Datasheet MOC3010M, MOC3022M Datasheet (Fairchild)

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MOC3010M MOC3011M MOC3012M MOC3020M MOC3021M MOC3022M MOC3023M

PACKAGE

SCHEMATIC

1

ANODE

MAIN TERM.

6

CATHODE

2

NC*

5

1

3

1

N/C

*DO NOT CONNECT (TRIAC SUBSTRATE)

4

MAIN TERM.

6

1

DESCRIPTION

The MOC301XM and MOC302XM series are optically isolated triac driver devices. These devices contain a GaAs infrared emitting diode and a light activated silicon bilateral switch, which functions like a triac. They are designed for interfacing between electronic controls and power triacs to control resistive and inductive loads for 115 VAC operations.

FEATURES

• Excellent I

• High isolation voltage—minimum 5300 VAC RMS

• Underwriters Laboratory (UL) recognized—File #E90700

•Peak blocking voltage – 250V-MOC301XM – 400V-MOC302XM

• VDE recognized (File #94766) – Ordering option V (e.g. MOC3023VM)

stability—IR emitting diode has low degradation

FT

APPLICATIONS

• Industrial controls • Solenoid/valve controls

•Trafﬁc lights • Static AC power switch

•Vending machines • Incandescent lamp dimmers

• Solid state relay • Motor control

• Lamp ballasts

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MOC3010M MOC3011M MOC3012M MOC3020M MOC3021M MOC3022M MOC3023M

ABSOLUTE MAXIMUM RATINGS

(T

= 25°C unless otherwise noted)

A

Parameters Symbol Device Value Units

TOTAL DEVICE

Storage Temperature T

Operating Temperature T

Lead Solder Temperature T

Junction Temperature Range T

(1)

Isolation Surge Voltage (peak AC voltage, 60Hz, 1 sec duration)

Total Device Power Dissipation @ 25°C

Derate above 25°C 4.4 mW/°C

V

STG

OPR

SOL

J

ISO

P

D

All -40 to +150 °C

All -40 to +85 °C

All 260 for 10 sec °C

All -40 to +100 °C

All 7500 Vac(pk)

All

330 mW

EMITTER

Continuous Forward Current I

Reverse Voltage V

Total Power Dissipation 25°C Ambient

Derate above 25°C 1.33 mW/°C

F

R

P

D

All 60 mA

All 3 V

All

100 mW

DETECTOR

Off-State Output Terminal Voltage V

Peak Repetitive Surge Current (PW = 1 ms, 120 pps) I

Total Power Dissipation @ 25°C Ambient

Derate above 25°C 4 mW/°C

DRM

TSM

P

D

MOC3010M/1M/2M

MOC3020M/1M/2M/3M

All 1 A

All

250 400

V

300 mW

Note

1. Isolation surge voltage, V

, is an internal device dielectric breakdown rating. For this test, Pins 1 and 2 are common, and

ISO

Pins 4, 5 and 6 are common.

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ELECTRICAL CHARACTERISTICS

INDIVIDUAL COMPONENT CHARACTERISTICS

Parameters Test Conditions Symbol Device Min Typ Max Units

EMITTER

Input Forward Voltage I

Reverse Leakage Current V

DETECTOR

Peak Blocking Current,Either Direction Rated V

Peak On-State Voltage,Either Direction I

(T

= 25°C Unless otherwise speciﬁed)

A

= 10 mA V

F

= 3 V, T

R

= 100 mA peak, I

TM

= 25°C I

A

, I

= 0 (note 1) I

DRM

F

= 0 V

F

R

DRM

TM

All 1.15 1.5 V

All 0.01 100 µA

All 10 100 nA

All 1.8 3 V

TRANSFER CHARACTERISTICS

(T

= 25°C Unless otherwise speciﬁed.)

A

DC Characteristics Test Conditions Symbol Device Min Typ Max Units

MOC3020M 30

LED Trigger Current Voltage = 3V (note 3) I

Holding Current, Either Direction I

FT

MOC3010M

MOC3021M

MOC3011M

MOC3022M

MOC3012M

MOC3023M

H

All 100 µA

15

10

mA

5

Note

1. Test voltage must be applied within dv/dt rating.

2. This is static dv/dt. See Figure 5 for test circuit. Commutating dv/dt is a function of the load-driving thyristor(s) only.

