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FEATURES
■ Dual Device Module
■ Electrically Isolated Package
■ Pressure Contact Construction
■ International Standard Footprint
■ Alumina (Non Toxic) Isolation Medium
■ Integral Water Cooled Heatsink
APPLICATIONS
■ Welding
VOLTAGE RATINGS
ORDERING INFORMATION
Order As:
MP04TT1550-XX-W2 1/4 - 18 NPT connection
MP04TT1550-XX-W3 1/4 - 18 NPT connection
MP04TT1550-XX-W3A 1/4 - 18 NPT water connection
thread
XX shown in the part number about represents V
DRM
/100
selection required, eg. MP04TT1550-17-W2
Note: When ordering, please use the complete part number.
KEY PARAMETERS
V
DRM
1800V
I
LINE(cont.)
1438A
I
LINE(20cy./50%)
1670A
I
TSM(per arm)
14000A
V
isol
3000V
MP04TT1550
Dual Thyristor Water Cooled Welding Module
Preliminary Information
DS5467-1.1 June 2001
1800
1700
1600
1500
MP04TT1550-18
MP04TT1550-17
MP04TT1550-16
MP04TT1550-15
Conditions
T
vj
= 0˚ to 125˚C,
I
DRM
= I
RRM
= 50mA
V
DSM
= V
RSM
=
V
DRM
= V
RRM
+ 100V
respectively
Lower voltage grades available
Type Number Repetitive Peak
Voltages
V
DRM VRRM
V
Fig. 1 TT Circuit diagram
Fig. 2 Module package variants - (not to scale)
Module outline type code: MP04-W2
(See Package Details for further information)
5 (G1)
6 (G2)
4 (K1)
7 (K2)
3 (A)
2 (A)
1 (AK)
Module outline type code:
MP04-W3
Module outline type code:
MP04-W3A
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Parameter
Max. controllable RMS line
current - single phase
Surge (non-repetitive) on-current
I
2
t for fusing
Surge (non-repetitive) on-current
I
2
t for fusing
Isolation voltage
Test Conditions
Continuous 50/60Hz T
water (in)
= 25˚C
4.5 Ltr/min T
water (in)
= 40˚C
20 cycles, 50% duty cycle T
water (in)
= 25˚C
4.5 Ltr/min T
water (in)
= 40˚C
10ms half sine, T
j
= 125˚C
V
R
= 0
10ms half sine, T
j
= 125˚C
V
R
= 50% V
DRM
Commoned terminals to base plate.
AC RMS, 1 min, 50Hz
Symbol
I
LINE
I
TSM
I2t
I
TSM
I2t
V
isol
Units
A
A
A
A
kA
A
2
s
kA
A
2
s
V
Max.
1438
1280
1860
1670
14
0.975X10
6
11.2
0.625X10
6
3000
Test Conditions
dc, 4.5 Ltr/min
Half wave, 4.5 Ltr/min
3 Phase, 4.5 Ltr/min
Reverse (blocking)
-
Mounting - M6
Electrical connections - M10
-
Parameter
Thermal resistance - junction to water
(per thyristor)
Virtual junction temperature
Storage temperature range
Screw torque
Weight (nominal)
THERMAL AND MECHANICAL RATINGS
ABSOLUTE MAXIMUM CURRENT RATINGS
Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme
conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety
precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability.
Symbol
R
th(j-W)
T
vj
T
stg
-
-
Units
˚C/kW
˚C/kW
˚C/kW
˚C
˚C
Nm (lb.ins)
Nm (lb.ins)
g
Max.
0.102
0.106
0.112
125
125
-
12(106)
Refer to
drawings
Min.
-
-
-
-
–40
6(53)
-
-
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Units
mA
V/µs
A/µs
V
mΩ
Test Conditions
At V
RRM/VDRM
, Tj = 125˚C
To 67% V
DRM
, Tj = 125˚C
From 67% V
DRM
to 500A, gate source 10V, 5Ω
t
r
= 0.5µs, Tj = 125˚C
At T
vj
= 125˚C
At T
vj
= 125˚C
Parameter
Peak reverse and off-state current
Linear rate of rise of off-state voltage
Rate of rise of on-state current
Threshold voltage
On-state slope resistance
DYNAMIC CHARACTERISTICS
Symbol
I
RRM/IDRM
dV/dt
dI/dt
V
T(TO)
r
T
Max.
50
1000
500
0.85
0.38
Min.
-
-
-
-
-
Parameter
Gate trigger voltage
Gate trigger current
Gate non-trigger voltage
Peak forward gate voltage
Peak forward gate voltage
Peak reverse gate voltage
Peak forward gate current
Peak gate power
Mean gate power
Test Conditions
V
DRM
= 5V, T
case
= 25oC
V
DRM
= 5V, T
case
= 25oC
At V
DRM Tcase
= 125oC
Anode positive with respect to cathode
Anode negative with respect to cathode
-
Anode positive with respect to cathode
See table fig. 5
-
Symbol
V
GT
I
GT
V
GD
V
FGM
V
FGN
V
RGM
I
FGM
P
GM
P
G(AV)
GATE TRIGGER CHARACTERISTICS AND RATINGS
Max.
3.5
200
0.25
30
0.25
5
10
150
10
Units
V
mA
V
V
V
V
A
W
W
Note: The data given in this datasheet with regard to forward voltage drop is for calculation of the power dissipation in the
semiconductor elements only. Forward voltage drops measured at the power terminals of the module will be in excess of these
figures due to the impedance of the busbar from the terminal to the semiconductor.
