Datasheet MOC3062-M, MOC3063-M, MOC3162-M, MOC3061-M, MOC3163-M Datasheet (Fairchild Semiconductor)

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MOC3061-M MOC3062-M MOC3063-M MOC3162-M MOC3163-M

PACKAGE

ANODE

SCHEMATIC

1

MAIN TERM.

6

CATHODE

N/C

2

3

ZERO

CROSSING

CIRCUIT

*DO NOT CONNECT (TRIAC SUBSTRATE)

6

1

NC*

5

4

MAIN TERM.

6

1

DESCRIPTION

The MOC306X-M and MOC316X-M devices consist of a GaAs infrared emitting diode optically coupled to a monolithic silicon detector performing the function of a zero voltage crossing bilateral triac driver. They are designed for use with a triac in the interface of logic systems to equipment powered from 115/240 VAC lines, such as solid-state relays, industrial controls, motors, solenoids and consumer appliances, etc.

FEATURES

• Simpliﬁes logic control of 115/240 VAC power

• Zero voltage crossing

• dv/dt of 1000 V/µs guaranteed (MOC316X-M), – 600 V/ms guaranteed (MOC306X-M)

• VDE recognized (File # 94766) – ordering option V (e.g., MOC3063V-M)

• Underwriters Laboratories (UL) recognized (File #E90700, volume 2)

APPLICATIONS

• Solenoid/valve controls

• Static power switches

•Temperature controls

•AC motor starters

• Lighting controls

•AC motor drives

• E.M. contactors

• Solid state relays

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ABSOLUTE MAXIMUM RATINGS

Parameters Symbol Device Value Units

TOTAL DEVICE

Storage Temperature T

Operating Temperature T

Lead Solder Temperature T

Junction Temperature Range T

Isolation Surge Voltage

Total Device Power Dissipation @ 25°C

Derate above 25°C 2.94 mW/°C

EMITTER

Continuous Forward Current I

Reverse Voltage V

Total Power Dissipation 25°C Ambient

Derate above 25°C 1.41 mW/°C

DETECTOR

Off-State Output Terminal Voltage V

Peak Repetitive Surge Current (PW = 100 µs, 120 pps) I

Total Power Dissipation @ 25°C Ambient

Derate above 25°C 1.76 mW/°C

(4)

(peak AC voltage, 60Hz, 1 sec duration) V

(T

= 25°C unless otherwise noted)

A

STG

OPR

SOL

J

ISO

P

D

F

R

P

D

DRM

TSM

P

D

All -40 to +150 °C

All -40 to +85 °C

All 260 for 10 sec °C

All -40 to +100 °C

All 7500 Vac(pk)

All

All 60 mA

All 6 V

All

All 600 V

All 1 A

All

250 mW

120 mW

150 mW

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ELECTRICAL CHARACTERISTICS

(TA = 25°C Unless otherwise speciﬁed)

INDIVIDUAL COMPONENT CHARACTERISTICS

Parameters Test Conditions Symbol Device Min Typ* Max Units

EMITTER

Input Forward Voltage I Reverse Leakage Current V

= 30 mA V

F

= 6 V I

R

F

R

DETECTOR

Peak Blocking Current, Either Direction V

Critical Rate of Rise of Off-State Voltage I

TRANSFER CHARACTERISTICS

= 600V, I

DRM

= 0 (ﬁgure 9, note 3) dv/dt

F

(T

A

= 0 (note 1) I

F

= 25°C Unless otherwise speciﬁed.)

DRM1

DC Characteristics Test Conditions Symbol Device Min Typ* Max Units

LED Trigger Current (rated I

FT

)

Peak On-State Voltage, Either Direction

main terminal

Voltage = 3V (note 2)

= 100 mA peak,

I

TM

I

= rated I

F

FT

Holding Current, Either Direction I

I

V

MOC3062-M/

FT

MOC3063-M/

TM

H

All 1.3 1.5 V All 0.005 100 µA

MOC316X-M 10 100 MOC306X-M 10 500 MOC306X-M 600 1500 MOC316X-M 1000

MOC3061-M 15

MOC3162-M

10

MOC3163-M

All 1.8 3 V

All 500 µA

nA

V/µs

mA

5

ZERO CROSSING CHARACTERISTICS

Characteristics Test Conditions Symbol Device Min Typ* Max Units

Inhibit Voltage (MT1-MT2 voltage above which device will not trigger)

Leakage in Inhibited State

I

= Rated I

F

I

= Rated I

F

V

= 600V, off state

DRM

FT

V

INH

,

I

DRM2

MOC3061-M/2M/3M 12 20

MOC3062-M/3M 12 15

All 150 500 µA

ISOLATION CHARACTERISTICS

Characteristics Test Conditions Symbol Device Min Typ* Max Units

Isolation Voltage f = 60 Hz, t = 1 sec V

*Typical values at T

= 25°C

A

ISO

Notes

1. Test voltage must be applied within dv/dt rating.

2. All devices are guaranteed to trigger at an I between max I absolute max I

(15 mA for MOC3061-M, 10 mA for MOC3062-M & MOC3162-M, 5 mA for MOC3063-M & MOC3163-M) and

FT

(60 mA).

