Datasheet MP02-260-16, MP02-260-10, MP02-260-12, MP02-260-14 Datasheet (DYNEX)

MP02 XX 260 Series

MP02 XX 260 Series

Dual Diode Modules

Replaces December 1998 version, DS5102-3.0 DS5102-4.0 January 2000

FEATURES

■ Dual Device Module

■ Electrically Isolated Package

■ Pressure Contact Construction

■ International Standard Footprint

■ Alumina (non-toxic) Isolation Medium

APPLICATIONS

■ Rectifier Bridges

■ DC Power Bridges

■ Plating Rectifiers

■ Traction Systems

VOLTAGE RATINGS

Type

Number

Repetitive

Peak

Voltages

V

RRM

MP02/260-16
MP02/260-14
MP02/260-12
MP02/260-10

Lower voltage grades available. For full description of part
numbers see "Ordering instructions" on page 3.

1600
1400
1200
1000

Conditions

Tvj = 150oC
IRM = 30mA
V

= V

RSM

RRM

+ 100V

CURRENT RATINGS - PER ARM

KEY PARAMETERS

V

RRM

I

FSM

I

(per arm) 267A

F(AV)

V

isol

CIRCUIT OPTIONS

Code

HB

G

GN

Circuit

PACKAGE OUTLINE

123

Module outline type code: MP02.

See Package Details for further information.

1600V

8100A

2500V

Symbol

I

F(AV)

F(RMS)

Parameter Units

Mean forward current

RMS value A420

Halfwave, resistive load

T

= 75oCI

case

Conditions

T

case

T

case

T

heatsink

T

heatsink

= 75oC
= 85oC

= 75oC
= 85oC

Max.

267

240

216

A
A
A
A192

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MP02 XX 260 Series

SURGE RATINGS - PER ARM

Symbol Parameter

I

I2t

FSM

Surge (non-repetitive) forward current

I2t for fusing

THERMAL & MECHANICAL RATINGS

Symbol

R

th(j-c)

R

th(c-hs)

T

vj

T

sto

Thermal resistance - junction to case
per Diode

Thermal resistance - case to heatsink
per Diode

Virtual junction temperature

Storage temperature range

Parameter

Conditions Max.

VR = 0

10ms half sine;
Tj = 150˚C

VR = 50% V
VR = 0

10ms half sine;
Tj = 150˚C

VR = 50% V

Conditions

dc
halfwave
3 phase

Mounting torque = 6Nm
with mounting compound

RRM

RRM

8100
6500

328000
211000

Max.

0.21

0.22

0.23

0.07

150

-40 to 150

Units

A
A

A2s
A2s

Units

o

C/W

o

C/W

o

C/W

o

C/W

o

C

o

C

V

isol

Isolation voltage

CHARACTERISTICS

Symbol

V

FM

I

RM

V

TO

r

T

Forward voltage
Peak reverse current At V
Threshold voltage
On-state slope resistance

Parameter

Commoned terminals to base plate
AC RMS, 1min, 50Hz

Conditions

At 600A, T

RRM

= 25oC

case

, Tj = 150oC

2.5

Max.

1.3
30

0.667At Tvj = 150oC

kV

Units

V

mA

V0.84At Tvj = 150oC

mΩ

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MP02 XX 260 Series

ORDERING INSTRUCTIONS

Part number is made up as follows:
MP02 HB 260 - 12
MP = Pressure contact module

02 = Outline type
HB = Circuit configuration code (see "circuit options" - front page)
260 = Nominal average current rating at T
12 = V

RRM

/100

Examples:

MP02 HB260-12
MP02 G260-16
MP02 GN260-10

Note: Prefered type is HB configuration. G & GN types are available for specific applications, only when requested.

MOUNTING RECOMMENDATIONS

= 75oC

case

Adequate heatsinking is required to maintain the base
temperature at 75oC if full rated current is to be achieved.
Power dissipation may be calculated by use of VTO and r
information in accordance with standard formulae. We can
provide assistance with calculations or choice of heatsink
if required.

The heatsink surface must be smooth and flat; a surface
finish of N6 (32µin) and a flatness within 0.05mm (0.002")
are recommended.

Immediately prior to mounting, the heatsink surface should
be lightly scrubbed with fine emery, Scotch Brite or a mild
chemical etchant and then cleaned with a solvent to
remove oxide build up and foreign material. Care should
be taken to ensure no foreign particles remain.

An even coating of thermal compound (eg. Unial) should be
applied to both the heatsink and module mounting surfaces.
This should ideally be 0.05mm (0.002") per surface to

T

ensure optimum thermal performance.
After application of thermal compound, place the module

squarely over the mounting holes, (or 'T' slots) in the
heatsink. Using a torque wrench, slowly tighten the
recommended fixing bolts at each end, rotating each in turn
no more than 1/4 of a revolution at a time. Continue until the
required torque of 6Nm (55lb.ins) is reached at both ends.

