Datasheet ML63514A-TB, ML63514A-TP, ML63512A-TB, ML63512A-TP Datasheet (OKI)

E2E0057-29-71

¡ Semiconductor ML63512A/63514A

¡ Semiconductor

This version: Jul. 1999

Previous version: Jun. 1999

ML63512A/63514A

4-Bit Microcontroller with Built-in Level Detector, Melody Circuit, and Comparator,
Operating at 0.9 V (Min.)

GENERAL DESCRIPTION

The ML63512A/63514A is a CMOS 4-bit microcontroller with built-in level detector and
operates at 0.9 V (min.).
The ML63512A/63514A is an M6351x series mask ROM-version product of OLMS-63K family,
which employs Oki's original CPU core nX-4/250.
The program memory capacity and data memory capacity of the ML63512A differ from those of
the ML63514A.
48-pin TQFP and 64-pin TQFP packages are available for the ML63512A and ML63514A.

FEATURES

• Extensive instruction set
407 instructions

Transfer, rotate, increment/decrement, arithmetic operations, comparison, logic operations,
mask operations, bit operations, ROM table reference, stack operations, flag operations,
jump, conditional branch, call/return, control.

• Wide variety selection of addressing modes
Indirect addressing of four data memory types, with current bank register, extra bank
register, HL register and XY register.
Data memory bank internal direct addressing mode.

• Processing speed
Two clocks per machine cycle, with most instructions executed in one machine cycle.
Minimum instruction execution time : 61 ms (@ 32.768 kHz system clock)

1 ms (@ 2 MHz system clock)

• Clock generation circuit
Low-speed clock : Crystal oscillation or RC oscillation selectable by

mask option (30 to 80 kHz)

High-speed clock : Ceramic oscillation or RC oscillation selectable by

mask option (2 MHz max.)

• Program memory space
ML63512A: 4K words
ML63514A: 8K words
Basic instruction length is 16 bits/1 word

• Data memory space
ML63512A: 128 nibbles
ML63514A: 256 nibbles

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¡ Semiconductor ML63512A/63514A

• Stack level
Call stack level : 16 levels
Register stack level : 16 levels

• I/O ports
Input ports: Selectable as input with pull-up resistor/high-impedance input
Output ports: N-channel open drain output (can directly drive LEDs)
Input-output ports: Selectable as input with pull-up resistor/high-impedance input

Selectable as N-channel open drain output/CMOS output
Can be interfaced with external peripherals that use a different power supply than this device
uses. (Power to the output port is supplied from V

(separate power suply))

DDI

Number of ports:

(For 48-pin packages)

Input port : 1 port ¥ 4 bits
Output port : 1 port ¥ 4 bits
Input-output port : 6 ports ¥ 4 bits

(For 64-pin packages)

Input port : 1 port ¥ 4 bits
Output port : 1 port ¥ 4 bits
Input-output port : 9 ports ¥ 4 bits

• Melody output function
Melody sound frequency : 529 to 2979 Hz (@ 32.768 kHz)
Tone length : 63 varieties
Tempo : 15 varieties
Melody data : Stored in the program memory
Number of ports : 1 (dedicated pin)
Buzzer driver signal output : 4 kHz (@ 32.768 kHz)

• Level detector

Conversion time : Approx. 183 ms (@ 32.768 kHz)
Dedicated input pins : 2 pins (switched by software; for the secondary

functions of the input ports)

Detection level : 12 levels

• Comparator

Offset voltage : 50 mV max. (VDD = 1.5 V)
Comparison time : Approx. 183 ms (@ 32.768 kHz)
Number of channels : 1 (for the secondary functions of the input ports)

• Reset function
Reset through RESETB pin (RESETB pin can be pulled up by mask option)

• Power supply backup
Backup circuit (voltage multiplier) enables operation at 0.9 V minimum

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¡ Semiconductor ML63512A/63514A

• Timers and counter
8-bit timer ¥ 2

Selectable as auto-reload mode/capture mode/clock frequency measurement mode

15-bit time base counter ¥ 1

1 Hz, 2 Hz, 4 Hz, 8 Hz, 16 Hz, 32 Hz, 64 Hz, 128 Hz, 256 Hz, 512 Hz, 1 kHz, and 2 kHz signals
can be read (@ 32.768 kHz)

• Serial port
Mode : Selectable as UART mode/synchronous

mode

UART communication speed : 2TBCCLK, TBCCLK, 1/2TBCCLK, Timers 0

& 1 overflow
24 kbps Max. (when 2TBCCLK @ 80 kHz
selected)

Clock frequency in synchronous mode : 30 to 80 kHz (internal clock mode), external

clock frequency

Data length : 5 to 8 bits

• Interrupt sources
External interrupt (4 sources) : Selectable as rising edge/falling edge/both

rising and falling edges

Internal interrupt (10 sources) : Time base interrupt ¥ 4 (2, 4, 16, and 32 Hz

@ 32.768 kHz)
Timer interrupt ¥ 2
Level detector interrupt ¥ 1
Serial port reception interrupt ¥ 1
Serial port transmission interrupt ¥ 1
Melody end interrupt ¥ 1

• Operating Temperature
–20 to +70°C

• Supply voltage
When backup used : 0.9 to 1.8 V

(Maximum operating frequency 1 MHz)

When backup not used : 1.8 to 3.5 V

(When Level detector or Comparator is

used, maximum operating frequency
2 MHz)

1.8 to 5.5 V
(When Level detector and Comparator are

not used, maximum operating frequency
2 MHz)

• Package options:
48-pin plastic TQFP (TQFP48-P-0707-0.50-K) : (Product name: ML63512A-xxxTB,

ML63514A-xxxTB)

64-pin plastic TQFP (TQFP64-P-1010-0.50-K) : (Product name: ML63512A-xxxTP,

ML63514A-xxxTP)

xxx indicates a code number.