F

value less than or equal to max I

F

3. This is static dv/dt. See Figure 9 for test circuit. Commutating dv/dt is a function of the load-driving thyristor(s) only.

4. Isolation surge voltage, V

, is an internal device dielectric breakdown rating. For this test, Pins 1 and 2 are common,

ISO

and Pins 4, 5 and 6 are common.

Page 3 of 10

All 7500 V

. Therefore, recommended operating I

FT

lies

F

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V

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Figure 1. LED Forward Voltage vs. Forward Current

1.7

1.6

1.5

1.4

1.3

1.2

1.1

, FORWARD VOLTAGE (V)

1.0

F

V

0.9

0.8

0.7

0.1 1 10 100

TA = -40°C

TA = 25°C

TA = 85°C

IF, LED FORWARD CURRENT (mA)

Figure 3. LED Current Required to Trigger vs.

LED Pulse Width

16

Figure 2. Trigger Current Vs. Temperature

1.6

1.5

1.4

1.3

1.2

, NORMALIZED

1.1

FT

I

1.0

0.9

0.8

-40 -20 0 20 40 60 80 100

Figure 4. Leakage Current, I

10000

VTM = 3V NORMALIZED TO T

TA, AMBIENT TEMPERATURE (°C)

= 25°C

A

vs. Temperature

DRM

14

12

10

8

6

4

2

, LED TRIGGER CURRENT (NORMALIZED)

FT

I

0

TA = 25°C NORMALIZED TO PW

PWIN, LED TRIGGER PULSE WIDTH (µs)

IN

101 100

>> 100µs

Page 4 of 10

1000

100

10

, LEAKAGE CURRENT (nA)

DRM

1

I

0.1

-40 -20 0 20 40 60 80 100

T

, AMBIENT TEMPERATURE (°C)

A

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Figure 5. I

2.4

2.2

2.0

1.8

1.6

1.4

1.2

, NORMALIZED

1.0

DRM2

I

0.8

0.6

0.4

-40 -20 0 20 40 60 80 100

Figure 7. I

3.2

2.8

2.4

2.0

1.6

1.2

0.8

, HOLDING CURRENT (NORMALIZED)

H

I

0.4

0.0

-40 -20 0 20 40 60 80 100

, Leakage in Inhibit State vs. Temperature

DRM2

IF = RATED I NORMALIZED TO TA = 25°C

T

, AMBIENT TEMPERATURE (°C)

A

, Holding Current vs. Temperature

H

T

, AMBIENT TEMPERATURE (°C)

A

FT

Figure 6. On-State Characteristics

800

600

400

200

-200

-400

, ON-STATE CURRENT (mA)

TM

I

-600

-800

TA = 25°C

0

-4 -3 -2 -1 0 1 2 3 4

VTM, ON-STATE VOLTAGE (VOLTS)

Figure 8. Inhibit Voltage vs. Temperature

1.20

1.15

1.10

1.05

1.00

, NORMALIZED

0.95

INH

V

0.90

0.85

0.80

NORMALIZED TO TA = 25°C

-40 -20 0 20 40 60 80 100

T

, AMBIENT TEMPERATURE (°C)

A

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1. 100x scope probes are used, to allow high speeds and voltages.

2. The worst-case condition for static dv/dt is established by triggering the D.U.T. with a normal LED input current, then removing

the current. The variable vernier resistor combined with various capacitor combinations allows the dv/dt to be gradually increased until the D.U.T. continues to trigger in response to the applied voltage pulse, even after the LED current has been removed. The dv/dt is then decreased until the D.U.T. stops triggering. τ

SELECT

V

DRM/VRRM

X100 PROBE

DIFFERENTIAL

PREAMP

MOUNT DUT ON TEMPERATURE CONTROLLED Cµ PLATE

1

2

X100 PROBE

6

DUT

4

dV

dt

VERNIER

20k

2W

100 2W

2W

82

is measured at this point and recorded.

RC

27

2W

0.33 1000V

470pF

0.001

0.005

0.01

0.047

1000

10 WATT

WIREWOUND

1 MEG 2W EACH

POWER

1.2 MEG

2W

0.047

1000V

TEST

1N914

20V

56

1000 f = 10 Hz PW = 100 µs 50 Ω PULSE GENERATOR

2W

ALL COMPONENTS ARE NON-INDUCTIVE UNLESS SHOWN

Figure 9. Circuit for Static dV Measurement of Power Thyristors

1/4W

1N967A

18V

dt

BASIC APPLICATIONS

Typical circuit for use when hot line switching is required. In this circuit the "hot" side of the line is switched and the load connected to the cold or neutral side. The load may be connected to either the neutral or hot line.

