Datasheet MRFIC1803 Datasheet (Motorola)

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
SEMICONDUCTOR TECHNICAL DATA
The MRFIC Line
  
Designed primarily for use in DECT , Japan’ s Personal Handy System (PHS), and other wireless Personal Communication Systems (PCS) applications at 1.8 GHz, but also applicable to Industrial, Scientific and Medical (ISM) applications at 2.5 GHz. The MRFIC1803 is a complete active upmixer, exciter amplifier , and LO buffer amplifier in a low-cost SOIC-16 package. The low power consumption design includes a single balanced active mixer, CMOS compatible receive and transmit enable inputs, a buffer/exciter amplifier, and a buffered LO output capable of driving the MRFIC1804 downconverter. IF, LO and RF ports are matched to 50 and no off-chip baluns are required. With both TX and RX enable pins low, the device is in standby mode and draws less than 0.3 mA.
Together with the rest of the MRFIC180X series, this GaAs IC family offers the complete transmit and receive functions, less LO and filters, needed for a typical 1.8 GHz cordless telephone.
10 dB IF to RF Conversion Gain
Usable Frequency Range = 1.7 to 2.5 GHz
Low Power Consumption = 80 mW (Typ)
Single Bias Supply = 2.7 to 3.3 V
No External Baluns Required
IF, LO and RF Ports Matched to 50
Low LO Power Requirement = –10 dBm (Typ)
Low Cost Surface Mount Plastic Package
Order MRFIC1803R2 for Tape and Reel.
R2 Suffix = 2,500 Units per 16 mm, 13 inch Reel.
Device Marking = M1803
Order this document
by MRFIC1803/D

1.8 GHz UPMIXER,
EXCITER AND LO AMP
GaAs MONOLITHIC
INTEGRATED CIRCUIT
CASE 751B-05
(SO–16)
MAXIMUM RATINGS
(TA = 25°C unless otherwise noted)
Ratings Symbol Value Unit
Supply Voltage V IF Input Power P LO Input Power P Transmit and Receive Enable V oltage Storage Temperature Range T Operating Ambient Temperature T
1GND
GND
LO OUT
GND GND
RF OUT
GND
V
DD
LO BUFFER
2
AND SWITCH
3 4
EXCITER
5 6
ACTIVE
7
BALANCED MIXER
8
TX EN, RX EN 5.5
DD
IF
LO
stg
A
16 15 14 13 12 11 10
9
5.5 Vdc 3 dBm 3 dBm
Vdc
– 65 to +150 °C
– 30 to + 85 °C
RX EN
GND LO IN GND GND
IF IN
GND TX EN
REV 3
Motorola, Inc. 1997
Pin Connections and Functional Block Diagram
MRFIC1803MOTOROLA RF DEVICE DATA
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RECOMMENDED OPERATING RANGES
Parameter
LO Input Frequency f LO Input Power P IF Input Frequency f RF Output Frequency f Transmit and Receive Enable V oltage TX EN, RX EN 2.7 to V Supply Voltage V
Symbol Value Unit
LO
LO IF
RF
DD
1.5 to 2.4 GHz
70 to 350 MHz
1.7 to 2.5 GHz
2.7 to 5 Vdc
–10 dBm
DD
Vdc
ELECTRICAL CHARACTERISTICS (V
TX EN = 3.0 V, RX EN = 0 V, unless otherwise noted)
Characteristic
IF to RF Conversion Gain 8 10 dB RF Output 1 dB Compression –2 dBm RF Output 3rd Order Intercept 9 dBm LO Feed Through to RF Port –19 dBm Auxiliary LO Output Power (TX EN = 0 V, RX EN = 3 Vdc) –4 dBm Supply Current, TX Mode 28 50 mA Supply Current, RX Mode (TX EN = 0 V, RX EN = 3 Vdc) 3 mA Standby Mode Current (TX EN = 0 V, RX EN = 0 Vdc) 0.1 0.3 mA
= 3 V, TA = 25°C, LO = 1790 MHz @ –10 dBm, IF = 110 MHz @ –15 dBm,
DD
Min Typ Max Unit
RX EN LO IN IF IN TX EN
C1
15
1416
10 9111213
MRFIC1803 2
1
2
345678
LO OUT RF OUT V
C1 470 pF C2 100 pF C3 0.1 µF (optional)
DD
Figure 1. Applications Circuit Configuration
C2 C3
MOTOROLA RF DEVICE DATA
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T ypical Characteristics
ÎÎÎ
13 12 11 10
9 8 7 6
GC, CONVERSION GAIN (dB)
5 4 3
–15 –13 –11 –9 –7 –5
VDD = 3.0 Vdc
2.7 Vdc
3.3 Vdc fRF = 1.9GHz
PIF = –20dBm fIF = 110MHz TA = 25°C