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¡ Semiconductor ML63512A/63514A

BLOCK DIAGRAM

An asterisk (*) indicates the port secondary function. The power to the circuits corresponding
to the signal names inside is supplied from V

nX-4/250

L

TIMING
CON­TROL

CBR

EBR

H

YX

RA

A

(power supply for interface).

DDI

PC

ROM
ML63512A: 4KW
ML63514A: 8KW

RESETB

TST1B
TST2B

XT0
XT1

OSC0
OSC1

TBCCLK*

HSCLK*

LDIN0*
LDIN1*

CMPIN*

CMPREF*

V

DDH

V

DD

CB1
CB2

SP

RSP

STACK
CAL: 16-level
REG: 16-level

Detector

RST

TST

OSC

Level

CMP

BACK-

UP

INT

1

ALU

INSTRUCTION
DECODER

INT

4

C G

MIE

IR

RAM
ML63512A: 128N
ML63514A: 256N

INT

TBC

Z

BUS
CON­TROL

INT

2

TIMER

8bit ¥ 2

INT

2

SIO

INT

1

MELODY

DATA BUS

I/O
PORT

INT

4

TM0CAP/TM1CAP*
TM0OVF/TM1OVF*
T0CK*
T1CK*

RXC*
TXC*
RXD*
TXD*

MD

P0.0-P0.3

P1.0-P1.3

P2.0-P2.3

P3.0-P3.3

P4.0-P4.3

P5.0-P5.3

=

P6.0-P6.3

=

P9.0-P9.3

PA.0-PA.3

=

V

DDL

=

Port 6 (P6.0 to P6.3), Port 9 (P9.0 to P9.3) and Port A (PA.0 to PA.3) are only provided for the 64-

VR

INPUT

PORT

OUTPUT

PORT

P7.0-P7.3

P8.0-P8.3

V

DDI

V

SS

pin packages.

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¡ Semiconductor ML63512A/63514A

PIN CONFIGURATION (TOP VIEW)

P0.0/INT0

P0.1/INT1

P0.2/INT2

P0.3/INT3

P1.0/TM0CAP/TM0OVF

P1.1/TM1CAP/TM1OVF

P1.2/T0CK

P1.3/T1CK

P2.0/TBCCLK

P2.1/HSCLK

P2.2

P2.3

37

38

39

40

41

42

43

44

45

46

47

48

P3.0/RXD

P3.1/TXC

P3.2/RXC

P3.3/TXD

P4.0
P4.1

P4.2
P4.3

P5.0
P5.1
P5.2
P5.3

10
11
12

1
2
3
4
5
6
7
8
9

24

23

22

21

20

19

18

17

16

15

14

13

SS

DD

V

DDH

V

V

P7.0/CMPIN

P7.2/LDIN0

P7.1/CMPREF

P8.1

P8.0

P7.3/LDIN1

P8.2

P8.3

DDI

V

36
35
34
33
32
31
30
29
28
27
26
25

MD
RESETB
OSC1
OSC0
V

SS

TST2B
TST1B
XT1
XT0
V

DDL

CB2
CB1

48-Pin Plastic TQFP

5/29

¡ Semiconductor ML63512A/63514A

PIN CONFIGURATION (TOP VIEW) (continued)

P0.0/INT0

P0.1/INT1

P0.2/INT2

P0.3/INT3

P1.0/TM0CAP/TM0OVF

P1.1/TM1CAP/TM1OVF

P1.2/T0CK

P1.3/T1CK

P2.0/TBCCLK

P2.1/HSCLK

P2.2

P2.3

PA.0

PA.1
64

63

62

61

60

59

58

57

56

55

54

53

52

51

P9.3
50

P9.2

49

PA.2
PA.3

P3.0/RXD

P3.1/TXC

P3.2/RXC

P3.3/TXD

P4.0

P4.1
P4.2
P4.3
P5.0
P5.1
P5.2
P5.3
P6.0
P6.1

10
11
12
13
14
15
16

1
2
3
4
5
6
7
8
9

48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33

P9.1
P9.0
MD
RESETB
OSC1
OSC0
V

SS

TST2B
TST1B
XT1
XT0
V

DDL

CB2
CB1
(NC)
(NC)

17

P6.2

P6.3

P7.0/CMPIN

P8.0

P7.3/LDIN1

P7.2/LDIN0

P7.1/CMPREF

P8.1

P8.2

P8.3

DDI

V

SS

DD

V

V

DDH

V

31

(NC)

30

29

28

27

26

25

24

23

22

21

20

19

18

64-Pin Plastic TQFP

Note: Pins marked as (NC) are no-connection pins which are left open.

32

(NC)

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¡ Semiconductor ML63512A/63514A

PIN DESCRIPTIONS

The basic functions of each pin of the ML63512A/63514A are described in Table 1.
A symbol with a slash (/) denotes a pin that has a secondary function.
Refer to Table 2 for secondary functions.
For type, "—" denotes a power supply pin, "I" an input pin, "O" an output pin, and "I/O" an input­output pin.
For pin, "TB" denotes a 48-pin flat package (48TQFP), and "TP" a 64-pin flat package (64TQFP).

