Datasheet MJE18008G, MJF18008G Specification

Page 1
MJE18008G, MJF18008G
SWITCHMODE
NPN Bipolar Power Transistor For Switching Power Supply Applications
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Features
Improved Efficiency Due to Low Base Drive Requirements:
High and Flat DC Current Gain h
Fast Switching
♦ ♦ No Coil Required in Base Circuit for TurnOff (No Current Tail)
FE
Tight Parametric Distributions are Consistent LottoLot
Two Package Choices: Standard TO220 or Isolated TO220
MJF18008, Case 221D, is UL Recognized at 3500 V
#E69369
RMS
: File
These Devices are PbFree and are RoHS Compliant*
MAXIMUM RATINGS
Rating Symbol Value Unit
CollectorEmitter Sustaining Voltage V
CollectorBase Breakdown Voltage V
EmitterBase Voltage V
Collector Current Continuous I
Collector Current Peak (Note 1) I
Base Current Continuous I
Base Current Peak (Note 1) I
RMS Isolation Voltage (Note 2)
(for 1 sec, R.H. < 30%, T
Total Device Dissipation @ TC = 25_C
Derate above 25°C MJE18008
Operating and Storage Temperature TJ, T
Test No. 1 Per Figure 22a Test No. 1 Per Figure 22b Test No. 1 Per Figure 22c
= 25_C)
A
MJE18008 MJF18008
MJF18008
V
CEO
CES
EBO
C
CM
B
BM
ISOL
P
D
stg
THERMAL CHARACTERISTICS
Characteristics Symbol Max Unit
Thermal Resistance, Junction−to−Case
MJE18008 MJF18008
Thermal Resistance, JunctiontoAmbient
Maximum Lead Temperature for Soldering Purposes 1/8 from Case for 5 Seconds
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
1. Pulse Test: Pulse Width = 5 ms, Duty Cycle 10%.
2. Proper strike and creepage distance must be provided.
R
q
JC
R
q
JA
T
L
450 Vdc
1000 Vdc
9.0 Vdc
8.0 Adc
16 Adc
4.0 Adc
8.0 Adc
MJF18008
4500 3500 1500
125
45
1.0
0.36
65 to 150
1.0
2.78
62.5
260
V
W
W/_C
_C
_C/W
_C/W
_C
POWER TRANSISTOR
8.0 AMPERES 1000 VOLTS
45 and 125 WATTS
COLLECTOR
2,4
1
BASE
3
EMITTER
MARKING
DIAGRAMS
4
MJE18008G
AYW W
TO−220AB
1
2
3
1
2
3
G = PbFree Package A = Assembly Location Y = Year WW = Work Week
See detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet.
*For additional information on our PbFree strategy
and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
CASE 221A−09
STYLE 1
TO220 FULLPACK
CASE 221D
STYLE 2
UL RECOGNIZED
MJF18008G
ORDERING INFORMATION
AYW W
© Semiconductor Components Industries, LLC, 2013
August, 2013 Rev. 9
1 Publication Order Number:
MJE18008/D
Page 2
MJE18008G, MJF18008G
ELECTRICAL CHARACTERISTICS (T
Characteristic
= 25_C unless otherwise specified)
C
Symbol Min Typ Max Unit
OFF CHARACTERISTICS
CollectorEmitter Sustaining Voltage (I
Collector Cutoff Current (VCE = Rated V
Collector Cutoff Current (VCE = Rated V
Collector Cutoff Current (V
= 800 V, VEB = 0) (TC = 125_C)
CE
Emitter Cutoff Current (VEB = 9.0 Vdc, IC = 0) I
= 100 mA, L = 25 mH) V
C
, IB = 0) I
CEO
, VEB = 0)
CES
(T
= 125_C)
C
CEO(sus)
CEO
I
CES
EBO
ON CHARACTERISTICS
BaseEmitter Saturation Voltage (IC = 2.0 Adc, IB = 0.2 Adc)
BaseEmitter Saturation Voltage (IC = 4.5 Adc, IB = 0.9 Adc)
