Datasheet MOS 4053 Datasheet (FREI)

Page 1
CD4051B, CD4052B, CD4053B
[ /Title (CD405 1B, CD4052 B, CD4053 B) /Sub­ject (CMOS Analog Multi­plex­ers/Dem ultiplex­ers with Logic Level Conver­sion) /Author () /Key­words (Harris Semi­conduc­tor, CD4000
Data sheet acquired from Harris Semiconductor SCHS047G
Features
- Digital . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3V to 20V
- Analog. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ≤20V
• Low ON Resistance, 125Ω (Typ) Over 15V Range for V
• High OFF Resistance, Channel Leakage of ±100pA (Typ) at V
DD-VEE
• Logic-Level Conversion for Digital Addressing Signals of 3V to 20V (V Signals to 20V
• Matched Switch Characteristics, r V
DD-VEE
• Very Low Quiescent Power Dissipation Under All Digital­Control Input and Supply Conditions, 0.2µW (Typ) at V
DD-VSS
• Binary Address Decoding on Chip
• 5V, 10V, and 15V Parametric Ratings
• 100% Tested for Quiescent Current at 20V
• Maximum Input Current of 1µA at 18V Over Full Package Temperature Range, 100nA at 18V and 25
• Break-Before-Make Switching Eliminates Channel Overlap
DD-VEE
= 18V
= 15V
= VDD-VEE = 10V
= 18V
DD-VSS
= 3V to 20V) to Switch Analog
(VDD-VEE = 20V)
P-P
= 5Ω (Typ) for
ON
Signal Input
P-P
o
C
P-P
Applications
• Analog and Digital Multiplexing and Demultiplexing
• A/D and D/A Conversion
• Signal Gating
CMOS Analog Multiplexers/Dem ultiplex er s with Logic Level Conver sion
The CD4051B, CD4052B, and CD4053B analog multiplexers are digitally-controlled analog switches having low ON impedance and very low OFF leakage current. Control of analog signals up to 20V signal amplitudes of 4.5V to 20V (if V V
DD-VEE
differences above 13V, a V required). For example, if V V
EE
controlled by digital inputs of 0V to 5V. These multiplexer circuits dissipate extremely low quiescent power over the full V independent of the logic state of the control signals. When a logic “1” is present at the inhibit input terminal, all channels are off.
of up to 13V can be controlled; for VDD-VEElevel
= -13.5V, analog signals from -13.5V to +4.5V can be
DD-VSS
and VDD-VEE supply-voltage ranges,
can be achieved by digital
P-P
DD-VSS
DD-VSS
DD
of at least 4.5V is
= +4.5V, VSS = 0V, and
= 3V, a
August 1998 - Revised October 2003
The CD4051B is a single 8-Channel multiplexerhaving three binary control inputs, A, B, and C, and an inhibit input. The three binary signals select 1 of 8 channels to be turned on, and connect one of the 8 inputs to the output.
The CD4052B is a differential 4-Channel multiplexer having two binary control inputs, A and B, and an inhibit input. The two binary input signals select 1 of 4 pairs of channels to be turned on and connect the analog inputs to the outputs.
The CD4053B is a triple 2-Channel multiplexer having three separate digital control inputs, A, B, and C, and an inhibit input. Each control input selects one of a pair of channels which are connected in a single-pole, double-throw configuration.
When these devices are used as demultiplexers, the “CHANNEL IN/OUT” terminals are the outputs and the “COMMON OUT/IN” terminals are the inputs.
Ordering Information
PART NUMBER
CD4051BF3A, CD4052BF3A, CD4053BF3A
CD4051BE, CD4052BE, CD4053BE
CD4051BM, CD4051BMT, CD4051BM96 CD4052BM, CD4052BMT, CD4052BM96 CD4053BM, CD4053BMT, CD4053BM96
CD4051BNSR, CD4052BNSR, CD4053BNSR
CD4051BPW, CD4051BPWR, CD4052BPW, CD4052BPWR CD4053BPW, CD4053BPWR
NOTE: When ordering, use the entire part number. The suffixes 96 and R denote tape and reel. The suffix T denotes a small-quantity reel of 250.
