Datasheet MOC215M, MOC216M, MOC217M Datasheet (Fairchild)

MOC215M, MOC216M, MOC217M — Small Outline Surface Mount Phototransistor Optocouplers

April 2009

MOC215M, MOC216M, MOC217M Small Outline Surface Mount Phototransistor Optocouplers

Features

■

U.L. recognized (File #E90700, Volume 2) VDE recognized (File #136616)

■

(add option “V” for VDE approval, i.e, MOC205VM)

■

Convenient plastic SOIC-8 surface mountable package style

■

Low LED input current required for easier logic interfacing

Standard SOIC-8 footprint, with 0.050" lead spacing

■

Compatible with dual wave, vapor phase and IR reflow soldering

High input-output isolation of 2500 V

■

guaranteed

AC(rms)

Applications

■

Low power logic circuits Interfacing and coupling systems of different

■

potentials and impedances

■

Telecommunications equipment Portable electronics

■

Description

These devices consist of a gallium arsenide infrared emitting diode optically coupled to a monolithic silicon phototransistor detector, in a surface mountable, small outline, plastic package. They are ideally suited for high density applications, and eliminate the need for throughthe-board mounting.

Marking Information

MOC215M = 215

■

MOC216M = 216 MOC217M = 217

■

Schematic

1

N/C

2

3

4

CATHODE

N/CANODE

8

7

BASE

COLLECTORN/C

6

EMITTER

5

MOC215M, MOC216M, MOC217M — Small Outline Surface Mount Phototransistor Optocouplers

Absolute Maximum Ratings

(T

= 25°C Unless otherwise speciﬁed)

A

Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only.

Symbol Rating Value Unit

EMITTER

I

F

I

(pk) Forward Current – Peak (PW = 100µs, 120pps) 1.0 A

F

V

R

P

D

DETECTOR

V

CEO

V

CBO

V

ECO

I

C

P

D

TOTAL DEVICE

V

ISO

P

D

T

A

T

stg

Forward Current – Continuous 60 mA

Reverse Voltage 6.0 V

LED Power Dissipation @ T Derate above 25°C

= 25°C

A

90

0.8

mW

mW/°C

Collector-Emitter Voltage 30 V

Collector-Base Voltage 70 V

Emitter-Collector Voltage 7.0 V

Collector Current-Continuous 150 mA

Detector Power Dissipation @ T Derate above 25°C

Input-Output Isolation Voltage (f = 60Hz, t = 1 min.)

Total Device Power Dissipation @ T Derate above 25°C

= 25°C

A

= 25°C

(1)(2)

150

1.76

mW

mW/°C

2500 Vac(rms)

250

2.94

mW

mW/°C

Ambient Operating Temperature Range -40 to +100 °C

Storage Temperature Range -40 to +125 °C

Notes:

1. Isolation Surge Voltage, V

, is an internal device dielectric breakdown rating.

ISO

2. For this test, Pins 1 and 2 are common and Pins 5, 6 and 7 are common.

Ω

MOC215M, MOC216M, MOC217M — Small Outline Surface Mount Phototransistor Optocouplers

Electrical Characteristics

(T

= 25°C unless otherwise speciﬁed)

A

Symbol Characteristic Test Conditions Min. Typ.* Max. Unit

EMITTER

V

Forward Voltage I

F

Reverse Leakage Current V

I

R

C Capacitance 18 pF

DETECTOR

BV

I

CEO

C

Collector-Emitter Dark Current V

Collector-Emitter Breakdown Voltage I

CEO

Emitter-Collector Breakdown Voltage I

ECO

Collector-Emitter Capacitance f = 1.0MHz, V

CE

COUPLED

CTR Output Collector Current

(4)

MOC215M MOC216M MOC217M

V

CE(sat)

