Datasheet MP02TT200-14, MP02TT200-15, MP02TT200-16, MP02TT200-13, MP02TT200-12 Datasheet (DYNEX)

MP02TT200

G1K1K2G

2

1

23

MP02TT200

Dual Thyristor Water Cooled Module

Preliminary Information

DS5434-1.1 April 2001

FEATURES

■ Dual Device Module

■ Electrically Isolated Package

■ Pressure Contact Construction

■ International Standard Footprint

■ Alumina (Non Toxic) Isolation Medium

■ Integral Water Cooled Heatsink

APPLICATIONS

■ Motor Control

■ Controlled Rectifier Bridges

■ Heater Control

■ AC Phase Control

VOLTAGE RATINGS

Type Number Repetitive Peak

Voltages
V

DRM VRRM

V

MP02TT200-16
MP02TT200-15
MP02TT200-14
MP02TT200-13
MP02TT200-12

Lower voltage grades available

1600
1500
1400
1300
1200

Conditions

T

= 0˚ to 125˚C,

vj

I

= I

= V
= V

= 30mA

RRM

RSM

RRM

V
V

DRM

DSM

DRM

respectively

=
+ 100V

KEY PARAMETERS
V

DRM

I

T(AV)

I

TSM(per arm)

I

T(RMS)

V

isol

Fig. 1 Circuit diagram

1

1600V

200A

6800A

318A

3000V

23

K2

G2

K1 G1

ORDERING INFORMATION

Outline type code: MP02 W12/W13

Order As:

MP02TT200-XX-W12 1/4 - 18 NPT connection
MP02TT200-XX-W13 1/4 BSP connection

XX shown in the part number about represents V
selection required, e.g. MP02TT200-14-W12

DRM

/100

(See package details for further information)

Fig. 2 Electrical connections - (not to scale)

Note: When ordering, please use the whole part number.
Auxiliary gate and cathode leads can be ordered separately.

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MP02TT200

ABSOLUTE MAXIMUM RATINGS - PER ARM

Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme
conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety
precautions should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability.

Symbol

I

T(AV)

I

T(RMS

I

TSM

I2t

I

TSM

I2t

V

isol

Mean on-state current

RMS value

Surge (non-repetitive) on-current

2

t for fusing

I

Surge (non-repetitive) on-current

2

t for fusing

I

Isolation voltage

Parameter

THERMAL AND MECHANICAL RATINGS

Test Conditions

Half wave resistive load, T

4.5 Ltr/min T

= 25˚C @ 4.5 Ltr/min

T

water (in)

= 40˚C @ 4.5 Ltr/min

T

water (in)

R

= 0

= 125˚C

j

= 125˚C

j

DRM

10ms half sine, T

V

10ms half sine, T

= 50% V

V

R

Commoned terminals to base plate.
AC RMS, 1 min, 50Hz

water (in)

water (in)

T

water (in)

= 25˚C

= 40˚C

= 50˚C

Max.

230

200

180

360

318

6.8

0.231 x 10

5.5

0.15 x 10

3000

6

6

Units

A

A

A

A

A

kA

2

s

A

kA

2

s

A

V

Symbol

R

th(j-w)

T

vj

T

stg

-

-

2/9

Parameter

Thermal resistance - junction to water

(per thyristor)

Virtual junction temperature

Storage temperature range

Screw torque

Weight (nominal)

Test Conditions

dc, 4.5 Ltr/min

Half wave, 4.5 Ltr/min

3 Phase, 4.5 Ltr/min

Reverse (blocking)

-

Mounting - M6

Electrical connections - M6

-

Min.

-

-

-

-

–40

5 (44)

-

-

Max.

0.3

0.32

0.33

125

125

5 (44)

1200

-

Units

˚C/kW

˚C/kW

˚C/kW

˚C

˚C

Nm (lb.ins)

Nm (lb.ins)

g

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DYNAMIC CHARACTERISTICS

MP02TT200

Symbol

I

RRM/IDRM

dV/dt

dI/dt

V

T(TO)

r

T

Parameter

Peak reverse and off-state current

Linear rate of rise of off-state voltage

Rate of rise of on-state current

Threshold voltage

On-state slope resistance

Test Conditions

DRM

= 125˚C

= 125˚C

, Tj = 125˚C

, Tj = 125˚C

to 200A, gate source 10V, 5Ω

DRM

At V

RRM/VDRM

To 67% V

From 67% V

t

= 0.5µs, Tj = 125˚C

r

At T

vj

At T

vj

Min.