TEMP. RANGE
(oC) PACKAGE
-55 to 125 16 Ld CERAMIC DIP
-55 to 125 16 Ld PDIP
-55 to 125 16 Ld SOIC
-55 to 125 16 Ld SOP
-55 to 125 16 Ld TSSOP
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
© 2003, Texas Instruments Incorporated
Copyright
Page 2
Pinouts
T
CHANNELS
IN/OUT
COM OUT/IN
CHANNELS
IN/OUT
CD4051B, CD4052B, CD4053B
CD4051B (PDIP, CDIP, SOIC, SOP, TSSOP)
TOP VIEW
16
V
DD
15
2
14
1
CHANNELS IN/OU
13
0
12
3 A
11 10
B
9
C
IN/OUT
OUT/IN CX OR CY
IN/OUT CX
CD4053B (PDIP, CDIP, SOP, TSSOP)
INH V V
EE SS
1
4
2
6
3 4
7
5
5
6 7 8
INH V V
by bx
EE SS
CD4052B (PDIP, CDIP, SOP, TSSOP)
TOP VIEW
16
Y CHANNELS
IN/OUT
COMMON “Y” OUT/IN
Y CHANNELS
IN/OUT
INH
V
EE
V
SS
1
0
2
2
3 4
3
5
1
6 7 8
V
DD
15
2
X CHANNELS IN/OUT
14
1
13
COMMON “X” OUT/IN
12
0
X CHANNELS IN/OUT
3
11 10
A
9
B
TOP VIEW
16
1 2 3
cy
4 5 6 7 8
V
DD
OUT/IN bx OR by
15 14
OUT/IN ax OR ay
13
ay 12 11 10
IN/OUT
ax
A
B
9
C
Functional Block Diagrams
11
A †
10
B †
LOGIC LEVEL
CONVERSION
9
C †
6
INH †
8 7
V
SS
†All inputs are protected by standard CMOS protection network.
CD4051B
CHANNEL IN/OUT
01234567
V
16
DD
BINARY
TO
1 OF 8
DECODER
WITH
INHIBIT
V
EE
134 2 5 1 12 15 14
TG
TG
TG
TG
TG
TG
TG
TG
COMMON
OUT/IN
3
2
Page 3
CD4051B, CD4052B, CD4053B
Functional Block Diagrams (Continued)
V
16
DD
CD4052B
X CHANNELS IN/OUT
0123
1211 15 14
TG
TG
A
B †
INH †
†
10
9
6
A †
B †
C †
INH †
CONVERSION
CONVERSION
11
10
9
6
LOGIC
LEVEL
V
SS
LOGIC
LEVEL
78
BINARY
TO
1 OF 4
DECODER
WITH
INHIBIT
V
EE
V
16
DD
CD4053B
BINARY TO
1 OF 2
DECODERS
WITH
INHIBIT
Y CHANNELS IN/OUT
IN/OUT
TG
TG
TG
TG
TG
TG
4251 3210
axaybxbycxcy 123 5 1 2 13
TG
TG
TG
TG
TG
TG
COMMON X
OUT/IN
13
3
COMMON Y
OUT/IN
COMMON
OUT/IN
ax OR ay
14
COMMON
OUT/IN
bx OR by
15
COMMON
OUT/IN
cx OR cy
4
8
V
SS
V
7
EE
†All inputs are protected by standard CMOS protection network.
3
V
DD
Page 4
CD4051B, CD4052B, CD4053B
TRUTH TABLES
INPUT STATES
“ON” CHANNEL(S)INHIBIT C B A
CD4051B
0000 0 0001 1 0010 2 0011 3 0100 4 0101 5 0110 6 0111 7 1 X X X None
CD4052B
INHIBIT B A
0 0 0 0x, 0y 0 0 1 1x, 1y 0 1 0 2x, 2y 0 1 1 3x, 3y 1 X X None
CD4053B
INHIBIT A OR B OR C
0 0 ax or bx or cx 0 1 ay or by or cy 1 X None
X = Don’t Care
4
Page 5
CD4051B, CD4052B, CD4053B
Absolute Maximum Ratings Supply Voltage (V+ to V-)
Voltages Referenced to VSS Terminal . . . . . . . . . . . -0.5V to 20V
DC Input Voltage Range . . . . . . . . . . . . . . . . . . -0.5V to VDD +0.5V
DC Input Current, Any One Input. . . . . . . . . . . . . . . . . . . . . . ±10mA
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. The package thermal impedance is calculated in accordance with JESD 51-7.
