Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
G(f)
P
T
channel
T
DS
DG
GS
D
,
stg
30Vdc
30Vdc
30Vdc
50mAdc
350
2.8
− 65 to +150°C
mW
mW/°C
2 SOURCE
3
GATE
1 DRAIN
TO−92 (TO−226AA)
1
2
3
CASE 29−11
STYLE 5
MARKING DIAGRAM
MPF
439x
AYWW G
G
MPF439x = Device Code
A= Assembly Location
Y= Year
WW= Work Week
G= Pb−Free Package
(Note: Microdot may be in either location)
x = 2 or 3
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
(ID = 6.0 mAdc, VGS = 0)MPF4392
(ID = 3.0 mAdc, VGS = 0)MPF4393
Static Drain−Source On Resistance
(ID = 1.0 mAdc, VGS = 0)MPF4392
MPF4393
SMALL− SIGNAL CHARACTERISTICS
Forward Transfer Admittance
(VDS = 15 Vdc, ID = 25 mAdc, f = 1.0 kHz)MPF4392
(VDS = 15 Vdc, ID = 5.0 mAdc, f = 1.0 kHz)MPF4393
Drain−Source “ON” Resistance
(VGS = 0, ID = 0, f = 1.0 kHz)MPF4392
MPF4393
Input Capacitance (VGS = 15 Vdc, VDS = 0, f = 1.0 MHz)C
Reverse Transfer Capacitance
(VGS = 12 Vdc, VDS = 0, f = 1.0 MHz)
(VDS = 15 Vdc, ID = 10 mAdc, f = 1.0 MHz)
SWITCHING CHARACTERISTICS
Rise Time (See Figure 2)
(I
= 6.0 mAdc)MPF4392
D(on)
(I
= 3.0 mAdc)MPF4393
D(on)
Fall Time (See Figure 4)
(V
= 7.0 Vdc)MPF4392
GS(off)
(V
= 5.0 Vdc)MPF4393
GS(off)
Turn−On Time (See Figures 1 and 2)
(I
= 6.0 mAdc)MPF4392
D(on)
(I
= 3.0 mAdc)MPF4393
D(on)
Turn−Off Time (See Figures 3 and 4)
(V
= 7.0 Vdc)MPF4392
GS(off)
(V
= 5.0 Vdc)MPF4393
GS(off)
1. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 3.0%.
V
(BR)GSS
I
GSS
I
D(off)
V
I
DSS
V
DS(on)
r
DS(on)
|yfs|
r
ds(on)
C
t
t
on
off
GS
iss
rss
t
r
t
30−−Vdc
−
−
−
−
−
−
−
−
1.0
0.2
1.0
0.1
nAdc
mAdc
nAdc
mAdc
Vdc
−2.0
−0.5
−
−5.0
−
−3.0
mAdc
25
5.0
−
−
75
30
Vdc
−
−
−
−
0.4
0.4
W
−
−
−
−
60
100
mmhos
−
−
17
12
−
−
W
−
−
−
−
60
100
−6.010pF
pF
−
−
2.5
3.2
3.5
−
ns
−
−
f
−
−
2.0
2.5
15
29
5.0
5.0
ns
20
35
ns
−
−
4.0
6.5
15
15
ns
−
−
20
37
35
55
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2
Page 3
MPF4392, MPF4393
TYPICAL SWITCHING CHARACTERISTICS
1000
500
200
100
50
20
10
, TURN−ON DELAY TIME (ns)
5.0
d(on)
t
2.0
1.0
0.51.03.07.0
0.72.01020
RK = RD′
RK = 0
ID, DRAIN CURRENT (mA)
Figure 1. Turn−On Delay TimeFigure 2. Rise Time
1000
500
200
100
50
20
10
, TURN−OFF DELAY TIME (ns)
5.0
d(off)
t
2.0
1.0
0.51.03.07.05.0
0.72.01020 3050
RK = RD′
RK = 0
ID, DRAIN CURRENT (mA)
Figure 3. Turn−Off Delay TimeFigure 4. Fall Time
TJ = 25°C
MPF4392
MPF4393
5.0
TJ = 25°CTJ = 25°C
MPF4392
MPF4393
V
GS(off)
V
GS(off)
= 7.0 V
= 5.0 V
3050
= 7.0 V
= 5.0 V
1000
500
200
100
50
20
, RISE TIME (ns)
r
t
10
5.0
2.0
1.0
0.51.03.07.0
0.72.01020 3050
1000
500
200
100
50
20
, FALL TIME (ns)
f
10
t
5.0
2.0
1.0
0.51.03.07.05.0
0.72.01020 3050
RK = RD′
RK = 0
ID, DRAIN CURRENT (mA)
RK = RD′
RK = 0
ID, DRAIN CURRENT (mA)
5.0
TJ = 25°C
MPF4392
MPF4393
MPF4392
MPF4393
V
GS(off)
V
GS(off)
= 7.0 V
= 5.0 V
= 7.0 V
= 5.0 V
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3
Page 4
MPF4392, MPF4393
NOTE 1
V
DD
R
D
INPUT
R
GEN
50 W
50
≤ 0.25 ns
t
r
tf ≤ 0.5 ns
W
V
GEN
INPUT PULSE
PULSE WIDTH = 2.0 ms
DUTY CYCLE ≤ 2.0%
SET V
= 10 V
DS(off)
R
K
RGG & R
RD′ = RD(RT + 50)
R
GG
V
GG
K
RD + RT + 50
Figure 5. Switching Time Test Circuit
20
MPF4392
10
7.0
5.0
3.0
, FORWARD TRANSFER ADMITTANCE (mmhos)
fs
y
2.0
MPF4393
T
= 25°C
channel
VDS = 15 V
0.51.03.07.05.05030
0.72.01020
ID, DRAIN CURRENT (mA)
The switching charact eristics shown above were measured using a
test circuit similar to Figure 5. At the beginning of th e switching
interval, the gate voltage is at Gate Supply Voltage (−VGG). The
Drain−Source Voltage (V
Voltage (V
Capacitance (C
V
R
T
OUTPUT
50
W
+ VDS.
