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Page 2
MM74HC273
Octal D-Type Flip-Flops with Clear
MM74HC273 Octal D-Type Flip-Flops with Clear
September 1983
Revised May 2005
General Description
The MM74HC273 edge triggered flip-flops utilize advanced
silicon-gate CMOS technology to implement D-type flipflops. They possess high noi se immunity, low power, and
speeds comparable to low power Schottky TTL circuits.
This device contains 8 master-slave flip-flops with a common clock and common clear. Data on the D input having
the specified se tup and hold times is tran sferred to th e Q
output on the LOW-to-HIG H tra nsiti o n of t he CL OC K i np ut.
The CLEAR input when LOW, sets all outputs to a low
state.
Each output can dri ve 10 low power S chottky TT L equivalent loads. The MM74HC 273 is function ally as well as pi n
compatible to the 74LS273. All inputs are protec ted from
damage due to static discharge by diodes to V
ground.
CC
Features
■ Typical propagation delay: 18 ns
■ Wide operating voltage range
■ Low input current: 1
■ Low quiescent current: 80
■ Output drive: 10 LS-TTL loads
and
P
A maximum
P
A (74 Series)
Ordering Code:
Order Number Package NumberPackage Description
MM74HC273WMM20B20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
MM74HC273SJM20D20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
MM74HC273MTCMTC2020-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
MM74HC273NN20A20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide
Devices also availab l e in Tape and Reel. Specify by appending the suffix lett er “X” to the ordering code .
H HIGH Level (S t eady State)
L LOW Level (S t eady State)
X Don’t Care
n
Transition from LOW-to-HIGH level
The level of Q before the indica ted ste ady state inp ut co ndit ions were
Q
0
established
InputsOutputs
LXXL
H
H
nn
HH
LL
HLXQ
Logic Diagram
0
www.fairchildsemi.com2
Page 4
Absolute Maximum Ratings(Note 1)
(Note 2)
Supply Voltage (VCC)
DC Input Voltage (V
DC Output Voltage (V
Clamp Diode Current (I
DC Output Current, per pin (I
)
IN
)
OUT
, IOK)
IK
)
OUT
DC VCC or GND Current, per pin (ICC)
Storage Temperature Range (T
Power Dissipation (P
)
D
STG
)
(Note 3)600 mW
S.O. Package only500 mW
Lead Temperature (TL)
(Soldering 10 seconds)260qC
1.5 to V
0.5 to V
65q
0.5 to 7.0V
CC
CC
C to 150qC
r
20 mA
r
25 mA
r
50 mA
Recommended Operating
Conditions
1.5V
Supply Voltage (V
0.5V
DC Input or Output Voltage
(VIN, V
OUT
Operating Temperature Range (TA)4085
Input Rise or Fall Times
(tr, tf) V
CC
V
CC
V
Note 1: Absolute Maximum Ratings are those values beyond which damage to the device may occur.
Note 2: Unless otherwis e s pecified all voltages are ref erenced to ground.
Note 3: Power Dissipation tem perature d erating — plastic “N” package:
12 mW/qC from 65qC to 85qC.
CC
)26V
CC
)0V
2.0V1000ns
4.5V500ns
6.0V400ns
MinMaxUnits
CC
DC Electrical Characteristics (Note 4)
TA
SymbolParameterConditions
V
Minimum HIGH Level2.0V1.51.51.5V
IH
Input Voltage4.5V3.153.153.15V
V
Maximum LOW Level2.0V0.50.50.5V
IL
Input Voltage 4.5V1.351.351.35V
V
Minimum HIGH LevelV
OH
Output Voltage|I
V
Maximum LOW LevelV
OL
Output Voltage|I
I
Maximum InputV
IN
Current
I
Maximum QuiescentV
CC
Supply CurrentI
Note 4: For a power supply of 5V r10% the worst case output voltages (VOH, and VOL) occur for HC a t 4.5V. Thus the 4.5V values s hould b e used w hen
designing with this s upply. Worst case VIH and VIL occur at V
rent (IIN, ICC, and IOZ) occur for CMOS at the higher voltage and so the 6.0V values should be used.