CollectorEmitter Saturation Voltage
(I
= 2.0 Adc, IB = 0.2 Adc)
C
(I
= 4.5 Adc, IB = 0.9 Adc)
C
DC Current Gain (IC = 1.0 Adc, VCE = 5.0 Vdc)
DC Current Gain (I
DC Current Gain (I
= 4.5 Adc, VCE = 1.0 Vdc)
C
= 2.0 Adc, VCE = 1.0 Vdc)
C
DC Current Gain (IC = 10 mAdc, VCE = 5.0 Vdc)
(T
= 125_C)
C
(T
= 125_C)
C
= 125_C)
(T
C
= 125_C)
(T
C
= 125_C)
(T
C
V
BE(sat)
V
CE(sat)
h
DYNAMIC CHARACTERISTICS
Current Gain Bandwidth (IC = 0.5 Adc, VCE = 10 Vdc, f = 1.0 MHz)
Output Capacitance (VCB = 10 Vdc, IE = 0, f = 1.0 MHz)
Input Capacitance (VEB = 8.0 V)
Dynamic Saturation Voltage:
Determined 1.0 ms and
3.0 ms respectively after rising I final I (see Figure 18)
reaches 90% of
B1
B1
(IC = 2.0 Adc
I
= 200 mAdc
B1
= 300 V)
V
CC
(IC = 5.0 Adc
1.0 ms
3.0 ms
1.0 ms
IB1 = 1.0 Adc
= 300 V)
V
CC
3.0 ms
(TC = 125°C)
(TC = 125°C)
(TC = 125°C)
(TC = 125°C)
C
C
V
CE(dsat)
SWITCHING CHARACTERISTICS: Resistive Load (D.C. v 10%, Pulse Width = 20 ms)
TurnOn Time
TurnOff Time
(IC = 2.0 Adc, IB1 = 0.2 Adc, IB2 = 1.0 Adc, VCC = 300 V)
(TC = 125°C)
t
t
(TC = 125°C)
TurnOn Time
TurnOff Time
(IC = 4.5 Adc, IB1 = 0.9 Adc,
IB2 = 2.25 Adc, VCC = 300 V)
(TC = 125°C)
t
t
(TC = 125°C)
SWITCHING CHARACTERISTICS: Inductive Load (V
Fall Time
(IC = 2.0 Adc, IB1 = 0.2 Adc,
IB2 = 1.0 Adc)
= 300 V, VCC = 15 V, L = 200 mH)
clamp
(TC = 125°C)
Storage Time
(TC = 125°C)
Crossover Time
(TC = 125°C)
Fall Time
(IC = 4.5 Adc, IB1 = 0.9 Adc,
I
= 2.25 Adc)
B2
(TC = 125°C)
Storage Time
(TC = 125°C)
Crossover Time
(TC = 125°C)
3. Pulse Test: Pulse Width = 5.0 ms, Duty Cycle v 10%.
4. Proper strike and creepage distance must be provided.
450 Vdc
100
100 500 100
100
0.82
0.92
1.1
1.25
mAdc
mAdc
mAdc
Vdc
Vdc
FE
14
6.0
5.0 11 11 10
f
T
ob
ib
on
off
on
off
t
fi
t
si
t
c
t
fi
t
si
t
c
0.3
0.3
0.35
0.4
28
9.0
8.0 15 16 20
13
100
1750
5.5
11.5
3.5
6.5
11.5
14.5
2.4
9.0
200 190
1.2
1.5
100 250
1.6
2.0
100 120
1.5
1.9
250 230
85
135
2.0
2.6
210 250
0.6
0.65
0.7
0.8
34
150
2500
300
2.5
180
2.5
180
2.75
350
150
3.2
300
MHz
pF
pF
Vdc
ns
ms
ns
ms
ns
ms
ns
ns
ms
ns
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Page 3
MJE18008G, MJF18008G
TYPICAL STATIC CHARACTERISTICS
100
, DC CURRENT GAIN
FE
h
10
1
0.01
2
1.5
1
TJ = 125°C
TJ = 25°C
TJ = -20°C
0.1
I
, COLLECTOR CURRENT (AMPS)
C
Figure 1. DC Current Gain @ 1 Volt
TJ = 25°C
IC = 1 A
3 A 5 A 8 A 10 A
100
VCE = 1 V
, DC CURRENT GAIN
h
110
TJ = 125°C
TJ = 25°C
10
TJ = -20°C
FE
1
0.01 0.1 1 10
10
1
VCE = 5 V
IC, COLLECTOR CURRENT (AMPS)
Figure 2. DC Current Gain @ 5 Volts
, VOLTAGE (VOLTS)
V
, VOLTAGE (VOLTS)
V
CE
BE
0.5
1.3
1.2
1.1
0.9
0.8
0.7
0.6
0.5
0.4
0
0.01
1
0.01
IC/IB = 10
, VOLTAGE (VOLTS)
0.1
CE
0.1 1 10
, BASE CURRENT (AMPS)
I
B
V
0.01
0.01
IC/IB = 5
0.1
IC COLLECTOR CURRENT (AMPS)
110
Figure 3. Collector Saturation Region Figure 4. CollectorEmitter Saturation Voltage
10000
C
ib
1000
100
C
ob
TJ = 25°C
10
C, CAPACITANCE (pF)
1
1 1000
VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)
