Page 1
2
1
MMSZ4697
MMSZ4697
General Description
Half watt, General purpose, Medium Current Surface
Mount Zener in the SOD-123 package. The SOD-123
package has the same footprint as the glass mini-melf (LL-
34) package & provides a convenient alternative to the
Leadless package.
Features
• Compact surface mount with same footprint as mini-melf
• 500mW rating on FR-4 or FR-5 board.
• Class 3 ESD rating (>16kV) per Human Body Model
Ordering
• 7 inch reel (178mm); 8mm Tape; 3,000 units per reel.
Absolute Maximum Ratings (Note 1)
Symbol Parameter Value Units
T
STG
T
J
P
D
R
∅JA
R
∅JL
∆V
Z
Lead Solder T emperature (Max 10 second duration) 260 °C
Nominal Zener Voltage (V
Note 1: These ratings are limiting values above which the serviceability of any semiconductor device may be impaired.
Note 2: Voltage change is equal to the difference between VZ at 100µA and VZ at 10µA.
Storage Temperature -55 ~ 150 °C
Maximum Junction Temperature -55 ~ 150 °C
Total Power Dissipation at 25°C
Derate above 25°C
Thermal Resistance Junction to Ambient 340 °C/W
Thermal Resistance Junction to Lead 150 °C/W
Maximum Voltage Change
) at 50µA10V
Z
Top Mark: DE
1: Cathode
2: Anode
TA=25°C unless otherwise noted
(Note 2)
500
6.7
100 mV
mW
mW/°C
Electrical Characteristics
Symbol Characteristics Test Conditions Min. Max. Units
V
Z
I
R
V
F
∆V
Z
©2004 Fairchild Semiconductor Corporation MMSZ4697, Rev. A
Zener Voltage IZT = 50µA
Reverse Leakage VR = 7.6V 1.0 µA
Forward Voltage IF = 10mA 900 mV
Delta Zener Voltage
TA=25°C unless otherwise noted
(Note 2)
IZT = 100µA to 10µA 100 mV
D.C
9.50 10.50 V
Page 2
MMSZ4697
SOD-123 PACKAGE
PACKAGE CODE = (D6)
Fairchild Semiconductor's Criteria
Corrected March 11, 1998
MIN MAX MIN MAX
Actual Size
DIM (mils) (mils) (mm) (mm)
A
2
B
D
1
A 55 71 1.400 1.800
B 100 112 2.550 2.850
C 34.6 46 0.880 1.180
D 141.7 153.5 3.600 3.900
E ---- ---- ------- ------F 21.5 27.5 0.546 0.70
G 0.5 4 0.0135 0.1015
H 12.7 ---- 0.322 -------
I 3.7 7.7 0.095 0.195
A
I
H
1.2 2 mm
48 mils
0.91 mm
36 mils
2.36 mm
93 mils
4.19 mm
165 mils
SOD-123 LAND PADS
C
0.91 mm
36 mils
G
F
©2004 Fairchild Semiconductor Corporation MMSZ4697, Rev. A
Page 3
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
ACEx™
ActiveArray™
Bottomless™
CoolFET™
CROSSVOL T™
DOME™
EcoSPARK™
E2CMOS
EnSigna
TM
TM
FACT™
FACT Quiet Series™
FAST
FASTr™
FPS™
FRFET™
GlobalOptoisolator™
GTO™
HiSeC™
I2C™
ImpliedDisconnect™
Across the board. Around the world.™
The Power Franchise™
Programmable Active Droop™
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE T O ANY
PRODUCTS HEREIN TO IMPROVE RELIABILITY , FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY
ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT
CONVEY ANY LICENSE UNDER ITS PA TENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
ISOPLANAR™
LittleFET™
MICROCOUPLER™
MicroFET™
MicroPak™
MICROWIRE™
MSX™
MSXPro™
OCX™
OCXPro™
OPTOLOGIC
OPTOPLANAR™
P ACMAN™
POP™
Power247™
PowerSaver™
PowerTrench
QFET
QS™
QT Optoelectronics™
Quiet Series™
RapidConfigure™
RapidConnect™
SILENT SWITCHER
SMART ST ART™
SPM™
Stealth™
SuperFET™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SyncFET™
TinyLogic
TINYOPTO™
TruTranslation™
UHC™
UltraFET
VCX™
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORA TION.
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, or (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the
user.
PRODUCT STA TUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information
Preliminary
No Identification Needed
Formative or
In Design
First Production
Full Production
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
Obsolete
Not In Production
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Rev. I8
Loading...