Datasheet MOS 4538 Datasheet (FREI)

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Data sheet acquired from Harris Semiconductor SCHS093C − Revised October 2003

The CD14538B is interchangeable with type MC14538 and is similar to and pin-compatible with the CD4098B* and CD4538B. It can replace the CD4538B which type is not recommended for new designs. The CD14538B types are s upplied in 16- lead hermetic dual-in-li ne ceramic packages (F3A suffix), 16-lead dual-in-line plastic packages (E suffix) , 16-lead small-outlin e packages (M, M96, MT, and NSR suffixes), and 16-lead thin shrink small-outline packages (PW and PWR suffixes).

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PACKAGE OPTION ADDENDUM

www.ti.com

PACKAGING INFORMATION

Orderable Device Status

5962-9055701EA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9055701EA

CD14538B-W ACTIVE WAFERSALE YS 0 TBD Call TI Call TI

CD14538BE ACTIVE PDIP N 16 25 Pb-Free

CD14538BF ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 CD14538BF

CD14538BF3A ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 5962-9055701EA

CD14538BM ACTIVE SOIC D 16 40 Green (RoHS

CD14538BM96 ACTIVE SOIC D 16 2500 Green (RoHS

CD14538BMT ACTIVE SOIC D 16 250 Green (RoHS

CD14538BNSR ACTIVE SO NS 16 2000 Green (RoHS

CD14538BNSRE4 ACTIVE SO NS 16 2000 Green (RoHS

CD14538BPW ACTIVE TSSOP PW 16 90 Green (RoHS

CD14538BPWG4 ACTIVE TSSOP PW 16 90 Green (RoHS

CD14538BPWR ACTIVE TSSOP PW 16 2000 Green (RoHS

CD14538BPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.

Package Type Package

(1)

Drawing

Pins Package

Qty

Eco Plan

(2)

(RoHS)

& no Sb/Br)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

CU NIPDAU N / A for Pkg Type -55 to 125 CD14538BE

CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD14538BM

CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD14538B

CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM538B

10-Jun-2014

Samples

(4/5)

CD14538BF3A

Addendum-Page 1

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PACKAGE OPTION ADDENDUM

www.ti.com

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

10-Jun-2014

(3)

MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)

There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)

Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 2

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PACKAGE MATERIALS INFORMATION

www.ti.com 8-Apr-2013

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

CD14538BM96 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1

CD14538BPWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1

Type

Package Drawing

Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm)B0(mm)K0(mm)P1(mm)W(mm)

Pin1

Quadrant

Pack Materials-Page 1

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PACKAGE MATERIALS INFORMATION

www.ti.com 8-Apr-2013

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

CD14538BM96 SOIC D 16 2500 333.2 345.9 28.6

CD14538BPWR TSSOP PW 16 2000 367.0 367.0 35.0

Pack Materials-Page 2

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