PLO, LO INPUT POWER (dBm)
Figure 2. Conversion Gain versus LO Power
14 12 10
8 6 4 2
0
GC,CONVERSION GAIN (dB)
–2 –4
1.5 1.6 1.7 1.8 1.9 2 2.1 2.2 2.3 2.4 2.5 2.6
–35°C
TA = 25°C
fIF = 110 MHz PRF = –20 dBm
PLO = –10 dBm VDD = 3 Vdc
fRF, RF FREQUENCY (GHz)
85
°
C
14
12
10
8
GC,CONVERSION GAIN (dB)
6
4
–15 –13 –11 –9 –7 –5
PLO, LO INPUT POWER (dBm)
–35°C
TA = 25°C
°
C
85
fRF = 1.9 GHz PIF = –20 dBm
fIF = 110 MHz
VDD = 3 Vdc
Figure 3. Conversion Gain versus LO Power
13 11
9 7
5 3 1
–1
GC,CONVERSION GAIN (dB)
–3 –5
1.5 1.6 1.7 1.8 1.9 2 2.1 2.2 2.3 2.4 2.5
fIF = 110 MHz PIF = –20 dBm
PLO = –10 dBm TA = 25
3.3 Vdc
°
C
fRF, RF FREQUENCY (GHz)
2.7 Vdc
VDD = 3.0 Vdc
2.6
Figure 4. Conversion Gain versus RF Frequency Figure 5. Conversion Gain versus RF Frequency
12
10
8
6
4
GC,CONVERSION GAIN (dB)
2
0
1.5 1.6 1.7 1.8 1.9 2 2.1 2.2 2.3 2.4 2.5 2.6
IF = 240 MHz
PIF = –20 dBm PLO = –10 dBm
VDD = 3 Vdc
°
C
TA = 25
fRF, RF FREQUENCY (GHz)
110 MHz
325 MHz
5 4
3 2
1 0
–1 –2
–3 –4
–5 –6
–7
RF
PRF, RF OUTPUT POWER (dBm)
–8
–9 –10 –11
–20 –15 –10 –5 0
VDD = 3 Vdc
2.7 Vdc
fRF = 1.9 GHz fIF = 110 MHz
3.3 Vdc
PIF, IF INPUT POWER (dBm)
PLO = –10 dBm TA = 25
Figure 6. Conversion Gain versus RF Frequency Figure 7. RF Output Power versus IF Input Power
°
C
MRFIC1803MOTOROLA RF DEVICE DATA
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T ypical Characteristics
6 4
2
0 –2 –4
–6 –8
RF
PRF, RF OUTPUT POWER (dBm)
–10 –12
–20 –15 –10 –5 0
–35°C
°
C
85
TA = 25°C
PIF, IF INPUT POWER (dBm)
fIF = 110 MHz fRF = 1.9 GHz VDD = 3 Vdc
Figure 8. RF Output Power versus IF Input Power
4 2
0 –2 –4 –6 –8
–10
RF
PRF, RF OUTPUT POWER (dBm)
–12 –14
–16
–20 –15 –10 –5 0
PIF, IF INPUT POWER (dBm)
325 MHz
IF = 110 MHz
fRF = 2.45 GHz VDD = 3 Vdc
TA = 25
240 MHz
°
C
Figure 10. RF Output Power versus IF Input
Power at 2.45GHz
6 4 2
0 –2 –4 –6
RF
PRF, RF OUTPUT POWER (dBm)
–8
–10
–20 –15 –10 –5 0
240 MHz
IF = 110 MHz
PIF, IF INPUT POWER (dBm)
325 MHz
fRF = 1.9 GHz VDD = 3 Vdc
°
TA = 25
Figure 9. RF Output Pwer versus IF Input Power
0
–5
–10
–15
–20
PRF = –20 dBm
LO–RF FEEDTHROUGH (dBm)
PLO = –10 dBm
–25
VDD = 3 Vdc
°
C
TA = 25
–30
1 1.2 1.4 1.6 1.8
fLO, LO FREQUENCY (GHz)
Figure 11. LO to RF Feedthrough versus
240 MHz
2
IF = 110 MHz
325 MHz
2.2 2.4 2.6
LO Frequency
C
MRFIC1803 4
MOTOROLA RF DEVICE DATA
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Frequency (MHz) RF Output LO Input LO Output
1500 22.07 –j11.36 41.98 +j22.31 20.09 +j31.15 1550 21.74 –j4.69 50.60 +j9.80 26.39 +j40.79 1600 22.28 +j2.16 41.93 –j0.07 37.63 +j52.47 1650 24.01 +j8.25 32.74 +j3.32 56.16 +j63.47 1700 26.64 +J14.13 28.78 +j11.39 87.97 +j67.31 1750 30.83 +j20.1 1 28.98 +j21.04 131.33 +j40.34 1800 36.39 +j25.30 32.13 +j30.26 137.85 –j16.48 1850 43.92 +j29.26 37.68 +j40.38 103.88 –j50.81 1900 54.37 +j30.98 48.31 +j54.15 69.58 –j53.97 1950 65.34 +j28.57 68.80 +j70.87 50.13 –j46.24 2000 75.30 +j21.12 118.18 +j86.46 38.97 –j36.86 2050 81.19 +j8.43 220.83 +j17.19 32.08 –j27.58 2100 80.22 –j4.24 148.91 –j120.77 28.43 –j19.86 2150 74.20 –j14.00 58.50 –j105.11 26.56 –j12.82 2200 65.50 –j19.72 27.23 –j71.51 26.03 –j5.89 2250 57.40 –j21.38 17.22 –j50.26 26.73 –j0.03 2300 50.59 –j20.61 13.00 –j35.19 28.46 +j5.10 2350 44.53 –j18.16 10.95 –j22.96 30.88 +j9.86 2400 40.24 –j14.78 10.23 –j13.58 33.75 +j13.92 2450 37.73 –j10.54 10.20 –j5.32 37.50 +j17.32 2500 36.38 –j6.72 10.62 +j2.90 42.00 +j20.34
T able 1. Selected Device Impedances
DESIGN AND APPLICATIONS INFORMATION
