Datasheet MPXV5100, MPX5100 Datasheet (Motorola)

Freescale Semiconductor, Inc.

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated
and Calibrated

The MPX5100/MPXV5100 series piezoresistive transducer is a state-of­the-art monolithic silicon pressure sensor designed for a wide range of appli­cations, but particularly those employing a microcontroller or microprocessor
with A/D inputs. This patented, single element transducer combines advanced
micromachining techniques, thin-film metallization, and bipolar processing to
provide an accurate, high level analog output signal that is proportional to the
applied pressure.

Features

nc...

I

• 2.5% Maximum Error over 0° to 85°C

• Ideally suited for Microprocessor or Microcontroller-Based
Systems

• Patented Silicon Shear Stress Strain Gauge

• Available in Absolute, Differential and Gauge Configurations

• Ideal for Automotive and Non-Automotive Applications

V

S

GAIN STAGE #2

AND

GROUND

REFERENCE

SHIFT CIRCUITRY

SENSING
ELEMENT

THIN FILM

TEMPERATURE

COMPENSATION

AND

GAIN STAGE #1

cale Semiconductor,

PINS 1 AND 5 THROUGH 8 ARE NO CONNECTS
FOR SMALL OUTLINE PACKAGE

PINS 4, 5, AND 6 ARE NO CONNECTS FOR
UNIBODY PACKAGE

Frees

GND

Figure 1. Fully Integrated Pressure Sensor Schematic

Order number: MPX5100/D

Rev 9, 3/2004

MPX5100/MPXV5100

SERIES

INTEGRATED PRESSURE SENSOR

Differential 0 to 100 kPa (0 to 14.5 psi)
Absolute 15 to 115 kPa (2.18 to 16.68 psi)

0.2 to 4.7 Volts Output

UNIBODY PACKAGESMALL OUTLINE

PACKAGE

MPX5100D

CASE 867

MPXV5100GC6U

CASE 482A

MPX5100DP

CASE 867C

MPXV5100GC7U

V

out

CASE 482C

PIN NUMBER

1 N/C 5 N/C

2 V

3 GND 7 N/C

4 V

NOTE: Pins 1, 5, 6, 7, and
8 are internal device
connections. Do not
connect to external
circuitry or ground. Pin1 is
noted by the notch in the
lead.

out

S

6 N/C

8 N/C

MPX5100GSX

CASE 867F

PIN NUMBER

1 V

2 GND 5 N/C

3 V

NOTE: Pins 4, 5, and 6
are internal device
connections. Do not
connect to external
circuitry or ground. Pin1 is
noted by the notch in the
lead.

out

S

4 N/C

6 N/C

© Motorola, Inc. 2004

For More Information On This Product,

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MPX5100/MPXV5100 SERIES

Freescale Semiconductor, Inc.

Table 1. MAXIMUM RATINGS

Rating Symbol Value Unit

Maximum Pressure (P1 > P2)

Storage Temperature

Operating Temperature

NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device.

Table 2. OPERATING CHARACTERISTICS (V

shown in Figure 4 required to meet electrical specifications.)

Characteristic Symbol Min Typ Max Unit

Pressure Range

Gauge, Differential: MPX5100D/MPX5100G/MPXV5100G
Absolute: MPX5100A

Supply Voltage

Supply Current

Minimum Pressure Offset

@ V

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I

cale Semiconductor,

Frees

= 5.0 Volts

S

Full Scale Output

@ V

= 5.0 Volts

S

Full Scale Span

@ V

= 5.0 Volts

S

Accuracy

Sensitivity

Response Time

Output Source Current at Full Scale Output

Warm-Up Time

Offset Stability

NOTES:

1. 1.0kPa (kiloPascal) equals 0.145 psi.

2. Device is ratiometric within this specified excitation range.

3. Offset (V

4. Full Scale Output (V

5. Full Scale Span (V
minimum rated pressure.

6. Accuracy (error budget) consists of the following:

• Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.

• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is

• Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from

• TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C.

• TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.

• Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of V

7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.

8. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.

9. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.

(1)

(2)

(3)

(0 to 85°C)

(4)

Differential and Absolute (0 to 85°C)

(5)

Differential and Absolute (0 to 85°C)

(6)

(7)

(8)

(9)

) is defined as the output voltage at the minimum rated pressure.

off

applied.

