Datasheet MRF858, MRF858S Datasheet (Motorola)

Page 1
1
MRF858 MRF858SMOTOROLA RF DEVICE DATA
The RF Line
    
Designed for 24 Volt UHF l arge–signal, common e mitter, class A linear amplifier applications in industrial and commercial equipment operating in the range of 800–960 MHz.
Specified for VCE = 24 Vdc, IC = 0.5 Adc Characteristics
Output Power = 3.6 Watts CW Minimum Power Gain = 11 dB Minimum ITO = +44.5 dBm Typical Noise Figure = 6 dB
Characterized with Small–Signal S–Parameters and Series Equivalent
Large–Signal Parameters from 800–960 MHz
Silicon Nitride Passivated
100% Tested for Load Mismatch Stress at All Phase Angles with 30:1
VSWR @ 24 Vdc, IC = 0.5 Adc and Rated Output Power
Will Withstand RF Input Overdrive of 0.85 W CW
Gold Metallized, Emitter Ballasted for Long Life and Resistance to Metal
Migration
Circuit board photomaster available upon request by contacting
RF Tactical Marketing in Phoenix, AZ.
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector–Emitter Voltage V
CEO
30 Vdc
Collector–Base Voltage V
CBO
55 Vdc
Emitter–Base Voltage V
EBO
4 Vdc
Total Device Dissipation @ TC = 50°C
Derate above 50°C
P
D
20
0.138
Watts
W/°C
Operating Junction Temperature T
J
200 °C
Storage Temperature Range T
stg
–65 to +150 °C
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance (TJ = 150°C, TC = 50°C) R
θJC
6.9 °C/W
ELECTRICAL CHARACTERISTICS
Characteristic Symbol Min Typ Max Unit
OFF CHARACTERISTICS
Collector–Emitter Breakdown Voltage (IC = 20 mA, IB = 0) V
(BR)CEO
28 35 Vdc
Collector–Emitter Breakdown Voltage (IC = 20 mA, VBE = 0) V
(BR)CES
55 85 Vdc
Collector–Base Breakdown Voltage (IC = 20 mA, IE = 0) V
(BR)CBO
55 85 Vdc
Emitter–Base Breakdown Voltage (IE = 1 mA, IC = 0) V
(BR)EBO
4 5 Vdc
Collector Cutoff Current (VCB = 24 V, IE = 0) I
CES
1 mA
(continued)
Teflon is a registered trademark of du Pont de Nemours & Co., Inc.
Order this document
by MRF858/D

SEMICONDUCTOR TECHNICAL DATA
CLASS A
800–960 MHz
3.6 W (CW), 24 V NPN SILICON
RF POWER TRANSISTOR
CASE 319–07, STYLE 2
MRF858
CASE 319A–02, STYLE 2
MRF858S
Motorola, Inc. 1995
REV 2
Page 2
MRF858 MRF858S 2
MOTOROLA RF DEVICE DATA
ELECTRICAL CHARACTERISTICS — continued
Characteristic Symbol Min Typ Max Unit
ON CHARACTERISTICS
DC Current Gain
(IC = 0.1 A, VCE = 5 V)
h
FE
30 60 120
DYNAMIC CHARACTERISTICS
Output Capacitance
(VCB = 24 V, f = 1 MHz)
C
ob
6.5 8 pF
FUNCTIONAL CHARACTERISTICS
Common–Emitter Power Gain
(VCE = 24 V, IC = 0.5 A, f = 840–900 MHz, Power Output = 3.6 W)
P
g
11 12 dB
Load Mismatch
(Po = 3.6 W) (VCE = 24 V, IC = 0.5 A, f = 840 MHz, Load VSWR = 30:1, All Phase Angles)
ψ
No Degradation in
Output Power
RF Input Overdrive
(VCE = 24 V, IC = 0.5 A, f = 840 MHz) No degradation
P
in(over)
0.85 W
Third Order Intercept Point
(VCE = 24 V, IC = 0.5 A) (f1 = 900 MHz, f2 = 900.1 MHz, Meas. @ IMD 3rd Order = –40 dBc)
ITO +44.5 +45.5 dBm
Noise Figure
