Datasheet MP03-280-16, MP03-280-18, MP03-280-20, MP03-280-14 Datasheet (DYNEX)

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MP03 XX 280 Series
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Symbol
Parameter
Max. Units
252
A A
241 A
T
case
= 75oC
T
heatsink
= 75oC
T
heatsink
= 85oC
T
case
= 85oC
T
case
= 75oC
I
F(RMS)
RMS value
A215 A
440
Mean forward current
Halfwave, resistive load
I
F(AV)
280
Code
Circuit
HB
G
GN
Repetitive
Peak
Voltages
V
RRM
Type
Number
MP03/280 - 20 MP03/280 - 18 MP03/280 - 16 MP03/280 - 14
Lower voltage grades available. For full description of part number see "Ordering Instructions" on page 3.
2000 1800 1600 1400
Tvj = 150oC IRM = 30mA V
RSM
= V
RRM
+ 100V
respectively
Module outline type code: MP03.
See Package Details for further information.
FEATURES
■ Dual Device Module
■ Electrically Isolated Package
■ Pressure Contact Construction
■ International Standard Footprint
■ Alumina (non-toxic) Isolation Medium
APPLICATIONS
■ Rectifier Bridges
■ DC Power Supplies
■ Plating Rectifiers
■ Traction Systems
CURRENT RATINGS - PER ARM
KEY PARAMETERS
V
RRM
2000V
I
FSM
6000A
I
F(AV)
(per arm) 280A
V
isol
2500V
CIRCUIT OPTIONS
VOLTAGE RATINGS
PACKAGE OUTLINE
MP03 XX 280 Series
Dual Diode Modules
Replaces December 1998 version, DS5105-2.0 DS5105-3.0 January 2000
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MP03 XX 280 Series
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Symbol
Parameter
Conditions Max.
Units
AVR = 0
VR = 50% V
RRM
VR = 0 VR = 50% V
RRM
A2s
A2s
A
10ms half sine; Tj = 150oC
10ms half sine; Tj = 150oC
Surge (non-repetitive) on-state current
I
FSM
I2t for fusing
I2t
Symbol
Parameter
Units
o
C/W
R
th(j-c)
Virtual junction temperatureT
vj
o
CT
sto
Storage temperature range
Mounting torque = 5Nm with mounting compound
3 phase
halfwave
dc
Commoned terminals to base plate AC RMS, 1min, 50Hz
Max.
0.22
0.23
R
th(c-hs)
Isolation voltage
Symbol
Parameter
1.1 mA
Forward voltage
30
V
FM
I
RM
Peak reverse current At V
RRM
, Tj = 150oC
At 400A peak, T
case
= 25oC
V
TO
Threshold voltage V0.80
mΩ0.6
At Tvj = 150oC At Tvj = 150oC
r
T
On-state slope resistance
Thermal resistance - junction to case per Diode
Thermal resistance - case to heatsink per Diode
o
C/W
V
isol
2.5
6000 4800
180000 115000
o
C/W
o
C/W
0.21
0.05
-40 to 150
150
o
C
kV
UnitsMax.
V
Surge Ratings - Per Arm
THERMAL & MECHANICAL RATINGS
CHARACTERISTICS
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MP03 XX 280 Series
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An even coating of thermal compound (eg. Unial) should be applied to both the heatsink and module mounting surfaces. This should ideally be 0.05mm (0.002") per surface to ensure optimum thermal performance.
After application of thermal compound, place the module squarely over the mounting holes, (or 'T' slots) in the heatsink. Using a torque wrench, slowly tighten the recommended fixing bolts at each end, rotating each in turn no more than 1/4 of a revolution at a time. Continue until the required torque of 5Nm (44lb.ins) is reached at both ends.
It is not acceptable to fully tighten one fixing bolt before starting to tighten the others. Such action may DAMAGE the module.
Adequate heatsinking is required to maintain the base temperature at 75oC if full rated current is to be achieved. Power dissipation may be calculated by use of V
(TO)
and r
T
information in accordance with standard formulae. We can provide assistance with calculations or choice of heatsink if required.
The heatsink surface must be smooth and flat; a surface finish of N6 (32µin) and a flatness within 0.05mm (0.002") are recommended.
Immediately prior to mounting, the heatsink surface should be lightly scrubbed with fine emery, Scotch Brite or a mild chemical etchant and then cleaned with a solvent to remove oxide build up and foreign material. Care should be taken to ensure no foreign particles remain.
Part number is made up as follows:
MP03 HB 280 - 18
MP = Pressure contact module 03 = Outline type HB = Circuit configuration code (see "circuit options" - front page) 280 = Nominal average current rating at T
case
= 75oC
18 = V
RRM
/100
Examples:
MP03HB280 - 16 MP03G280 - 20 MP03GN280 - 18
Note: Prefered type is HB configuration. G and GN types are available for specific applications, only when requested.
