Datasheet mmbt4124lt1 Datasheet

Page 1
MMBT4124LT1G
General Purpose Transistor
NPN Silicon
Features
Compliant
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector− Emitter Voltage V
Collector− Base Voltage V
Emitter− Base Voltage V
Collector Current − Continuous I
CEO
CBO
EBO
C
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Total Device Dissipation
FR−5 Board (Note 1) @TA = 25°C Derate above 25°C
Thermal Resistance, Junction−to−Ambient R
Total Device Dissipation Alumina Substrate (Note 2) @TA = 25°C
Derate above 25°C
Thermal Resistance, Junction−to−Ambient R
Junction and Storage Temperature TJ, T
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
1. FR−5 = 1.0 0.75 0.062 in.
2. Alumina = 0.4 0.3 0.024 in. 99.5% alumina.
P
D
JA
P
D
JA
stg
25 Vdc
30 Vdc
5.0 Vdc
200 mAdc
225
1.8
556 °C/W
300
2.4
417 °C/W
−55 to +150 °C
W
mW/°C
W
mW/°C
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COLLECTOR
3
1
BASE
2
EMITTER
3
1
2
SOT−23 (TO−236)
CASE 318
STYLE 6
MARKING DIAGRAM
ZC M G
G
ZC = Device Code M = Date Code* G = Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may vary
depending upon manufacturing location.
© Semiconductor Components Industries, LLC, 2009
August, 2009 − Rev. 2
ORDERING INFORMATION
Device Package Shipping
MMBT4124LT1G SOT−23
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
1 Publication Order Number:
3000 / Tape & Reel
MMBT4124LT1/D
†
Page 2
MMBT4124LT1G
ELECTRICAL CHARACTERISTICS (T
= 25°C unless otherwise noted)
A
Characteristic Symbol Min Max Unit
OFF CHARACTERISTICS
Collector− Emitter Breakdown Voltage (Note 3)
(I
= 1.0 mAdc, IE = 0)
C
Collector− Base Breakdown Voltage
(IC = 10 Adc, IE = 0)
Emitter− Base Breakdown Voltage
(IE = 10 Adc, IC = 0)
Collector Cutoff Current
(VCB = 20 Vdc, IE = 0)
Emitter Cutoff Current
(VEB = 3.0 Vdc, IC = 0)
ON CHARACTERISTICS
DC Current Gain (Note 3)
(IC = 2.0 mAdc, VCE = 1.0 Vdc) (IC = 50 mAdc, VCE = 1.0 Vdc)
Collector− Emitter Saturation Voltage (Note 3)
(IC = 50 mAdc, IB = 5.0 mAdc)
Base−Emitter Saturation Voltage (Note 3)
(IC = 50 mAdc, IB = 5.0 mAdc)
SMALL−SIGNAL CHARACTERISTICS
Current− Gain − Bandwidth Product
(IC = 10 mAdc, VCE = 20 Vdc, f = 100 MHz)
Input Capacitance
(VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)
Collector−Base Capacitance
(IE = 0, VCB = 5.0 V, f = 1.0 MHz)
Small−Signal Current Gain
(IC = 2.0 mAdc, VCE = 10 Vdc, RS = 10 k , f = 1.0 kHz)
Current Gain − High Frequency
(IC = 10 mAdc, VCE = 20 Vdc, f = 100 MHz) (IC = 2.0 mAdc, VCE = 10 V, f = 1.0 kHz)
Noise Figure
(IC = 100 Adc, VCE = 5.0 Vdc, RS = 1.0 k, f = 1.0 kHz)