Electrical Specifications Common Conditions Here: If Whole Table is For the Full Temp. Range, V
RL = 100Ω, Unless Otherwise Specified (Note 3)
CONDITIONS LIMITS AT INDICATED TEMPERATURES (oC)
PARAMETER
SIGNAL INPUTS (VIS) AND OUTPUTS (VOS)
Quiescent Device Current, IDD Max
Drain to Source ON Resistance rON Max 0 ≤ VIS≤ V
Change in ON Resistance (Between Any Two Channels), ∆r
ON
OFF Channel Leakage Current: Any Channel OFF (Max) or ALL ChannelsOFF(Common OUT/IN) (Max)
Capacitance: - -5 5- 5
Propagation Delay Time (Signal Input to Output
DD
Input, C
IS
Output, C
Feedthrough
OS
CD4051 -----30 - pF CD4052 -----18 - pF CD4053 ----- 9 - pF
C
IOS
- - - 5 5 5 150 150 - 0.04 5 µA
- - - 10 10 10 300 300 - 0.04 10 µA
- - - 15 20 20 600 600 - 0.04 20 µA
- - - 20 100 100 3000 3000 - 0.08 100 µA
- 0 0 5 800 850 1200 1300 - 470 1050 Ω
- 0 0 10 310 330 520 550 - 180 400 Ω
- 0 0 15 200 210 300 320 - 125 240 Ω
- 0 0 5 -----15 - Ω
- 0 010-----10 - Ω
- 0 015----- 5 - Ω
-0018±100 (Note 2) ±1000 (Note 2) - ±0.01 ±100
V
DD
RL = 200kΩ, CL = 50pF, tr, tf = 20ns
5 -----3060ns 10-----1530ns 15-----1020ns
Thermal Information
Package Thermal Impedance, θJA(see Note 1):
E (PDIP) package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67oC/W
M (SOIC) package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73oC/W
NS (SOP) package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64oC/W
PW (TSSOP) package. . . . . . . . . . . . . . . . . . . . . . . . . . 108oC/W
Maximum Junction Temperature (Ceramic Package) . . . . . . . . .175oC
Maximum Junction Temperature (Plastic Package) . . . . . . . .150oC
Maximum Storage Temperature Range. . . . . . . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .265oC
(SOIC - Lead Tips Only)
= ±5V, AV = +1,
SUPPLY
UNITSVIS (V) VEE (V) VSS (V) VDD (V) -55 -40 85 12525MIN TYP MAX
nA
(Note 2)
----- 5 - pF
-----0.2 - pF
5
Page 6
CD4051B, CD4052B, CD4053B
Electrical Specifications Common Conditions Here: If Whole Table is For the Full Temp. Range, V
RL = 100Ω, Unless Otherwise Specified (Continued) (Note 3)
CONDITIONS LIMITS AT INDICATED TEMPERATURES (oC)
PARAMETER
CONTROL (ADDRESS OR INHIBIT), V
Input Low Voltage, VIL, Max
Input High Voltage, VIH, Min
Input Current, IIN (Max) VIN = 0, 18 18 ±0.1 ±0.1 ±1 ±1-±10 Propagation Delay Time:
Address-to-Signal OUT(ChannelsON or OFF) See Figures 10, 11, 14
Propagation Delay Time:
Inhibit-to-Signal OUT (Channel Turning ON) See Figure 11
Propagation Delay Time:
Inhibit-to-Signal OUT (Channel Turning OFF) See Figure 15
Input Capacitance, C (Any Address or Inhibit Input)
NOTE:
2. Determined by minimum feasible leakage measurement for automatic testing.
VIL = V through 1kΩ; VIH = V through 1kΩ