The MRFIC1803 combines a single–balanced FET mix­er with an LO pre–amp and an exciter amplifier to form a self–contained upconverter. The device is usable from RF frequencies of 1.7 to 2.5 GHz and at IF frequencies of 70 to 325 MHz. The design is optimized for low side injection in hetrodyne transmitter applications. In the upconversion process, modulation is imparted to an IF carrier which is converted to the RF transmit frequency by a mixer. By DC coupling the IF input, the device can be used for simple on–off keying (OOK) or bi–phase shift keying (BPSK) ap­plications with no IF.
The MRFIC1803 design minimizes the need for off–chip components. An active balun is employed at the IF input and provides an excellent broadband 50match over the full range of IF frequencies. The LO quadrature divider is passive and internal to the device. The LO buffer amplifier is equipped with a diversity switch which switches the am­plified LO signal to the LO output pin during RECEIVE mode. The –5 dBm LO output is the appropriate level to drive the MRFIC1804 for 1.8 GHz applications or the MRFIC2401 for 2.4 GHz applications.
As shown in Figure 1, the device is easy to use with minimal off–chip components. More or les s bypassing of the control and supply lines may be required depending on board layout and shielding. Careful layout of the RF
frequency portions of the board is critical to successful implementation. Controlled impedance lines must be used and any off–chip components must be mounted as close to the IC as possible. The applications circuit was used to gather the information displayed in the typical characteris­tics curves. Since the MRFIC1803 design was optimized for the 1.7 to 1.9 GHz frequency range, improved perfor­mance can be had with some off–chip matching at fre­quencies outside this range. In particular , matching of the LO port will supply higher LO drive and improve conver­sion gain. At the RF output, either better gain or better 1dB compression can be had with external matching.
Filtering is generally required in the upconversion pro­cess to reduce image and LO radiation. To minimize pin count, this filtering is accomplished external to the device at the exciter output. For the frequency ranges of applica­tion, two and three pole ceramic surface filters are avail­able at reasonable cost and with less than 2 dB of loss.
EVALUATION BOARDS
Evaluation boards are available for RF Monolithic Inte­grated Circuits by adding a “TF” suffix to the device type. For a complete list of currently available boards and ones in development for newly introduced product, please con ­tact your local Motorola Distributor or Sales Office.
MRFIC1803MOTOROLA RF DEVICE DATA
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P ACKAGE DIMENSIONS
–T–
–A–
16 9
–B–
18
8 PLP
0.25 (0.010) B
G
K
C
SEATING
PLANE
D
16 PL
0.25 (0.010) A
M
S
B
T
M
S
CASE 751B–05
M
R
X 45
_
ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.
S
F
J
5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.
DIM MIN MAX MIN MAX
A 9.80 10.00 0.386 0.393 B 3.80 4.00 0.150 0.157 C 1.35 1.75 0.054 0.068 D 0.35 0.49 0.014 0.019 F 0.40 1.25 0.016 0.049 G 1.27 BSC 0.050 BSC J 0.19 0.25 0.008 0.009 K 0.10 0.25 0.004 0.009
M 0 7 0 7
____
P 5.80 6.20 0.229 0.244 R 0.25 0.50 0.010 0.019
INCHESMILLIMETERS
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty , representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “T ypical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.
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MRFIC1803
MOTOROLA RF DEVICE DATA
MRFIC1803/D
6
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