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查询MR27T6402L供应商
OKI Semiconducto
FEDR27T6402L-02-01
Issue Date: May. 9, 2005
MR27T6402L
4M–Word × 16–Bit or 8M–Word × 8–Bit P2ROM
FEATURES
·4,194,304-word × 16-bit / 8,388,608-word × 8-bit electri cally
switchable configuration
· Access time
2.7 V to 3.6 V power supply 90 ns MAX
3.0 V to 3.6 V power supply 80 ns MAX
· Operating cur rent 20 mA MAX (5MHz)
· Standby current 10 µA MAX
· Input/Output TTL compatible
· Three- state output
PACKAGES
· MR27T6402L-xxxMA
44-pin plastic SOP (SOP44-P-600-1.27-K)
· MR27T6402L-xxxTN
48-pin plastic TSOP (TSOP I 48-P-1220-0.50-1K)
P2ROM ADVANCED TECHNOL O G Y
P2ROM stands for Production Programmed ROM. This
exclusive Oki technology utilizes factory test equipment for
programming the customers code into the P2ROM prior to final
production testing. Advancements in this technology allows
production cos ts to be equiv alent to MAS KRO M and has ma ny
advantages and added benefits over the other non-volatile
technologies, which include the following;
· Short le ad t i me , since the P2ROM is programmed at the
final stage of the production process, a large P2ROM
inventory "bank system" of un-programmed packaged
pr oduct s are main tained to provid e a n aggressive lead-time
and minimize liability as a custom product.
· No mask charge, since P2ROMs do not utilize a custom
mask for stor ing customer code, no mask charg es a pp ly.
· No additional pr ogr a mming c harge, unlike Flash and
OTP that require additional programming and handling
costs, the P2ROM alr eady has the code l oa ded at the
factory with minimal effect on the production throughput.
The cost is included in the unit price.
· Custom Marking is available at no additional charge.
· Pin Compatible with Mask RO M and some FLASH
products.
PIN CONFIGURATION (TOP VIEW)
1
2
3
4
5
6
7
8
9
10
11
0
12
CE
13
V
S
14
OE
15
D0
16
D8
17
D1
18
D9
19
D2
20
D10
21
D3
22
D11
1
A15
2
A14
3
A13
4
A12
5
A11
6
A10
7
A9
8
A8
9
A19
10
A20
11
NC
12
NC
13
A21
14
NC
15
NC
16
A18
17
A17
18
A7
19
A6
20
A5
21
A4
22
A3
23
A2
24
A1
48TSOP(Type-I)
44SOP
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
A20
A19
A8
A9
A10
A11
A12
A13
A14
A15
A16
BYTE#
VSS
D15/A–1
D7
D14
D6
D13
D5
D12
D4
VCC
A16
BYTE#
VSS
D15/A–1
D7
D14
D6
D13
D5
D12
D4
VCC
D11
D3
D10
D2
D9
D1
D8
D0
OE#
VSS
CE#
A0
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FEDR27T6402L-02-01
A
A
OKI Semiconductor
BLOCK DIAG RAM
A1
A2
A3
A4
A5
A6
A7
A8
A9
10
A11
A12
A13
A14
A15
A16
A17
A18
A19
A20
A21
0
Address Buffer
PIN DESCRIPTIONS
Pin name Functions
D15 / A–1 Data output / Address input
A0 to A21 Address inputs
D0 to D14 Data outputs
CE# Chip enable input
OE# Output enable input
BYTE# Word / Byt e select input
VCC Power supply voltage
VSS Ground
NC No connect
A–1
× 8/× 16 Switch
CE# BYTE# OE#
CE OE
Row Decoder Column Decoder
D0 D2 D4 D6 D8 D10 D12 D14
D1 D3 D5 D7 D9 D11 D13 D15
MR27T6402L / P2ROM
Memory Cell Matrix
4M × 16-Bit or 8M × 8-Bit
Multiplexer
Output Buffer
In 8-bit output mode, these pins
are placed in a high-Z state and
pin D15 functions as the A-1
address pin.