It is not acceptable to fully tighten one fixing bolt before
starting to tighten the others. Such action may DAMAGE the
module.

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MP02 XX 260 Series

CURVES

2500

2000

- (A)

F

1500

1000

Instantaneous forward current I

500

0

Fig. 1 Maximum (limit) forward characteristics (Per diode)

0.3

0.2

0.1

Thermal Impedance - (˚C/W)

Tj = 150˚C

0.5 1.0 1.5 2.0
Instantaneous forward voltage I

- (V)

R

R

th(j-hs)

th(j-c)

4/9

0

0.001 0.010 0.100 1.0 10 100

Fig. 2 Transient thermal impedance (DC) - (Per diode)

Time - (s)

15000

MP02 XX 260 Series

12500

I2t

10000

7500

5000

Peak half sine wave forward current - (A)

2500

0

11012355010 20 30

ms cycles at 50Hz

Duration

Fig. 3 Surge (non-repetitive) forward current vs time (with 0% V

RRM

, T

22

20

I
t value - A

18

16

s x 10

14

12

10

= 150˚C)

case

2

2

4

5/9

MP02 XX 260 Series

450

400

350

300

250

200

150

100

On-state power loss per device - (W)

50

60˚ Rectangular

180˚ Rectangular
180˚ Sine

120˚ Rectangular

d.c.

0

0 50 100 150 200 250

Mean forward current - (A)

Fig. 4 On-state power loss per arm vs forward current at various conduction angles, 50/60Hz

300

160

140

120

100

d.c.

80

60

40

20

Maximum permissible case temperature - (˚C)

0

25 75 125 175 225 275 300

0 50 100 150

60˚ Rectangular

120˚ Rectangular

180˚ Sine

180˚ Rectangular

250200

325

Forward current - (A)

Fig. 5 Maximum permissible case temperature vs forward current per arm at various conduction angles, 50/60Hz

6/9

1400

MP02 XX 260 Series

1200

0.02

0.04

R

th(hs-a)

˚C/W

R- Load

1000

L- Load

800

0.08

0.10

600

Total power - (W)

400

0.12

0.15

0.20

0.30

0.40

200

0

20 60 100

04080

Maximum ambient temperature - (˚C)

Fig. 6 50/60Hz single phase bridge dc output current vs power loss and maximum permissible ambient temperature for

various values of heatsink thermal resistance.

(Note: R

values given above are true heatsink thermal resistances to ambient and already account for R

th(hs-a)

120 140

0

D.C. output current - (A)

600400200

module contact thermal).

th(c-hs)

1400

1200

1000

800

0.08

0.10

R

th(hs-a)

0.04

˚C/W

0.02

R & L - Load

0.12

600

Total power - (W)

400

0.15

0.20

0.30

0.40

200

0

04080 0

Maximum ambient temperature - (˚C)

Fig. 7 50/60Hz 3- phase bridge dc output current vs power loss and maximum permissible ambient temperature for various

values of heatsink thermal resistance.

(Note: R

values given above are true heatsink thermal resistances to ambient and already account for R

th(hs-a)

120 140 160

D.C. output current - (A)

module contact thermal).

th(c-hs)

50040020020 60 100

7/9

MP02 XX 260 Series

PACKAGE DETAILS

For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise.
DO NOT SCALE.

23 23 24

Ø6.5

12.8

13

80

2x M6

Recommended fixings for mounting: M6 socket head cap screws

Recommended torque for electrical connections: 5Nm (44lb.ins)

Maximum torque for electrical connections: 8Nm (70lb.ins)

123

94

Nominal weight: 350g

Recommended mounting torque: 6Nm (55lb.ins)

3430

CIRCUIT CONFIGURATIONS

8/9

Module outline type code: MP02

1

2

HB

1

2

G

1

2

GN

3

3

3

MP02 XX 260 Series

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e-mail: [email protected]

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DYNEX SEMICONDUCTOR LTD

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Lincolnshire. LN6 3LF. United Kingdom.
Tel: [phone]
Fax: [phone]

DYNEX POWER INC.

Unit 7 - 58 Antares Drive,
Nepean, Ontario, Canada K2E 7W6.
Tel: [phone]
Fax: [phone]
Toll Free: 1.888.33.DYNEX (39639)

Datasheet Annotations:

Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:-

Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.

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© Dynex Semiconductor 2000 Publication No. DS5102-4 Issue No. 4.0 January 2000
TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM

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