Table 1 Pin Descriptions (Basic Functions)

Function Symbol

Pin

Power

V

V
V

V

DD

SS

DDI

DDL

TB

23 —

22, 32 —

21 —

27 —

TP

29

28, 42

27

37

Supply

V

DDH

24 —

CB1 25 —
CB2 26 —

XT0 28 I

XT1 29 O

30

35
36

38

39

Oscillation

OSC0 33 I

OSC1 34 O

TST1B 30 I

43

44

40

Test

TST2B 31 I

Reset RESETB 35 I

41

45

Type

Description

Positive power supply
Negative power supply
Positive power supply pin for external interface (PORT8 supply)
Positive power supply pin for internal logic (internally generated).
A capacitor C

(0.1 mF) should be connected between this pin and VSS.

l

Voltage multiplier pin for power supply backup (internally generated).
A capacitor C

(1.0 mF) should be connected between this pin and VSS.

h

Pins to connect a capacitor for voltage multiplier.
A capacitor (1.0 mF) should be connected between CB1 and CB2.
Low-speed clock oscillation pins.
Crystal oscillation or RC oscillation is selected by the mask option.
If crystal oscillation is selected, connect a crystal between XT0 and
XT1, and connect capacitor (C

) between XT0 and VSS.

G

If RC oscillation is selected, connect external oscillation resistor

) between XT0 and XT1.

(R

CRL

High-speed clock oscillation pins.
Ceramic oscillation or RC oscillation is selected by the mask option.
If ceramic oscillation is selected, connect a ceramic resonator
between OSC0 and OSC1, and connect capacitor (C
OSC0 and V

, OSC1 and VSS.

SS

, CL1) between

L0

If RC oscillation is selected, connect external oscillation resistor

) between OSC0 and OSC1.

(R

CRH

Input pins for testing.
A pull-up resistor is internally connected to these pins.
Reset input pin.
Setting this pin to "L" level puts this device into a reset state.
Then, setting this pin to "H" level starts executing an instruction
from address 0000H.
An internal or external pull-up resistor is selected by mask option.

Melody MD 36 O

46

Melody output pin (non-inverted output)

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¡ Semiconductor ML63512A/63514A

Table 1 Pin Descriptions (Basic Functions) (continued)

Function Symbol

P0.0/INT0 37
P0.1/INT1 38 52
P0.2/INT2 39 53
P0.3/INT3 40 54

P1.0/

TM0CAP/

TM0OVF

P1.1/

TM1CAP/

TM1OVF
P1.2/T0CK 43 57
P1.3/T1CK 44 58

P2.0/TBCCLK 45 59

P2.1/HSCLK 46 60

P2.2 47 61
P2.3 48 62

P3.0/RXD 1 3

P3.1/TXC 2 4
P3.2/RXC 3 5
P3.3/TXD 4 6

P4.0 5 7
P4.1 6 8
P4.2 7 9
P4.3 8 10
P5.0 9 11
P5.1 10 12
P5.2 11 13
P5.3 12 14

Pin

TB

41 55

42 56

TP

51

Type

I/O

I/O

I/OPort

I/O

I/O

I/O

Description

4-bit input-output ports.
In input mode, pull-up resistor input or high-impedance
input is selectable for each bit.
In output mode, N-channel open drain output or CMOS
output is selectable for each bit.

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¡ Semiconductor ML63512A/63514A

Table 1 Pin Descriptions (Basic Functions) (continued)

Function Symbol

P6.0 —

P6.1 — 16

P6.2 — 17

P6.3 — 18

P7.0/CMPIN 13 19

P7.1/CMPREF 14 20

P7.2/LDIN0 15 21
P7.3/LDIN1 16 22

Port

P8.0 17 23
P8.1 18 24
P8.2 19 25
P8.3 20 26
P9.0 — 47
P9.1 — 48
P9.2 — 49

P9.3 — 50
PA.0 — 63
PA.1 — 64
PA.2 — 1
PA.3 — 2

TB

Pin

TP

15

Type

I/O

I

O

I/O

I/O

Description

4-bit input-output port.
In input mode, pull-up resistor input or high-impedance
input is selectable for each bit.
In output mode, N-channel open drain output or CMOS
output is selectable for each bit.
Note that these pins are available for only a 64-pin package.

4-bit input port.
Pull-up resistor input or high-impedance input is selectable
for each bit.

4-bit output port.
N-channel open drain output.

4-bit input-output ports.
In input mode, pull-up resistor input or high-impedance
input is selectable for each bit.
In output mode, N-channel open drain output or CMOS
output is selectable for each bit.
Note that these pins are available for only a 64-pin package.

9/29

¡ Semiconductor ML63512A/63514A

Table 2 shows the secondary functions of each pin of the ML63512A/63514A.

Table 2 Pin Descriptions (Secondary Functions)

Function Symbol Type Description

P0.0/INT0 37 51

P0.1/INT1 38 52

External

Interrupt

P0.2/INT2 39 53

P0.3/INT3 40 54

Capture

Timer

Oscillation

Output

Serial

Port

Comparator

Level

Detector

P1.0/TM0CAP 41 55 I Timer 0 (TM0) capture trigger input pin.
P1.1/TM1CAP 42 56 I Timer 1 (TM1) capture trigger input pin.
P1.0/TM0OVF 41 55 O Timer 0 (TM0) overflow flag output pin.
P1.1/TM1OVF 42 56 O Timer 1 (TM1) overflow flag output pin.

