NPN Bipolar Power Transistor
For Switching Power Supply Applications
The MJE/MJF18008G have an applications specific state−of−the−art
die designed for use in 220 V line−operated SWITCHMODE Power
supplies and electronic light ballasts.
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Features
• Improved Efficiency Due to Low Base Drive Requirements:
♦ High and Flat DC Current Gain h
Fast Switching
♦
♦ No Coil Required in Base Circuit for Turn−Off (No Current Tail)
FE
• Tight Parametric Distributions are Consistent Lot−to−Lot
• Two Package Choices: Standard TO−220 or Isolated TO−220
• MJF18008, Case 221D, is UL Recognized at 3500 V
#E69369
RMS
: File
• These Devices are Pb−Free and are RoHS Compliant*
MAXIMUM RATINGS
RatingSymbolValueUnit
Collector−Emitter Sustaining VoltageV
Collector−Base Breakdown VoltageV
Emitter−Base VoltageV
Collector Current− ContinuousI
Collector Current− Peak (Note 1)I
Base Current− ContinuousI
Base Current− Peak (Note 1)I
RMS Isolation Voltage (Note 2)
(for 1 sec, R.H. < 30%, T
Total Device Dissipation @ TC = 25_C
Derate above 25°CMJE18008
Operating and Storage TemperatureTJ, T
Test No. 1 Per Figure 22a
Test No. 1 Per Figure 22b
Test No. 1 Per Figure 22c
= 25_C)
A
MJE18008
MJF18008
MJF18008
V
CEO
CES
EBO
C
CM
B
BM
ISOL
P
D
stg
THERMAL CHARACTERISTICS
CharacteristicsSymbolMaxUnit
Thermal Resistance, Junction−to−Case
MJE18008
MJF18008
Thermal Resistance, Junction−to−Ambient
Maximum Lead Temperature for Soldering
Purposes 1/8″ from Case for 5 Seconds
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
There are two limitations on the power handling ability
of a transistor: average junction temperature and second
breakdown. Safe operating area curves indicate I
B2
10 ms1 ms
EXTENDED
SOA
DERATING
I
B(off)
V
= 15 V
CC
= 300 V
V
Z
L
= 200 mH
C
C
= IC/2
− V
CE
400
I
= IC/2
350
300
250
200
150
, CROSSOVER TIME (ns)
C
T
100
50
3515467891011121314
IC = 4.5 A
TJ = 25°C
T
= 125°C
J
IC = 2 A
hFE, FORCED GAIN
B(off)
V
= 15 V
CC
= 300 V
V
Z
L
= 200 mH
C
Figure 14. Inductive Crossover Time
9
800
TC ≤ 125°C
I
≥ 4
C/IB
L
= 500 mH
C
-5 V
8
7
6
5
4
3
2
, COLLECTOR CURRENT (AMPS)
C
I
1
0
0200
VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)
V
BE(off)
400
= 0 V
-1, 5 V
6001000
Operating Area
limits of the transistor that must be observed for reliable
operation; i.e., the transistor must not be subjected to greater
dissipation than the curves indicate. The data of Figure 15 is
based on T
= 25°C; T
C
is variable depending on power
J(pk)
level. Second breakdown pulse limits are valid for duty
cycles to 10% but must be derated when T
> 25°C. Second
C
breakdown limitations do not derate the same as thermal
limitations. Allowable current at the voltages shown in
Figure 15 may be found at any case temperature by using the
appropriate curve on Figure 17. T
may be calculated
J(pk)
from the data in Figure 20 and 21. At any case temperatures,
thermal limitations will reduce the power that can be handled
to values less than the limitations imposed by second
breakdown. For inductive loads, high voltage and current
must be sustained simultaneously during turn−off with the
base−to−emitter junction reverse−biased. The safe level is
specified as a reverse−biased safe operating area (Figure 16).
This rating is verified under clamped conditions so that the
device is never subjected to an avalanche mode.
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5
Page 6
MJE18008G, MJF18008G
5
V
CE
4
3
2
1
0
VOLTS
-1
-2
-3
-4
I
B
-5
012345678
Figure 18. Dynamic Saturation Voltage Measurements
1 ms
dyn 1 ms
90% I
dyn 3 ms
B
3 ms
TIME
+15 V
+10 V
COMMON
-V
off
1 mF
MPF930
50 W
150 W
3 W
MPF930
500 mF
100 W
3 W
10
I
9
C
8
7
t
si
6
5
V
CLAMP
10% V
CLAMP
90% I
C
t
fi
t
c
10% I
C
4
I
B
3
90% IB1
2
1
0
01234567 8
TIME
Figure 19. Inductive Switching Measurements
100 mF
PEAK
V
CE
V
R
B1
I
out
CE
IB1
I
B
A
2
I
R
B2
V(BR)CEO(sus)
L = 10 mH
RB2 = ∞
V
= 20 VOLTS
CC
I
(pk) = 100 mA
C
1 mF
B
INDUCTIVE SWITCHING
L = 200 mH
RB2 = 0
V
= 15 VOLTS
CC
RB1 SELECTED FOR
DESIRED I
150 W
3 W
MTP8P10
MTP8P10
MUR105
MJE210
MTP12N10
I
PEAK
C
RBSOA
L = 500 mH
RB2 = 0
V
= 15 VOLTS
CC
RB1 SELECTED
1
B
FOR DESIRED I
1
B
Table 1. Inductive Load Switching Drive Circuit
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6
Page 7
1
MJE18008G, MJF18008G
TYPICAL THERMAL RESPONSE
D = 0.5
0.2
0.1
0.1
0.05
P
(pk)
R
(t) = r(t) R
q
JC
R
= 1.0°C/W MAX
q
JC
q
JC
D CURVES APPLY FOR POWER
(NORMALIZED)
0.02
SINGLE PULSE
t
1
t
2
DUTY CYCLE, D = t1/t