MOUNTING RECOMMENDATIONS
ORDERING INSTRUCTIONS
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MP03 XX 280 Series
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0 0.5 1.0 1.5 2.0
Instantaneous forward voltage V
F
- (V)
1000
800
600
400
200
0
Instantaneous forward current I
F
- (A)
Tj = 150˚C
CURVES
0.001 0.010 0.100 1.0 10 100 Time - (s)
0
0.1
0.2
0.3
Thermal Impedance - (˚C/W)
R
th(j-hs)
R
th(j-c)
Fig. 1 Maximum (limit) forward characteristics (Per diode)
Fig. 2 Transient thermal impedance (DC) - (Per diode)
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MP03 XX 280 Series
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0
2000
1000
3000
4000
5000
6000
Peak half sine wave forward current - (A)
11012355010 20 30
ms cycles at 50Hz
Duration
50
60
70
80
90
100
110
I
2
t value - A
2
s x 10
3
I2t
1207000
8000
9000
10000
Fig. 3 Surge (non-repetitive) forward current vs time (with 0% V
RRM
, T
case
= 150˚C)
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MP03 XX 280 Series
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0 50 100 150 200 250
Mean forward current - (A)
400
350
300
250
200
150
100
50
0
On-state power loss per device - (W)
d.c.
120˚ Rectangular
180˚ Sine
60˚ Rectangular
180˚ Rectangular
300 350 400
0 50 100 150 200 250
300
Mean forward current - (A)
120
100
80
60
40
20
0
Maximum permissible case temperature - (˚C)
d.c.
180˚ Rectangular
120˚ Rectangular
60˚ Rectangular
140
160
180˚ Sine
350 400
Fig. 4 On-state power loss per arm vs forward current at various conduction angles, 50/60Hz
Fig. 5 Maximum permissible case temperature vs forward current per arm at various conduction angles, 50/60Hz
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MP03 XX 280 Series
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40 80 120 0 100 200
300
1200
1000
800
600
400
200
0
Total power - (W)
140100
60
Maximum ambient temperature - (˚C
)
D.C. output current - (A
)
400
R - Load
L - Load
R
th(hs-a)
˚C/W
0.02
0.04
0.08
0.10
0.12
0.15
0.20
0.40
0.30
020
40 80 120 0 100 200
300
1200
1000
800
600
400
200
0
Total power - (W)
140100
60
Maximum ambient temperature - (˚C)
D.C. output current - (A)
400
R & L - Load
R
th(hs-a)
˚C/W0.02
0.040.080.10
0.12
0.15
0.20
0.40
0.30
020
Fig. 6 50/60Hz single phase bridge dc output current vs power loss and maximum permissible ambient temperature for
various values of heatsink thermal resistance.
(Note: R
th(hs-a)
values given above are true heatsink thermal resistances to ambient and already account for R
th(c-hs)
module contact thermal).
Fig. 7 50/60Hz 3- phase bridge dc output current vs power loss and maximum permissible ambient temperature for various
values of heatsink thermal resistance.
(Note: R
th(hs-a)
values given above are true heatsink thermal resistances to ambient and already account for R
th(c-hs)
module contact thermal).
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MP03 XX 280 Series
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G
1
2
3
1
2
3
HB
GN
1
2
3
PACKAGE DETAILS
For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise. DO NOT SCALE.
CIRCUIT CONFIGURATIONS
35 28.5
80
50
52
92
2x M8
18
4 holes Ø5.5
38
32
42.5
5
1
2
3
Recommended fixings for mounting: M5 socket head cap screws. Recommended mounting torque: 5Nm (44lb.ins) Recommended torque for electrical connections: 8Nm (70lb.ins) Maximum torque for electrical connections: 9Nm (80lb.ins) Nominal weight: 950g
Module outline type code: MP03
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CUSTOMER SERVICE CENTRES
France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50 North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444 UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020
SALES OFFICES
France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50 Germany Tel: 07351 827723 North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /
Tel: (831) 440-1988. Fax: (831) 440-1989 / Tel: (949) 733-3005. Fax: (949) 733-2986. UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 These offices are supported by Representatives and Distributors in many countries world-wide. © Dynex Semiconductor 2000 Publication No. DS5105-3 Issue No. 3.0 January 2000 TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM
HEADQUARTERS OPERATIONS
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: 00-44-(0)1522-500500 Fax: 00-44-(0)1522-500550
DYNEX POWER INC.
Unit 7 - 58 Antares Drive, Nepean, Ontario, Canada K2E 7W6. Tel: 613.723.7035 Fax: 613.723.1518 Toll Free: 1.888.33.DYNEX (39639)
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Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change. Advance Information: The product design is complete and final characterisation for volume production is well in hand. No Annotation: The product parameters are fixed and the product is available to datasheet specification.
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