P1.2/T0CK 43 57 I Timer 0 (TM0) external clock input pin.
P1.3/T1CK 44 58 I Timer 1 (TM1) external clock input pin.

P2.0/TBCCLK 45 59 O Low-speed oscillation clock output pin.

P2.1/HSCLK 46 60 O High-speed oscillation clock output pin.

P3.0/RXD 1 3 I Serial port receive data input pin.

P3.1/TXC 2 4 I/O

P3.2/RXC 3 5 I/O

P3.3/TXD 4 6 O Serial port transmit data output pin.

P7.0/CMPIN 13 19 I Comparator analog input pin.

P7.1/CMPREF 14 20 I Comparator reference voltage input pin.

P7.2/LDIN0 15 21 I Level detector analog input pin.
P7.3/LDIN1 16 22 I Level detector analog input pin.

Pin

TB TP

External 0 interrupt input pin.
Edge detection can be selected from one of a rising edge,

I

a falling edge, or both rising and falling edges.
External 1 interrupt input pin.
Edge detection can be selected from one of a rising edge,

I

a falling edge, or both rising and falling edges.
External 2 interrupt input pin.
Edge detection can be selected from one of a rising edge,

I

a falling edge, or both rising and falling edges.
External 3 interrupt input pin.
Edge detection can be selected from one of a rising edge,

I

a falling edge, or both rising and falling edges.

Sync serial port clock input-output pin.
Transmit sync clock input-output pin when a serial port is used
synchronously.
Transmit clock output when this device is used as a master processor.
Transmit clock input when this device is used as a slave processor.
Sync serial port clock input-output pin.
Receive sync clock input-output pin when a serial port is used
synchronously.
Receive clock output when this device is used as a master processor.
Receive clock input when this device is used as a slave processor.

10/29

¡ Semiconductor ML63512A/63514A

ABSOLUTE MAXIMUM RATINGS

(V

= 0 V)

SS

Parameter Symbol Condition Rating Unit

Power Supply Voltage 1 V

V

OUT1

OUT2

OUT3

T

DD

DDI

DDH

DDL

IN1

IN2

STG

D

DDI

DDI

DDH

–0.3 to +5.8Ta = 25°C V
–0.3 to +5.8Power Supply Voltage 2 Ta = 25°CV
–0.3 to +5.8Power Supply Voltage 3 Ta = 25°C
–0.3 to +5.8Power Supply Voltage 4 Ta = 25°CV

–0.3 to V

Input, Ta = 25°CV

–0.3 to V

–0.3 to V

Output, Ta = 25°CV

Output, Ta = 25°CV

–0.3 to V

–0.3 to V

DD

DDI

DD

DDI

DDH

+ 0.3Input Voltage 1 VDD Input, Ta = 25°CV

+ 0.3Input Voltage 2 V

+ 0.3Output Voltage 1 VDD Output, Ta = 25°CV

+ 0.3Output Voltage 2 V

+ 0.3Output Voltage 3 V

–55 to +150Storage Temperature —

60Power Dissipation Ta = 25°CP

V
V
V
V
V
V
V
V

°C

mW

11/29

¡ Semiconductor ML63512A/63514A

RECOMMENDED OPERATING CONDITIONS

• When backup is used

(V

= 0 V)

SS

Parameter Symbol Condition Range Unit

Operating Temperature T

Operating Voltage

Crystal Oscillation Frequency f
Low-Speed RC Oscillator
Frequency
External High-Speed RC
Oscillator Resistance

• When backup is not used

R

V

V

f

op

DD

DDI

XT

CRL

CRH

—
— 0.9 to 1.8 V
—
—

= 1 MW ±10%

CRL

= 0.9 to 1.8 V

DD

–20 to +70 °C

0.9 to 3.5 V
30 to 80 kHz

32 kHzR

100 to 300 kWV

Parameter Symbol Condition Range Unit

Operating Temperature T

Operating Voltage

Crystal Oscillation Frequency f
Low-Speed RC Oscillator
Frequency
External High-Speed RC
Oscillator Resistance

R

Ceramic Oscillation Frequency

V

V

f

f

op

DD

DDI

XT

CRL

CRH

CM

—
— 1.8 to 3.5

When Level detector and

Comparator are not used

—
—

= 1 MW ±10%

CRL

= 1.8 to 5.5 V

DD

= 2.2 to 5.5 V

DD

= 0 V)

(V

SS

–20 to +70 °C

1.8 to 5.5 V

1.8 to 5.5
30 to 80 kHz

32R

15 to 300V

kHz

kW

300k to 1MV
200k to 2MVDD = 2.7 to 5.5 V

Hz

12/29

¡ Semiconductor ML63512A/63514A

ELECTRICAL CHARACTERISTICS

DC Characteristics

• When backup is used

(VDD = V

= 1.5 V, VSS = 0 V, Ta = –20 to +70°C unless otherwise specified)

DDI

Parameter Symbol Condition

CPU is in HALT state

Supply Current 1

I

High-speed oscillation stop

DD1

Level detector stop

CPU operating

Supply Current 2

I

High-speed oscillation stop

DD2

Level detector stop

CPU operating at low speed

I

DD3

High-speed oscillation stop

Level detector active

(for a soft duty of about 3%)
CPU operating at high speed

DD4

High-speed RC oscillation

R

= 100 kW

CRH

• When backup is not used

Ta = 25°C
Ta = –20 to +50°C
Ta = –20 to +70°C

Ta = 25°C
Ta = –20 to +50°C
Ta = –20 to +70°C

4.8
—
—

12.0
—
—

5.3

5.3

5.3

13.0

13.0

13.0

Max.Typ.Min.