10
100
TJ = 125°C
IC/IB = 5 I
C/IB
0.1 1 10
, COLLECTOR CURRENT (AMPS)
I
C
= 10
TJ = 25°C T
= 125°C
J
TJ = 25°C f = 1 MHz
Figure 5. BaseEmitter Saturation Region Figure 6. Capacitance
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MJE18008G, MJF18008G
TYPICAL SWITCHING CHARACTERISTICS
(I
= IC/2 for all switching)
B2
1500
I
= IC/2
B(off)
V
= 300 V
CC
PW = 20 ms
1000
TJ = 125°C IC/IB = 5 I
C/IB
= 10
TJ = 25°C
t, TIME (ns)
500
0
0
1 357 1 3 5 7
2
48
6
IC, COLLECTOR CURRENT (AMPS)
Figure 7. Resistive Switching, t
on
3500
I
= IC/2
3000
2500
IC/IB = 5
B(off)
V
= 15 V
CC
= 300 V
V
Z
L
= 200 mH
C
2000
1500
t, TIME (ns)
1000
500
0
13467
TJ = 25°C T
= 125°C
J
IC/IB = 10
25 8
IC COLLECTOR CURRENT (AMPS)
Figure 9. Inductive Storage Time, t
si
4500
4000
3500
3000
2500
2000
t, TIME (ns)
1500
1000
500
0
5000
4500
4000
3500
3000
2500
2000
, STORAGE TIME (ns)
1500
si
t
1000
500
0
IC/IB = 5
TJ = 25°C
= 125°C
T
J
IC/IB = 10
4826
I
, COLLECTOR CURRENT (AMPS)
C
Figure 8. Resistive Switching, t
TJ = 25°C T
= 125°C
J
IC = 2 A
IC = 4.5 A
4 5 7 8 10 11 13 14
3
6
9
, FORCED GAIN
h
FE
12 15
Figure 10. Inductive Storage Time, tsi(hFE)
I
= IC/2
B(off)
= 300 V
V
CC
PW = 20 ms
off
I
= IC/2
B(off)
V
= 15 V
CC
= 300 V
V
Z
L
= 200 mH
C
400
350
300
250
200
t, TIME (ns)
150
I
= IC/2
B(off)
100
V
= 15 V
CC
= 300 V
V
50
Z
L
= 200 mH
C
0
123 5
t
fi
48
IC, COLLECTOR CURRENT (AMPS)
Figure 11. Inductive Switching, t
IC/IB = 5
t
c
TJ = 25°C T
= 125°C
J
67
and t
c
fi
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300
t, TIME (ns)
250
200
150
TJ = 25°C T
= 125°C
J
t
fi
t
c
I
B(off)
V
= 15 V
CC
= 300 V
V
Z
L
= 200 mH
C
= IC/2
100
50
478123 56
IC, COLLECTOR CURRENT (AMPS)
Figure 12. Inductive Switching, t
and t
c
fi
IC/IB = 10
4
Page 5
MJE18008G, MJF18008G
TYPICAL SWITCHING CHARACTERISTICS
(I
= IC/2 for all switching)
160
150
140
130
120
110
100
, FALL TIME (ns)
fi
t
90
80
70
60
3
IC = 4.5 A
TJ = 25°C T
= 125°C
J
4 67891011121314
515
, FORCED GAIN
h
FE
IC = 2 A
Figure 13. Inductive Fall Time
GUARANTEED SAFE OPERATING AREA INFORMATION
100
DC (MJE18008)
5 ms
1 ms
10
1
DC (MJF18008)
0.1
, COLLECTOR CURRENT (AMPS)
C
I
0.01 10
VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)
100 1000
Figure 15. Forward Bias Safe Operating Area Figure 16. Reverse Bias Switching Safe
1,0
SECOND BREAKDOWN
POWER DERATING FACTOR
0,8
0,6
0,4
0,2
0,0
THERMAL DERATING
20
40 60 100 120
T
80 140 160
, CASE TEMPERATURE (°C)
C
Figure 17. Forward Bias Power Derating
There are two limitations on the power handling ability of a transistor: average junction temperature and second breakdown. Safe operating area curves indicate I
B2
10 ms 1 ms
EXTENDED
SOA
DERATING
I
B(off)
V
= 15 V
CC
= 300 V
V
Z
L
= 200 mH
C
C
= IC/2
V
CE
400
I
= IC/2
350
300
250
200
150
, CROSSOVER TIME (ns)
C
T
100
50
35 154 67891011121314
IC = 4.5 A
TJ = 25°C T
= 125°C
J
IC = 2 A
hFE, FORCED GAIN
B(off)
V
= 15 V
CC
= 300 V
V
Z
L
= 200 mH
C
Figure 14. Inductive Crossover Time