) is defined as the output voltage at the maximum or full rated pressure.

FSO

) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the

FSS

(NOTE)

P

max

T

stg

T

A

= 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit

S

P

OP

V

S

I

o

V

off

V

FSO

V

FSS

— — — ± 2.5 %V

V/P — 45 — mV/kPa

t

R

I

o+

— — 20 — ms

— — ± 0.5 — %V

cycled to and from the minimum or maximum operating temperature points, with zero differential pressure

minimum or maximum rated pressure at 25°C.

0

15

4.75 5.0 5.25 Vdc

— 7.0 10 mAdc

0.088 0.20 0.313 Vdc

4.587 4.700 4.813 Vdc

— 4.500 — Vdc

— 1.0 — ms

— 0.1 — mAdc

400 kPa

–40° to +125° °C

–40° to +125° °C

—
—

FSS

100
115

at 25°C.

Table 3. MECHANICAL CHARACTERISTICS

Characteristics Typ Unit

Weight, Basic Element (Case 867)

Weight, Basic Element (Case 482)

4.0 grams

1.5 grams

kPa

FSS

FSS

2 Motorola Sensor Device Data MOTOROLA

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ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING

Figure 2 shows the sensor output signal relative to pressure
input. Typical, minimum, and maximum output curves are
shown for operation over a temperature range of 0° to 85°C
using the decoupling circuit shown in Figure 4. The output will
saturate outside of the specified pressure range.

Figure 3 illustrates both the Differential/Gauge and the Abso­lute Sensing Chip in the basic chip carrier (Case 867). A fluoro­silicone gel isolates the die surface and wire bonds from the
environment, while allowing the pressure signal to be transmit­ted to the sensor diaphragm.

Transfer Function MPX5100D/MPX5100G/MPXV5100G Series

5

V

= VS x (0.009 x P + 0.04)

out

± (Pressure Error x Temperature Factor x 0.009 x V

= 5.0 V ± 0.25 Vdc

V

S

4

PE = 2.5
TM = 1
Temperature = 0–85°C

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I

3

2

OUTPUT VOLTAGE (V)

1

MAX

MIN

MPX5100/MPXV5100 SERIES

The MPX5100/MPXV5100 series pressure sensor operating
characteristics, and internal reliability and qualification tests are
based on use of dry air as the pressure media. Media, other
than dry air, may have adverse effects on sensor performance
and long-term reliability. Contact the factory for information re­garding media compatibility in your application.

Figure 4 shows the recommended decoupling circuit for in­terfacing the output of the integrated sensor to the A/D input of
a microprocessor or microcontroller. Proper decoupling of the
power supply is recommended.

Figure 1.

)

S

TYPICAL

SPAN RANGE (TYP)

OUTPUT RANGE (TYP)

cale Semiconductor,

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FLUORO SILICONE

GEL DIE COAT

WIRE BOND

LEAD FRAME

0

0 10 20 30 40 50 60 70 80 90 100

Figure 2. Output versus Pressure Differential

DIE

DIFFERENTIAL/GAUGE ELEMENT

Figure 3. Cross-Sectional Diagrams

1.0 µF0.01 µF

PRESSURE (kPa)

STAINLESS STEEL

METAL COVER

EPOXY PLASTIC

CASE

DIE
BOND

(Not to Scale)

V

WIRE BOND

LEAD FRAME

+5 V

S

IPS

GND

FLUORO SILICONE

GEL DIE COAT

V

out

470 pF

110

DIE

ABSOLUTE ELEMENT

OUTPUT

OFFSET

(TYP)

STAINLESS STEEL

METAL COVER

EPOXY PLASTIC

CASE

DIE
BOND

Figure 4. Recommended Power Supply Decoupling and Output Filtering

(For additional output filtering, please refer to Application Note AN1646)

MOTOROLA Motorola Sensor Device Data 3

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MPX5100/MPXV5100 SERIES

Transfer Function (MPX5100D, MPX5100G, MPXV5100G)

Freescale Semiconductor, Inc.

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Nominal Transfer Value: V

± (Pressure Error x Temp. Mult. x 0.009 x VS)
V

Temperature Error Multiplier

4.0

3.0

2.0

1.0

0.0

NOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C.