tr, tf = 20ns, CL = 50pF, RL = 10kΩ
tr, tf = 20ns, CL = 50pF, RL = 1kΩ
tr, tf = 20ns, CL = 50pF, RL = 10kΩ
IN
C
VEE = VSS,
DD
RL = 1kΩ to VSS, IIS < 2µA on All OFF Channels
DD
-100 5 -----200400ns
-100 5 -----130300ns
5 1.5 1.5 1.5 1.5 - - 1.5 V 103333 - - 3 V 154444 - - 4 V
5 3.5 3.5 3.5 3.5 3.5 - - V 1077777 - - V 15 11 11 11 11 11 - - V
0 0 5 -----450720ns 0 010-----160320ns 0 015-----120240ns
-5 0 5 ---- -225450ns
0 0 5 -----400720ns 0 010-----160320ns 0 015-----120240ns
0 0 5 -----200450ns 0 010-----90210ns 0 015-----70160ns
----- 5 7.5pF
SUPPLY
= ±5V, AV = +1,
-5
UNITSVIS (V) VEE (V) VSS (V) VDD (V) -55 -40 85 12525MIN TYP MAX
±0.1 µA
Electrical Specifications
PARAMETER
Cutoff (-3dB) Frequency Chan­nel ON (Sine Wave Input)
TEST CONDITIONS LIMITS
UNITSVIS (V) VDD (V) RL (kΩ) TYP
5 (Note 3) 10 1 VOS at Common OUT/IN CD4053 30 MHz
VEE = VSS, CD4052 25 MHz
20Log
V
OS
----------- -
V
IS
3dB–=
VOS at Any Channel 60 MHz
CD4051 20 MHz
6
Page 7
B
5
0
CD4051B, CD4052B, CD4053B
Electrical Specifications
TEST CONDITIONS LIMITS
PARAMETER
Total Harmonic Distortion, THD 2 (Note 3) 5 10 0.3 %
3 (Note 3) 10 0.2 % 5 (Note 3) 15 0.12 %
VEE = VSS, fIS = 1kHz Sine Wav e %
-40dB Feedthrough Frequency (All Channels OFF)
-40dB Signal Crosstalk Frequency
Address-or-Inhibit-to-Signal Crosstalk
5 (Note 3) 10 1 VOS at Common OUT/IN CD4053 8 MHz
VEE = VSS, CD4052 10 MHz
V
20Log
OS
----------- -
V
IS
–=
40d
VOS at Any Channel 8 MHz
CD4051 12 MHz
5 (Note 3) 10 1 Between Any 2 Channels 3 MHz
VEE = VSS, Between Sections,
20Log
V
OS
----------- -
V
IS
40dB–=
CD4052 Only
Between Any Two Sections, CD4053 Only
-1010
Measured on Common 6 MHz Measured on Any Chan-
10 MHz
nel In Pin 2, Out Pin 14 2.5 MHz In Pin 15, Out Pin 14 6 MHz
65 mV
(Note 4)
VEE=0,VSS=0,tr,tf=20ns,V
CC
65 mV
= VDD - VSS (Square Wave)
NOTES:
–
3. Peak-to-Peak voltage symmetrical about
4. Both ends of channel.
V
DDVEE
-----------------------------
2
UNITSVIS (V) VDD (V) RL (kΩ) TYP
PEAK
PEAK
Typical Performance Curves
600
VDD - VEE = 5V
500
400
300
200
, CHANNEL ON RESISTANCE (Ω)
100
ON
r
0
-4 -3 -2 -1 0 1 2 3 4 , INPUT SIGNAL VOLTAGE (V)
V
IS
FIGURE 1. CHANNELON RESISTANCE vs INPUT SIGNAL
VOLTAGE (ALL TYPES)
TA = 125oC
= 25oC
T
A
TA = -55oC
300
V
- VEE = 10V
DD
250
200
150
100
, CHANNEL ON RESISTANCE (Ω)
50
ON
r
0
-10 -7.5 -5 -2.5 0 2.5 5 7.5 1 , INPUT SIGNAL VOLTAGE (V)
V
IS
TA = 125oC
TA = 25oC
= -55oC
T
A
FIGURE 2. CHANNELON RESISTANCE vs INPUT SIGNAL
VOLTAGE (ALL TYPES)
7
Page 8
5
P
, POWER DISSIPATION PACKAGE (
W)
5
P
, POWER DISSIPATION PACKAGE (
W)
CD4051B, CD4052B, CD4053B
Typical Performance Curves (Continued)
600
TA = 25oC
500
VDD - VEE = 5V
400
300
200
10V
, CHANNEL ON RESISTANCE (Ω)
100
ON