-

-

-

-

-

Max.

30

1000

500

0.98

0.75

Units

Note 1: The data given in this datasheet with regard to forward voltage drop is for calculation of the power dissipation in the

semiconductor elements only. Forward voltage drops measured at the power terminals of the module will be in excess of these

figures due to the impedance of the busbar from the terminal to the semiconductor.

GATE TRIGGER CHARACTERISTICS AND RATINGS

Symbol

V

GT

I

GT

Gate trigger voltage

Gate trigger current

Parameter

V

V

DRM

DRM

= 5V, T

= 5V, T

Test Conditions

= 25oC

case

= 25oC

case

Max.

150

Units

3

mA

V/µs

A/µs

V

mΩ

V

mA

P

V

V

V

V

I

FGM

P

G(AV)

GD

FGM

FGN

RGM

GM

Gate non-trigger voltage

Peak forward gate voltage

Peak forward gate voltage

Peak reverse gate voltage

Peak forward gate current

Peak gate power

Mean gate power

At V

DRM Tcase

= 125oC

Anode positive with respect to cathode

Anode negative with respect to cathode

-

Anode positive with respect to cathode

See table fig. 5

-

0.25

30

0.25

5

10

100

5

V

V

V

V

A

W

W

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3/9

MP02TT200

2000

Measured under pulse conditions

1500

- (A)

T

1000

T

= 125˚C

j

500

Instantaneous on-state current, I

0

0.5 1.0 2.0

1.5

Instantaneous on-state voltage, V

Fig. 3 Maximum (limit) on-state characteristics

V

100

FGM

10

- (V)

GT

Pulse Frequency

Pulse
Width

µs

50

20

100

25

100

100

100

500

100

1ms

100

10ms

10

Hz

100
100

100
100
100

50

-

Table gives pulse power PGM in watts

400
100

100
100

25

-

10W

5W

-

- (V)

T

75W

50W

100W

2.5

20

15

10

5

Peak half sine wave on-state current - (kA)

0

1

I2t

10 1 2 3 45 50

ms cycles at 50Hz

Duration

10 20 30

Fig. 4 Surge (non-repetitive) on-state current vs time

(with 50% V

1.0

- (ßC/W)

th(j-w)

0.1

RSM

at T

= 125˚C)

case

180

140

100

60

I

2

t value - A

2

s x 10

3

Tj = 25˚C

Tj = 125˚C

T

j

= -40˚C

1.0

Gate trigger voltage, V

Upper limit 99%

V

GD

0.1

0.001 0.01 0.1 1.0 10
Gate trigger current, I

Lower limit 1%

- (A)

GT

Fig. 5 Gate characteristics

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I

FGM

0.01

Thermal resistance (junction to water). R

0.001

0.010.001
Time - (s)

Fig. 6 Transient thermal impedance - dc

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1010.1 1000

100

MP02TT200

700

90˚

600

500

400

300

200

On-state power loss per device - (W)

100

Conduction Angle 30˚

0

0 100 200 300 400

Mean on-state current, I

60˚

T(AV)

- (A)

120˚

180˚

Fig. 7 On-state power loss per arm vs on-state current at

specified conduction angles, sine wave 50/60Hz

600

180˚

120˚

T(AV)

90˚

- (A)

500

60˚

Conduction Angle 30˚

400

300

200

On-state power loss per device - (W)

100

0

0 100 200 300 400

Mean on-state current, I

Fig. 8 On-state power loss per arm vs on-state current at

specified conduction angles, square wave 50/60Hz

100

90

80

70

60

50

40

30

20

10

Max. permissible water inlet temperature - (˚C @ 4.5 l/min)

0

0 50 100 150 200 250 200

Conduction

Angle 30˚

Mean on-state current, I

60˚

90˚

T(AV)

120˚

180˚

- (A)

Fig. 9 Maximum permissible water inlet temperature vs on-

state current at specified conduction angles,

sine wave 50/60Hz

100

90

80

70

60

50

40

30

20

Max. permissible water inlet temperature - (˚C @ 4.5 l/min)

10

0

0 50 100 150 200 250 200

Conduction

Angle 30˚

Mean on-state current, I

60˚

90˚

T(AV)