PULSE TRAIN SHOWN
READ TIME AT t
T
- TC = P
J(pk)
2
(pk)
1
R
q
JC
r(t), TRANSIENT THERMAL RESISTANCE
0.01
0.010.11101001000
Figure 20. Typical Thermal Response (Z
t, TIME (ms)
(t)) for MJE18008
q
JC
1
D = 0.5
0.2
0.1
0.1
P
(pk)
R
(t) = r(t) R
q
JC
R
= 2.78°C/W MAX
q
JC
q
JC
D CURVES APPLY FOR POWER
(NORMALIZED)
0.05
r(t), TRANSIENT THERMAL RESISTANCE
0.02
0.01
0.010.1110100100000
SINGLE PULSE
t
1
t
2
DUTY CYCLE, D = t1/t
PULSE TRAIN SHOWN
READ TIME AT t
T
- TC = P
J(pk)
2
(pk)
100010000
1
R
q
JC
t, TIME (ms)
Figure 21. Typical Thermal Response (Z
(t)) for MJF18008
q
JC
(t)
(t)
ORDERING INFORMATION
DevicePackageShipping
MJE18008GTO−220AB
(Pb−Free)
MJF18008GTO−220 (Fullpack)
(Pb−Free)
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7
50 Units / Rail
50 Units / Rail
Page 8
MJE18008G, MJF18008G
TEST CONDITIONS FOR ISOLATION TESTS*
MOUNTED
CLIP
Figure 22a. Screw or Clip Mounting Position
for Isolation Test Number 1
*Measurement made between leads and heatsink with all leads shorted together
FULLY ISOLATED
PACKAGE
CLIP
LEADS
HEATSINK
0.110″ MIN
Figure 22b. Clip Mounting Position
for Isolation Test Number 2
MOUNTED
FULLY ISOLATED
PACKAGE
MOUNTING INFORMATION**
4-40 SCREW
PLAIN WASHER
LEADS
HEATSINK
MOUNTED
0.099″ MIN
Figure 22c. Screw Mounting Position
for Isolation Test Number 3
FULLY ISOLATED
PACKAGE
0.099″ MIN
LEADS
HEATSINK
CLIP
HEATSINK
COMPRESSION WASHER
NUT
HEATSINK
Figure 23a. Screw−MountedFigure 23b. Clip−Mounted
Figure 23. Typical Mounting Techniques
for Isolated Package
Laboratory tests on a limited number of samples indicate, when using the screw and compression washer mounting
technique, a screw torque of 6 to 8 in
.
lbs is sufficient to provide maximum power dissipation capability. The compression washer helps to maintain a constant pressure on the package over time and during large temperature excursions.
Destructive laboratory tests show that using a hex head 4−40 screw, without washers, and applying a torque in excess
of 20 in
Additional tests on slotted 4−40 screws indicate that the screw slot fails between 15 to 20 in
.
lbs will cause the plastic to crack around the mounting hole, resulting in a loss of isolation capability.
.
lbs without adversely
affecting the package. However, in order to positively ensure the package integrity of the fully isolated device, ON Semiconductor does not recommend exceeding 10 in
** For more information about mounting power semiconductors see Application Note AN1040.
.
lbs of mounting torque under any mounting conditions.
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8
Page 9
MJE18008G, MJF18008G
PACKAGE DIMENSIONS
TO−220
CASE 221A−09
ISSUE AG
SEATING
−T−
PLANE
B
4
Q
123
F
T
A
U
H
K
Z
L
V
G
D
N
C
S
R
J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION Z DEFINES A ZONE WHERE ALL
BODY AND LEAD IRREGULARITIES ARE
ALLOWED.
DIM MINMAXMINMAX
A0.570 0.620 14.48 15.75
B 0.380 0.4059.66 10.28
C 0.160 0.1904.074.82
D 0.025 0.0360.640.91
F0.142 0.1613.614.09
G 0.095 0.1052.422.66
H0.110 0.1612.804.10
J0.014 0.0250.360.64
K 0.500 0.562 12.70 14.27
L0.045 0.0601.151.52
N 0.190 0.2104.835.33
Q 0.100 0.1202.543.04
R 0.0800.1102.042.79
S 0.045 0.0551.151.39
T0.235 0.2555.976.47
U 0.000 0.0500.001.27
V 0.045---1.15---
Z--- 0.080---2.04
STYLE 1:
PIN 1. BASE
2. COLLECTOR
3. EMITTER
4. COLLECTOR
MILLIMETERSINCHES
TO−220 FULLPAK
CASE 221D−03
ISSUE K
SEATING
−T−
PLANE
F
−B−
Q
C
S
U
A
123
H
G
N
−Y−
J
R
K
L
D
3 PL
M
M
0.25 (0.010)Y
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH
3. 221D-01 THRU 221D-02 OBSOLETE, NEW
STANDARD 221D-03.
INCHES
DIMAMINMAXMINMAX
0.617 0.635 15.67 16.12
B 0.392 0.4199.96 10.63
C 0.177 0.1934.504.90
D 0.024 0.0390.601.00
L0.048 0.0581.231.47
N0.200 BSC5.08 BSC
Q 0.122 0.1383.103.50
R 0.0990.1172.512.96
S 0.0920.1132.342.87
U 0.239 0.2716.066.88
STYLE 2:
PIN 1. BASE
2. COLLECTOR
3. EMITTER
MILLIMETERS
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9
Page 10
MJE18008G, MJF18008G
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where
personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,
any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
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Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
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Phone: 421 33 790 2910
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ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MJE18008/D
10
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