Datasheet MPIC2112P, MPIC2112DW Datasheet (Motorola)

1

Motorola Power Products Division Technical Data

Power Products Division

    

The MPIC2112 is a high voltage, high speed, power MOSFET and IGBT driver
with independent high and low side referenced output channels. Proprietary HVIC
and latch immune CMOS technologies enable ruggedized monolithic construction.
Logic inputs are compatible with standard CMOS or LSTTL outputs. The output
drivers feature a high pulse current buffer stage designed for minimum driver
cross–conduction. Propagation delays are matched to simplify use in high frequen­cy applications. The floating channel can be used to drive an N–channel power
MOSFET or IGBT in the high side configuration which operates from 10 to 600
volts.

• Floating Channel Designed for Bootstrap Operation

• Fully Operational to +600 V

• Tolerant to Negative Transient Voltage

• dV/dt Immune

• Gate Drive Supply Range from 10 to 20 V

• Undervoltage Lockout for Both Channels

• Separate Logic Supply

• Operating Supply Range from 5 to 20 V

• Logic and Power Ground Operating Offset Range from –5 to +5 V

• CMOS Schmitt–triggered Inputs with Pull–down

• Cycle by Cycle Edge–triggered Shutdown Logic

• Matched Propagation Delay for Both Channels

• Outputs in Phase with Inputs

PRODUCT SUMMARY

V

OFFSET 600 V MAX

I

O+/– 200 mA/400 mA

V

OUT 10 – 20 V

t

on/off

(typical)

125 & 105 ns

Delay Matching

30 ns

PIN CONNECTIONS

(TOP VIEW)

8

HO

9

V

DD

10

HIN

11

SD

12

LIN

13

V

SS

14

7
6
5
4
3
2
1

V

B

V

S

V

CC

COM

LO

9

HO

V

DD

11

HIN

12

SD

13

LIN

14

V

SS

15

8
7
6
5
4
3
2

V

B

V

S

V

CC

COM

LO

14 LEADS PDIP MPIC2112P

16 1

10

16 LEADS SOIC (WIDE BODY)

MPIC2112DW

Order this document

by MPIC2112/D



SEMICONDUCTOR TECHNICAL DATA



Device

Package

HIGH AND LOW

SIDE DRIVER

ORDERING INFORMATION

MPIC2112P PDIP

MPIC2112DW SOIC WIDE

DW SUFFIX

PLASTIC PACKAGE

CASE 751G–02

SOIC – WIDE

16

1

P SUFFIX

PLASTIC PACKAGE

CASE 646–06

14

1

 Motorola, Inc. 1996

MPIC2112

2

Motorola Power Products Division Technical Data

SIMPLIFIED BLOCK DIAGRAM

PULSE

GEN

UV

DETECT

PULSE
FILTER

HV

LEVEL

SHIFT

COM

LO

V

CC

V

S

V

B

HO

R
R

S

Q

V

DD

HIN

SD

LIN

V

SS

UV

DETECT

DELAY

VDD/V

CC

LEVEL

SHIFT

VDD/V

CC

LEVEL

SHIFT

R Q

S

R Q

S

ABSOLUTE MAXIMUM RATINGS

Absolute Maximum Ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are absolute
voltages referenced to COM. The Thermal Resistance and Power Dissipation ratings are measured under board mounted and still air
conditions.

Rating

Symbol Min Max Unit

High Side Floating Absolute Voltage

V

–0.3

625

V

High Side Floating Absolute Voltage
High Side Floating Supply Offset Voltage

V

B

V

–0.3

V

–25

625

V

+0.3

V

DC

High Side Floating Supply Offset Voltage
High Side Floating Output Voltage

V

S

V

HO

VB–25

VS–0.3

VB+0.3
VB+0.3

High Side Floating Output Voltage
Low Side Fixed Supply Voltage

V

HO

V

CC

VS–0.3

–0.3

VB+0.3

25

Low Side Fixed Supply Voltage
Low Side Output Voltage

V

CC

V

LO

–0.3
–0.3

25

VCC+0.3

LO

V

DD

CC

+0.3

VSS+25

DD

V

SS

SS

+25

VCC+0.3

Logic Input Voltage (HIN, LIN & SD)

