Datasheet MPX10GP, MPX10GS, MPX10GSX, MPX10D, MPX10DP Datasheet (Motorola)



SEMICONDUCTOR TECHNICAL DATA

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The MPX10 series device is a silicon piezoresistive pressure sensor providing a very
accurate and linear voltage output — directly proportional to the applied pressure. This
standard, low cost, uncompensated sensor permits manufacturers to design and add
their own external temperature compensating and signal conditioning networks.
Compensation techniques are simplified because of the predictability of Motorola’s single
element strain gauge design.

Features

• Low Cost

• Patented Silicon Shear Stress Strain Gauge Design

• Ratiometric to Supply Voltage

• Easy to Use Chip Carrier Package Options

• Differential and Gauge Options

Application Examples

• Air Movement Control

• Environmental Control Systems

• Level Indicators

• Leak Detection

• Medical Instrumentation

• Industrial Controls

• Pneumatic Control Systems

• Robotics

Figure 1 shows a schematic of the internal circuitry on the stand–alone pressure
sensor chip.

PIN 3

+ V

S

PIN 2

+ V

PIN 4

– V

out

out

X–ducer



0 to 10 kPa (0–1.45 psi)

35 mV FULL SCALE SPAN

(TYPICAL)

BASIC CHIP

CARRIER ELEMENT

CASE 344–15, STYLE 1

DIFFERENTIAL

PORT OPTION

CASE 344C–01, STYLE 1

NOTE: Pin 1 is the notched pin.

PIN NUMBER

1

Gnd

2

+V

out

3

V

4

–V

S

out

PIN 1

Figure 1. Uncompensated Pressure Sensor Schematic

VOLTAGE OUTPUT versus APPLIED DIFFERENTIAL PRESSURE

The differential voltage output of the X–ducer is directly proportional to the differential
pressure applied.

The output voltage of the differential or gauge sensor increases with increasing
pressure applied to the pressure side (P1) relative to the vacuum side (P2). Similarly,
output voltage increases as increasing vacuum is applied to the vacuum side (P2)
relative to the pressure side (P1).

Senseon and X–ducer are trademarks of Motorola, Inc.
REV 5

 Motorola, Inc. 1997

1Motorola Sensor Device Data

 

MAXIMUM RATINGS

Rating Symbol Value Unit

Overpressure
Burst Pressure
Storage Temperature T
Operating Temperature T

(8)

(P1 > P2) P

(8)

(P1 > P2) P

max

burst

stg

A

75 kPa

100 kPa
–40 to +125 °C
–40 to +125 °C

OPERATING CHARACTERISTICS (V

Characteristic

Differential Pressure Range

(5)

(2)

(3)

(6)

(10% to 90%) t

(9)

Supply Voltage
Supply Current I
Full Scale Span

(4)

Offset
Sensitivity ∆V/∆P — 3.5 — mV/kPa
Linearity
Pressure Hysteresis
Temperature Hysteresis
Temperature Coefficient of Full Scale Span
Temperature Coefficient of Offset
Temperature Coefficient of Resistance
Input Impedance Z
Output Impedance Z
Response Time
Warm–Up — — 20 — ms
Offset Stability

(1)

(5)

(0 to 10 kPa) — — ± 0.1 — %V

(5)

(–40°C to +125°C) — — ± 0.5 — %V

(5)

= 3.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2)

S

Symbol Min Typ Max Unit

P

OP

V

S

o

V

FSS

V

off

— –1.0 — 1.0 %V

(5)

(5)

TCV

FSS

TCV

off

TCR 0.21 — 0.27 %Zin/°C

in

out

R

— — ±0.5 — %V

0 — 10 kPa
— 3.0 6.0 Vdc
— 6.0 — mAdc
20 35 50 mV

0 20 35 mV

–0.22 — –0.16 %V

— ±15 — µV/°C

400 — 550 Ω
750 — 1250 Ω

— 1.0 — ms

MECHANICAL CHARACTERISTICS

Characteristic Symbol Min Typ Max Unit

Weight (Basic Element, Case 344–15) — — 2.0 — Grams
Common Mode Line Pressure

NOTES:

1. 1.0 kPa (kiloPascal) equals 0.145 psi.

2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self–heating.

3. Full Scale Span (V
minimum rated pressure.

4. Offset (V

5. Accuracy (error budget) consists of the following:

• Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified

• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is

• Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the

• TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.

• TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative

• TCR: Zin deviation with minimum rated pressure applied, over the temperature range of –40°C to +125°C,

6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.

7. Common mode pressures beyond specified may result in leakage at the case–to–lead interface.

8. Exposure beyond these limits may cause permanent damage or degradation to the device.

9. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.

) is defined as the output voltage at the minimum rated pressure.

off

(7)

) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the

FSS

pressure range.

cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.

minimum or maximum rated pressure, at 25°C.

to 25°C.

relative to 25°C.

— — — 690 kPa

FSS
FSS
FSS

FSS

FSS

/°C

2 Motorola Sensor Device Data

TEMPERATURE COMPENSATION

Figure 2 shows the typical output characteristics of the

MPX10 series over temperature.

The X–ducer piezoresistive pressure sensor element is a
semiconductor device which gives an electrical output signal
proportional to the pressure applied to the device. This de­vice uses a unique transverse voltage diffused semiconduc­tor strain gauge which is sensitive to stresses produced in a
thin silicon diaphragm by the applied pressure.

Because this strain gauge is an integral part of the silicon
diaphragm, there are no temperature effects due to differ­ences in the thermal expansion of the strain gauge and the
diaphragm, as are often encountered in bonded strain gauge
pressure sensors. However, the properties of the strain
gauge itself are temperature dependent, requiring that the
device be temperature compensated if it is to be used over
an extensive temperature range.

Temperature compensation and offset calibration can be
achieved rather simply with additional resistive components,

 

or by designing your system using the MPX2010D series
sensor.

Several approaches to external temperature compensa­tion over both – 40 to +125°C and 0 to + 80°C ranges are
presented in Motorola Applications Note AN840.

LINEARITY

Linearity refers to how well a transducer’s output follows
the equation: V
pressure range (Figure 3). There are two basic methods for
calculating nonlinearity: (1) end point straight line fit or (2) a
least squares best line fit. While a least squares fit gives the
“best case” linearity error (lower numerical value), the cal­culations required are burdensome.

Conversely, an end point fit will give the “worst case” error
(often more desirable in error budget calculations) and the
calculations are more straightforward for the user. Motorola’ s
specified pressure sensor linearities are based on the end
point straight line method measured at the midrange
pressure.

out

= V

+ sensitivity x P over the operating

off

80

70
60
50
40

OUTPUT (mVdc)

30
20
10

0

0

PSI
kPa

VS = 3 Vdc

P1 > P2

0.3

2.0

0.6

4.0

PRESSURE DIFFERENTIAL

+25°C

0.9

6.0

–40°C

+125°C

1.2

8.0 10

SPAN

RANGE

(TYP)

OFFSET

(TYP)

1.5

70

60

50

40

30

OUTPUT (mVdc)

20

10

0

0 MAX

LINEARITY

ACTUAL

THEORETICAL

PRESSURE (kPA)

Figure 2. Output versus Pressure Differential Figure 3. Linearity Specification Comparison

WIRE BOND

SILICONE
DIE COAT

DIE

P1

STAINLESS STEEL

METAL COVER

EPOXY

CASE

SPAN

(V

)

FSS

OFFSET

(V

)

OFF

P

OP

LEAD FRAME

Figure 4. Cross–Sectional Diagram (not to scale)

Figure 4 illustrates the differential or gauge configuration
in the basic chip carrier (Case 344–15). A silicone gel iso­lates the die surface and wire bonds from the environment,
while allowing the pressure signal to be transmitted to the sil­icon diaphragm.

The MPX10 series pressure sensor operating characteris-

RTV DIE

P2

BOND

tics and internal reliability and qualification tests are based
on use of dry air as the pressure media. Media other than dry
air may have adverse effects on sensor performance and
long term reliability. Contact the factory for information re­garding media compatibility in your application.

3Motorola Sensor Device Data

 

PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE

Motorola designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing silicone gel which
isolates the die from the environment. The Motorola MPX

Part Number Case Type Pressure (P1) Side Identifier

MPX10D 344–15C Stainless Steel Cap
MPX10DP 344C–01 Side with Part Marking
MPX10GP 344B–01 Side with Port Attached
MPX10GVP 344D–01 Stainless Steel Cap
MPX10GS 344E–01 Side with Port Attached
MPX10GSX 344F–01 Side with Port Attached

pressure sensor is designed to operate with positive differen­tial pressure applied, P1 > P2.

The Pressure (P1) side may be identified by using the table

below:

ORDERING INFORMATION

MPX10 series pressure sensors are available in differential and gauge configurations. Devices are available in the basic
element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure
connections.

