Datasheet MM74HC04SJX, MM74HC04SJ, MM74HC04N, MM74HC04MX, MM74HC04MTC Datasheet (Fairchild Semiconductor)

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September 1983 Revised February 1999
MM74HC04 Hex Inverter
© 1999 Fairchild Semiconductor Corporation DS005069.prf www.fairchildsemi.com
MM74HC04 Hex Inverter
General Description
The MM74HC04 inverters utilize advanced silicon-gate CMOS technology to achieve operating speeds similar to LS-TTL gates with the low p ower con sumpti on of standa rd CMOS integrated circuits.
The MM74HC04 is a triple buffered inverter. It has high noise immunity and the ability to drive 10 LS-TTL loads. The 74HC logic family is functionally as well as pin-out compatible with the standard 74LS logic family. All inputs
are protected from damage due to static discharge by inter­nal diode clamps to V
CC
and ground.
Features
Typical propagation delay: 8 ns
Fan out of 10 LS-TTL loads
Quiescent power consumption: 10 µW maximum at
room temperature
Low input current: 1 µA maximum
Ordering Code:
Devices also availab le in Tape and Reel. Specify by appending th e s uffix let t er “X” to the ordering cod e.
Connection Diagram
Pin Assignments f or DIP, SOIC, SOP and TSSOP
Top View
Logic Diagram
1 of 6 Inverters
Order Number Package Number Package Description
MM74HC04M M14A 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-120, 0.150” Narrow MM74HC04SJ M14D 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.5mm Wide MM74HC04MTC MTC14 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide MM74HC04N N14A 14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide
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MM74HC04
Absolute Maximum Ratings(Note 1)
(Note 2)
Recommended Operating Conditions
Note 1: Absolute Maximum Ratings are those values beyond which dam-
age to the device may occur.
Note 2: Unless otherwise specified all voltages are referenced to ground. Note 3: Power Dissipation temper ature dera ting — plas tic “N” packa ge:
12 mW/°C from 65 °C to 85°C.
DC Electrical Characteristics (Note 4)
Note 4: For a power supply of 5V ±1 0% the worst c ase ou tput volta ges (VOH, and VOL) occur for HC at 4.5V. Thus the 4. 5V valu es shoul d be use d when
designing with this supply. Worst case V
IH
and VIL occur at VCC=5.5V and 4.5V respectively. (The VIH value at 5.5V is 3.85V.) The worst case leakage current
(I
IN
, ICC, and IOZ) occur for CMOS at the higher voltage and s o th e 6.0V values should be used.
Supply Voltage (VCC) 0.5 to +7.0V DC Input Voltage (V
IN
) 1.5 to V
CC
+1.5V
DC Output Voltage (V
OUT
) 0.5 to V
CC
+0.5V
Clamp Diode Current (I
IK
, IOK) ±20 mA
DC Output Current, per pin (I
OUT
) ±25 mA
DC V
CC
or GND Current, per pin (ICC) ±50 mA
Storage Temperature Range (T
STG
) 65°C to +150°C
Power Dissipation (P
D
) (Note 3) 600 mW S.O. Package only 500 mW
Lead Temperature (T
L
) (Solderi ng 10 seconds) 260°C
Min Max Units
Supply Voltage (V
CC
)26V
DC Input or Output Voltage 0 V
CC
V
(V
IN
, V
OUT
)
Operating Temperature Range (T
A
) 40 +85 °C
Input Rise or Fall Times
(t
r
, tf) V
CC
= 2.0V 1000 ns
V
CC
= 4.5V 500 ns
V
CC
= 6.0V 400 ns
Symbol Parameter Conditions
V
CC
TA = 25°CTA = −40 to 85°CTA = −55 to 125°C
Units
Typ Guaranteed Limits
V
IH
Minimum HIGH Level 2.0V 1.5 1.5 1.5 V Input Voltage 4.5V 3.15 3.15 3.15 V
6.0V 4.2 4.2 4.2 V
V
IL
Maximum LOW Level 2.0V 0.5 0.5 0.5 V Input Voltage 4.5V 1.35 1.35 1.35 V
6.0V 1.8 1.8 1.8 V
V
OH
Minimum HIGH Level V
IN
= V
IL
Output Voltage |I
OUT
| 20 µA 2.0V 2.0 1.9 1.9 1.9 V
4.5V 4.5 4.4 4.4 4.4 V
6.0V 6.0 5.9 5.9 5.9 V
V
IN
= V
IL
|I
OUT
| 4.0 mA 4.5V 4.2 3.98 3.84 3.7 V
|I
OUT
| 5.2 mA 6.0V 5.7 5.48 5.34 5.2 V
V
OL
Maximum LOW Level VIN = V
IH
Output Voltage |I
OUT
| 20 µA 2.0V 0 0.1 0.1 0.1 V
4.5V 0 0.1 0.1 0.1 V
6.0V 0 0.1 0.1 0.1 V
V
IN
= V
IH
|I
OUT
| 4.0 mA 4.5V 0.2 0.26 0.33 0.4 V
|I
OUT
| 5.2 mA 6.0V 0.2 0.26 0.33 0.4 V
I
IN
Maximum Input V
IN
= VCC or GND 6.0V ±0.1 ±1.0 ±1.0 µA
Current
I
CC
Maximum Quiescent V
IN
= VCC or GND 6.0V 2.0 20 40 µA
Supply Current I
OUT
= 0 µA
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MM74HC04
AC Electrical Characteristics
V
CC
= 5V, TA = 25°C, CL = 15 pF, tr = t
f
= 6 ns
AC Electrical Characteristics
V
CC
= 2.0V to 6.0V, CL = 50 pF, tr = t
f
= 6 ns (unless otherwise specified)
Note 5: CPD determines the no load dynamic power con s um ption, PD = CPD V
CC
2
f + ICC VCC, and the no load dynam ic current consumpt ion,
I
S
= CPDVCCf + ICC.
Symbol Parameter Conditions Typ
Guaranteed
Units
Limit
t
PHL
, t
PLH
Maximum Propagation 8 15 ns Delay
Symbol Parameter Conditions
V
CC
TA = 25°CTA = −40 to 85°CTA = −55 to 125°C
Units
Typ Guaranteed Limits
t
PHL
, t
PLH
Maximum Propagation 2.0V 55 95 120 145 ns Delay 4.5V 11 19 24 29 ns
6.0V 9 16 20 24 ns
t
TLH
, t
THL
Maximum Output Rise 2.0V 30 75 95 110 ns and Fall Time 4.5V 8 15 19 22 ns
6.0V 7 13 16 19 ns
C
PD
Power Dissipation (per gate) 20 pF Capacitance (Note 5)
C
IN
Maximum Input 5 10 10 10 pF Capacitance
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MM74HC04
Physical Dimensions inches (millimeters) unless otherwise noted
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-120, 0.150” Narrow
Package Number M14A
14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package Number M14D
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MM74HC04
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package Number MTC14
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Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.
MM74HC04 Hex Inverter
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or syste ms which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be rea­sonably expected to result in a significant inju ry to the user.
2. A critical component i n any compon ent of a lif e support device or system whose failu re to perform can be rea­sonably expected to ca use the fa i lure of the life su pp ort device or system, or to affect its safety or effectiveness.
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Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide
Package Number N14A
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