Datasheet mmbfj177lt1-d Datasheet

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Page 1

MMBFJ177LT1G

JFET Chopper

P−Channel − Depletion

Features

• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

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2 SOURCE

MAXIMUM RATINGS

Rating Symbol Value Unit

Drain−Gate Voltage V

Reverse Gate−Source Voltage V

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.

GS(r)

25 Vdc

−25 Vdc

THERMAL CHARACTERISTICS

Total Device Dissipation FR−5 Board

(Note 1) TA = 25°C Derate above 25°C

Thermal Resistance,

Junction−to−Ambient

Junction and Storage Temperature TJ, T

1. FR− 5 = 1.0  0.75  0.062 in.

stg

225

1.8

556 °C/W

−55 to +150 °C

mW/°C

GATE

1 DRAIN

SOT−23 (TO−236AB)

CASE 318−08

STYLE 10

MARKING DIAGRAM

6Y MG

6Y = Specific Device Code M = Date Code* G = Pb−Free Package

(Note: Microdot may be in either location)

*Date Code orientation and/or overbar may

vary depending upon manufacturing location.

August, 2009 − Rev. 4

ORDERING INFORMATION

Device Package Shipping

MMBFJ177LT1G SOT−23

(Pb−Free)

†For information on tape and reel specifications,

including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.

1 Publication Order Number:

3000 Tape & Reel

MMBFJ177LT1/D

†

Page 2

MMBFJ177LT1G

ELECTRICAL CHARACTERISTICS (T

= 25°C unless otherwise noted)

Characteristic Symbol Min Max Unit

OFF CHARACTERISTICS

Gate−Source Breakdown Voltage (VDS = 0, ID = 1.0 mAdc)

Gate Reverse Current (VDS = 0 Vdc, VGS = 20 Vdc) I

Gate Source Cutoff Voltage (VDS = 15 Vdc, ID = 10 nAdc) V

ON CHARACTERISTICS

Zero−Gate−Voltage Drain Current (VGS = 0, VDS = 15 Vdc) (Note 2) I

Drain Cutoff Current (VDS = 15 Vdc, VGS = 10 Vdc) I

Drain Source On Resistance (ID = 500 mAdc)

Input Capacitance

Reverse Transfer Capacitance C

2. Pulse Test: Pulse Width < 300 ms, Duty Cycle ≤ 2%.

VDS = 0, VGS = 10 Vdc

f = 1.0 MHz

(BR)GSS

GSS

GS(off)

DSS

D(off)

DS(on)

iss

rss

30 − Vdc

− 1.0 nAdc

0.8 2.5 Vdc

1.5 20 mAdc

− 1.0 nAdc

− 300

− 11

− 5.5

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Page 3

MMBFJ177LT1G

PACKAGE DIMENSIONS

SOT−23 (TO−236AB)

CASE 318−08

ISSUE AN

NOTES:

SEE VIEW C

0.25

VIEW C

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.

4. 318−01 THRU −07 AND −09 OBSOLETE, NEW STANDARD 318−08.

DIMAMIN NOM MAX MIN

A1 0.01 0.06 0.10 0.001

b 0.37 0.44 0.50 0.015 c 0.09 0.13 0.18 0.003 D 2.80 2.90 3.04 0.110 E 1.20 1.30 1.40 0.047 e 1.78 1.90 2.04 0.070 L 0.10 0.20 0.30 0.004

STYLE 10:

PIN 1. DRAIN

MILLIMETERS

0.89 1.00 1.11 0.035

0.35 0.54 0.69 0.014 0.021 0.029

2.10 2.40 2.64 0.083 0.094 0.104

2. SOURCE

3. GATE

INCHES

NOM MAX

0.040 0.044

0.002 0.004

0.018 0.020

0.005 0.007

0.114 0.120

0.051 0.055

0.075 0.081

0.008 0.012

SOLDERING FOOTPRINT*

0.95

0.037

0.9

0.035

0.8

0.031

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

0.037

SCALE 10:1

2.0

0.079

inches

PUBLICATION ORDERING INFORMATION

LITERATURE FULFILLMENT:

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Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: [email protected]

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USA/Canada

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Phone: 421 33 790 2910

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Phone: 81−3−5773−3850

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Order Literature: http://www.onsemi.com/orderlit

For additional information, please contact your local Sales Representative

MMBFJ177LT1/D