(VCE = 24 V, IC = 0.5 A, f = 900 MHz)
NF 6 dB
Input Return Loss
(VCE = 24 V, IC = 0.5 A, f = 840–900 MHz, Power Output = 3.6 W)
IRL –12 –9 dB
Table 1. MRF858 Common Emitter S–Parameters
S
11
S
21
S
12
S
22
V
CE
(V)
I
C
(A)
f
(MHz)
|S11| φ |S21| φ |S12| φ |S22| φ
24 0.5 800
820 840 860 880 900 920 940 960
0.942
0.942
0.941
0.940
0.941
0.940
0.940
0.940
0.940
167 166 166 166 165 165 165 164 164
1.493
1.453
1.415
1.379
1.351
1.320
1.289
1.252
1.222
50 50 49 48 47 46 45 44 43
0.027
0.027
0.028
0.028
0.029
0.030
0.030
0.031
0.031
58 58 59 59 59 59 59 59 59
0.538
0.541
0.545
0.550
0.553
0.557
0.562
0.566
0.570
–165 –164 –165 –165 –165 –165 –165 –165 –165
Table 2. Zin and ZOL* versus Frequency
f
(MHz)
Z
in
(Ohms)
ZOL*
(Ohms)
840 870 900
1.1
1.1
1.2
2.9
3.5
3.5
9.9
9.5 9
–14.4 –14.6 –14.5
VCE = 24 V, IC = 0.5 A, Po = 3.6 W
ZOL* = Conjugate of optimum load impedance into which the device operates at a given output power, voltage and frequency.
Page 3
3
MRF858 MRF858SMOTOROLA RF DEVICE DATA
B1, B2 Short Ferrite Bead, Fair Rite (2743021447) C1 250 µF, 50 Vdc Electrolytic Capacitor C2, C5 10 µF, 50 Vdc Electrolytic Capacitor C3, C6 0.1 µF, Chip Capacitor C4, C7 100 pF, Chip Capacitor C8, C15 43 pF, 100 Mil Chip Capacitor C9, C10 10 pF, Mini–Unelco C11 5 pF, Mini–Unelco C12, C13, C14 0.8–8.0 pF, Johanson Gigatrim C15, C16 1000 pF, Chip Capacitor F1 1 A Micro–Fuse L1, L2 10 Turns, 20 AWG, 0.150 ID (10 1/2 W Resistor) L3 4 Turns, 16 AWG, 0.101 ID L4 0.5 18 AWG Wire Q1 MMBT2222ALT1, NPN Transistor Q2 BD136, PNP Transistor
R1 390 , 1/4 W R2 500 Potentiometer, 1/4 W R3 7.5K , 1/4 W R4 2 x 4.7K , 1/4 W R5 56 , 2 W R6 75 , 1/4 W R7 4.7 , 1/4 W R8 4 , 10 W TL1, TL5 50 , Microstrip Transmission Line TL2 Microstrip Transmission Line TL3 Microstrip Transmission Line TL4 Microstrip Transmission Line V_Supply +26 Vdc ±0.5 Vdc Due to Resistor Tolerance V
CE
+24 Vdc @ 0.5 A
Board 0.030 Glass–Teflon 2 oz. Cu, εr = 2.55
Figure 1. MRF858 Class A RF Test Fixture Schematic
R1
R2
R3
R8
R5
R6
L3
C7 C5
C14
C13C12
TL2
C9
Q1
R4
C4
L4
C6
OUTPUT
C10
C2 C3
B1
C1
V_SUPPLY
Q2
+
+
+
INPUT
V
CE
L1
L2
B2
TL4
C15 TL5
0.685
DUT
TL3
C8TL1
R7
C15
F1
C16
C11
Page 4
MRF858 MRF858S 4
MOTOROLA RF DEVICE DATA
8.57E+05
MTBF FACTOR (HOURS x AMPS
2
)
P , OUTPUT POWER (WATTS)
out
G
pe
, POWER GAIN (dB)
G
pe
, POWER GAIN (dB)
830 910
f, FREQUENCY (MHz)
Figure 2. Performance in Broadband Circuit
TYPICAL CHARACTERISTICS
13.5
13
12.5
10.5 840 850 860 870 880 890 900
G
pe
4
3.5
3
2.5
2
1.5
1
VSWR
in
, INPUT VSWR
VSWR
VCC = 24 Vdc IC = 500 mA P
out
= 3.6 W (CW)
7
6
5
0
Pin, INPUT POWER (WATTS)
Figure 3. Output Power & Power Gain versus
Input Power
4
3
2
0
0.1 0.2 0.3
G
pe
15
1 4
13
1 2
11
8
P
out
VCC = 24 Vdc IC = 500 mA f = 870 MHz
1
0.4 0.5 0.6 1
10
9
2000
0
VCE (Vdc)
Figure 4. DC SOA
0
Tj = 150
°
C
Tf = 50
°
C
1000
500
I
C
(mAdc)
1100
0
VCE (Vdc)
Figure 5. DC SOA
(This device is MTBF limited for VCE < 20 Vdc.)