5.8

9.0

15.0

14.0

16.0

24.0

35.010.0—Supply Current 3

750.0550.0—Supply Current 4 I

Unit

mA

mA

mA

mA

Mea-

suring

Circuit

1

(VDD = V

= 3.0 V, VSS = 0 V, Ta = –20 to +70°C unless otherwise specified)

DDI

Parameter Symbol Condition

CPU is in HALT state

Supply Current 1

I

High-speed oscillation stop

DD1

Level detector stop

CPU operating

Supply Current 2

I

High-speed oscillation stop

DD2

Level detector stop

CPU operating at low speed

I

DD3

High-speed oscillation stop

Level detector active

(for a soft duty of about 3%)

CPU operating at high speed

DD4

High-speed RC oscillation

R

= 100 kW

CRH

CPU operating at high speed

DD5

High-speed ceramic oscillation

(ceramic oscillation, 2 MHz)

Ta = 25°C
Ta = –20 to +50°C
Ta = –20 to +70°C

Ta = 25°C
Ta = –20 to +50°C
Ta = –20 to +70°C

2.1

—
—

5.0

—
—

2.4

2.4

2.4

6.0

6.0

6.0

Max.Typ.Min.

550.0410.0—Supply Current 4 I

1000.0850.0—Supply Current 5 I

2.7

7.0

10.0

7.0

9.0

15.0

25.06.0—Supply Current 3

Unit

mA

mA

mA

mA

mA

Mea-

suring

Circuit

1

13/29

¡ Semiconductor ML63512A/63514A

DC Characteristics (continued)

Parameter

(Pin Name)

Voltage

V

DDH

V

Voltage

DDL

Crystal Oscillation Start
Voltage
Crystal Oscillation Hold
Voltage
External Crystal Oscillator
Capacitance
Internal Crystal Oscillator
Capacitance
Internal Low-Speed RC
Oscillator Capacitance
Internal High-Speed RC
Oscillator Capacitance
Input Pin Capacitance
(P0.0 to P0.3)
(P1.0 to P1.3)

···

(P7.0 to P7.3)
(P9.0 to P9.3)
(PA.0 to PA.3)

(VDD = V

= 1.5 V, VSS = 0 V, Ta = –20 to +70°C unless otherwise specified)

DDI

Symbol Condition Typ.Min. Max.

High-speed clock stop

2.8 — 3.0

= 1.5 V

V

V

DDH

High-speed clock oscillation

DD

2.0 — —

(RC oscillation, R

= 100 kW)

CRH

High-speed clock stop 1.0 1.5 2.0

V

V

V

HOLD

C

C

C

DDL

STA

C

C

G

D

XT

OS

IN

High-speed clock oscillation 2.0 — 2.7

Oscillation start time: within 5 seconds 1.2 — —

— 0.9 — —

— 5.0 — 25.0

— 20.0 25.0 30.0

— 10.0 15.0 20.0

— 8.0 12.0 16.0

— — — 5.0

Unit

V

V

V
V

V

V

pF

pF

pF

pF

pF

Mea-

suring

Circuit

1

14/29

¡ Semiconductor ML63512A/63514A

DC Characteristics (continued)

Parameter

(Pin Name)

Output Current 1
(P0.0 to P0.3)
(P1.0 to P1.3)

···
(P6.0 to P6.3)
(P9.0 to P9.3)
(PA.0 to PA.3)
(MD)

Output Current 2
(P8.0 to P8.3)

Output Current 3
(OSC1)

Output Leakage
(P0.0 to P0.3)
(P1.0 to P1.3)

···
(P6.0 to P6.3)
(P8.0 to P8.3)
(P9.0 to P9.3)
(PA.0 to PA.3)

(VDD = V

= 1.5 V, VSS = 0 V, Ta = –20 to +70°C unless otherwise specified)

DDI

Symbol Condition Typ.Min. Max.

–0.2–1.3–2.5
–1.0–3.5–6.0
–1.5–5.0–8.5

2.51.30.2

6.03.01.0

8.53.71.5

1.0——

14.07.53.0

20.012.06.0

28.015.08.0
–0.2–1.5–2.5
–0.5–1.8–3.5

2.51.50.2

3.51.80.5

–60–160–300

–100–240–400

30017060
400210100

1.0——I

——–1.0I

I

OH1

I

OL1

I

OH2Z

I

OL2

I

OH3R

I

OL3R

I

OH3C

I

OL3C

OOHVOH

OOLVOL

= VDD – 0.5 V

V

OH1

V

= 0.5 V

OL1

= V

V

OH2

V

= 0.5 V

OL2

= V

V

OH3R

= 0.5 V

V

OL3R

= V

V

OH3C

= 0.5 V

V

OL3C

= V

= V

DD

SS

DD

DDH

DDH

– 0.5 V

– 0.5 V

VDD = 1.5 V

= 3.0 V

V

DD

V

= 5.0 V

DD

VDD = 1.5 V

= 3.0 V

V

DD

V

= 5.0 V

DD

V

= 1.5 V

DDI

V

= 3.0 V

DDI

V

= 5.0 V

DDI

VDD = V
V
VDD = V
V
VDD = V
V
VDD = V
V

DD

DD

DD

DD

= V

= V

= V

= V

DDH

DDH

DDH

DDH

DDH

DDH

DDH

DDH

= 3.0 V
= 5.0 V
= 3.0 V
= 5.0 V
= 3.0 V
= 5.0 V
= 3.0 V
= 5.0 V

Unit

mA
mA
mA

mA
mA
mA

mA

mA
mA
mA
mA
mA
mA
mA

mA
mA
mA
mA

mA

mA

Mea-

suring

Circuit

2

15/29

¡ Semiconductor ML63512A/63514A

DC Characteristics (continued)