VIH or V
V
|I
|I
V
|I
|I
OUT
IN
OUT
IN
OUT
OUT
IN
OUT
IN
OUT
OUT
IN
IN
IL
| d 20 PA2.0V2.01.91.91.9V
VIH or V
IL
| d 4.0 mA4.5V4.23.983.843.7V
| d 5.2 mA6.0V5.75.485.345.2V
VIH or V
IL
| d 20 PA2.0V00.10.10.1V
VIH or V
IL
| d 4 mA4.5V0.20.260.330.4V
| d 5.2 mA6.0V0.20.260.330.4V
VCC or GND6.0V
VCC or GND6.0V880160
0 PA
CC
V
CC
6.0V4.24.24.2V
6.0V1.81.81.8V
4.5V4.54.44.44.4V
6.0V6.05.95.95.9V
4.5V00.10.10.1V
6.0V00.10.10.1V
5.5V and 4.5V respectively. (The VIH value at 5.5V is 3.85V.) The worst case leakage cur-
25qCTA
TypGuaranteed Limits
r
0.1
40 to 85qCTA
r
1.0
55 to 125qC
r
1.0
MM74HC273
V
q
C
Units
P
A
P
A
3www.fairchildsemi.com
Page 5
AC Electrical Characteristics
V
5V, T
CC
25qC, C
A
15 pF, t
L
t
6 ns
r
f
SymbolParameterConditionsTyp
f
MAX
MM74HC273
, t
t
PHL
PLH
Maximum Operating Frequency5030MHz
Maximum Propagation1827ns
Delay, Clock to Output
t
PHL
Maximum Propagation1827ns
Delay, Clear to Output
t
REM
Minimum Removal Ti me,1020ns
Clear to Clock
t
s
Minimum Setup Time1020ns
Data to Clock
t
H
Minimum Hold Time
Clock to Data
t
W
Minimum Pulse Width1016ns
Clock or Clear
AC Electrical Characteristics
C
50 pF, t
t
L
SymbolParameterConditions
f
MAX
t
, t
PHL
PLH
t
PHL
t
REM
t
s
t
H
t
W
tr, t
f
t
, t
THL
TLH
C
PD
C
IN
Note 5: CPD determines the no lo ad dynamic power con s um ption, P
I
CPDVCCf ICC.
S
6 ns (unless otherwise specified)
r
f
V
CC
TA
25qCTA
TypGuaranteed Limits
Maximum Operating2.0V16543MHz
Frequency4.5V74272118MHz
6.0V78312420MHz
Maximum Propagation2.0V38135170205ns
Delay, Clock to Output4.5V14273441ns
6.0V12232935ns
Maximum Propagation2.0V42135170205ns
Delay, Clear to Output4.5V19273441ns
6.0V18232935ns
Minimum Removal Time2.0V0253237ns
Clear to Clock4.5V0567ns
6.0V0456ns
Minimum Setup Time2.0V26100125150ns
Data to Clock4.5V7202530ns
6.0V5172125ns
Minimum Hold Time2.0V
Clock to Data4.5V
6.0V
15000ns
6000 ns
4000 ns
Minimum Pulse Width2.0V3480100120ns
Clock or Clear4.5V11162024ns
6.0V10141820ns
Maximum Input Rise and2.0V100010001000ns
Fall Time, Clock4.5V500500500ns
6.0V400400400ns
Maximum Output Rise2.0V287595110ns
and Fall Time4.5V11151922ns
6.0V9131619ns
Power Dissipation(per flip-flop)45pF
Capacitance (Note 5)
Maximum Input7101010pF
Capacitance
2
CPD V
D
f ICC VCC, and the no load dynamic current consumption,
Fairchild does not assume any responsibility for use of any circu itry described, no circuit patent licenses are imp lied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or syste ms
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be reasonably expected to result in a significant inju ry to the
user.
2. A critical component in any componen t of a life support
device or system whose failu re to perform can be reasonably expected to cause the failure of the l ife su pp ort
device or system, or to affect its safety or effectiveness.
www.fairchildsemi.com
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Page 10
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Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
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designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
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