r
15V
0
-10 -7.5 -5 -2.5 0 2.5 5 7.5 10 V
, INPUT SIGNAL VOLTAGE (V)
IS
FIGURE 3. CHANNEL ON RESISTANCE vs INPUT SIGNAL
VOLTAGE (ALL TYPES)
6
VDD = 5V V
= 0V
SS
= -5V
V
EE
4
T
= 25oC
A
2
0
-2
, OUTPUT SIGNAL VOLTAGE (V)
-4
OS
V
-6
-6 -4 -2 0 2 4 6 V
, INPUT SIGNAL VOLTAGE (V)
IS
RL = 100kΩ, RL = 10kΩ
1kΩ 500Ω
100Ω
250
VDD - VEE = 15V
200
TA = 125oC
150
100
TA = 25oC
TA = -55oC
50
, CHANNEL ON RESISTANCE (Ω)
ON
r
0
-10 -7.5 -5 -2.5 0 2.5 5 7.5 10 V
, INPUT SIGNAL VOLTAGE (V)
IS
FIGURE 4. CHANNEL ON RESISTANCE vs INPUT SIGNAL
VOLTAGE (ALL TYPES)
5
10
TA = 25oC ALTERNATING “O”
AND “I” PATTERN
C
= 50pF
L
4
10
3
10
2
10
, POWER DISSIPATION PACKAGE (µW)
D
P
10
1
VDD = 15V
VDD = 10V
VDD = 5V
CL = 15pF
2
10
10
10
SWITCHING FREQUENCY (kHz)
3
TEST CIRCUIT
V
DD
B/D
f
CD4029
ABC
V
DD
1011
100Ω
13 14 15
CD4051
12
1 5 2 4
8
7
100Ω
4
10
9
6
C
L
Ι
3
5
10
FIGURE 5. ON CHARACTERISTICS FOR 1 OF 8 CHANNELS
(CD4051B)
5
10
TA = 25oC ALTERNATING “O”
µ
D
10
10
10
10
CL = 50pF
4
3
2
1
AND “I” PATTERN
VDD = 15V
VDD = 5V
CL = 15pF
10
VDD = 10V
2
10
10
f
V
DD
100Ω
100Ω
3
TEST CIRCUIT
V
DD
CD4029
B/D
AB
10
9
1 5 2
4
CD4052
6 7
8
Ι
4
10
3
C 13 12 14
15 11
SWITCHING FREQUENCY (kHz)
FIGURE 7. DYNAMIC POWER DISSIPATION vs SWITCHING
FREQUENCY (CD4052B)
8
FIGURE 6. DYNAMIC POWER DISSIPATION vs SWITCHING
FREQUENCY (CD4051B)
5
10
TA = 25oC ALTERNATING “O”
µ
AND “I” PATTERN
C
= 50pF
L
4
10
L
10
3
10
CL = 15pF
10
VDD = 5V
2
10
2
10
D
10
1
SWITCHING FREQUENCY (kHz)
100Ω
10
VDD = 15V
V
DD
100Ω
3
VDD = 10V
TEST CIRCUIT
f
9 3 5
CD4053
10 11
6 7
8
Ι
4
10
4
C
L
12 13
2 1 15 14
10
FIGURE 8. DYNAMIC POWER DISSIPATION vs SWITCHING
FREQUENCY (CD4053B)
Page 9
Test Circuits and Waveforms
= 15V
V
DD
VDD = 7.5V
CD4051B, CD4052B, CD4053B
VDD = 5V
VDD = 5V
7.5V
VSS = 0V
VEE = 0V
VSS = 0V
7 8
(A)
V
EE
= -7.5V
7
8
(B)
NOTE: The ADDRESS (digital-control inputs) and INHIBIT logic levels are: “0” = VSSand “1” = VDD. The analog signal (through the TG) may swing from VEE to VDD.
FIGURE 9. TYPICAL BIAS VOLTAGES
t
= 20ns
10%
90%
50%
90%
50%
r
90%
50%
TURN-ON TIME
10%
TURN-OFF TIME
tf = 20ns
10%
10%
1616 1616
5V
= 0V VSS = 0V
V
SS
10%
t
PHZ
7
8
(C)
t
90%
50%
VEE = -10V
5V
VEE = -5V
= 20ns
r
90%
TURN-OFF TIME
90%
50%
7 8
(D)
tf = 20ns
10%
10%
TURN-ON TIME
FIGURE 10. WAVEFORMS, CHANNEL BEING TURNED ON
(RL = 1kΩ)
V
DD
1
16
2
15 3 4 5 6 7 8
CD4051
I
14
DD
13
12
11
10
9
FIGURE 12. OFF CHANNEL LEAKAGE CURRENT - ANY CHANNEL OFF
1 2 3 4 5 6 7 8
CD4052
FIGURE 11. WAVEFORMS, CHANNEL BEING TURNED OFF
(RL = 1kΩ)
V
DD
16 15
I
14
DD
13 12 11 10
9
1 2 3 4 5 6 7 8
CD4053
V
DD
16 15 14 13 12 11 10
I
DD
9
9
Page 10
CD4051B, CD4052B, CD4053B
Test Circuits and Waveforms (Continued)
V
DD
1
16
2
I
DD
15
3
14
4
13
5
12
6