Pressure Error Band

3.0

2.0

1.0

0.0

Error (kPa)

–1.0

–2.0

–3.0

= VS (P x 0.009 + 0.04)

out

= 5.0 V ± 5% P kPa

S

MPX5100D/MPX5100G/MPXV5100G Series

Temp Multiplier

–40 3
0 to 85 1
+125 3

–40 –20 0 20 40 60

Temperature in °C

MPX5100D/MPX5100G/MPXV5100G Series

Error Limits for Pressure

0 20 40 60 80 100

120

13012010080

140

Pressure in kPa

Pressure Error (max)

0 to 100 kPa ± 2.5 kPa

4 Motorola Sensor Device Data MOTOROLA

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Transfer Function (MPX5100A)

MPX5100/MPXV5100 SERIES

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cale Semiconductor,

Frees

Nominal Transfer Value: V

± (Pressure Error x Temp. Mult. x 0.009 x VS)
V

Temperature Error Multiplier

4.0

3.0

2.0

1.0

0.0

NOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C.

Pressure Error Band

3.0

2.0

1.0

0.0

Error (kPa)

-1.0

-2.0

-3.0

= VS (P x 0.009 – 0.095)

out

= 5.0 V ±5% P kPa

S

MPX5100A Series

Temp Multiplier

–40 3
0 to 85 1
+125 3

–40 –20 0 20 40 60

MPX5100A Series

Error Limits for Pressure

0 20 40 60 80 100

Temperature in °C

130

13012010080

140

Pressure in kPa

Pressure Error (max)

15 to 115 kPa ± 2.5 kPa

MOTOROLA Motorola Sensor Device Data 5

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MPX5100/MPXV5100 SERIES

Freescale Semiconductor, Inc.

PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE

Motorola designates the two sides of the pressure sensor as
the Pressure (P1) side and the Vacuum (P2) side. The Pressure
(P1) side is the side containing fluoro silicone gel which protects
the die from harsh media. The Motorola MPX pressure sensor

Part Number Case Type Pressure (P1) Side Identifier

MPX5100A, MPX5100D

MPX5100DP

MPX5100AP, MPX5100GP

MPX5100GSX

MPXV5100GC6U

MPXV5100GC7U

867C

867B

867F

482A

482C

ORDERING INFORMATION

The MPX5100/MPXV5100 pressure sensor is available in absolute, differential, gauge, and vacuum configurations.
Devices are available in the basic element package or with pressure port fittings that provide printed circuit board mount-

nc...

ing ease and barbed hose pressure connections.

I

is designed to operate with positive differential pressure
applied, P1 > P2.

The Pressure (P1) side may be identified by using the Table

below:

867

Stainless Steel Cap

Side with Part Marking

Side with Port Attached

Side with Port Attached

Side with Port Attached

Side with Port Attached

Device Name Options Case Type

Basic Element Absolute

Differential

Ported Elements Differential Dual Ports

Absolute, Single Port

Gauge, Single Port

Gauge, Axial PC Mount

Gauge, Axial Port, SMT

Gauge, Axial Port, DIP

INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)

cale Semiconductor,

Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct footprint,

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Frees

MPX Series

Order Number Device Marking

867

867

867C

867B

867B

867F

482A

482C

the packages will self align when subjected to a solder reflow
process. It is always recommended to design boards with a
solder mask layer to avoid bridging and shorting between solder
pads.

0.660

16.76

MPX5100A MPX5100A

MPX5100D MPX5100D

MPX5100DP MPX5100DP

MPX5100AP MPX5100AP

MPX5100GP MPX5100GP

MPX5100GSX MPX5100D

MPXV5100GC6U MPXV5100G

MPXV5100GC7U MPXV5100G

0.100 TYP 8X

2.54

0.060 TYP 8X

1.52

0.100 TYP 8X

2.54

Figure 5. SOP Footprint (Case 482)

6 Motorola Sensor Device Data MOTOROLA

inch

mm

0.300

7.62

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PACKAGE DIMENSIONS

MPX5100/MPXV5100 SERIES

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Frees

C

R

POSITIVE PRESSURE

M

B

J
S

-A-

SEATING
PLANE

STYLE 1:

PIN 1. VOUT

2. GROUND

3. VCC

4. V1

5. V2

6. VEX

PIN 1

-T-

123456

F

D

STYLE 2:

(P1)

N

G

6 PL

0.136 (0.005) T

PIN 1. OPEN

2. GROUND

3. -VOUT

4. VSUPPLY

5. +VOUT

6. OPEN

L

M

M

A

STYLE 3:

PIN 1. OPEN

NOTES:

2. GROUND

3. +VOUT

4. +VSUPPLY

5. -VOUT

6. OPEN

1.

DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.

2.
DIMENSION -A- IS INCLUSIVE OF THE MOLD

3.
STOP RING. MOLD STOP RING NOT TO EXCEED

16.00 (0.630).

MILLIMETERSINCHES

DIM

MIN

A

0.595

B

0.514

C

0.200

D

0.027

F

0.048

0.100 BSC 2.54 BSC

G
J

0.014

L

0.695
30˚ NOM 30˚ NOM

M
N

0.475

R

0.430

S

0.090

MAX

0.630

0.534

0.220

0.033

0.064

0.016

0.725

0.495

0.450

0.105

MAX

MIN

16.00

15.11

13.56

13.06

5.08

0.68

1.22

0.36

18.42

17.65

12.57

12.07

11.43

10.92

2.29 2.66

5.59

0.84

1.63

0.40

CASE 867-08

ISSUE N

BASIC ELEMENT

SEATING PLANE

T

A
U

L

R

N

V

Q

Q

B

1

2345

6

K

P

M

0.25 T

P

C

J

PIN 1

M

Q

G

F

6X

S

D

S

M

0.173 Q

P

T

NOTES:

DIMENSIONS ARE IN MILLIMETERS.

1.

2.

DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.

MILLIMETERS

MAX

MIN

DIM

A
B
C
D

F

G

J

K

L

N

P
Q
R

S
U

V

S

STYLE 1:

PIN 1. V

29.08

17.4

7.75

0.68

1.22

2.54 BSC

0.36

17.65

7.37

10.67

3.89

3.89

5.84

5.59

23.11 BSC

4.62

OUT

2. GROUND

3. VCC

4. V1

5. V2

6. VEX

29.85

18.16

8.26

0.84

1.63

0.41

18.42

7.62

11.18

4.04

4.04

6.35

6.1

4.93

CASE 867B-04

ISSUE F

CASE 867B-04

ISSUE F

PRESSURE SIDE PORTED (AP, GP)

DATE 09/20/99

MOTOROLA Motorola Sensor Device Data 7

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MPX5100/MPXV5100 SERIES

0.25 (0.010) T

X

PORT #1

POSITIVE

PRESSURE

(P1)

PORT #2

VACUUM

(P2)

SEATING

-T- -T-

PLANE

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Freescale Semiconductor, Inc.

P

M

M

Q

R

N

B

C

SEATING
PLANE

J

PIN 1

G

-A­U

W

123456

F

L

V

PORT #2 VACUUM (P2)
PORT #1 POSITIVE

PRESSURE (P1)

-Q-

6 PL

D

0.13 (0.005)

NOTES:

1.2.DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
CONTROLLING DIMENSION: INCH.

DIM MIN MAX MIN MAX

A 1.145 1.175 29.08 29.85
B 0.685 0.715 17.40 18.16
C 0.405 0.435 10.29 11.05
D 0.027 0.033 0.68 0.84

F 0.048 0.064 1.22 1.63

G 0.100 BSC 2.54 BSC

J 0.014 0.016 0.36 0.41

K 0.695 0.725 17.65 18.42

L 0.290 0.300 7.37 7.62

N 0.420 0.440 10.67 11.18

P 0.153 0.159 3.89 4.04
Q 0.153 0.159 3.89 4.04
R 0.063 0.083 1.60 2.11

S

0.220 0.240 5.59 6.10

K

S

M

M

A

U 0.910 BSC 23.11 BSC

V 0.182 0.194 4.62 4.93
W 0.310 0.330 7.87 8.38

X 0.248 0.278 6.30 7.06

STYLE 1:

PIN 1. VOUT

2. GROUND

3. V

4. V1

5. V2

6. V

MILLIMETERSINCHES

CC

EX

cale Semiconductor,

Frees

V

PORT #1

POSITIVE

PRESSURE

(P1)

CASE 867C-05

CASE 876C-05

ISSUE F

ISSUE F

PRESSURE AND VACUUM SIDES PORTED (DP)

C

E

J

-T-

-P-

0.25 (0.010) T

0.13 (0.005) Q

M

M

P

T

M

Q

6 PL

D

S

S

F

A
U

N

PIN 1

654321

S

K

G

NOTES:

1.2.DIMENSIONING AND TOLERANCING PER

-Q-

B

R

ANSI Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.

