Datasheet MP04TT500-28, MP04TT500-25, MP04TT500-26, MP04TT500-27 Datasheet (DYNEX)

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FEATURES

■ Dual Device Module

■ Electrically Isolated Package

■ Pressure Contact Construction

■ International Standard Footprint

■ Alumina (Non Toxic) Isolation Medium

■ Integral Water Cooled Heatsink

APPLICATIONS

■ Motor Control

■ Controlled Rectifier Bridges

■ Heater Control

■ AC Phase Control

VOLTAGE RATINGS

ORDERING INFORMATION

Order As:

MP04TT500-XX-W2 1/4 - 18 NPT connection
MP04TT500-XX-W3 1/4 - 18 NPT connection
MP04TT500-XX-W3A 1/4 - 18 NPT water connection

thread

XX shown in the part number about represents V

DRM

/100

selection required, eg. MP04TT500-27-W2
Note: When ordering, please use the complete part number.

KEY PARAMETERS
V

DRM

2800V

I

T(AV)(per arm)

480A

I

TSM(per arm)

11200A

I

T(RMS)(per arm)

753A

V

isol

3000V

MP04TT500

Dual Thyristor Water Cooled Module

Advance Information

DS5446-1.2 May 2001

Fig. 1 TT Circuit diagram

Fig. 2 Module package variants - (not to scale)

Module outline type code: MP04-W2

(See Package Details for further information)

2800
2700
2600
2500

MP04TT500-28
MP04TT500-27
MP04TT500-26
MP04TT500-25

Conditions

T

vj

= 0˚ to 125˚C,

I

DRM

= I

RRM

= 50mA

V

DSM

= V

RSM

=

V

DRM

= V

RRM

+ 100V

respectively

Lower voltage grades available

Type Number Repetitive Peak

Voltages
V

DRM VRRM

V

5 (G1)

6 (G2)

4 (K1)

7 (K2)

3 (A)

2 (A)

1 (AK)

Module outline type code:

MP04-W3

Module outline type code:

MP04-W3A

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Parameter

Mean on-state current

RMS value

Surge (non-repetitive) on-current

I

2

t for fusing

Surge (non-repetitive) on-current

I

2

t for fusing

Isolation voltage

Test Conditions

Half wave resistive load, T

water (in)

= 25˚C

4.5 Ltr/min T

water (in)

= 40˚C

T

water (in)

= 25˚C @ 4.5 Ltr/min

T

water (in)

= 40˚C @ 4.5 Ltr/min

10ms half sine, T

j

= 125˚C

V

R

= 0

10ms half sine, T

j

= 125˚C

V

R

= 50% V

DRM

Commoned terminals to base plate.
AC RMS, 1 min, 50Hz

Symbol

I

T(AV)

I

T(RMS

I

TSM

I2t

I

TSM

I2t

V

isol

Units

A

A

A

A

kA

A

2

s

kA

A

2

s

V

Max.

540

480

845

753

11.25

633 x 10

3

9

506 x 10

3

3000

Test Conditions

dc, 4.5 Ltr/min

Half wave, 4.5 Ltr/min

3 Phase, 4.5 Ltr/min

Reverse (blocking)

-

Mounting - M6

Electrical connections - M10

Parameter

Thermal resistance - junction to water

(per thyristor)

Virtual junction temperature

Storage temperature range

Screw torque

THERMAL AND MECHANICAL RATINGS

ABSOLUTE MAXIMUM RATINGS - PER ARM

Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme
conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety
precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability.

Symbol

R

th(j-w)

T

vj

T

stg

-

Units

˚C/kW

˚C/kW

˚C/kW

˚C

˚C

Nm (lb.ins)

Nm (lb.ins)

Max.

0.102

0.106

0.112

125

125

-

12 (106)

Min.

-

-

-

-

–40

6 (53)

-

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Units

mA

V/µs

A/µs

V

mΩ

Test Conditions

t V

RRM/VDRM

, Tj = 125˚C

To 67% V

DRM

, Tj = 125˚C

From 67% V

DRM

to 500A, gate source 10V, 5Ω

t

r

= 0.5µs, Tj = 125˚C

At T

vj

= 125˚C

At T

vj

= 125˚C

Parameter

Peak reverse and off-state current

Linear rate of rise of off-state voltage

Rate of rise of on-state current

Threshold voltage. (See note 1)

On-state slope resistance. (See note 1)

DYNAMIC CHARACTERISTICS

Symbol

I

RRM/IDRM

dV/dt

dI/dt

V

T(TO)

r

T

Max.