9
800
TC 125°C I
4
C/IB
L
= 500 mH
C
-5 V
8
7
6
5
4
3
2
, COLLECTOR CURRENT (AMPS)
C
I
1
0
0 200
VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)
V
BE(off)
400
= 0 V
-1, 5 V
600 1000
Operating Area
limits of the transistor that must be observed for reliable operation; i.e., the transistor must not be subjected to greater dissipation than the curves indicate. The data of Figure 15 is based on T
= 25°C; T
C
is variable depending on power
J(pk)
level. Second breakdown pulse limits are valid for duty cycles to 10% but must be derated when T
> 25°C. Second
C
breakdown limitations do not derate the same as thermal limitations. Allowable current at the voltages shown in Figure 15 may be found at any case temperature by using the appropriate curve on Figure 17. T
may be calculated
J(pk)
from the data in Figure 20 and 21. At any case temperatures, thermal limitations will reduce the power that can be handled to values less than the limitations imposed by second breakdown. For inductive loads, high voltage and current must be sustained simultaneously during turnoff with the basetoemitter junction reversebiased. The safe level is specified as a reverse−biased safe operating area (Figure 16). This rating is verified under clamped conditions so that the device is never subjected to an avalanche mode.
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Page 6
MJE18008G, MJF18008G
5
V
CE
4
3
2
1
0
VOLTS
-1
-2
-3
-4 I
B
-5
012345678
Figure 18. Dynamic Saturation Voltage Measurements
1 ms
dyn 1 ms
90% I
dyn 3 ms
B
3 ms
TIME
+15 V
+10 V
COMMON
-V
off
1 mF
MPF930
50 W
150 W
3 W
MPF930
500 mF
100 W
3 W
10
I
9
C
8
7
t
si
6
5
V
CLAMP
10% V
CLAMP
90% I
C
t
fi
t
c
10% I
C
4
I
B
3
90% IB1
2
1
0
01234567 8
TIME
Figure 19. Inductive Switching Measurements
100 mF
PEAK
V
CE
V
R
B1
I
out
CE
IB1
I
B
A
2
I
R
B2
V(BR)CEO(sus)
L = 10 mH RB2 = V
= 20 VOLTS
CC
I
(pk) = 100 mA
C
1 mF
B
INDUCTIVE SWITCHING
L = 200 mH RB2 = 0 V
= 15 VOLTS
CC
RB1 SELECTED FOR DESIRED I
150 W
3 W
MTP8P10
MTP8P10
MUR105
MJE210
MTP12N10
I
PEAK
C
RBSOA
L = 500 mH RB2 = 0 V
= 15 VOLTS
CC
RB1 SELECTED
1
B
FOR DESIRED I
1
B
Table 1. Inductive Load Switching Drive Circuit
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Page 7
1
MJE18008G, MJF18008G
TYPICAL THERMAL RESPONSE
D = 0.5
0.2
0.1
0.1
0.05
P
(pk)
R
(t) = r(t) R
q
JC
R
= 1.0°C/W MAX
q
JC
q
JC
D CURVES APPLY FOR POWER
(NORMALIZED)
0.02
SINGLE PULSE
t
1
t
2
DUTY CYCLE, D = t1/t
PULSE TRAIN SHOWN READ TIME AT t T
- TC = P
J(pk)
2
(pk)
1
R
q
JC
r(t), TRANSIENT THERMAL RESISTANCE
0.01
0.01 0.1 1 10 100 1000
Figure 20. Typical Thermal Response (Z
t, TIME (ms)
(t)) for MJE18008
q
JC
1
D = 0.5
0.2
0.1
0.1
P
(pk)
R
(t) = r(t) R
q
JC
R
= 2.78°C/W MAX
q
JC
q
JC
D CURVES APPLY FOR POWER
(NORMALIZED)
0.05
r(t), TRANSIENT THERMAL RESISTANCE
0.02
0.01
0.01 0.1 1 10 100 100000
SINGLE PULSE
t
1
t
2
DUTY CYCLE, D = t1/t
PULSE TRAIN SHOWN READ TIME AT t T
- TC = P
J(pk)
2
(pk)