GG
During the turn−on interval, Gate−Source Capacitance (C
discharges through the series combination of R
must discharge to V
parallel combination of effective load impedance (R′
) due to the voltage divider. Thus Reverse Transfer
DD
) or Gate−Drain Capacitance (Cgd) is charged to
rss
Drain−Source Resistance (r
) is slightly lower than Drain Supply
DS
through RG and RK in series with the
DS(on)
). During the turn−off, this charge
ds
Gen
and RK. C
) and
D
)
gs
gd
flow is reversed.
Predicting turn−on time is somewhat difficult as the channel
resistance r
discharges, VGS approaches zero and rds decreases. Since C
is a function of the gate−source voltage. While C
ds
gs
gd
discharges t hrough rds, turn−on t ime i s n on−linear. During turn−off,
the situation is reversed with r
increasing as Cgd charges.
ds
The above switching curves show two impedance conditions:
1) RK is equal to RD′ which simulates the switching behavior of
cascaded stages where t he d riving source impedance i s normally t he
load impedance of the previous stage, and 2) RK = 0 (low
impedance) the driving source impedance is that of the generator.
15
C, CAPACITANCE (pF)
7.0
5.0
3.0
2.0
1.5
1.0
10
T
= 25°C
channel
(Cds IS NEGLIGIBLE)
0.51.03.0305.00.30.1100.050.03
VR, REVERSE VOLTAGE (VOLTS)
C
gs
C
gd
200
160
120
80
RESISTANCE (OHMS)
40
ds(on)
r, DRAIN−SOURCE ON−STATE
0
Figure 6. Typical Forward Transfer Admittance
I
DSS
= 10
mA
50 mA 75 mA 100 mA125 mA
25
mA
1.03.05.02.0
VGS, GATE−SOURCE VOLTAGE (VOLTS)
4.00
T
= 25°C
channel
6.07.08.0
Figure 8. Effect of Gate−Source Voltage
On Drain−Source Resistance
http://onsemi.com
2.0
1.8
1.6
1.4
1.2
1.0
, DRAIN−SOURCE ON−STATE
0.8
RESISTANCE (NORMALIZED)
ds(on)
r
0.6
0.4
4
Figure 7. Typical Capacitance
ID = 1.0 mA
VGS = 0
5017020−10−4080140−70
T
, CHANNEL TEMPERATURE (°C)
channel
110
Figure 9. Effect of Temperature On
Drain−Source On−State Resistance
Page 5
MPF4392, MPF4393
.
f
l
t
100
90
80
70
60
50
40
30
, DRAIN−SOURCE ON−STATE
RESISTANCE (OHMS)
20
ds(on)
r
10
0
10
T
= 25°C
channel
r
@ VGS = 0
DS(on)
V
GS(off)
70
30 40 50 60
20
I
, ZERO−GATE VOLTAGE DRAIN CURRENT (mA)
DSS
Figure 10. Effect of I
80 90 100 110 120 130 140 150
On Drain−Source
DSS
Resistance and Gate−Source Voltage
10
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
1.0
0
NOTE 2
The Zero−Gate−Voltage Drain Current (I
principle determinant of other J−FET characteristics
Figure 10 shows the relationship of Gate−Source Of
Voltage (V
(r
) to I
ds(on)
of the values shown in Figure 10. This data will be usefu
(VOLTS)
in predicting the characteristic variations for a given par
number.
, GATE−SOURCE VOLTAGE
For example:
GS
V
Unknown
r
) and Drain−Source On Resistance
GS(off)
. Most of the devices will be within ±10%
DSS
and VGS range for an MPF4392
ds(on)
The electrical characteristics table indicates that an
MPF4392 has an I
shows r
= 52 W for I
ds(on)
range of 25 to 75 mA. Figure 10
DSS
= 25 mA and 30 W for I
DSS
75 mA. The corresponding VGS values are 2.2 V and
4.8 V.
DSS
), is the
DSS
http://onsemi.com
5
Page 6
MPF4392, MPF4393
PACKAGE DIMENSIONS
TO−92 (TO−226)
CASE 29−11
ISSUE AL
SEATING
PLANE
A
B
R
P
L
K
XX
V
1
G
H
C
N
D
J
SECTION X−X
N
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P AND
BEYOND DIMENSION K MINIMUM.
DIM MINMAXMINMAX
A 0.175 0.2054.455.20
B 0.170 0.2104.325.33
C 0.125 0.1653.184.19
D 0.016 0.021 0.407 0.533
G 0.045 0.0551.151.39
H 0.095 0.1052.422.66
J0.015 0.0200.390.50
K 0.500−−− 12.70−−−
L0.250−−−6.35−−−
N 0.080 0.1052.042.66
P−−− 0.100−−−2.54
R0.115−−−2.93−−−
V 0.135−−−3.43−−−
STYLE 5:
PIN 1. DRAIN
2. SOURCE
3. GATE
MILLIMETERSINCHES
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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MPF4392/D
6
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