V

R

C

*Typical values at T

Collector-Emitter Saturation Voltage I

Tu r n-On Time I

t

on

Tu r n-Off Time I

t

off

Rise Time I

t

r

Fall Time I

t

f

Input-Output Isolation Voltage

ISO

Isolation Resistance

ISO

Isolation Capacitance

ISO

= 25°C

A

(2)

(1)(2)(3)

= 1.0mA 1.07 1.3 V

F

= 6.0V 0.001 100 µA

R

= 5.0V, T

CE

= 5.0V, T

V

CE

= 100µA 30 100 V

C

= 100µA 7.0 10 V

E

= 1.0mA, V

I

F

= 25°C 1.0 50 nA

A

= 100°C 1.0 µA

A

= 0 7.0 pF

CE

= 5.0V

CE

20 50

100

= 100µA, I

C

= 2.0mA, V

C

= 100 Ω , (Fig. 10)

R

L

= 2.0mA, V

C

= 100 Ω (Fig. 10)

R

L

= 2.0mA, V

C

= 100 Ω (Fig. 10)

R

L

= 2.0mA, V

C

= 100 Ω (Fig. 10)

R

L

= 1.0mA 0.4 V

F

= 10V,

CC

= 10V,

CC

= 10V,

CC

= 10V,

CC

4.0 µs

3.0 µs

f = 60 Hz, t = 1.0 min. 2500 Vac(rms)

V

= 500V 10

I-O

V

= 0, f = 1.0MHz 0.2 pF

I-O

11

%

Notes:

1. Isolation Surge Voltage, V

, is an internal device dielectric breakdown rating.

ISO

2. For this test, Pins 1 and 2 are common and Pins 5, 6 and 7 are common.

3. V

rating of 2500 V

ISO

4. Current Transfer Ratio (CTR) = I

for t = 1 min. is equivalent to a rating of 3,000 V

AC(rms)

/I

x 100%.

C

F

AC(rms)

for t = 1 sec.

Typical Performance Curves

MOC215M, MOC216M, MOC217M — Small Outline Surface Mount Phototransistor Optocouplers

Fig. 1 LED Forward Voltage vs. Forward Current

1.8

1.7

1.6

1.5

1.4

1.3

1.2

– FORWARD VOLTAGE (V)

F

V

1.1

1.0 110100

TA = –55°C

TA = 25°C

TA = 100°C

IF – LED FORWARD CURRENT (mA)

Fig. 3 Output Current vs. Ambient Temperature

10

1

10

VCE = 5V NOR MALIZE D TO I

1

0.1

– OUTPUT COLLECT OR CURRENT (NORMALIZED)

C

I

0.01

0.1 1 1 0 100

= 10 mA

F

IF – LED INPUT CURRENT (mA)

Fig. 4 Output Current vs. Collector-Emitter Voltage

1.6

1.4

1.2

1.0

0.8

Fig. 2 Output Curent vs. Input Current

– OUTPUT COLLECT OR CUR RENT (N ORM ALIZE D)

C

I

NORMALIZED TO TA = 25°C

0.1

-80 -60 -40 -2 0 0 20 40 6 0 80 100 120

TA – AMBIENT TEMPERATURE (°C)

Fig. 5 Dark Current vs. Ambient Temperature

1000 0

V

= 10V

CE

1000

100

10

1

– COLLECTOR -E MIT TER DA RK CU RRE NT (nA )

CEO

I

0.1 020406080100

TA – AMBIENT TEMPERATURE (°C)

0.6

0.4

0.2

– OUTPUT COLLECTOR CURRENT (NORMALIZED)

C

0.0

I

012345678910

IF = 10 mA NORM ALIZE D TO V

VCE – COLLECTOR-EMITTER VOLTAGE (V)

4.0

3.5

3.0

on

2.5

2.0

ALIZED t

1.5

NORM

Fig. 6 Normalized ton vs. R

= 10V

V

CC

= 2mA

I

C

R

= 100Ω

L

NORMALIZED TO :