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FEDR27T6402L-02-01
OKI Semiconductor
MR27T6402L / P2ROM
FUNCTION TABLE
Mode CE# OE# BYTE# VCC D0 to D7 D8 to D14 D15/A–1
Read (16-Bit) L L H D
Read (8-Bit) L L L D
Output disabl e L H
Standby H ∗
H
L
H
L
2.7 V
to
3.6 V
Hi–Z L/H
OUT
OUT
Hi–Z
Hi–Z
∗
∗
∗: Don’t Care (H or L)
ABSOLUT E MAXIMUM RATINGS
Parameter Symbol Condition Value Unit
Operating temperatur e under bias Ta 0 to 70 °C
Storage temperature Tstg
Input voltage VI –0.5 to VCC+0.5 V
Output volt age VO –0.5 to VCC+0.5 V
Power supply voltage VCC
Power dissipation per package PD Ta = 25°C 1.0 W
Output short circuit current IOS — 10 mA
—
relative to V
SS
–55 to 125 °C
–0.5 to 5 V
RECOMMENDED OPERAT IN G CO NDI T I O NS
(Ta = 0 to 70°C)
Parameter Symbol Condition Min. Typ. Max. Unit
VCC power supply voltage VCC 2.7 — 3.6 V
V
Input “H” level VIH 2.2 — VCC+0.5∗ V
Input “L” level VIL
= 2.7 to 3.6 V
CC
–0.5∗∗ — 0.6 V
Voltage is relative to VSS.
∗ : Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns.
∗∗ : -1.5V(Min.) when pulse width of undershoot i s l ess than 10ns.
PIN CAPACITANCE
(VCC = 3.0 V, Ta = 25°C, f = 1 MHz)
Parameter Symbol Condition Min. Typ. Max. Unit
Input C
BYTE# C
Output C
— — 12
IN1
IN2
V
OUT
V
= 0 V
I
= 0 V — — 12
O
— — 200
pF
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FEDR27T6402L-02-01
OKI Semiconductor
MR27T6402L / P2ROM
ELECTRICAL CHARACTERISTICS
DC Characte ristics
(VCC = 2.7 V to 3.6 V, Ta = 0 to 70°C)
Parameter Symbol Condition Min. Typ. Max. Unit
Input leakage current ILI V
Output leakage current ILO V
I
CE# = VCC — — 10 µA VCC power supply current
CCSC
(Standby)
V
power supply current
CC
(Read)
I
CE# = VIH — — 1 mA
CCST
I
CCA
Input “H” level VIH — 2.2 — VCC+0.5∗ V
Input “L” level VIL — –0.5∗∗ — 0.6 V
Output “H” level VOH I
Output “L” level VOL I
Voltage is relative to VSS.
∗ : Vcc+1.5V(Max.) when pulse width of overshoot i s l ess than 10ns.
∗∗ : -1.5V(M in.) when pulse width of undershoot is less than 10ns.
= 0 to VCC — — 10 µA
I
= 0 to VCC — — 10 µA
O
CE# = V
, OE# = V
IL
f=5MHz
= –1 mA 2. 4 — — V
OH
= 2 mA — — 0.4 V
OL
IH
— — 20 mA
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FEDR27T6402L-02-01
OKI Semiconductor
MR27T6402L / P2ROM
AC Characte ristics
(VCC = 2.7 V to 3.6 V, Ta = 0 to 70°C)
Parameter Symbol Condition Min. Max. Unit
Address cycle time tC — 90 — ns
Address access time t
CE# = OE# = V
ACC
IL
— 90 ns
CE# access time tCE OE# = VIL — 90 ns
OE# access time tOE CE# = VIL — 30 ns
t
OE# = VIL 0 30 ns
Output disabl e ti me
Output hold t ime tOH CE# = OE# = V
CHZ
CE# = VIL 0 25 ns
t
OHZ
IL
0 — ns
(VCC = 3.0 V to 3.6 V, Ta = 0 to 70°C)
Parameter Symbol Condition Min. Max. Unit
Address cycle time tC — 80 — ns
Address access time t
CE# = OE# = V
ACC
IL
— 80 ns
CE# access time tCE OE# = VIL — 80 ns
OE# access time tOE CE# = VIL — 30 ns
t
OE# = VIL 0 20 ns
Output disabl e ti me
Output hold t ime tOH CE# = OE# = V
CHZ
CE# = VIL 0 20 ns
t
OHZ
IL
0 — ns
Measurement conditions
Input signal level ------------------------------------0 V/3 V
Input timing reference level-----------------------1/2Vcc
Output load-------------------------------------------50 pF
Output timing reference level
Output load
Output
-------------------1/2Vcc
50 pF
(Including scope and jig)
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FEDR27T6402L-02-01
OKI Semiconductor
TIMING CHART (READ CYCLE)
16-BIT RE AD M ODE (BY T E# = VIH)
tC
A0 to A21
tCE
CE#
tOE
OE#
t
ACC
D0 to D15
8-BIT READ MODE (BYTE# = V
Hi-Z
tC
A-1 to A21
tCE
CE#
tOE
OE#
t
ACC
D0 to D7
Hi-Z
Valid Data
)
IL
Valid Data
t
t
OH
OH
t
ACC
t
ACC
MR27T6402L / P2ROM
t
C
tOH
t
CHZ
t
OHZ
Valid Data
t
C
Hi-Z
tOH
t
CHZ
t
OHZ
Valid Data
Hi-Z
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FEDR27T6402L-02-01
OKI Semiconductor
PACKAGE DIMENSIO NS
SOP44-P-600-1.27-K
Mirror finish
MR27T6402L / P2ROM
(Unit: mm)
Package material Epoxy resin
Lead frame material 42 alloy
5
Pin treatment
Package weight (g) 2.10 TYP.