MPX Series

Device Type Options Case Type

Basic Element Differential Case 344–15 MPX10D MPX10D
Ported Elements

Differential Case 344C–01 MPX10DP MPX10DP
Gauge Case 344B–01 MPX10GP MPX10GP
Gauge Vacuum Case 344D–01 MPX10GVP MPX10GVP
Gauge Stove Pipe Case 344E–01 MPX10GS MPX10D
Gauge Axial Case 344F–01 MPX10GSX MPX10D

Order Number Device Marking

4 Motorola Sensor Device Data

P ACKAGE DIMENSIONS

 

SEATING

PLANE

–T–

J

C

R

POSITIVE

PRESSURE (P1)

M

B

–A–

N

PIN 1

1234

L

–T–

SEATING

J

POSITIVE

PRESSURE

(P1)

PLANE

F

D

4 PL

0.136 (0.005) T

G

M

M

A

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION –A– IS INCLUSIVE OF THE MOLD
STOP RING. MOLD STOP RING NOT TO EXCEED

16.00 (0.630).

DIM MIN MAX MIN MAX

A 0.595 0.630 15.11 16.00
B 0.514 0.534 13.06 13.56
C 0.200 0.220 5.08 5.59
D 0.016 0.020 0.41 0.51
F 0.048 0.064 1.22 1.63
G 0.100 BSC 2.54 BSC
J 0.014 0.016 0.36 0.40
L 0.695 0.725 17.65 18.42
M 30 NOM 30 NOM

__

N 0.475 0.495 12.07 12.57
R 0.430 0.450 10.92 11.43

STYLE 1:

PIN 1. GROUND

MILLIMETERSINCHES

2. + OUTPUT

3. + SUPPLY

4. – OUTPUT

CASE 344–15

ISSUE W

–Q–

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5, 1982.

2. CONTROLLING DIMENSION: INCH.

2. + OUTPUT

3. + SUPPLY

4. – OUTPUT

MILLIMETERSINCHES

DIM MIN MAX MIN MAX

A 1.145 1.175 29.08 29.85
B 0.685 0.715 17.40 18.16
C 0.305 0.325 7.75 8.26
D 0.016 0.020 0.41 0.51
F 0.048 0.064 1.22 1.63

G 0.100 BSC 2.54 BSC

H 0.182 0.194 4.62 4.93
J 0.014 0.016 0.36 0.41
K 0.695 0.725 17.65 18.42
L 0.290 0.300 7.37 7.62
N 0.420 0.440 10.67 11.18
P 0.153 0.159 3.89 4.04

Q 0.153 0.159 3.89 4.04

R 0.230 0.250 5.84 6.35
S

0.220 0.240 5.59 6.10

U 0.910 BSC 23.11 BSC

STYLE 1:

PIN 1. GROUND

–A–

U

R

L

H

N

PORT #1

POSITIVE

PRESSURE

(P1)

B

PIN 1

12 34

K

–P–

0.25 (0.010) T

M

C

S

Q

F

G

D

4 PL

0.13 (0.005) Q

S

M

S

S

T

S

CASE 344B–01

ISSUE B

5Motorola Sensor Device Data

 

P ACKAGE DIMENSIONS — CONTINUED

R

PORT #2

SEATING
PLANE

–T– –T–

V

PORT #1

–A–

U

W

L

H

PORT #2

N

VACUUM

(P2)

PORT #1
POSITIVE PRESSURE
(P1)

–Q–

SEATING

B

PLANE

PIN 1

–P–

M

0.25 (0.010) T

Q

J

C

0.13 (0.005) Q

M

T

12 43

K

S

S

F

G

D

4 PL

S

S

S

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

DIM MIN MAX MIN MAX

A 1.145 1.175 29.08 29.85
B 0.685 0.715 17.40 18.16
C 0.405 0.435 10.29 11.05
D 0.016 0.020 0.41 0.51
F 0.048 0.064 1.22 1.63
G 0.100 BSC 2.54 BSC
H 0.182 0.194 4.62 4.93
J 0.014 0.016 0.36 0.41
K 0.695 0.725 17.65 18.42
L 0.290 0.300 7.37 7.62
N 0.420 0.440 10.67 11.18
P 0.153 0.159 3.89 4.04
Q 0.153 0.159 3.89 4.04
R 0.063 0.083 1.60 2.11
S