AT RBE = OPEN

t

on

BE

1.0

0.5

0.0

0.01 0.1 1 10 100

RBE –

BASE RESISTANCE (MΩ )

= 5V

CE

MOC215M, MOC216M, MOC217M — Small Outline Surface Mount Phototransistor Optocouplers

Typical Performance Curves

Fig. 7 Normalized t

1.6 VCC = 10V

= 2mA

I

C

= 100Ω

R

L

1.4 Normalized to:

at RBE = Open

t

off

1.2

1.0

off

0.8

0.6

NORMALIZED t

0.4

0.2

0.0

0.01 0.1 1 10 10 0

RBE – BASE RESISTANCE (MΩ)

vs. R

off

1.0

0.9

(Continued)

BE

Fig. 9 CTR vs. RBE (Unsaturated)

Fig. 8 CTR vs. RBE (Saturated)

1.0

0.9

I

= 10 mA

0.8

0.7

0.6

= 20mA

I

F

0.5

0.4

NORMALIZED CTR

0.3

0.2

0.1

0.0

10 100 100 0

RBE – BASE RESISTANCE (kΩ)

F

= 5mA

I

F

VCE = 0.3V, TA = 25°C Normalized to:

= Open

CTR at R

BE

INPUT

TEST CIRCUIT

I

F

R

BE

0.8

0.7

0.6

I

= 20mA

F

0.5

0.4

NORMALIZED CTR

0.3

0.2

0.1

0.0

10 100 100 0

RBE – BASE RESISTANCE (kΩ)

I

= 10 mA

F

= 5mA

I

F

VCE = 5V, TA = 25°C Normalized to:

= Open

CTR at R

BE

WAVEFORMS

= 10V

V

CC

INPUT PULSE

I

C

R

L

OUTPUT

I

Adjust

F to produce IC = 2mA

10%

90%

OUTPUT PULSE

t

r

t

on

t

f

t

off

Figure 10. Switching Time Test Circuit and Waveforms

Package Dimensions

8-pin SOIC Surface Mount

8

1

0.202 (5.13)

0.182 (4.63)

0.164 (4.16)

0.144 (3.66)

MOC215M, MOC216M, MOC217M — Small Outline Surface Mount Phototransistor Optocouplers

0.143 (3.63)

0.123 (3.13)

SEATING PLANE

0.021 (0.53)

0.011 (0.28)

Lead Coplanarity: 0.004 (0.10) MAX

Recommended Pad Layout

0.050 (1.27) Typ.

0.275 (6.99)

0.155 (3.94)

0.008 (0.20)

0.003 (0.08)

0.024 (0.61)

0.010 (0.25)

0.006 (0.16)

0.244 (6.19)

0.224 (5.69)

0.060 (1.52)

0.050 (1.27)

Dimensions in inches (mm).

Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package speciﬁcations do not expand the terms of Fairchild’s worldwide terms and conditions, speciﬁcally the warranty therein, which covers Fairchild products.

Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:

http://www

.fairchildsemi.com/packaging/

Ordering Information

Option Order Entry Identiﬁer Description

VVVDE 0884

R2 R2 Tape and reel (2500 units per reel)

R2V R2V VDE 0884, Tape and reel (2500 units per reel)

Marking Information

1

MOC215M, MOC216M, MOC217M — Small Outline Surface Mount Phototransistor Optocouplers

215

SYYXV

43

5

2

6

Deﬁnitions

1Fairchild logo

2Device number

3 VDE mark (Note: Only appears on parts ordered with VDE

option – See order entry table)

4 One digit year code, e.g., ‘8’

5Two digit work week ranging from ‘01’ to ‘53’

6 Assembly package code

Carrier Tape Specifications

8.0 ± 0.10

MOC215M, MOC216M, MOC217M — Small Outline Surface Mount Phototransistor Optocouplers