Parameter

(Pin Name)

Input Current 1
(P0.0 to P0.3)
(P1.0 to P1.3)

···

(P7.0 to P7.3)
(P9.0 to P9.3)
(PA.0 to PA.3)

Input Current 2
(RESETB)

Input Current 3
(OSC0)

Input Current 4
(TST1B, TST2B)

(VDD = V

= 1.5 V, VSS = 0 V, Ta = –20 to +70°C unless otherwise specified)

DDI

Symbol Condition

V

I

IH1U

= VDD (when pulled up)

IH1

VDD = 1.5 V

V

= V

IL1

IH2

SS

= V

(in a high-impedance state) mA

DD

= V

(in a high-impedance state) mA

SS

= V

DD

V

DD

V

DD

I

IL1U

(when pulled up)

I

IH1ZVIH1

I

IL1ZVIL1

I

V

IH2

VDD = 1.5 V

V

= V

IL2

I

IL2

(when pulled up)

SS

VDD = 3.0 V
VDD = 5.0 V

V

I

IL3

IH3RVIH3

IL3RVIL3

I

IH4

IL3

(when pulled up)

V

IH4

= V

= V
= V
= V

SS

DDH

SS

DD

V

DD

V

DD

VDD = 1.5 V

V

= V

IL4

I

IL4

(when pulled up)

SS

V

DD

V

DD

= 3.0 V
= 5.0 V

= V

DDH

= V

DDH

= 3.0 V
= 5.0 V

= 3.0 V
= 5.0 V

–1320.0

Unit

Max.Typ.Min.

1.0——

mA

–1.0–4.0–8.0

mA
–10.0–30.0–60.0 mA
–23.0–90.0–150.0 mA

1.0——
——–1.0

1.0—— mA

–2.0–20.0–45.0 mA
–30.0–120.0–260.0 mA
–70.0–300.0–870.0

–30.0–170.0–350.0

mA
mA

–200.0–450.0–750.0 mA

mA

1.0——I
mA

——–1.0I

0.1—— mA

–10.0–60.0–120.0 mA
–100.0–350.0–600.0
–220.0–770.0

mA
mA

Mea-

suring

Circuit

3

16/29

¡ Semiconductor ML63512A/63514A

DC Characteristics (continued)

Parameter

(Pin Name)

Input Voltage 1
(P0.0 to P0.3)
(P1.0 to P1.3)

······

(P7.0 to P7.3)
(P9.0 to P9.3)
(PA.0 to PA.3)

Input Voltage 2
(OSC0)

Input Voltage 3
(RESETB)
(TST1B, TST2B)

Hysteresis Width
(P0.0 to P0.3)
(P1.0 to P1.3)

(VDD = V

= 1.5 V, VSS = 0 V, Ta = –20 to +70°C unless otherwise specified)

DDI

Symbol Condition

= 1.5 V

V

DD

V

IH1

V

IL1

V

IH2

V

IL2

V

IH3

V

IL3

V

DD

V

DD

V

DD

V

DD

V

DD

V

DD

V

DD

V

DD

V

DD

V

DD

V

DD

V

DD

V

DD

V

DD

V

DD

V

DD

= 3.0 V
= 5.0 V
= 1.5 V
= 3.0 V
= 5.0 V
= V

DDH

= V

DDH

= V

DDH

= V

DDH

= 1.5 V
= 3.0 V
= 5.0 V
= 1.5 V
= 3.0 V
= 5.0 V

= 1.5 V

= 3.0 V
= 5.0 V
= 3.0 V
= 5.0 V

Max.Typ.Min.

1.5—1.2

3.0—2.4

5.0—4.0 V

0.3—0.0

0.6—0.0 V

1.0—0.0 V

3.0—2.4

5.0—4.0

0.6—0.0

1.0—0.0 V

1.50—1.35

3.0—2.4 V

5.0—4.0 V

0.15—0.00

0.6—0.0 V

1.0—0.0 V

0.300.100.05

Unit

V
V

V

V
V
V

V

V

V

Mea-

suring

Circuit

4

(P7.0 to P7.3)
(P9.0 to P9.3)
(PA.0 to PA.3)
(RESETB)

(TST1B, TST2B)

V

T

V

DD

V

DD

= 3.0 V

= 5.0 V

1.00.50.2 V

1.501.000.25 V

17/29

¡ Semiconductor ML63512A/63514A

Hysteresis width

V

Input Signal

T

V

DD

V

SS

Internal Signal V

DDL

V

SS

18/29

¡ Semiconductor ML63512A/63514A

Measuring circuit 1

*1

*2

*1

q

w

e

r

RC oscillator

XT0
XT1
OSC0
OSC1

CB1

C

b12

CB2

V

SS

V

DD

V

A

DDI

V

DDH

C

h

V

DDL

C

l

V

C

G

C

b12

C

l

C

O

Ceramic Resonator

V

: 15 pF
: 1 mF

, C

h

: 0.1 mF
: 12 pF

: CSA2.00MG (2 MHz)
CSB1000J (1 MHz)
(Murata MFG.-make)

C

L0

C

L1

: 30 pF
: 30 pF

*2

RC oscillator

R

CRL

Crystal oscillator

C

G

q

w

q

w

R

CRH

Ceramic oscillator

C

L0

C

Ceramic resonator

L1

e

r

e

r

19/29

¡ Semiconductor ML63512A/63514A

p

Measuring circuit 2

*4

V

IH

*3

V

IL

Measuring circuit 3

*5

INPUT OUTPUT

V

SS

V

DD

V

DDI

V

DDHVDDL

*3 Input logic circuit to determine the specified measuring conditions.
*4 Measured at the s

ecified output pins.