R

is calculated so that I

in

mA for the MOC3061-M, 10 mA for the MOC3062-M, or 5 mA for the MOC3063-M. The 39 ohm resistor and 0.01 µF capacitor are for snubbing of the triac and is often, but not always, necessary depending upon the particular triac and load used.

Suggested method of ﬁring two, back-to-back SCR’s with a Fairchild triac driver. Diodes can be 1N4001; resistors, R1 and R2, are optional 330 ohm.

Note: This optoisolator should not be used to drive a load directly. It is intended to be a trigger device only.

is equal to the rated I

F

of the part, 15

FT

V

RFP4N100

CC

0.1

0.47

R

in

V

CC

1

R

in

2

3

1

MOC3061-M

2

MOC3062-M MOC3063-M

3

Figure 10. Hot-Line Switching Application Circuit

R1 D1

6

MOC3061-M MOC3062-M MOC3063-M

5

360 Ω

4

6

5

4

360

SCR

0-1000V

10mA

360 Ω

R2 D2

FKPF12N60

39Ω

0.01µF

SCR

LOAD

HOT

240 VAC

NEUTRAL

115 VAC

Page 6 of 10

Figure 11. Inverse-Parallel SCR Driver Circuit

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Package Dimensions (Through Hole) Package Dimensions (Surface Mount)

0.350 (8.89)

0.320 (8.13)

0.014 (0.36)

0.010 (0.25)

0.260 (6.60)

0.240 (6.10)

0.100 [2.54]

0.012 (0.30)

0.008 (0.20)

0.390 (9.90)

0.332 (8.43)

0.320 (8.13)

0.035 (0.88)

0.006 (0.16)

0.070 (1.77)

0.040 (1.02)

0.200 (5.08)

0.115 (2.93)

0.100 (2.54)

0.015 (0.38)

0.020 (0.50)

0.016 (0.41)

0.350 (8.89)

0.320 (8.13)

0.014 (0.36)

0.010 (0.25)

0.100 (2.54)

0.260 (6.60)

0.240 (6.10)

0.320 (8.13)

15°

0.012 (0.30)

0.070 (1.77)

0.040 (1.02)

0.200 (5.08)

0.115 (2.93)

0.025 (0.63)

0.020 (0.51)

0.020 (0.50)

0.016 (0.41)

Package Dimensions (0.4” Lead Spacing) Recommended Pad Layout for

0.350 (8.89)

0.320 (8.13)

Surface Mount Leadform

0.260 (6.60)

0.240 (6.10)

0.070 (1.77)

0.040 (1.02)

0.200 (5.08)

0.115 (2.93)

0.100 (2.54)

0.015 (0.38)

0.020 (0.50)

0.016 (0.41)

0.014 (0.36)

0.010 (0.25)

0.100 [2.54]

NOTE

All dimensions are in inches (millimeters)

0.012 (0.30)

0.008 (0.21)

0.425 (10.80)

0.400 (10.16)

Page 7 of 10

0.425 (10.79

0.100 (2.54

0.305 (7.75

0.070 (1.78

0.060 (1.52

0.030 (0.76

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ORDERING INFORMATION

Option Order Entry Identiﬁer Description

SSSurface Mount Lead Bend

SR2 SR2 Surface Mount; Tape and reel

TT0.4" Lead Spacing

VVVDE 0884

TV TV VDE 0884, 0.4" Lead Spacing

SV SV VDE 0884, Surface Mount

SR2V SR2V VDE 0884, Surface Mount, Tape & Reel

MARKING INFORMATION

Deﬁnitions

1Fairchild logo

2Device number

3

4 One digit year code, e.g., ‘3’

5Two digit work week ranging from ‘01’ to ‘53’

6 Assembly package code

*Note – Parts that do not have the ‘V’ option (see deﬁnition 3 above) that are marked with date code ‘325’ or earlier are marked in portrait format.

1

MOC3061

V X YY Q

43

VDE mark (Note: Only appears on parts ordered with VDE option – See order entry table)

5

2

6

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Carrier Tape Specifications

12.0 ± 0.1

4.5 ± 0.20

0.30 ± 0.05

21.0 ± 0.1

4.0 ± 0.1

2.0 ± 0.05

1.5 MIN

Ø

11.5 ± 1.0

9.1 ± 0.20

1.75 ± 0.10

24.0 ± 0.3

0.1 MAX

User Direction of Feed

NOTE

All dimensions are in inches (millimeters)

Reﬂow Proﬁle (White Package, -M Sufﬁx)

300

250

200

150

100

Temperature (°C)

50

0

0.5 1 1.5 2 2.5 3 3.5 4 4.5

0

245°C peak

Time above 183°C, 120–180 sec

Ramp up = 2–10°C/sec

Time (Minute)

10.1 ± 0.20

230°C, 10–30 s

Ø

1.5 ± 0.1/-0

• Peak reflow temperature: 245°C (package surface temperature)

• Time of temperature higher than 183°C for 120–180 seconds

• One time soldering reflow is recommended

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DISCLAIMER

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.

LIFE SUPPORT POLICY

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:

1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user.

2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.

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