3. Pulse Test: Pulse Width = 300 s, Duty Cycle = 2.0%.
V
(BR)CEO
V
(BR)CBO
V
(BR)EBO
I
CBO
I
EBO
h
FE
V
CE(sat )
V
BE(sat)
f
C
ibo
C
h
T
cb
fe
25 − Vdc
30 − Vdc
5.0 − Vdc
− 50 nAdc
− 50 nAdc
120
60
360
−
− 0.3 Vdc
− 0.95 Vdc
300 − MHz
− 8.0 pF
− 4.0 pF
120 480 −
|hfe|
3.0
120
−
480
NF − 5.0 dB
−
−
10
7.0
5.0
3.0
CAPACITANCE (pF)
2.0
1.0
0.1
0.2 0.3 0.5 0.7 REVERSE BIAS VOLTAGE (VOLTS)
Figure 1. Capacitance
C
ibo
C
obo
1.0 2.0 3.0 5.0 7.0 10 20
200
100
70 50
30
TIME (ns)
20
10.0
7.0
30 40
5.0
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2
t
s
t
d
t
f
t
r
VCC = 3 V IC/IB = 10 V
= 0.5 V
EB(off)
1.0
2.0 3.0 5.0 7.0 10 20 30 50 70 100 200 IC, COLLECTOR CURRENT (mA)
Figure 2. Switching Times
Page 3
12
10
8
6
4
NF, NOISE FIGURE (dB)
2
0
SOURCE RESISTANCE = 200 I
= 1 mA
C
SOURCE RESISTANCE = 500 IC = 100 A
0.1
Figure 3. Frequency Variations
AUDIO SMALL−SIGNAL CHARACTERISTICS
SOURCE RESISTANCE = 200 IC = 0.5 mA
SOURCE RESISTANCE = 1 k IC = 50 A
12 4 1020400.2 0.4
f, FREQUENCY (kHz)
MMBT4124LT1G
NOISE FIGURE
(V
= 5 Vdc, TA = 25°C)
CE
Bandwidth = 1.0 Hz
14
f = 1 kHz
12
10
8
6
4
NF, NOISE FIGURE (dB)
2
100
h PARAMETERS
(VCE = 10 V, f = 1 kHz, TA = 25°C)
0
0.1 1.0 2.0 4.0 10 20 400.2 0.4 100
IC = 1 mA
IC = 0.5 mA
IC = 50 A
IC = 100 A
RS, SOURCE RESISTANCE (k)
Figure 4. Source Resistance
300
200
100
, CURRENT GAIN
70
fe
h
50
30
0.1 0.2 1.0 2.0
0.5
IC, COLLECTOR CURRENT (mA)
Figure 5. Current Gain
20
10
5.0
2.0
5.0 10
100
50
20
10
5
oe
2
h , OUTPUT ADMITTANCE ( mhos)
1
0.1 0.2 1.0 2.0
0.5
IC, COLLECTOR CURRENT (mA)
Figure 6. Output Admittance
10
-4
7.0
5.0
3.0
2.0
5.0 10
1.0
, INPUT IMPEDANCE (k )Ω
ie
h
0.5
0.2
0.1 0.2 1.0 2.0 5.0 100.5 IC, COLLECTOR CURRENT (mA)
Figure 7. Input Impedance
1.0
0.7
re
h , VOLTAGE FEEDBACK RATIO (X 10 )
0.5
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3
0.1 0.2 1.0 2.0 5.0 IC, COLLECTOR CURRENT (mA)
Figure 8. Voltage Feedback Ratio
100.5
Page 4
2.0
MMBT4124LT1G
STATIC CHARACTERISTICS
TJ = +125°C
VCE = 1 V
1.0
0.7
0.5
0.3
0.2
FE
h , DC CURRENT GAIN (NORMALIZED)
0.1
1.0
0.8
0.6
0.4
0.1
IC = 1 mA
0.5 2.0 3.0 10 50 700.2 0.3
+25°C
-55°C
IC, COLLECTOR CURRENT (mA)
Figure 9. DC Current Gain
10 mA
1001.00.7 20030205.0 7.0
TJ = 25°C
30 mA 100 mA
0.2
CE
V , COLLECTOR EMITTER VOLTAGE (VOLTS)
0
0.070.050.030.020.01
Figure 10. Collector Saturation Region
1.2 TJ = 25°C
V
1.0
0.8
0.6
0.4
V, VOLTAGE (VOLTS)
0.2
1.0 2.0 5.0 10 20 500100
IC, COLLECTOR CURRENT (mA)
V
CE(sat)
@ IC/IB = 10
BE(sat)
VBE @ VCE = 1 V
@ IC/IB = 10
Figure 11. “On” Voltages
0.1
0.5 2.0 3.0 100.2 0.3
IB, BASE CURRENT (mA)
1.0
0.5
0
-0.5
-1.0
-1.5
, TEMPERATURE COEFFICIENTS (mV/ C)°θ
V
-2.0
200
0 60 80 120 140 160 18020 40 100 200
1.00.7 5.0 7.0
+25°C to +125°C
VC for V
CE(sat)
-55°C to +25°C
-55°C to +25°C
+25°C to +125°C
VB for V
BE(sat)
IC, COLLECTOR CURRENT (mA)
Figure 12. Temperature Coefficients
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4
Page 5
MMBT4124LT1G
PACKAGE DIMENSIONS
SOT−23 (TO−236)
CASE 318−08
ISSUE AN
A
A1
D
H
SEE VIEW C
E
c
0.25
3
E
12
b
e
q
L
L1
VIEW C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
4. 318−01 THRU −07 AND −09 OBSOLETE, NEW STANDARD 318−08.
DIMAMIN NOM MAX MIN
A1 0.01 0.06 0.10 0.001
b 0.37 0.44 0.50 0.015 c 0.09 0.13 0.18 0.003
D 2.80 2.90 3.04 0.110
E 1.20 1.30 1.40 0.047 e 1.78 1.90 2.04 0.070 L 0.10 0.20 0.30 0.004
L1
H
STYLE 6:
PIN 1. BASE
MILLIMETERS
0.89 1.00 1.11 0.035
0.35 0.54 0.69 0.014 0.021 0.029
2.10 2.40 2.64 0.083 0.094 0.104
E
2. EMITTER
3. COLLECTOR
INCHES
NOM MAX
0.040 0.044
0.002 0.004
0.018 0.020
0.005 0.007
0.114 0.120
0.051 0.055
0.075 0.081
0.008 0.012
SOLDERING FOOTPRINT*
0.95
0.95
0.037
0.037
2.0
0.079
0.9
0.035
SCALE 10:1
0.8
ǒ
inches
mm
Ǔ
0.031
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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MMBT4124LT1/D
5
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