11
7
10
8
9
CD4051
1 2
I
3
DD
4 5 6 7 8
CD4052
V
DD
16 15 14 13 12 11 10
9
1 2 3 4 5 6 7 8
V
DD
16 15
I
DD
14 13 12 11 10
9
CD4053
FIGURE 13. OFF CHANNEL LEAKAGE CURRENT - ALL CHANNELS OFF
V
DD
OUTPUT
1
16 2 3 4 5 6 7 8
CD4051
15
14
13
12
11
10
V
DD
V
EE
V
SS
R
L
V
DD
V
SS
CLOCK
9
V
SS
IN
OUTPUT
C
L
V
EE
R
C
L
V
EE
V
V
SS
EE
2
L
3
V
DD
4 5 6 7 8
CD4052
1
V
16
DD
15 14 13 12 11
V
DD
10
V
SS
9
V
SS
CLOCK
IN
V
V
SS
EE
1 2 3 4 5 6 7 8
CD4053
V
DD
16 15 14
R
L
13 12
V
DD
11
V
SS
10
9
V
SS
CLOCK
IN
OUTPUT
C
L
V
EE
FIGURE 14. PROPAGATION DELAY - ADDRESS INPUT TO SIGNAL OUTPUT
OUTPUT
1 2 3 4 5 6 7 8
AND t
16 15 14 13 12 11 10
PLH
V V
R
DD SS
L
CLOCK
IN
50pF
V
V
DD
V
EE
V
SS
EE
t
PHL
CD4051
FIGURE 15. PROPAGATION DELAY - INHIBIT INPUT TO SIGNAL OUTPUT
V
DD
µA
1K
1
16
2
15
3
1K
V
IH
V
IL
MEASURE < 2µA ON ALL “OFF” CHANNELS (e.g., CHANNEL 6)
14
4
13
5
12
6
11
7
10
89
CD4051B
V
DD
OUTPUT
1
50pF
R
L R
V
DD
V
SS
CLOCK
9
V
SS
V
IH
V
IL
IN
1 2 3
IH
IL
4 5 6 7 89
V
V
CD4052B
2 3
V
EE
4 5
V
DD
6 7
V
EE
V
8
SS
t
AND t
PHL
CD4052
V
DD
16
1K
15 14 13
1K
12 11 10
MEASURE < 2µA ON ALL “OFF” CHANNELS (e.g., CHANNEL 2x)
µA
16 15 14 13 12 11 10
9
PLH
V
V
DD
OUTPUT
50pF
L
V
DD
V
SS
CLOCK
IN
V
SS
V
IH
V
IL
V
IH
IL
1
16
V
15 14 13 12 11 10
PLH
16 15 14 13 12 11 10
DD
9
V
SS
V
DD
µA
1K
V
IH
V
IL
2 3 4
V
EE
5
V
DD
6 7
V
EE
V
8
SS
t
AND t
PHL
CD4053
1
1K
2 3 4 5 6 7 89
CD4053B
MEASURE < 2µA ON ALL “OFF” CHANNELS (e.g., CHANNEL by)
FIGURE 16. INPUT VOLTAGE TEST CIRCUITS (NOISE IMMUNITY)
10
Page 11
F
CD4051B, CD4052B, CD4053B
Test Circuits and Waveforms (Continued)
V
V
DD
Ι
1 2 3 4 5 6 7 89
CD4052
1 2 3 4 5 6 7 89
CD4051
Ι
CD4053
16 15 14 13 12 11 10
FIGURE 17. QUIESCENT DEVICE CURRENT FIGURE 18. CHANNEL ON RESISTANCE MEASUREMENT
DD
16 15 14 13 12 11 10
10kΩ
V
DD
V
SS
“ON”
CIRCUIT
TG
KEITHLEY
160 DIGITAL
MULTIMETER
1kΩ
RANGE
H.P.
MOSELEY
7030A
Y
X-Y
PLOTTER
X
V
DD
1
16
2
15
3
14
4
13
5
12
6
11
7
10
89
V
SS
CD4051 CD4053
NOTE: Measureinputssequentially,
V
DD
Ι
V
SS
V
SS
1 2 3 4 5 6 7 89
CD4052
to both VDD and VSS connect all unused inputs to either VDDor VSS.
V
DD
16 15 14 13 12 11 10
V
DD
Ι
V
SS
NOTE: Measureinputssequentially, to both VDD and VSS connect all unused inputs to either VDDor VSS.
FIGURE 19. INPUT CURRENT
5V
P-P
R
L
CHANNEL
OFF
CHANNEL
ON
R
VM
R
L
5V
P-P
V
DD
OFF
CHANNEL
6 7 8
1K
RF VM
COMMON
CHANNEL
ON
CHANNEL
OFF
R
L
RF VM
R
L
FIGURE 20. FEEDTHROUGH (ALL TYPES) FIGURE 21. CROSSTALK BETWEEN ANY TWO CHANNELS
(ALL TYPES)
5V
P-P
CHANNEL IN X
ON OR OFF
CHANNEL IN Y
ON OR OFF
R
L
RF VM
R
L
FIGURE 22. CROSSTALK BETWEEN DUALS OR TRIPLETS (CD4052B, CD4053B)
11
Page 12
CD4051B, CD4052B, CD4053B
Test Circuits and Waveforms (Continued)
DIFFERENTIAL
SIGNALS
CD4052
DIFF.