Rev. No./Last Revised 4/Dec. 5, 1996
Solder plating (≥5µm)
Notes for Mounting the Surface Mount Type Package
The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in
storage.
Ther efore, before you p erform r eflow mou nting , contact Ok i’s res ponsible sales per son for th e product n ame,
package name, pin number, package code and desired mounting conditions (reflow method, temperature and
times).
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FEDR27T6402L-02-01
OKI Semiconductor
TSOP(1)48-P-1220-0.50-1K
Mirror finish
MR27T6402L / P2ROM
(Unit: mm)
Package material Epoxy resin
Lead frame material 42 alloy
5
Pin treatment
Package weight (g) 0.55 TYP.
Rev. No./Last Revised 1/Dec. 2, 1999
Solder plating (≥5µm)
Notes for Mounting the Surface Mount Type Package
The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in
storage.
Ther efore, before you p erform r eflow mou nting , contact Ok i’s res ponsible sales per son for th e product n ame,
package name, pin number, package code and desired mounting conditions (reflow method, temperature and
times).
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Page 9
FEDR27T6402L-02-01
OKI Semiconductor
REVISION HI S T O RY
Edition
Page
Current
Edition
Document
No.
FEDR27T6402L-02-01 May. 9, 2005 – – Fi nal edition 1
Date
Previous
MR27T6402L / P2ROM
Description
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Page 10
FEDR27T6402L-02-01
OKI Semiconductor
MR27T6402L / P2ROM
NOTICE
1. The information contained herein can change without notice owing to product and/or technical improvements.
Before using the product, please make sure that the information being referr ed to is up-to-date.
2. The outline of action and examples for application circuits described herein have been chosen as an
explanation f or the standa rd ac t io n and pe rformance of the produc t. When planning to us e the product, please
ensure that the external conditions are reflected in the actual circuit, assembly, and program designs.
3. When designing your product, please use our product below the specified maximum ratings an d within th e
speci fied op erat in g r an ge s incl udi n g, bu t not li mi t ed to, op er at i ng vol t a ge , p ower d is si pa ti on , and ope ra t in g
temperature.
4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation
resul ting from mi suse, negl ect, improper installa tion, repair , alterat ion or acciden t, improper handlin g, or
unusual phy s ical o r ele ct rical s tress inc ludi ng, b ut not limite d to , e xpos ure to pa rame ters b eyo nd the sp ec ifie d
maximum ratings or oper ation outside the specified operating range.
5. Neither indemnity against nor license of a third party’s industrial and intellectual property right, etc. is
granted by us in co nnection wit h the us e o f the p roduct and/o r t he info rmation a nd drawi ngs contai ned he rein.
No res po nsib ility is ass umed by u s fo r any infr inge me nt of a t hi rd p arty ’ s righ t w hic h may re sult f ro m the use
thereof.
6. Th e product s li sted in this docum en t are int ended for use in gener al el ectron ics equ ipmen t for com merci al
applications (e.g., office automation, communication equipment, measurement equipment, consumer
electronics , etc.). These pr od u cts are not authorized for u s e in any system or application tha t requires sp ecial
or enhanced quality an d reliability characteristics nor in any system or application where the failure of such
system or application may result in the loss or damage of property, or death or injury to humans.
Such applications i nc lude, but are not limited to, traffic and automotive equipme n t, safety devices , aerospace
equipment, nuclear power control, medical equipment, a nd life-support systems.
7. Cer ta in pr od uct s in th i s d ocu m en t may n eed gove r n m en t a pproval be fore th ey ca n be e xp or t ed t o pa r t i cul ar
countries. The purchaser assumes the responsibility of determining the legality of export of these products
and will take appropriate and necessary steps at their own expense for t hese.
8. No part of the contents contained herein may be reprinted or reproduced without our prior permission.
Copyright 2005 Oki Electric Industry Co., Ltd.
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