3. All devices are guaranteed to trigger at an I between max I

(30 mA for MOC3020M, 15 mA for MOC3010M and MOC3021M, 10 mA for MOC3011M and MOC3022M,

FT

5 mA for MOC3012M and MOC3023M) and absolute max I

value less than or equal to max I

F

(60 mA).

F

. Therefore, recommended operating I

FT

lies

F

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Fig. 1 LED Forward Voltage vs. Forward Current

1.8

1.7

1.6

1.5

1.4

1.3

- FORWARD VOLTAGE (V)

F

V

1.2

1.1

1.0 110100

IF - LED FORWARD CURRENT (mA)

TA = -55oC

T

= 25oC

A

T

= 100oC

A

Fig. 3 Trigger Current vs. Ambient Temperature

1.4

1.3

1.2

1.1

(NORMALIZED)

FT

1.0

0.9

0.8

TRIGGER CURRENT - I

0.7

NORMALIZED TO TA = 25∞C

0.6

-40 -20 0 20 40 60 80 100

AMBIENT TEMPERATURE - TA (oC)

Fig. 5 dv/dt vs. Temperature

12

10

8

µs)

6

STATIC dv/dt

CIRCUIT IN FIGURE 5

800

600

400

(mA)

TM

200

0

-200

-400

ON-STATE CURRENT - I

-600

-800

-3 -2 -1 0 1 2 3

ON-STATE VOLTAGE - VTM (V)

Fig. 4 LED Current Required to Trigger vs. LED Pulse Width

25

Fig. 2 On-State Characteristics

20

15

(NORMALIZED)

FT

10

5

TRIGGER CURRENT - I

0

12 5102050100

LED TRIGGER WIDTH - PWin (µs)

Fig. 6 Leakage Current, I

10000

1000

100

NORMALIZED TO: PWin ≥ 100 µs

vs. Temperature

DRM

4

STATIC - dv/dt (V/

2

0

25 30 40 6050 70 80 90 100

Ambient Temperature - TA (oC)

, LEAKAGE CURRENT (nA)

DRM

I

Page 4 of 10

10

1

0.1

-40 -20 0 20 40 60 80 100

TA, AMBIENT TEMPERATURE (oC)

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1. The mercury wetted relay provides a high speed repeated

400V (MOC302X) 250V (MOC301X)

Vdc

PULSE

INPUT

MERCURY

WETTED

RELAY

R

TEST

C

TEST

D.U. T.D.U. T.

R = 10 kΩ

X100 SCOPE PROBE

pulse to the D.U.T.

2. 100x scope probes are used, to allow high speeds and voltages.

3. The worst-case condition for static dv/dt is established by triggering the D.U.T. with a normal LED input current, then removing the current. The variable R

allows the dv/dt

TEST

to be gradually increased until the D.U.T. continues to trigger in response to the applied voltage pulse, even after the LED current has been removed. The dv/dt is then decreased until the D.U.T. stops triggering. τ

RC

is

measured at this point and recorded.

V

=

400 V (MOC302X)

APPLIED VOLTAGE

WAVEFORM

0 VOLTS

252 V (MOC302X) 158 V (MOC301X)

τ

RC

max

= 250 V (MOC301X)

0.63 V

dv/dt =

Figure 5. Static dv/dt Test Circuit

Note: This optoisolator should not be used to drive a load directly.

It is intended to be a trigger device only.

R

in

V

CC

1

MOC3010M

2

MOC3011M MOC3012M

3

Figure 6. Resistive Load

180

6

5

4

252

max

=

τ

158

τ

RC

(MOC302X)

(MOC301X)

120 V 60 Hz

τ

RC

R

L

R

V

CC

in

Figure 7. Inductive Load with Sensitive Gate Triac (IGT ≤ 15 mA)

1

2

3

MOC3010M MOC3011M MOC3012M

180

6

5

4

Page 5 of 10

0.1 µF

Z

L

2.4k

120 V

C1

60 Hz

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Z

L

R

in

V

CC

1

2

3

MOC3010M MOC3011M MOC3012M

180

6

5

4

0.2 µF

1.2 k

120 V 60 Hz

C1

Figure 8. Inductive Load with Sensitive Gate Triac (IGT ≤ 15 mA)

R

in

V

CC

1

2

3

MOC3020M MOC3021M MOC3022M MOC3023M

360

6

5

4

0.05 µF

470

39

0.01 µF

LOAD

HOT

240

VAC

GROUND

In this circuit the “hot” side of the line is switched and the load connected to the cold or ground side.