AMPLIFIER/
LINE DRIVER
DIFF.
MULTIPLEXING
FIGURE 23. TYPICAL TIME-DIVISION APPLICATION OF THE CD4052B
Special Considerations
In applications where separate power sources are used to drive V should exceed V provision avoids permanent current flow or clamp action on the V CD4051B, CD4052B or CD4053B.
A B C
and the signal inputs, the VDDcurrent capability
DD
DD/RL(RL
supply when power is applied or removed from the
DD
= effective external load). This
A B
CD4051B
C INH
COMMUNICATIONS
LINK
DIFF.
RECEIVER
CD4052
DEMULTIPLEXING
Q
A
D E
1/2
B
CD4556
E
0
Q
1
Q
2
A B C INH
A B C INH
CD4051B
CD4051B
COMMON OUTPUT
FIGURE 24. 24-TO-1 MUX ADDRESSING
12
Page 13
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security Low Power www.ti.com/lpw Telephony www.ti.com/telephony
Wireless
Video & Imaging www.ti.com/video Wireless www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
Page 14
PACKAGE OPTION ADDENDUM
www.ti.com
PACKAGING INFORMATION
Orderable Device Status
7901502EA ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type 8101801EA ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type CD4051BE ACTIVE PDIP N 16 25 Pb-Free
CD4051BEE4 ACTIVE PDIP N 16 25 Pb-Free
CD4051BF ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type
CD4051BF3A ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type
CD4051BM ACTIVE SOIC D 16 40 Green (RoHS &
CD4051BM96 ACTIVE SOIC D 16 2500 Green (RoHS &
CD4051BM96E4 ACTIVE SOIC D 16 2500 Green (RoHS &
CD4051BM96G4 ACTIVE SOIC D 16 2500 Green (RoHS &
CD4051BME4 ACTIVE SOIC D 16 40 Green (RoHS &
CD4051BMG4 ACTIVE SOIC D 16 40 Green (RoHS &
CD4051BMT ACTIVE SOIC D 16 250 Green (RoHS &
CD4051BMTE4 ACTIVE SOIC D 16 250 Green (RoHS &
CD4051BMTG4 ACTIVE SOIC D 16 250 Green (RoHS &
CD4051BNSR ACTIVE SO NS 16 2000 Green (RoHS &
CD4051BNSRE4 ACTIVE SO NS 16 2000 Green (RoHS &
CD4051BPW ACTIVE TSSOP PW 16 90 Green (RoHS &
CD4051BPWE4 ACTIVE TSSOP PW 16 90 Green (RoHS &
CD4051BPWR ACTIVE TSSOP PW 16 2000 Green (RoHS &
CD4051BPWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS &
CD4052BE ACTIVE PDIP N 16 25 Pb-Free
CD4052BEE4 ACTIVE PDIP N 16 25 Pb-Free
CD4052BF ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type
CD4052BF3A ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type
CD4052BM ACTIVE SOIC D 16 40 Green (RoHS &
CD4052BM96 ACTIVE SOIC D 16 2500 Green (RoHS &
(1)
Package
Type
Package Drawing
Pins Package
Qty
Eco Plan
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
no Sb/Br)
(RoHS)
(RoHS)
(RoHS)
(RoHS)
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU N / A for Pkg Type
CU NIPDAU N / A for Pkg Type
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
23-Apr-2007
(3)
Addendum-Page 1
Page 15
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device Status
(1)
Package
Type
Package Drawing
Pins Package
Qty
Eco Plan
CD4052BM96E4 ACTIVE SOIC D 16 2500 Green (RoHS &
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU Level-1-260C-UNLIM
23-Apr-2007
no Sb/Br)
CD4052BM96G4 ACTIVE SOIC D 16 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4052BME4 ACTIVE SOIC D 16 40 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4052BMG4 ACTIVE SOIC D 16 40 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4052BMT ACTIVE SOIC D 16 250 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4052BMTE4 ACTIVE SOIC D 16 250 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4052BMTG4 ACTIVE SOIC D 16 250 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4052BNSR ACTIVE SO NS 16 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4052BNSRE4 ACTIVE SO NS 16 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4052BNSRG4 ACTIVE SO NS 16 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4052BPW ACTIVE TSSOP PW 16 90 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4052BPWE4 ACTIVE TSSOP PW 16 90 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4052BPWG4 ACTIVE TSSOP PW 16 90 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4052BPWR ACTIVE TSSOP PW 16 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4052BPWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4052BPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4053BE ACTIVE PDIP N 16 25 Pb-Free