50

1000

500

0.91

0.65

Min.

-

-

-

-

-

Parameter

Gate trigger voltage

Gate trigger current

Gate non-trigger voltage

Peak forward gate voltage

Peak forward gate voltage

Peak reverse gate voltage

Peak forward gate current

Peak gate power

Mean gate power

Test Conditions

V

DRM

= 5V, T

case

= 25oC

V

DRM

= 5V, T

case

= 25oC

At V

DRM Tcase

= 125oC

Anode positive with respect to cathode

Anode negative with respect to cathode

-

Anode positive with respect to cathode

See table fig. 5

-

Symbol

V

GT

I

GT

V

GD

V

FGM

V

FGN

V

RGM

I

FGM

P

GM

P

G(AV)

GATE TRIGGER CHARACTERISTICS AND RATINGS

Max.

3.5

200

0.25

30

0.25

5

10

150

10

Units

V

mA

V

V

V

V

A

W

W

Note 1: The data given in this datasheet with regard to forward voltage drop is for calculation of the power dissipation in the

semiconductor elements only. Forward voltage drops measured at the power terminals of the module will be in excess of these

figures due to the impedance of the busbar from the terminal to the semiconductor.

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20

15

10

5

0

Peak half sine wave on-state current - (kA)

11012345

50

ms Cycles at 50Hz

Duration

250

300

I

2

t value - (A

2

s x 10

3

)

I2t

I2t = Î2 x t
2

350

25

400

10 20 30

Fig. 6 Transient thermal impedance - dc

Fig. 3 Maximum (limit) on-state characteristics Fig. 4 Surge (non-repetitive) on-state current vs time

(with 50% V

RSM

at T

case

= 125˚C)

Fig. 5 Gate characteristics

0.5 1.0 1.5 2.0 2.5
Instantaneous on-state voltage, V

T

- (V)

0

500

1000

1500

2000

2500

Instantaneous on-state current, I

T

- (A)

1 2

1: Tj = 125˚C Min
2: T

j

= 125˚C Max

Measured under pulse
conditions

1010.10.010.001

Gate trigger current, I

GT

- (A)

100

10

1

0.1

Gate trigger voltage V

GT

- (V)

Region of certain

triggering

Upper limit 99%

Lower limit 99%

T

j

= 125˚C

T

j

= 25˚C

T

j

= -40˚C

V

GD

I

FGM

Table gives pulse power PGM in Watts

Pulse width

µs
100
200
500

1ms

10ms

Frequency Hz

50
150
150
150
150

20

100
150
150
150
100

-

400
150
125
100

25

-

100W

50W

20W

10W

5W

0

0.02

0.04

0.06

0.08

0.1

0.12

0.001 0.01 0.1 1 10 100 1000
Time (Seconds)

Thermal resistance, Junction to water, R

th(j-w)

- (°C/W)

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Fig. 7 On-state power loss per arm vs on-state current at

specified conduction angles, sine wave 50/60Hz

Fig. 8 On-state power loss per arm vs on-state current at

specified conduction angles, square wave 50/60Hz

Fig. 9 Maximum permissible water inlet temperature vs on-

state current at specified conduction angles,

sine wave 50/60Hz

Fig. 10 Maximum permissible water inlet temperature vs on-

state current at specified conduction angles,

square wave 50/60Hz

0

200

400

600

800

1000

1200

1400

1600

1800

2000

2200

0 100 200 300 400 500 600 700 800 900 1000

Sine wave current (Average, per arm)

Power dissipation (Watts, per arm)

30°
60°

90°
120°
180°

0

200

400

600

800

1000

1200

1400

1600

1800

2000

2200

0 200 400 600 800 1000 1200 1400

Square wave current (Average, per arm)

Power dissipation (Watts, per arm)

30°
60°

90°
120°
180°

DC

0

10

20

30

40

50

60

70

80

90

100

0 100 200 300 400 500 600

Sine wave current (Average, per arm)

