0020 142.6 0.97 –21.8 700 0.88 –84.7 1.07 165.0 0.0030 147.8 0.97 –24.1 750 0.89 –90.7 1.14 161.5 0.0030 153.4 0.96 –26.4 800 0.89 –98.2 1.17 155.8 0.0040 161.0 0.96 –28.8 850 0.88 –104.6 1.22 151.2 0.0050 161.8 0.96 –30.7 900 0.87 –110.1 1.24 144.6 0.0060 162.7 0.95 32.8 950 0.86 –114.6 1.26 139.9 0.0070 160.3 0.95 –35.1
1000 0.85 –118.8 1.27 134.1 0.0080 158.2 0.94 –37.2
3.0 100 0.85 –10.9 0.003 –85.9 0.0001 115.0 0.99 –2.8 300 0.86 –31.9 0.014 –78.8 0.0006 121.0 0.99 –8.5 500 0.87 –56.9 0.032 –61.1 0.0010 128.0 0.98 –15.1 550 0.88 –62.4 0.038 –65.8 0.0010 136.2 0.98 –17.0 600 0.89 –69.4 0.048 –68.3 0.0010 140.0 0.98 –19.2 650 0.90 –75.1 0.058 –75.1 0.0020 145.1 0.98 –21.3 700 0.90 –81.3 0.069 –82.4 0.0020 150.8 0.97 –23.6 750 0.91 –87.3 0.081 –89.4 0.0020 156.8 0.97 –25.8 800 0.91 –93.8 0.092 –113.4 0.0030 160.3 0.97 –28.1 850 0.92 –100.7 0.092 –121.8 0.0040 163.3 0.96 –30.1 900 0.91 –106.8 0.089 –128.2 0.0050 163.3 0.96 –32.3 950 0.90 –111.4 0.083 –137.1 0.0060 155.2 0.95 –34.5
1000 0.89 –115.2 0.077 –151.9 0.0060 150.0 0.95 –36.6
T able 1. Small Signal Deembedded S Parameters
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MOTOROLA RF DEVICE DATA
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24 18
12
6 0
–6
G, GAIN (dB)
–12 –18
–24
V
= 1 V
cont
1.9 V
TA = 25°C V
3 V
f, FREQUENCY (MHz)
CC1
, V
CC2
= 3 V
1000900800700600500
6
3
0
–3
out
P , OUTPUT POWER (dBm)
–6
–9
–30
25°C
TA = –35°C
85°C
–26 – 22 –18 –14 –1
Pin, INPUT POWER (dBm)
Figure 4. Small Signal Gain versus Frequency Figure 5. Output Power versus Input Power
V V
CC1 cont
, V
CC2
= 1 V
= 3 V
0
24
16
6
0
G, GAIN (dB)
–8
TA = 25°C V
CC1
–16
1
–10 dBm
Pin = –30 dBm
, V
= 3 V
CC2
1.4 1.8 2.2 2.6 3 V
, GAIN CONTROL VOLTAGE (V)
cont
–20 dBm
–15 dBm
13
12
11
10
9
, SUPPLY CURRENT (mA)
C
I
8
7
–35
–15 5 25 45 65 85
TA, AMBIENT TEMPERATURE (
Figure 6. Driver Gain versus Gain Control Voltage Figure 7. Supply Current versus Ambient
Temperature
3
2.5
2
1.5
, RAMP VOLTAGE (V)
1
RAMP
V
0.5
0
0
TXEN LOW @ 50 µs
TA = 25°C V
, V
CC2
= 2 nF
= 3 V
CC1
C
INT
DRIVER & PA TURN ON
TXEN HIGH @ 10 µs
20 6040 80 100
tr & tf, RISE AND FALL TIME (
DRIVER & PA TURN OFF
µ
s)
V
, V
CC1
CC2
TX EN HIGH RX EN LOW
°
C)
= 3 V
Figure 8. Ramp V oltage versus Rise & Fall Time
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APPLICATIONS INFORMATION
DESIGN PHILOSOPHY
The MRFIC2004 was designed as a support IC for a CT2 chip-set. The other chips making up the chip-set are the MRFIC2001 downconverter, the MRFIC2002 transmit mixer, the MRFIC2003 antenna switch and the MRFIC2006 PA. A complete CT2 front-end solution requires a ramp for burst control, an inverter for complementary antenna switch con­trol and gain control (or an attenuator) for the transmitter low power mode. In order to keep the other chips in the chip-set relatively general purpose, yet provide the system designer with an easily controlled solution, these functions were com­bined with a driver amplifier into one IC, the MRFIC2004.