A

A

INPUT OUTPUT

V

SS

V

DD

V

DDI

V

DDHVDDL

20/29

¡ Semiconductor ML63512A/63514A

Measuring circuit 4

V

IH

*5

V

IL

INPUT OUTPUT

V

SS

V

DD

V

DDI

V

DDH

V

DDL

Waveform
Monitoring

*5 Measured at the specified input pins.

21/29

¡ Semiconductor ML63512A/63514A

AC Characteristics (Serial Interface, Serial Port)

(VDD = 0.9 to 5.5 V, V

= 1.8 to 5.5 V, VSS = 0 V, V

DDH

otherwise specified)

(1) Synchronous Communication

Parameter Symbol Condition Unit

t

f

r

TXC/RXC Input "L" Level
Pulse Width

TXC/RXC Input "H" Level
Pulse Width

TXC/RXC Output Cycle Time

t

CWL

t

CWH

CYC

t

CYC1(O)

CYC2(O)

DDR

DS

DH

= 0.9 to 5.5 V, Ta = –20 to +70°C unless

DDI

Max.Typ.Min.

— ms— 1.0
— ms— 1.0

— ms——

— ms——

— ms——

CPU operating at 32.768 kHz ms30.5 —

—TXC/RXC Input Fall Time
—TXC/RXC Input Rise Time t

0.8

0.8

2.0TXC/RXC Input Cycle Time t
—

CPU operating at 2 MHz

= V

V

DD

= 2.7 to 5.5 V

DDH

Output load capacitance 10 pF ms— 0.4

— ms——
— ms——

—t

—TXD Output Delay Time t

0.5RXD Input Setup Time t

0.8RXD Input Hold Time t

ms0.5 —

Synchronous communication timing
("H" level = 4.0 V, "L" level = 1.0 V)

t

CYC

TXC (P3.1)/
RXC (P3.2)

t

DDR

TXD (P3.3)

t

DS

RXD (P3.0)

VDD (5.0 V)

V

t

r

t

CWH

t

DDR

t

f

t

CWL

SS

VDD (5.0 V)

V

SS

t

DH

t

DS

VDD (5.0 V)

V

SS

22/29

¡ Semiconductor ML63512A/63514A

(2) UART Communication

Parameter Symbol Condition Unit

Transmit Baud Rate

T

BRT

BRT

UART communication timing
("H" level = 4.0 V, "L" level = 1.0 V)

TXD (P3.3)

RXD (P3.0)

Max.Typ.Min.

T

= 1/f

BRT

TCR = 1/f

BRT

f

: Baud rates (2TBCCLK, TBCCLK, 1/2TBCCLK, Timer 0/1 overflow)

BRT

T

= 1/f

BRT

BRT

OSC

BRT

T

BRT–TCR

R

BRT

BRT

¥0.97Receive Baud Rate R

BRT

T

BRT+TCR

R

BRT

¥1.03R

VDD (5.0 V)

V

SS

R

BRT

VDD (5.0 V)

V

SS

sT

sR

23/29

¡ Semiconductor ML63512A/63514A

AC Characteristics

(VDD = V

= 0.9 to 5.5 V, VSS = 0 V, Ta = –20 to + 70°C unless otherwise specified)

DDI

Parameter Symbol Condition Unit

External Interrupt Enable
Pulse Width (Rising Edge)

External Interrupt Enable
Pulse Width (Falling Edge)

External Interrupt Disable
Time

AC characteristics timing

P0.0 to P0.3

(Interrupt on the rising edge)

P0.0 to P0.3

t

t

t

NUL

WH

WL

—ns——

—ns——

Interrupt enable, MIE = 1

CPU operating under

the NOP instruction

System clock: 32.768 kHz

t

WH

t

NUL

20

20

13.0

Max.Typ.Min.

ms— 65.1

(Interrupt on the falling edge)

P0.0 to P0.3

(Interrupt on both rising and falling edges)

t

WL

t

NUL

t

NUL

24/29

¡ Semiconductor ML63512A/63514A

Comparator Electrical Characteristics

(V

= 0.9 V, VSS = 0 V, Ta = –20 to +70°C)

DD

Parameter Symbol Condition Min. Typ. Max. Unit

Remarks

Comparator Offset
Voltage

V

coff

— — — 30 mV

Comparator Input
Voltage
Comparator Conversion
Time
Comparator Supply
Current

V

cin

T

I

DDCMP

I

DSCMP

—V

System clock: 32.768 kHz — 183 — ms

C

SS

Comparator operating — 30 90 mA

Comparator stopped — — 0.1 mA

—VDDV

CMPIN

CMPREF

Conceptual diagram of comparator supply current

The conceptual diagram of the comparator supply current I

I

DD

(VSS)

[mA]