3.50 ± 0.20

0.30 MAX

8.3 ± 0.10

0.1 MAX

User Direction of Feed

Dimensions in mm

4.0 ± 0.10

2.0 ± 0.05

6.40 ± 0.20

Ø1.5 MIN

1.75 ± 0.10

5.5 ± 0.05

12.0 ± 0.3

5.20 ± 0.20

Ø1.5 ± 0.1

Reﬂow Proﬁle

MOC215M, MOC216M, MOC217M — Small Outline Surface Mount Phototransistor Optocouplers

Max. Ramp-up Rate = 3°C/S

Max. Ramp-down Rate = 6°C/S

Ts ma x

Preheat Area

Ts mi n

t

L

t

s

260 240 220 200 180 160 140 120

T

P

T

L

100

80 60

Temperature (°C)

40 20

0

120

240 360

Time 25°C to Peak

Time (seconds)

Proﬁle Freature Pb-Free Assembly Proﬁle

Temperature Min. (Tsmin) 150°C

Temperature Max. (Tsmax) 200°C

Time (t

Ramp-up Rate (t

Liquidous Temperature (T

Time (t

Peak Body Package Temperature 260°C +0°C / –5°C

Time (t

Ramp-down Rate (T

Time 25°C to Peak Temperature 8 minutes max.

) from (Tsmin to Tsmax) 60–120 seconds

S

to t

) 3°C/second max.

L

P

) 217°C

L

) Maintained Above (T

L

) within 5°C of 260°C 30 seconds

P

to TL) 6°C/second max.

P

) 60–150 seconds

L

t

P

TRADEMARKS

The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries,andis not intended to be an exhaustive list of all such trademarks.

Auto-SPM™ Build it Now™ CorePLUS™ CorePOWER™

CROSSVOLT™

CTL™ Current Transfer Logic™ EcoSPARK EfficentMax™ EZSWITCH™*

®

™*

®

Fairchild Fairchild Semiconductor FACT Quiet Series™

®

FACT

®

FAST

®

F-PFS™

®

FRFET Global Power Resource Green FPS™ Green FPS™ e-Series™ Gmax™ GTO™ IntelliMAX™ ISOPLANAR™ MegaBuck™ MICROCOUPLER™ MicroFET™ MicroPak™ MillerDrive™ MotionMax™ Motion-SPM™ OPTOLOGIC OPTOPLANAR

®

FastvCore™ FETBench™ FlashWriter FPS™

®

*

PDP SPM™ Power-SPM™

PowerTrench

SM

PowerXS™ Programmable Active Droop™ QFET QS™ Quiet Series™ RapidConfigure™

Saving our world, 1mW/W/kW at a time™ SmartMax™ SMART START™ SPM STEALTH™ SuperFET™ SuperSOT™-3

®

SuperSOT™-6 SuperSOT™-8 SupreMOS™ SyncFET™ Sync-Lock™

®

ThePower Franchise

TinyBoost™ TinyBuck™

®

TinyLogic

®

TINYOPTO™

™

TinyPower™ TinyPWM™ TinyWire™ TriFault Detect™

®

TRUECURRENT™* µSerDes™

®

UHC Ultra FRFET™ UniFET™ VCX™ VisualMax™

®

*

XS™

*Trademarks of System General Corporation, used under license by Fairchild Semiconductor.

DISCLAIMER

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANYPRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.

MOC215M, MOC216M, MOC217M — Small Outline Surface Mount Phototransistor Optocouplers

LIFE SUPPORT POLICY

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.

As used herein:

1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user.

2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.

ANTI-COUNTERFEITING POLICY

Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com, under Sales Support.

Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failedapplications, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technicalandproduct information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors.

PRODUCT STATUS DEFINITIONS

Definition of Terms

Datasheet Identification Product Status Definition

Advance Information Formative / In Design

Preliminary

First Production

No Identification Needed Full Production

Obsolete Not In Production

Datasheet contains the design specifications for product development. Specifications may change in any manner without notice.

Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design.

Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design.

Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only.

Rev. I40