CU NIPDAU N / A for Pkg Type
(RoHS)
CD4053BEE4 ACTIVE PDIP N 16 25 Pb-Free
CU NIPDAU N / A for Pkg Type
(RoHS)
CD4053BF ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type
CD4053BF3A ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type
CD4053BM ACTIVE SOIC D 16 40 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4053BM96 ACTIVE SOIC D 16 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4053BM96E4 ACTIVE SOIC D 16 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4053BM96G4 ACTIVE SOIC D 16 2500 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4053BME4 ACTIVE SOIC D 16 40 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4053BMG4 ACTIVE SOIC D 16 40 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4053BMT ACTIVE SOIC D 16 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
(3)
Addendum-Page 2
Page 16
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device Status
(1)
Package
Type
Package Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
23-Apr-2007
(3)
no Sb/Br)
CD4053BMTE4 ACTIVE SOIC D 16 250 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4053BMTG4 ACTIVE SOIC D 16 250 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4053BNSR ACTIVE SO NS 16 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4053BNSRE4 ACTIVE SO NS 16 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4053BNSRG4 ACTIVE SO NS 16 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4053BPW ACTIVE TSSOP PW 16 90 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4053BPWE4 ACTIVE TSSOP PW 16 90 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4053BPWG4 ACTIVE TSSOP PW 16 90 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4053BPWR ACTIVE TSSOP PW 16 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4053BPWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4053BPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS &
CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
Page 17
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Apr-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
Page 18
PACKAGE MATERIALS INFORMATION
www.ti.com
Device Package Pins Site Reel
Diameter
(mm)
CD4051BM96 D 16 MLA 330 16 6.5 10.3 12.1 2 16 Q1 CD4051BM96 D 16 FMX 0 16 6.5 10.3 12.1 2 16 Q1 CD4051BNSR NS 16 MLA 330 16 8.2 10.5 2.5 12 16 Q1
CD4051BPWR PW 16 MLA 330 12 7.0 5.6 1.6 8 12 Q1
CD4052BM96 D 16 FMX 0 16 6.5 10.3 12.1 2 16 Q1 CD4052BNSR NS 16 MLA 330 16 8.2 10.5 2.5 12 16 Q1
CD4052BPWR PW 16 MLA 330 12 7.0 5.6 1.6 8 12 Q1
CD4053BM96 D 16 FMX 0 16 6.5 10.3 12.1 2 16 Q1 CD4053BNSR NS 16 MLA 330 16 8.2 10.5 2.5 12 16 Q1
CD4053BPWR PW 16 MLA 330 12 7.0 5.6 1.6 8 12 Q1
Reel
Width
(mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm)W(mm)
30-Apr-2007
Pin1
Quadrant
TAPE AND REEL BOX INFORMATION
Device Package Pins Site Length (mm) Width (mm) Height (mm)
CD4051BM96 D 16 MLA 333.2 333.2 28.58 CD4051BM96 D 16 FMX 333.2 333.2 28.58
CD4051BNSR NS 16 MLA 333.2 333.2 28.58
CD4051BPWR PW 16 MLA 338.1 340.5 20.64
CD4052BM96 D 16 FMX 333.2 333.2 28.58
CD4052BNSR NS 16 MLA 333.2 333.2 28.58
CD4052BPWR PW 16 MLA 338.1 340.5 20.64
CD4053BM96 D 16 FMX 333.2 333.2 28.58
CD4053BNSR NS 16 MLA 333.2 333.2 28.58
CD4053BPWR PW 16 MLA 338.1 340.5 20.64
Pack Materials-Page 2
Page 19
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Apr-2007
Pack Materials-Page 3
Page 20
Page 21
Page 22
Page 23
Page 24
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65
1,20 MAX
14
0,30
0,19
8
4,50 4,30
PINS **
7
Seating Plane
0,15
0,05
8
1
A
DIM
6,60 6,20
14
0,10
M
0,10
0,15 NOM
0°–8°
2016
Gage Plane
24
0,25
0,75 0,50
28
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-153
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
7,70
9,80
9,60
4040064/F 01/97
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Page 25
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products Applications
Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security Low Power www.ti.com/lpw Telephony www.ti.com/telephony
Wireless
Video & Imaging www.ti.com/video Wireless www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
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