50
0
Tj = 175
°
C
Tf = 50
°
C
I
C
(mAdc)
1000
900
800
700
600
1.00E+08
100
TJ, JUNCTION TEMPERATURE (
°
C)
Figure 6. MTBF Factor versus
Junction Temperature
1.00E+07
1.00E+06
1.00E+05
1.00E+04
1.00E+03 120 140 160 180 200 220 240 260
11.5
12
11
0.7 0.8 0.9
1500
2 4 6 8 10 12 14 16 18 20 22 24 26 28
2 4 6 8 10 12 14 16 18 20 22 24 26 28
1.72E+07
3.58E+06
2.34E+05
7.17E+04
2.43E+04
8.98E+03
3.59E+03
1.53E+03
Page 5
5
MRF858 MRF858SMOTOROLA RF DEVICE DATA
Figure 7. MRF858 Test Fixture Component Layout
R3 R2 R1
Q1
R5
R6
R7
Q1
C4
C9
L3
C8
B1
C12
C10
C5
C6
B2
L2
L4
C7
R8
C15
C11
C13
C14
R4
C15
+
MRF858
C11
C16
+
C2
C3
L1
Page 6
MRF858 MRF858S 6
MOTOROLA RF DEVICE DATA
PACKAGE DIMENSIONS
CASE 319–07
ISSUE M
MRF858
0.965
0.355
0.230
0.115
0.102
0.075
0.160
0.004
0.090
0.225
0.125
0.985
0.375
0.260
0.125
0.114
0.085
0.170
0.006
0.110
0.241
0.135
24.52
9.02
5.85
2.93
2.59
1.91
4.07
0.11
2.29
5.72
3.18
25.01
9.52
6.60
3.17
2.90
2.15
4.31
0.15
2.79
6.12
3.42
MM
MIN MINMAX MAX
INCHES MILLIMETER
DIM
A B C D E F H J K L N Q
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
0.725 BSC 18.42 BSC
SEATING PLANE
IDENTIFICATION
NOTCH
1 2 3
456
F
J
B
H
E
K
L
0.15 (0.006) T A N
M
-A-
-N-
-T-
Q 2 PL
D 2 PL
MM
0.38 (0.015) T A N
M
MM
0.38 (0.015) T A N
M
C
PIN 1. EMITTER (COMMON)
2. BASE (INPUT)
3. EMITTER (COMMON)
4. EMITTER (COMMON)
5. COLLECTOR (OUTPUT)
6. EMITTER (COMMON)
STYLE 2:
CASE 319A–02
ISSUE B
MRF858S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
STYLE 2:
PIN 1. EMITTER
2. BASE
3. EMITTER
4. EMITTER
5. COLLECTOR
6. EMITTER
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.355 0.365 9.02 9.27 B 0.225 0.235 5.72 5.96 C 0.110 0.125 2.80 3.17 D 0.115 0.125 2.93 3.17
F 0.075 0.085 1.91 2.15
H 0.035 0.045 0.89 1.14
J 0.004 0.006 0.11 0.15
K 0.090 0.110 2.29 2.79
IDENTIFICATION NOTCH
SEATING PLANE
6 5 4
1 2 3
A
K
B
D
F
C
J
H
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MRF858/D
*MRF858/D*
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