Page 1
MMSD914
General Description:
The high breakdown voltage, fast switching speed and high
forward conductance of this diode packaged in a SOD-123
Surface Mount package makes it desirable also as a general
purpose diode.
Features:
• Compact surface mount with same footprint as mini-melf.
• 400 milliwatt Power Dissipation package.
• High Breakdown Voltage, Fast Switching Speed.
• Typical capacitance less than 1.5 picofarad.
Ordering:
High Conductance
• 7 inch reel (178 mm); 8 mm Tape; 3,000 units per reel.
Fast Diode
Absolute Maximum Ratings* TA = 25
Sym Parameter Value Units
T
stg
T
J
P
D
Linear Derating Factor from T
R
OJA
W
iv
I
O
I
F
i
F(surge)
*These ratings are limiting values above which the serviceability of any semiconductor device may be impaired
ELECTRICALLY THE SAME AS
THE FDLL914 DEVICE. SOURCED
Electrical Characteristics TA = 25
Storage Temperature -55 to +150
Operating Junction Temperature -55 to +150 OC
Total Power Dissipation at TA = 25OC 400 W
= 25OC 3.2 mW/OC
A
Thermal Resistance Junction-to-Ambient 312 OC/W
Working Inverse Voltage 75 V
Average Rectified Current 200 mA
DC Forward Current (IF) 600 mA
Peak Forward Surge Current (IFSM) Pulse Width = 1.0 Second 1.0 Amp
Pulse Width = 1.0 microsecond 2.0 Amp
FROM THE 1P PRODUCT.
Top Mark: 5D
O
O
C unless otherwise noted
C unless otherwise noted
O
1
2
Actual Size
C
SYM CHARACTERISTICS MIN MAX UNITS TEST CONDITIONS
B
Breakdown Voltage 100 V IR= 100 uA
V
75 V IR= 5.0 uA
I
Reverse Leakage 25 nA VR= 20 V
R
50 uA VR= 20 V TA = 150OC
5.0 uA VR= 75 V
V
C
T
Forward Voltage 1.0 V IF= 10 mA
F
Capacitance 4.0 pF VR= 0.0 V,f = 1.0 MHz
T
Reverse Recovery Time 4.0 ns IF = 10 mA VR = 6.0 V
RR
IRR= 1.0 mA
RL = 100 Ohms
© 1999 Fairchild Semiconductor Corporation
MMSD914 - Rev. A
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SOD-123 PACKAGE
PACKAGE CODE = (D6)
Fairchild Semiconductor's Criteria
Actual Size
MIN MAX MIN MAX
DIM (mils) (mils) (mm) (mm)
2
1
A
A 55 71 1.400 1.800
B 100 112 2.550 2.850
C 35 46 0.880 1.180
D 142 154 3.600 3.900
B
E ---- ---- ------- ------F 21 28 0.546 0.70
G 0.5 4 0.0135 0.1015
D
H 13 ---- 0.322 -------
I 4 8 0.095 0.195
A
H
0.91 mm
36 mils
I
1.2 2 mm
48 mils
2.36 mm
93 mils
4.19 mm
165 mils
SOD-123 LAND PADS
C
F
G
0.91 mm
36 mils
Page 3
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not intended to be an exhaustive list of all such trademarks.
ACEx™
CoolFET™
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E2CMOS
TM
FACT™
FACT Quiet Series™
®
FAST
FASTr™
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HiSeC™
ISOPLANAR™
MICROWIRE™
POP™
PowerTrench™
QS™
Quiet Series™
SuperSOT™-3
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SuperSOT™-8
TinyLogic™
UHC™
VCX™
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NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD
DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT
RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
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DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROV AL OF FAIRCHILD SEMICONDUCTOR CORPORA TION.
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, or (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the
user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
PRODUCT STA TUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information
Preliminary
No Identification Needed
Obsolete
Formative or
In Design
First Production
Full Production
Not In Production
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
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