I

DDCMP

I

DSCMP

Sampling reference voltage Comparing

Level detector operatingLevel detector stopped Level detector stopped

DDCMP

and I

reference

voltage with

input voltage

DSCMP

is shown below.

t [ms]

25/29

¡ Semiconductor ML63512A/63514A

Level Detector Electrical Characteristics

= 0.9 V, VSS = 0 V, Ta = –20 to +70°C)

(V

DD

Parameter Symbol Condition Min. Typ. Max. Unit

Remarks

Level Detector Input
Voltage
Level Detector Conversion
Time
Level Dtector Supply
Current

V

T

I

DDLD

I

DSLD

LD

System clock: 32.768 kHz — 183 — ms

C

— V

SS

Level detector operating — 80 130 mA

Level detector stopped — — 0.1 mA

—VDDV

LDIN0, 1

Conceptual diagram of level detector supply current

The conceptual diagram of the level detector supply current I

I

DD

(VSS)

[mA]

I

DDLD

I

DSLD

Sampling reference voltage Comparing

voltage with

input voltage

Level detector operatingLevel detector stopped Level detector stopped

DDLD

reference

and I

is shown below.

DSLD

t [ms]

26/29

¡ Semiconductor ML63512A/63514A

Level Detector Input Levels and Output Codes

(VDD = 0.9 to 1.8 V: when backup is used, VDD = 1.8 to 3.5 V: when backup is not used;
V

= 0 V, Ta = –20 to +70°C)

SS

Input Level [V]

Min. Max.

1440/1500 ¥ V
1306/1500 ¥ V
1190/1500 ¥ V
1074/1500 ¥ V

958/1500 ¥ V
842/1500 ¥ V
726/1500 ¥ V
610/1500 ¥ V
494/1500 ¥ V
378/1500 ¥ V
262/1500 ¥ V
146/1500 ¥ V

V

DD

DD

DD

DD

DD

DD

DD

DD

DD

DD

DD

DD

SS

V

DD

1366/1500 ¥ V
1250/1500 ¥ V
1134/1500 ¥ V
1018/1500 ¥ V

902/1500 ¥ V
786/1500 ¥ V
670/1500 ¥ V
554/1500 ¥ V
438/1500 ¥ V
322/1500 ¥ V
206/1500 ¥ V

88/1500 ¥ V

DD

DD

DD

DD

DD

DD

DD

DD

DD

DD

DD

DD

Level Detector

Operation State

OFF state

ON state

bit 3

1
1
1
1
1
0
0
0
0
0
0
0
0

LDOUT

bit 2

1
0
0
0
0
1
1
1
1
0
0
0
0

bit 1

1
1
1
0
0
1
1
0
0
1
1
0
0

bit 0

1
1
0
1
0
1
0
1
0
1
0
1
0

27/29

¡ Semiconductor ML63512A/63514A

PACKAGE DIMENSIONS

(Unit : mm)

TQFP48-P-0707-0.50-K

Mirror finish

Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)

Epoxy resin
42 alloy
Solder plating
5 mm or more

0.13 TYP.

Notes for Mounting the Surface Mount Type Package

The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type
packages, which are very susceptible to heat in reflow mounting and humidity absorbed in
storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person
on the product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).

28/29

¡ Semiconductor ML63512A/63514A

(Unit : mm)

TQFP64-P-1010-0.50-K

Mirror finish

Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)

Epoxy resin
42 alloy
Solder plating
5 mm or more

0.26 TYP.

Notes for Mounting the Surface Mount Type Package

The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type
packages, which are very susceptible to heat in reflow mounting and humidity absorbed in
storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person
on the product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).

29/29

E2Y0002-29-62

NOTICE

1. The information contained herein can change without notice owing to product and/or
technical improvements. Before using the product, please make sure that the information
being referred to is up-to-date.

2. The outline of action and examples for application circuits described herein have been
chosen as an explanation for the standard action and performance of the product. When
planning to use the product, please ensure that the external conditions are reflected in the
actual circuit, assembly, and program designs.

3. When designing your product, please use our product below the specified maximum
ratings and within the specified operating ranges including, but not limited to, operating
voltage, power dissipation, and operating temperature.

4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or

unexpected operation resulting from misuse, neglect, improper installation, repair, alteration
or accident, improper handling, or unusual physical or electrical stress including, but not
limited to, exposure to parameters beyond the specified maximum ratings or operation
outside the specified operating range.

5. Neither indemnity against nor license of a third party’s industrial and intellectual property
right, etc. is granted by us in connection with the use of the product and/or the information
and drawings contained herein. No responsibility is assumed by us for any infringement
of a third party’s right which may result from the use thereof.

6. The products listed in this document are intended for use in general electronics equipment
for commercial applications (e.g., office automation, communication equipment,
measurement equipment, consumer electronics, etc.). These products are not authorized
for use in any system or application that requires special or enhanced quality and reliability
characteristics nor in any system or application where the failure of such system or
application may result in the loss or damage of property, or death or injury to humans.
Such applications include, but are not limited to, traffic and automotive equipment, safety
devices, aerospace equipment, nuclear power control, medical equipment, and life-support
systems.

7. Certain products in this document may need government approval before they can be
exported to particular countries. The purchaser assumes the responsibility of determining
the legality of export of these products and will take appropriate and necessary steps at their
own expense for these.

8. No part of the contents contained herein may be reprinted or reproduced without our prior
permission.

9. MS-DOS is a registered trademark of Microsoft Corporation.

Copyright 1999 Oki Electric Industry Co., Ltd.

Printed in Japan