120˚

- (A)

180˚

Fig. 10 Maximum permissible water inlet temperature vs on-

state current at specified conduction angles,

square wave 50/60Hz

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5/9

MP02TT200

1400
1300
1200
1100
1000

900
800

700
600
500

Total power loss - (W)

400
300

200
100

0

0204060801000 500

Max. water inlet temperature - (˚C) DC output current - (A)

100

200 300

Inductive load

Resistive load

400

Fig. 11 50/60Hz single phase bridge DC output current vs power loss and maximum permissible water inlet temperature for

specified values of heatsink thermal resistance

2000

1800

1600

Resistive load

1400

1200

1000

800

Total power loss - (W)

600

400

200

0

0 20 40 60 80 100 0

Max. water inlet temperature - (˚C) DC output current - (A)

100 200 300

or

Inductive load

400

500

Fig. 12 Fig. 11 50/60Hz Three phase bridge DC output current vs power loss and maximum permissible water inlet

temperature for specified values of heatsink thermal resistance

6/9

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MP02TT200

PACKAGE DETAILS

For further package information, please visit our website or contact your nearest Customer Service Centre. All dimensions in mm, unless
stated otherwise. DO NOT SCALE.

Ø6.5

2 Off water connectors
1/4 - 18 NTP (W12)

12.8

M6

23

13

1

23 24

K2

80

23

15

K1 G1

G2

24534

2.8 X 0.8

49

Water-way plug

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10.5

21.6

50.8
94

Recommended fixings for mounting: M6 socket head cap screws.

Auxiliary gate and cathode leads can be ordered separately.

Nominal weight: 1200g

Module outline type code: MP02-W12

9.5

23.8

2 Off Holes M3 x 0.5
10 deep

7/9

MP02TT200

PACKAGE DETAILS

For further package information, please visit our website or contact your nearest Customer Service Centre. All dimensions in mm, unless
stated otherwise. DO NOT SCALE.

fl6.5

2 Off water connectors
1/4 BSP (W13)

12.8

M6

23

13

1

23 24

K2

80

23

15

K1 G1

G2

24534

2.8 X 0.8

49

8/9

Water-way plug

10.5

21.6

50.8
94

Recommended fixings for mounting: M6 socket head cap screws.

Auxiliary gate and cathode leads can be ordered separately.

Nominal weight: 1200g

Module outline type code: MP02-W13

9.5

23.8

2 Off Holes M3 x 0.5
10 deep

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MP02TT200

POWER ASSEMBLY CAPABILITY

The Power Assembly group provides support for those customers requiring more than the basic semiconductor switch. Using CAD
design tools the group has developed a flexible range of heatsink / clamping systems in line with advances in device types and the
voltage and current capability of Dynex semiconductors.

An extensive range of air and liquid cooled assemblies is available covering the range of circuit designs in general use today.

HEATSINKS

The Power Assembly group has a proprietary range of extruded aluminium heatsinks. These were designed to optimise the
performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on
request.

For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or customer
service office.

http://www.dynexsemi.com

e-mail: [email protected]

HEADQUARTERS OPERATIONS

DYNEX SEMICONDUCTOR LTD

Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.
Tel: [phone]
Fax: [phone]

DYNEX POWER INC.

99 Bank Street, Suite 410,
Ottawa, Ontario, Canada, K1P 6B9
Tel: [phone]
Fax: [phone]
Toll Free: 1.888.33.DYNEX (39639)

Datasheet Annotations:

Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:-

Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.

This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as
a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves
the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such
methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication
or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury

or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.

All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.

CUSTOMER SERVICE CENTRES

Mainland Europe Tel: [phone]. Fax: [phone]
North America Tel: [phone]. Fax: [phone]
UK, Scandinavia & Rest Of World Tel: [phone]. Fax: [phone]

SALES OFFICES

Mainland Europe Tel: [phone]. Fax: [phone]
North America Tel: [phone]. Fax: [phone]. Toll Free: 1.888.33.DYNEX (39639) /

Tel: [phone]. Fax: [phone].
UK, Scandinavia & Rest Of World Tel: [phone]. Fax: [phone]

These offices are supported by Representatives and Distributors in many countries world-wide.
© Dynex Semiconductor 2001 Publication No. DS5434-1 Issue No. 1.1 April 2001
TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM

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