The 39 ohm resistor and 0.01µF capacitor are for snubbing of the triac, and the 470 ohm resistor and

0.05 µF capacitor are for snubbing the coupler. These components may or may not be necessary depending upon the particular and load used.

Figure 9. Typical Application Circuit

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MOC3010M MOC3011M MOC3012M MOC3020M MOC3021M MOC3022M MOC3023M

Package Dimensions (Through Hole) Package Dimensions (Surface Mount)

0.350 (8.89)

0.320 (8.13)

0.014 (0.36)

0.010 (0.25)

0.260 (6.60)

0.240 (6.10)

0.100 [2.54]

0.390 (9.90)

0.332 (8.43)

0.012 (0.30)

0.008 (0.20)

0.320 (8.13)

0.035 (0.88)

0.012 (0.30)

0.070 (1.77)

0.040 (1.02)

0.200 (5.08)

0.115 (2.93)

0.100 (2.54)

0.015 (0.38)

0.020 (0.50)

0.016 (0.41)

0.350 (8.89)

0.320 (8.13)

0.014 (0.36)

0.010 (0.25)

0.100 (2.54)

0.260 (6.60)

0.240 (6.10)

0.320 (8.13)

15°

0.012 (0.30)

0.070 (1.77)

0.040 (1.02)

0.200 (5.08)

0.115 (2.93)

0.025 (0.63)

0.020 (0.51)

0.020 (0.50)

0.016 (0.41)

Package Dimensions (0.4” Lead Spacing) Recommended Pad Layout for

0.350 (8.89)

0.320 (8.13)

Surface Mount Leadform

0.260 (6.60)

0.240 (6.10)

0.070 (1.77)

0.040 (1.02)

0.200 (5.08)

0.115 (2.93)

0.100 (2.54)

0.015 (0.38)

0.020 (0.50)

0.016 (0.41)

0.014 (0.36)

0.010 (0.25)

0.100 [2.54]

NOTE

All dimensions are in inches (millimeters)

0.012 (0.30)

0.008 (0.21)

0.425 (10.80)

0.400 (10.16)

Page 7 of 10

0.425 (10.79

0.100 (2.54

0.305 (7.75

0.070 (1.78

0.060 (1.52

0.030 (0.76

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ORDERING INFORMATION

Option Order Entry Identiﬁer Description

SS Surface Mount Lead Bend

SR2 SR2 Surface Mount; Tape and reel

TT 0.4" Lead Spacing

VV VDE 0884

TV TV VDE 0884, 0.4" Lead Spacing

SV SV VDE 0884, Surface Mount

SR2V SR2V VDE 0884, Surface Mount, Tape & Reel

MARKING INFORMATION

Deﬁnitions

1Fairchild logo

2Device number

3

4 One digit year code, e.g., ‘3’

5Two digit work week ranging from ‘01’ to ‘53’

6 Assembly package code

*Note – Parts that do not have the ‘V’ option (see deﬁnition 3 above) that are marked with date code ‘325’ or earlier are marked in portrait format.

1

MOC3010

V X YY Q

43

VDE mark (Note: Only appears on parts ordered with VDE option – See order entry table)

5

2

6

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Carrier Tape Specifications

12.0 ± 0.1

4.5 ± 0.20

0.30 ± 0.05

21.0 ± 0.1

4.0 ± 0.1

2.0 ± 0.05

1.5 MIN

Ø

9.1 ± 0.20

1.75 ± 0.10

11.5 ± 1.0

24.0 ± 0.3

0.1 MAX

User Direction of Feed

NOTE

All dimensions are in inches (millimeters)

Reﬂow Proﬁle (White Package, -M Sufﬁx)

300

280

260

240

220

200

180

160

°C

140

120

100

80

60

40

20

0

0 60 180120 270

10.1 ± 0.20

1.822°C/Sec Ramp up rate

33 Sec

Time (s)

260°C

Time above

183°C = 90 Sec

Ø

1.5 ± 0.1/-0

>245°C = 42 Sec

360

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DISCLAIMER

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.

LIFE SUPPORT POLICY

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:

1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user.

2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.

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