0.220 0.240 5.59 6.10

U 0.910 BSC 23.11 BSC
V 0.248 0.278 6.30 7.06

W 0.310 0.330 7.87 8.38

STYLE 1:

PIN 1. GROUND

2. + OUTPUT

3. + SUPPLY

4. – OUTPUT

MILLIMETERSINCHES

CASE 344C–01

ISSUE B

NOTES:

–A–

SEATING

–T–

PLANE

R

PORT #2
VACUUM

(P2)

N

U
L

H

POSITIVE

PRESSURE

(P1)

–Q–

B

PIN 1

12 34

K

S

C

–P–

J

0.25 (0.010) T

F

M

S

Q

G

D

4 PL

0.13 (0.005) Q

M

T

S

S

1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5, 1982.

2. CONTROLLING DIMENSION: INCH.

DIM MIN MAX MIN MAX

A 1.145 1.175 29.08 29.85
B 0.685 0.715 17.40 18.16
C 0.305 0.325 7.75 8.26
D 0.016 0.020 0.41 0.51
F 0.048 0.064 1.22 1.63

G 0.100 BSC 2.54 BSC

H 0.182 0.194 4.62 4.93
J 0.014 0.016 0.36 0.41
K 0.695 0.725 17.65 18.42
L 0.290 0.300 7.37 7.62
N 0.420 0.440 10.67 11.18
P 0.153 0.159 3.89 4.04

Q 0.153 0.158 3.89 4.04

R 0.230 0.250 5.84 6.35
S

0.220 0.240 5.59 6.10

U 0.910 BSC 23.11 BSC

STYLE 1:

PIN 1. GROUND

2. + OUTPUT

S

3. + SUPPLY

4. – OUTPUT

MILLIMETERSINCHES

CASE 344D–01

ISSUE B

6 Motorola Sensor Device Data

PORT #1

POSITIVE

PRESSURE

(P1)

–B–

 

P ACKAGE DIMENSIONS — CONTINUED

NOTES:

C

BACK SIDE

VACUUM

(P2)

V

K

N

SEATING

PLANE

R

–T–

J

F

G

4

A

32

1

PIN 1

S

4 PL

D

0.13 (0.005) T

M

B

M

1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

DIM MIN MAX MIN MAX

A 0.690 0.720 17.53 18.28
B 0.245 0.255 6.22 6.48
C 0.780 0.820 19.81 20.82
D 0.016 0.020 0.41 0.51
F 0.048 0.064 1.22 1.63
G 0.100 BSC 2.54 BSC

J 0.014 0.016 0.36 0.41
K 0.345 0.375 8.76 9.53
N 0.300 0.310 7.62 7.87
R 0.178 0.186 4.52 4.72
S

0.220 0.240 5.59 6.10

V 0.182 0.194 4.62 4.93

STYLE 1:

PIN 1. GROUND

2. + OUTPUT

3. + SUPPLY

4. – OUTPUT

MILLIMETERSINCHES

CASE 344E–01

ISSUE B

V

PORT #1
POSITIVE
PRESSURE
(P1)

C

E

A
U

–Q–

N

R

–T–

–P–

0.25 (0.010) T

M

M

Q

4321

PIN 1

S

K

J

F

D

4 PL

0.13 (0.005) Q

G

M

P

T

S

S

NOTES:

1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

DIM MIN MAX MIN MAX

A 1.080 1.120 27.43 28.45
B 0.740 0.760 18.80 19.30
C 0.630 0.650 16.00 16.51

B

D 0.016 0.020 0.41 0.51
E 0.160 0.180 4.06 4.57

F 0.048 0.064 1.22 1.63

G 0.100 BSC 2.54 BSC

J 0.014 0.016 0.36 0.41

K

0.220 0.240 5.59 6.10

N 0.070 0.080 1.78 2.03
P 0.150 0.160 3.81 4.06
Q 0.150 0.160 3.81 4.06
R 0.440 0.460 11.18 11.68
S 0.695 0.725 17.65 18.42
U 0.840 0.860 21.34 21.84
V 0.182 0.194 4.62 4.92

STYLE 1:

PIN 1. GROUND

2. V (+) OUT

3. V SUPPLY

4. V (–) OUT

MILLIMETERSINCHES

CASE 344F–01

ISSUE B

7Motorola Sensor Device Data

 

Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty , representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “T ypical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
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Opportunity/Affirmative Action Employer.

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8 Motorola Sensor Device Data

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MPX10/D