Maximum permissble inlet water temperature - (°C)

30°
60°

90°
120°
180°

0

10

20

30

40

50

60

70

80

90

100

0 100 200 300 400 500 600 700 800

Square wave current (Average, per arm)

Maximum permissible water inlet temperature - (°C)

30°
60°

90°
120°
180°

DC

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Fig. 11 50/60Hz single phase bridge DC output current vs

power loss and maximum permissible water inlet

Fig. 12 50/60Hz three phase bridge DC output current vs

power loss and maximum permissible water inlet

0

500

1000

1500

2000

2500

3000

3500

4000

400 500 600 700 800 900 1000 1100 1200

DC bridge output current - (A)

Total device power loss - (W)

Power resistive load
Power inductive load
Temp resistive load

Temp inductive load

20

10

30

40

50

60

70

80

90

Max permissible water inlet temp. - (˚C)

0

1000

2000

3000

4000

5000

6000

600 700 800 900 1000 1100 1200 1300 1400 1500

DC bridge output current - (A)

Total device power loss - (W)

Power resistive or inductive load
Temp resistive or inductive load

10

0

20

30

40

50

60

70

80

90

Max permissible water inlet temp. - (˚C)

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PACKAGE DETAILS

For further package information, please visit our website or contact your nearest Customer Service Centre. All dimensions in mm, unless
stated otherwise. DO NOT SCALE.

Recommended fixings for mounting: M6 socket head cap screws

Nominal weight: 2060g

Auxiliary gate/cathode leads not supplied as standard, but maybe purchased separately.

Module outline type code: MP04-W2

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PACKAGE DETAILS

For further package information, please visit our website or contact your nearest Customer Service Centre. All dimensions in mm, unless
stated otherwise. DO NOT SCALE.

Recommended fixings for mounting: M6 socket head cap screws

Nominal weight: 2060g

Auxiliary gate/cathode leads not supplied as standard, but maybe purchased separately.

Module outline type code: MP04-W3

MP04TT500

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PACKAGE DETAILS

For further package information, please visit our website or contact your nearest Customer Service Centre. All dimensions in mm, unless
stated otherwise. DO NOT SCALE.

Recommended fixings for mounting: M6 socket head cap screws

Nominal weight: 2530g

Auxiliary gate/cathode leads not supplied as standard, but maybe purchased separately.

Module outline type code: MP04-W3A

MP04TT500

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POWER ASSEMBLY CAPABILITY

The Power Assembly group provides support for those customers requiring more than the basic semiconductor switch. Using CAD
design tools the group has developed a flexible range of heatsink / clamping systems in line with advances in device types and the
voltage and current capability of Dynex semiconductors.

An extensive range of air and liquid cooled assemblies is available covering the range of circuit designs in general use today.

HEATSINKS

The Power Assembly group has a proprietary range of extruded aluminium heatsinks. These were designed to optimise the
performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on
request.

For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or customer
service office.

CUSTOMER SERVICE CENTRES

Mainland Europe Tel: [phone]. Fax: [phone]
North America Tel: [phone]. Fax: [phone]
UK, Scandinavia & Rest Of World Tel: [phone]. Fax: [phone]

SALES OFFICES

Mainland Europe Tel: [phone]. Fax: [phone]
North America Tel: [phone]. Fax: [phone]. Toll Free: 1.888.33.DYNEX (39639) /

Tel: [phone]. Fax: [phone].
UK, Scandinavia & Rest Of World Tel: [phone]. Fax: [phone]

These offices are supported by Representatives and Distributors in many countries world-wide.
© Dynex Semiconductor 2001 Publication No. DS5446-1 Issue No. 1.2 May 2001
TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM

HEADQUARTERS OPERATIONS

DYNEX SEMICONDUCTOR LTD

Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.
Tel: [phone]
Fax: [phone]

DYNEX POWER INC.

99 Bank Street, Suite 410,
Ottawa, Ontario, Canada, K1P 6B9
Tel: [phone]
Fax: [phone]
Toll Free: 1.888.33.DYNEX (39639)

This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as
a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves
the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such
methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication
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e-mail: [email protected]

Datasheet Annotations:

Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:-

Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.