DIM

MIN

A

1.080

B

0.740

C

0.630

D

0.027

E

0.160

F

0.048

G

0.100 BSC 2.54 BSC

0.014

J

0.220

K

0.070

N

0.150

P

0.150

Q

0.440

R

0.695

S

0.840

U

0.182

V

STYLE 1:

PIN 1. V

DATE 12/12/96

MILLIMETERSINCHES

MIN

MAX

27.43

1.120

18.80

0.760

16.00

0.650

0.68

0.033

4.06

0.180

1.22

0.064

0.36

0.016

5.59

0.240

1.78

0.080

3.81

0.160

3.81

0.160

11.18

0.460

17.65

0.725

21.34

0.860

4.62

0.194

OUT

2. GROUND

3. VCC

4. V1

5. V2

6. V

EX

MAX

28.45

19.30

16.51

0.84

4.57

1.63

0.41

6.10

2.03

4.06

4.06

11.68

18.42

21.84

4.93

CASE 867F-03

CASE 867F-03

ISSUE D

ISSUE D

DATE 12/12/96

PRESSURE SIDE AXIAL PORT (GSX)

8 Motorola Sensor Device Data MOTOROLA

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MPX5100/MPXV5100 SERIES

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Frees

-A-

5

N

-B-

8

S

V

J

K

SMALL OUTLINE PACKAGE SURFACE MOUNT

-A-

5

N

-B-

8

S

J

4

G

1

V

4

G

1

C

M

C

M

DETAIL X

D

8 PL

0.25 (0.010) AT

0.25 (0.010) A

PIN 1
IDENTIFIER

M

W

PIN 1 IDENTIFIER

CASE 482A-01

CASE 482A-01

ISSUE A

ISSUE A

M

B

T

W

S

B

D 8 PL

S

DETAIL X

S

H

-T-

SEATING
PLANE

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).

5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.

DIM MIN MAX MIN MAX

A 10.540.4250.415 10.79
B 10.540.4250.415 10.79
C 12.700.5200.500 13.21
D 0.960.0420.038 1.07
G 0.100 BSC 2.54 BSC
H 0.002 0.010 0.05 0.25

J 0.009 0.011 0.23 0.28
K 0.061 0.071 1.55 1.80
M 0˚ 7˚ 0˚ 7˚
N 0.444 0.448 11.28 11.38
S 0.709 0.725 18.01 18.41
V 0.245 0.255 6.22 6.48
W 0.115 0.125 2.92 3.17

MILLIMETERSINCHES

DATE 05/13/98

NOTES:

DIMENSIONING AND TOLERANCING PER

1.
ANSI Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.

2.
DIMENSION A AND B DO NOT INCLUDE

3.
MOLD PROTRUSION.
MAXIMUM MOLD PROTRUSION 0.15 (0.006).

4.
ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.

5.
DIMENSION S TO CENTER OF LEAD WHEN

6.
FORMED PARALLEL.

S

SEATING

-T-

K

PLANE

MIN

DIM

0.415

A

0.415

B

0.500

C

0.026

D
G

0.100 BSC 2.54 BSC

0.009

J

0.100

K

0

M
N

0.444

S

0.540

V

0.245

W

0.115

MILLIMETERSINCHES

MAX

MIN

10.54

10.54

12.70

0.66

0.23

2.54

11.28

13.72

6.22

2.92

MAX

10.79

10.79

13.21

0.864

0.28

3.05

0

15

˚

˚

11.38

14.22

6.48

3.17

0.425

0.425

0.520

0.034

0.011

0.120
15

˚

˚

0.448

0.560

0.255

0.125

CASE 482C-03

CASE 482C-03

ISSUE B

ISSUE B

SMALL OUTLINE PACKAGE THROUGH-HOLE

DATE 06/12/9

MOTOROLA Motorola Sensor Device Data 9

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10 Motorola Sensor Device Data MOTOROLA

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MOTOROLA Motorola Sensor Device Data 11

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Information in this document is provided solely to enable system and software implementers to use Motorola products. There are no express or implied
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Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee

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