Datasheet MP04DD810-28, MP04DD810-24, MP04DD810-30, MP04DD810-26 Datasheet (DYNEX)

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MP04DD810

FEATURES

■ Dual Device Module

■ Electrically Isolated Package

■ Pressure Contact Construction

■ International Standard Footprint

■ Alumina (Non-toxic) Isolation Medium

APPLICATIONS

■ Power Supplies

■ Large IGBT Circuit 'Front Ends'

■ Rectifiers

■ Battery Chargers

VOLTAGE RATINGS

KEY PARAMETERS
V

RRM

3000V

I

F(AV)

812A

I

FSM (per arm)

20000A

I

F(RMS)

1276A

V

isol

3000V

3000
2800
2600
2400

MP04DD810-30
MP04DD810-28
MP04DD810-26
MP04DD810-24

Conditions

T

vj

= –40˚ to 150˚C,

V

RSM

= V

RRM

+ 100V

Lower voltage grades available

Type Number Repetitive Peak

Voltages
V

DRM VRRM

V

Fig.1 DD circuit configuration

ORDERING INFORMATION

Order As:

MP04DD810-XX-W2 1/4 - 18 NPT connection
MP04DD810-XX-W3 1/4 - 18 NPT connection
MP04DD810-XX-W3A 1/4 - 18 NPT water connection

thread

XX shown in the part number about represents V

DRM

/100

selection required, eg. MP04DD810-28-W2
Note: When ordering, please use the complete part number.

Please quote full part number in all correspondance.

1

2

3

MP04DD810

Dual Rectifier Diode Water Cooled Module

Preliminary Information

DS5286-2.1 June 2001

Fig. 2 Module package variants - (not to scale)

Module outline type code: MP04-W2

(See Package Details for further information)

Module outline type code:

MP04-W3

Module outline type code:

MP04-W3A

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MP04DD810

Half wave resistive load

THERMAL AND MECHANICAL DATA

dc, 4.5 Ltr/min

Conditions Min. Max. Units

o

C/W

-

0.106Halfwave, 4.5 Ltr/min

T

vj

Virtual junction temperature

T

stg

Storage temperature range

-

Thermal resistance - junction to water
(per diode)

R

th(j-w)

Symbol

Parameter

Screw torque

6 (53) -

Nm (lb.ins)

–40 150

o

C

Reverse (blocking) - 150

o

C

3 Phase, 4.5 Ltr/min

- 0.112

o

C/W

- 0.102

o

C/W

Symbol Parameter Conditions

I

F(AV)

Mean forward current

I

F(RMS)

RMS value

UnitsMax.

885 A

T

water (in)

= 40oC 812 A

T

water (in)

= 25oC, 4.5 Ltr/min 1392 A

T

water (in)

= 40oC, 4.5 Ltr/min 1276 A

ABSOLUTE MAXIMUM RATINGS - PER ARM

Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this
specification is not implied. Exposure to Absolute Maximum Ratings for extended periods may affect device reliability.

T

water (in)

= 25oC

10ms half sine; Tj = 150oC

VR = 0

10ms half sine; Tj = 150oC

VR = 50% V

RRM

I

FSM

Surge (non-repetitive) forward current

I

2

tI

2

t for fusing

I

FSM

Surge (non-repetitive) forward current

I

2

t

I

2

t for fusing 1.28 x 106A2s

16 kA

2.0 x 10

6

A2s

20 kA

V

isol

Isolation voltage

3000 V

Commoned terminals to base plate AC RMS, 1 min, 50Hz

Mounting - M6

-

- 12 (106)

Nm (lb.ins)

Electrical connections - M10

-

Refer to
Drawing

g

-

-

Weight (nominal)

4.5 Ltr/min

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MP04DD810

Note 1: The data given in this datasheet with regard to forward voltage drop is the for the calculation of the power dissipation in

the semiconductor elements only. Forward voltage drops measured at the power terminals will be in excess of these figures due to
the impedance of the busbars from the terminals to the semiconductor.

CHARACTERISTICS

Peak reverse current

Parameter

µC1600

At Tvj = 150˚C -

Q

S

Total stored charge

I

F

= 1000A, dIRR/dt = 3A/µs

T

case

= 150˚C, VR = 100V

Symbol

I

RRM

I

RR

Peak recovery current

V

TO

Threshold voltage. See Note 1.

r

T

Slope resistance. See Note 1. 0.29 mΩ

At T

vj

= 150˚C - 0.7 V

-85A

-

At V

RRM

, T

case

= 150oC-50mA

Conditions Min. Max. Units

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MP04DD810

Fig.5 Maximum stored charge

0.1 1.0 10 100
Rate of decay of on-state current dIF/dt - (A/µs)

10000

1000

100

Stored charge Q

S

- (µC)