THEORY OF OPERATION
The driver is a cascode design that exits the IC open­collector. Impedance matching must be done externally. Since the output requires a bias inductor and DC blocking capacitor, the output can be matched with these two ele­ments. To keep the driver unconditionally stable, it is recom­mended that a 300 – 400 ohm resistor be placed in parallel with the bias inductor as close to the IC as possible. Since the output impedance of the driver by itself is very high, the resistor sets the output impedance. The input can be matched with a series inductor followed by a shunt capacitor. Alternatively, a series transmission line followed by a shunt capacitor can be used. A DC block is also required on the input.
Gain control is provided to meet the CT2 low power mode requirement. The CT2 Common Air Interface specifi­cation requires the transmitter to be capable of dropping the output power by 16 ± 4.0 dB. Although the driver has 34 dB of small signal gain control, it can be reduced by ad-
ding a resistor in series with the gain control pin. The value of the resistor depends on the logic levels being used and the amount of gain compression after the driver. Also, the amount of gain control is a function of the driver input power level. The input power should be kept less than –10 dBm to allow for sufficient gain control to achieve the low power mode. The gain control can also be used for P A output power trimming. However, this is not an efficient method.
The ramp is an integrator which is used to slow down the driver and PA turn-on and turn-off times to reduce AM splat­ter. By applying a pulse waveform to the input, a linear ramp waveform is created at the output which is then applied to the current mirrors of the driver and PA. An external integrating capacitor is used so that the rise/fall time can be pro­grammed externally. A minimum value of 2.0 –2.4 nF is needed to meet the CT2 Common Air Interface splatter spec­ification. For non-TDD/TDMA systems the ramp reverts to an enable/disable function.
The inverter is CMOS/TTL compatible and was included to provide complementary control for an antenna switch such as the MRFIC2003. By applying the receiver enable control line, RXEN, to the inverter the inverse RXEN RXEN and RXEN can then be used to control the MRFIC2003 antenna switch.
EVALUATION BOARDS
Evaluation boards are available for RF Monolithic Inte­grated Circuits by adding a “TF” suffix to the device type. For a complete list of currently available boards and ones in development for newly introduced product, please con ­tact your local Motorola Distributor or Sales Office.
will be created.
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P ACKAGE DIMENSIONS
–T–
–A–
16 9
–B–
18
8 PLP
0.25 (0.010) B
G
K
C
SEATING
PLANE
D
16 PL
0.25 (0.010) A
M
S
B
T
M
S
CASE 751B–05
M
R
X 45
_
ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
S
F
J
5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.
DIM MIN MAX MIN MAX
A 9.80 10.00 0.386 0.393 B 3.80 4.00 0.150 0.157 C 1.35 1.75 0.054 0.068 D 0.35 0.49 0.014 0.019 F 0.40 1.25 0.016 0.049 G 1.27 BSC 0.050 BSC J 0.19 0.25 0.008 0.009 K 0.10 0.25 0.004 0.009 M 0 7 0 7
____
P 5.80 6.20 0.229 0.244 R 0.25 0.50 0.010 0.019
INCHESMILLIMETERS
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty , representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “T ypical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.
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– US & Canada ONLY 1–800–774–1848 51 Ting Kok Road, T ai Po, N.T., Hong Kong. 852–26629298
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MRFIC2004/D
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