Designed for general−purpose amplifiers and switching
applications, where the mounting surface of the device is required to
be electrically isolated from the heatsink or chassis.
Features
• Isolated Overmold Package, TO−220 Type
• Electrically Similar to the Popular 2N6388, 2N6668, TIP102, and
TIP107
• 100 V
CEO(sus)
• 10 A Rated Collector Current
• No Isolating Washers Required
• Reduced System Cost
• High DC Current Gain − 1000 (Min) @ I
= 5.0 Adc
C
• High Isolation Voltage (up to 4500 VRMS)
• Case 221D is UL Recognized at 3500 VRMS: File #E69369
• Pb−Free Packages are Available*
MAXIMUM RATINGS
Rating
Collector−Emitter Voltage
Collector−Base Voltage
Emitter−Base Voltage
RMS Isolation Voltage (Note 1)
(t = 0.3 sec, R.H. ≤ 30%, TA = 25_C)
Per Figure 14
Collector Current− Continuous
Base Current − Continuous
Total Power Dissipation (Note 3) @ TC = 25_C
Derate above 25_C
Total Power Dissipation @ TA = 25_C
Derate above 25_C
Operating and Storage Temperature Range
− Peak (Note 2)
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction−to−Case (Note 3)
Thermal Resistance, Junction−to−Ambient
Lead Temperature for Soldering Purposes
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Proper strike and creepage distance must be provided.
D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t
T
J(pk)
t, TIME (ms)
Figure 5. Thermal Response
q
= °C/W MAX
- TC = P
JC
1
R
q
(pk)
JC(t)
100 2003300.33001K 2K5K10K 20K50K3K30K
P
(pk)
t
1
t
2
DUTY CYCLE, D = t1/t
2
1
SECOND BREAKDOWN
0.8
0.6
THERMAL
DERATING
6010014080
TC, CASE TEMPERATURE (°C)
POWER DERATING FACTOR
0.4
0.2
0
20
40120160
Figure 6. Maximum Power Derating
NPN
MJF6388
10,000
5000
3000
2000
1000
500
300
200
100
50
, SMALL-SIGNAL CURRENT GAIN
30
fe
h
20
10
1100050105100500220200
TC = 25°C
V
= 4 Vdc
CE
= 3 Adc
I
C
f, FREQUENCY (kHz)
DERATING
There are two limitations on the power handling ability of
a transistor: average junction temperature and second
breakdown. Safe operating area curves indicate I
− V
C
limits of the transistor that must be observed for reliable
operation; i.e., the transistor must not be subjected to greater
dissipation than the curves indicate.
The data of Figure 4 is based on T
= l50_C; TC is
J(pk)
variable depending on conditions. Secondary breakdown
pulse limits are valid for duty cycles to 10% provided T
< 150_C. T
may be calculated from the data in Figure 5.
J(pk)
J(pk)
At high case temperatures, thermal limitations will reduce
the power that can be handled to values less than the
limitations imposed by secondary breakdown.
*Measurement made between leads and heatsink with all leads shorted together.
MOUNTING INFORMATION
4-40 SCREW
CLIP
PLAIN WASHER
HEATSINK
COMPRESSION WASHER
NUT
HEATSINK
Figure 15. Typical Mounting Techniques*
Laboratory tests on a limited number of samples indicate, when using the screw and compression washer mounting technique, a screw
torque of 6 to 8 in
stant pressure on the package over time and during large temperature excursions.
Destructive laboratory tests show that using a hex head 4−40 screw, without washers, and applying a torque in excess of 20 in
cause the plastic to crack around the mounting hole, resulting in a loss of isolation capability.
Additional tests on slotted 4−40 screws indicate that the screw slot fails between 15 to 20 in
age. However, in order to positively ensure the package integrity of the fully isolated device, ON Semiconductor does not recommend
exceeding 10 in
.
lbs is sufficient to provide maximum power dissipation capability. The compression washer helps to maintain a con-
.
.
lbs without adversely affecting the pack-
.
lbs of mounting torque under any mounting conditions.
lbs will
** For more information about mounting power semiconductors see Application Note AN1040.
http://onsemi.com
7
MJF6388 (NPN), MJF6668 (PNP)
PACKAGE DIMENSIONS
TO−220 FULLPAK
CASE 221D−03
ISSUE J
SEATING
−T−
PLANE
F
−B−
Q
C
S
U
A
123
H
G
N
−Y−
J
R
K
L
D
3 PL
M
M
0.25 (0.010)Y
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH
3. 221D-01 THRU 221D-02 OBSOLETE, NEW
STANDARD 221D-03.
INCHES
DIMAMINMAXMINMAX
0.617 0.635 15.67 16.12
B 0.392 0.4199.96 10.63
C 0.177 0.1934.504.90
D 0.024 0.0390.601.00
F 0.116 0.1292.953.28
G0.100 BSC2.54 BSC
H 0.118 0.1353.003.43
J 0.018 0.0250.450.63
K 0.503 0.541 12.78 13.73
L 0.048 0.0581.231.47
N0.200 BSC5.08 BSC
Q 0.122 0.1383.103.50
R 0.099 0.1172.512.96
S 0.092 0.1132.342.87
U 0.239 0.2716.066.88
STYLE 2:
PIN 1. BASE
2. COLLECTOR
3. EMITTER
MILLIMETERS
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867Toll Free USA/Canada
Email: orderlit@onsemi.com
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
http://onsemi.com
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MJF6388/D
8
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