Conditions:
Tj = 150˚C
VR = 100V
IF = 1000A

I

RR

I

F

dIF/dt

Q

S

Fig.6 Maximum reverse recovery current

1.0 10 100
Rate of decay of forward current dIF/dt - (A/µs)

1000

100

10

Reverse current I

RR

- (A)

Conditions:
Tj = 150˚C
VR = 100V
IF = 1000A

CURVES

Fig.3 Maximum (limit) forward characteristics

0.5 0.75 1.0 1.51.25
Instantaneous forward voltage V

F

- (V)

0

500

1000

1500

2000

2500

Instantaneous forward current I

F

- (A)

Measured under pulse
conditions

Tj = 25˚C

Tj = 150˚C

Fig.4 Power dissipation curves

0

200

400

600

800

1000

1200

1400

1600

1800

2000

2200

0 200 400 600 800 1000 1200 1400 1600 1800

Forward current, (Average, per arm) I

F(AV)

- (A)

Power dissipation (Watts, per arm)

30°
60°
90°
120°
180°
DC

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MP04DD810

Fig.7 Surge (non-repetitive) forward current vs time

(with 50% V

RRM

@ Tc - 150˚C)

1101235102050

0

5

10

15

20

25

30

35

0.8

0.9

0.7

1.0

1.1

I

2

t value - (A

2

s x 10

6

)

ms Cycles at 50Hz

Duration

Peak half sine forward current - (kA)

I2t = Î2 x t

2

1.2

1.3

I2t

1.4

Fig.8 Transient thermal impedance - dc

0

0.02

0.04

0.06

0.08

0.1

0.12

0.001 0.01 0.1 1 10 100 1000
Time (Seconds)

Thermal resistance, Junction to water, R

th(j-w)

- (°C/W)

Fig. 9 Maximum permissible water inlet temperature vs on-state

current at specified conduction angles, sine wave 50/60Hz

0

10

20

30

40

50

60

70

80

90

100

100 200 300 400 500 600 700 800 900 1000 1100

Forward current (Average, per arm), I

F(AV)

- (A)

Maximum permissble inlet water temperature - (°C)

30°
60°
90°
120°
180°
DC

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MP04DD810

PACKAGE DETAILS

For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise.
DO NOT SCALE.

Recommended fixings for mounting: M6 socket head cap screws

Nominal weight: 2060g

Auxiliary gate/cathode leads not supplied as standard, but maybe purchased separately.

Module outline type code: MP04-W2

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MP04DD810

PACKAGE DETAILS

For further package information, please visit our website or contact your nearest Customer Service Centre. All dimensions in mm, unless
stated otherwise. DO NOT SCALE.

Recommended fixings for mounting: M6 socket head cap screws

Nominal weight: 2060g

Auxiliary gate/cathode leads not supplied as standard, but maybe purchased separately.

Module outline type code: MP04-W3

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MP04DD810

PACKAGE DETAILS

For further package information, please visit our website or contact your nearest Customer Service Centre. All dimensions in mm, unless
stated otherwise. DO NOT SCALE.

Recommended fixings for mounting: M6 socket head cap screws

Nominal weight: 2530g

Auxiliary gate/cathode leads not supplied as standard, but maybe purchased separately.

Module outline type code: MP04-W3A

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MP04DD810

CUSTOMER SERVICE CENTRES

Central Europe Tel: [phone]. Fax: [phone]
North America Tel: [phone]. Fax: [phone]
UK, Scandinavia & Rest Of World Tel: [phone]. Fax: [phone]

SALES OFFICES

Central Europe Tel: [phone]. Fax: [phone]
North America Tel: [phone]. Fax: [phone]. Toll Free: 1.888.33.DYNEX (39639) /

Tel: [phone]. Fax: [phone].
UK, Scandinavia & Rest Of World Tel: [phone]. Fax: [phone]

These offices are supported by Representatives and Distributors in many countries world-wide.
© Dynex Semiconductor 2001 Publication No. DS5286-2 Issue No. 2.1 June 2001
TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM

HEADQUARTERS OPERATIONS

DYNEX SEMICONDUCTOR LTD

Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.
Tel: [phone]
Fax: [phone]

DYNEX POWER INC.

99 Bank Street, Suite 410,
Ottawa, Ontario, Canada, K1P 6B9
Tel: [phone]
Fax: [phone]
Toll Free: 1.888.33.DYNEX (39639)

This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as
a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves
the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such
methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication
or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury

or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.

All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.

http://www.dynexsemi.com

e-mail: [email protected]

Datasheet Annotations:

Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:-

Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.

POWER ASSEMBLY CAPABILITY

The Power Assembly group was set up to provide a support service for those customers requiring more than the basic
semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages and
current capability of our semiconductors.

We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The
Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of
our customers.

Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete
Solution (PACs).

HEATSINKS

The Power Assembly group has its own proprietary range of extruded aluminium heatsinks. They have been designed to optimise
the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is
available on request.

For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or customer
service office.