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Fig. 3 Maximum (limit) on-state characteristics
Fig. 6 Transient thermal impedance - dc
Fig. 4 Surge (non-repetitive) on-state current vs time
(with 50% V
RSM
at T
case
= 125˚C)
Fig. 5 Gate characteristics
0.5 1.0 1.5 2.0 2.5
Instantaneous on-state voltage V
T
- (V)
0
500
1000
1500
2000
2500
Measured under pulse
conditions
Instantaneous on-state current I
T
- (A)
12
1: Tj = 125˚C Min
2: Tj = 125˚C Max
20
15
10
5
0
Peak half sine wave on-state current - (kA)
11012345
50
ms Cycles at 50Hz
Duration
400
500
I
2t
value - (A
2
s x 10
3
)
I2t
I2t = Î2 x t
2
600
700
25
10 20 30
1010.10.010.001
Gate trigger current, IGT - (A)
100
10
1
0.1
Gate trigger voltage, V
GT
- (V)
V
GD
I
FGM
Table gives pulse power PGM in Watts
Pulse width
µs
100
200
500
1ms
10ms
Frequency Hz
50
150
150
150
150
20
100
150
150
150
100
-
400
150
125
100
25
-
Upper limit 99%
100W
50W
20W
10W
5W
Region of certain
triggering
Lower limit 99%
T
j
= 125˚C
T
j
= 25˚C
T
j
= -40˚C
0
0.02
0.04
0.06
0.08
0.1
0.12
0.001 0.01 0.1 1 10 100 1000
Time (Seconds)
Thermal resistance, Junction to water, R
th(j-w)
- (°C/W)
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Fig. 7 Single phase welding rating @T
water
= 25˚C
Fig. 10 Single phase welding rating @T
water
= 50˚C
Fig. 8 Single phase welding rating @T
water
= 30˚C
Fig. 9 Single phase welding rating @T
water
= 40˚C
0
1000
2000
3000
4000
5000
6000
7000
8000
9000
110100
Duty cycle - (%)
Rms line current - (A rms)
No. of cycles
1
3
5
10
20
30
50
100
Tj = 100˚C, T
water
= 25˚C @ 4.5 Ltrs/min
0
1000
2000
3000
4000
5000
6000
7000
8000
9000
110100
Duty cycle - (%)
Rms line current - (A rms)
Tj = 125˚C, T
water
= 30˚C @ 4.5 Ltrs/min
No. of cycles
1
3
5
10
20
30
50
100
0
1000
2000
3000
4000
5000
6000
7000
8000
110100
Duty Cycle (%)
Rms line current - (A rms)
Tj = 125˚C, T
water
= 40˚C @ 4.5 Ltrs/min
No. of cycles
1
3
5
10
20
30
50
100
0
1000
2000
3000
4000
5000
6000
7000
110100
Duty Cycle (%)
Rms line current - (A rms)
Tj = 125˚C, T
water
= 50˚C @ 4.5 Ltrs/min
No. of cycles
1
3
5
10
20
30
50
100
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Fig. 10 Single phase welding rating @T
water
= 40˚C
0
1000
2000
3000
4000
5000
6000
7000
110100
Duty Cycle (%)
Rms line current - (A rms)
Tj = 100˚C, T
water
= 40˚C @ 4.5 Ltrs/min
No. of cycles
1
3
5
10
20
30
50
100
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PACKAGE DETAILS
For further package information, please visit our website or contact your nearest Customer Service Centre. All dimensions in mm, unless
stated otherwise. DO NOT SCALE.
Recommended fixings for mounting: M6 socket head cap screws
Nominal weight: 2060g
Auxiliary gate/cathode leads not supplied as standard, but maybe purchased separately.
Module outline type code: MP04-W2
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PACKAGE DETAILS
For further package information, please visit our website or contact your nearest Customer Service Centre. All dimensions in mm, unless
stated otherwise. DO NOT SCALE.
Recommended fixings for mounting: M6 socket head cap screws
Nominal weight: 2060g
Auxiliary gate/cathode leads not supplied as standard, but maybe purchased separately.
Module outline type code: MP04-W3
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PACKAGE DETAILS
For further package information, please visit our website or contact your nearest Customer Service Centre. All dimensions in mm, unless
stated otherwise. DO NOT SCALE.
Recommended fixings for mounting: M6 socket head cap screws
Nominal weight: 2530g
Auxiliary gate/cathode leads not supplied as standard, but maybe purchased separately.
Module outline type code: MP04-W3A
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POWER ASSEMBLY CAPABILITY
The Power Assembly group provides support for those customers requiring more than the basic semiconductor switch. Using CAD
design tools the group has developed a flexible range of heatsink / clamping systems in line with advances in device types and the
voltage and current capability of Dynex semiconductors.
An extensive range of air and liquid cooled assemblies is available covering the range of circuit designs in general use today.
HEATSINKS
The Power Assembly group has a proprietary range of extruded aluminium heatsinks. These were designed to optimise the
performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on
request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or customer
service office.
CUSTOMER SERVICE CENTRES
Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33
North America Tel: (613) 723-7035. Fax: (613) 723-1518.
UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
SALES OFFICES
Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33
North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /
Tel: (949) 733-3005. Fax: (949) 733-2986.
UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
These offices are supported by Representatives and Distributors in many countries world-wide.
© Dynex Semiconductor 2001 Publication No. DS5467-1 Issue No. 1.1 June 2001
TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM
HEADQUARTERS OPERATIONS
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.
Tel: 00-44-(0)1522-500500
Fax: 00-44-(0)1522-500550
DYNEX POWER INC.
99 Bank Street, Suite 410,
Ottawa, Ontario, Canada, K1P 6B9
Tel: 613.723.7035
Fax: 613.723.1518
Toll Free: 1.888.33.DYNEX (39639)
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as
a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves
the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such
methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication
or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury
or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.
All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
http://www.dynexsemi.com
e-mail: [email protected]
Datasheet Annotations:
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:-
Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.
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