SS

V

IN

CC

–25

VSS–0.3

CC

+0.3

VDD+0.3

Allowable Offset Supply Voltage Transient dVS/dt – 50 V/ns
*Package Power Dissipation @ TA ≤ +25°C (14 Lead DIP)

(16 SOIC–WIDE)

P

D

–

–
–

1.6

1.25

Watt

Thermal Resistance, Junction to Ambient (14 Lead DIP)

(16 SOIC–WIDE)

R

θJA

–
–

75

100

°C/W

Operating and Storage Temperature Tj, T

stg

–55 150 °C

Lead Temperature for Soldering Purposes, 10 seconds T

L

– 260 °C

RECOMMENDED OPERATING CONDITIONS

The Input/Output logic timing Diagram is shown in Figure 1. For proper operation the device should be used within the recommended condi­tions. The VS and VSS offset ratings are tested with all supplies biased at 15 V differential.

High Side Floating Supply Absolute Voltage

V

B

VS+10 VS+20

High Side Floating Supply Offset Voltage V

S

Note 1 600

High Side Floating Output Voltage V

HO

V

S

V

B

Low Side Fixed Supply Voltage V

CC

10 20

Low Side Output Voltage V

LO

0 V

CC

Logic Supply Voltage V

DD

VSS+5 VSS+20

Logic Supply Offset Voltage V

SS

–5 5

Logic Input Voltage (HIN, LIN & SD) V

IN

V

SS

V

DD

Ambient Temperature T

A

–40 125 °C

Note 1: Logic operational for VS of –5 to +600 V. Logic state held for VS of –5 V to –VBS.

Logic Supply Voltage
Logic Supply Offset Voltage

–0.3

VCC–25

V

MPIC2112

3

Motorola Power Products Division Technical Data

ELECTRICAL CHARACTERISTICS (T

C

= 25°C unless otherwise specified)

Characteristic

Symbol Min Typ Max Unit

STATIC ELECTRICAL CHARACTERISTICS – SUPPLY CHARACTERISTICS

V

BIAS

(VCC, V

BS, VDD

) = 15 V and VSS = COM unless otherwise specified. The VIN, VTH and IIN parameters are referenced to VSS and are
applicable to all three logic input leads: HIN, LIN and SD. The VO and IO parameters are referenced to COM or VSS and are applicable to
the respective output leads: HO or LO.

Logic “1” Input Voltage V

IH

9.5 – –

Logic “0” Input Voltage V

IL

– – 6.0

High Level Output Voltage, V

BIAS–VO

@ VIN = VIH, IO = 0 A V

OH

– – 100

Low Level Output Voltage, VO @ VIN = VIL, IO = 0 A V

OL

– – 100

Offset Supply Leakage Current @ VB = VS = 600 V I

LK

– – 50

µA

Quiescent VBS Supply Current @ VIN = 0 V or V

DD

I

QBS

– 25 60

Quiescent VCC Supply Current @ VIN = 0 V or V

DD

I

QCC

– 80 180

Quiescent VDD Supply Current @ VIN = 0 V or V

DD

I

QDD

– 2.0 5.0

Logic “1” Input Bias Current @ VIN = 15 V I

IN+

– 20 40

Logic “0” Input Bias Current @ VIN = 0 V I

IN–

– – 1.0

VBS Supply Undervoltage Positive Going Threshold V

BSUV+

7.4 – 9.6

VBS Supply Undervoltage Negative Going Threshold V

BSUV–

7.0 – 9.2

VCC Supply Undervoltage Positive Going Threshold V

CCUV+

7.6 – 9.6

VCC Supply Undervoltage Negative Going Threshold V

CCUV–

7.2 – 9.2

Output High Short Circuit Pulsed Current

@ V

OUT

= 0 V, VIN = 15 V, PW ≤10 µs

I

O+

200 250 –

Output Low Short Circuit Pulsed Current

@ V

OUT

= 15 V, VIN = 0 V, PW ≤ 10 µs

I

O–

420 500 –

DYNAMIC ELECTRICAL CHARACTERISTICS

V

BIAS

(VCC, VBS, VDD) = 15 V and VSS = COM unless otherwise specified. TA = 25°C.

Turn–On Propagation Delay @ VS = 0 V t

on

– 125 180

Turn–Off Propagation Delay @ VS = 600 V t

off

– 105 160

Shutdown Propagation Delay @ VS = 600 V t

sd

– 105 160

Turn–On Rise Time @ CL = 1000 pF t

r

– 80 130

Turn–Off Fall Time @ CL = 1000 pF t

f

– 40 65

Delay Matching, HS & LS Turn–On/Off MT – – 30

TYPICAL CONNECTION

TO

LOAD

10 TO 600 V

V

DD

HIN
SD

V

SS

V

S

HO

V

B

LIN

V

DD

HIN

SD

V

SS

LIN

V

CC

LO

V

CC

COM

V

mV

V

mA

ns

MPIC2112

4

Motorola Power Products Division Technical Data

LEAD DEFINITIONS

Symbol Lead Description

V

DD

Logic Supply

HIN Logic Input for High Side Gate Driver Output (HO), In Phase

SD Logic Input for Shutdown

LIN Logic Input for Low Side Gate Driver Output (LO), In Phase

V

SS

Logic Ground

V

B

High Side Floating Supply
HO High Side Gate Drive Output
V

S

High Side Floating Supply Return

V

CC

Low Side Supply
LO Low Side Gate Drive Output

COM Low Side Return

Figure 1. Input / Output Timing Diagram

Figure 2. Switching Time Waveform

Definitions

Figure 3. Deadtime Waveform Definitions

HIN
LIN

SD

HO
LO

HIN
LIN

HO
LO

10% 10%

90% 90%

t

on

t

r

50% 50%

t

off

t

f

Figure 4. Delay Matching Waveform

Definitions

50%

90%

HO
LO

SD

t

sd

10%

50%50%

90%

HIN
LIN

LO HO

LO HO

MT MT

MPIC2112

5

Motorola Power Products Division Technical Data

PACKAGE DIMENSIONS

CASE 646–06

ISSUE L

NOTES:

1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.

2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.

3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.

4. ROUNDED CORNERS OPTIONAL.

1 7

14 8

B

A

F

H G D

K

C

N

L

J

M

SEATING
PLANE

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A 0.715 0.770 18.16 19.56
B 0.240 0.260 6.10 6.60
C 0.145 0.185 3.69 4.69
D 0.015 0.021 0.38 0.53

F 0.040 0.070 1.02 1.78
G 0.100 BSC 2.54 BSC
H 0.052 0.095 1.32 2.41
J 0.008 0.015 0.20 0.38
K 0.115 0.135 2.92 3.43
L 0.300 BSC 7.62 BSC
M 0 10 0 10
N 0.015 0.039 0.39 1.01

_ _ _ _

CASE 751G–02

ISSUE A

DIM MIN MAX MIN MAX

INCHESMILLIMETERS

A 10.15 10.45 0.400 0.411
B 7.40 7.60 0.292 0.299
C 2.35 2.65 0.093 0.104
D 0.35 0.49 0.014 0.019
F 0.50 0.90 0.020 0.035
G 1.27 BSC 0.050 BSC
J 0.25 0.32 0.010 0.012
K 0.10 0.25 0.004 0.009
M 0 7 0 7
P 10.05 10.55 0.395 0.415
R 0.25 0.75 0.010 0.029

M

B

M

0.010 (0.25)

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.

–A–

–B– P8X

G14X

D16X

SEATING
PLANE

–T–

S

A

M

0.010 (0.25) B

S

T

16 9

81

F

J

R

X 45

_

_ _ _ _

M

C

K

MPIC2112

6

Motorola Power Products Division Technical Data

Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty , representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability , including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
Opportunity/Affirmative Action Employer.

How to reach us:
USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center,

P.O. Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 or 602–303–5454 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–81–3521–8315

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INTERNET: http://Design–NET.com 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298

MPIC2112/D

*MPIC2112/D*

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