1000 10000
1
R
q
JC
t, TIME (ms)
Figure 21. Typical Thermal Response (Z
(t)) for MJF18008
q
JC
(t)
(t)
ORDERING INFORMATION
Device Package Shipping
MJE18008G TO220AB
(PbFree)
MJF18008G TO220 (Fullpack)
(PbFree)
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7
50 Units / Rail
50 Units / Rail
Page 8
MJE18008G, MJF18008G
TEST CONDITIONS FOR ISOLATION TESTS*
MOUNTED
CLIP
Figure 22a. Screw or Clip Mounting Position
for Isolation Test Number 1
*Measurement made between leads and heatsink with all leads shorted together
FULLY ISOLATED
PACKAGE
CLIP
LEADS
HEATSINK
0.110 MIN
Figure 22b. Clip Mounting Position
for Isolation Test Number 2
MOUNTED
FULLY ISOLATED
PACKAGE
MOUNTING INFORMATION**
4-40 SCREW
PLAIN WASHER
LEADS
HEATSINK
MOUNTED
0.099MIN
Figure 22c. Screw Mounting Position
for Isolation Test Number 3
FULLY ISOLATED
PACKAGE
0.099 MIN
LEADS
HEATSINK
CLIP
HEATSINK
COMPRESSION WASHER
NUT
HEATSINK
Figure 23a. ScrewMounted Figure 23b. ClipMounted
Figure 23. Typical Mounting Techniques
for Isolated Package
Laboratory tests on a limited number of samples indicate, when using the screw and compression washer mounting
technique, a screw torque of 6 to 8 in
.
lbs is sufficient to provide maximum power dissipation capability. The compres­sion washer helps to maintain a constant pressure on the package over time and during large temperature excursions. Destructive laboratory tests show that using a hex head 440 screw, without washers, and applying a torque in excess of 20 in Additional tests on slotted 440 screws indicate that the screw slot fails between 15 to 20 in
.
lbs will cause the plastic to crack around the mounting hole, resulting in a loss of isolation capability.
.
lbs without adversely affecting the package. However, in order to positively ensure the package integrity of the fully isolated device, ON Semi­conductor does not recommend exceeding 10 in
** For more information about mounting power semiconductors see Application Note AN1040.
.
lbs of mounting torque under any mounting conditions.
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MJE18008G, MJF18008G
PACKAGE DIMENSIONS
TO−220
CASE 221A−09
ISSUE AG
SEATING
T
PLANE
B
4
Q
123
F
T
A
U
H
K
Z
L
V
G
D
N
C
S
R
J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION Z DEFINES A ZONE WHERE ALL BODY AND LEAD IRREGULARITIES ARE ALLOWED.
DIM MIN MAX MIN MAX
A 0.570 0.620 14.48 15.75 B 0.380 0.405 9.66 10.28 C 0.160 0.190 4.07 4.82 D 0.025 0.036 0.64 0.91 F 0.142 0.161 3.61 4.09 G 0.095 0.105 2.42 2.66 H 0.110 0.161 2.80 4.10 J 0.014 0.025 0.36 0.64 K 0.500 0.562 12.70 14.27 L 0.045 0.060 1.15 1.52 N 0.190 0.210 4.83 5.33 Q 0.100 0.120 2.54 3.04 R 0.080 0.110 2.04 2.79 S 0.045 0.055 1.15 1.39 T 0.235 0.255 5.97 6.47 U 0.000 0.050 0.00 1.27 V 0.045 --- 1.15 --- Z --- 0.080 --- 2.04
STYLE 1:
PIN 1. BASE
2. COLLECTOR
3. EMITTER
4. COLLECTOR
MILLIMETERSINCHES
TO220 FULLPAK
CASE 221D03
ISSUE K
SEATING
T
PLANE
F
B
Q
C
S
U
A
123
H
G N
Y
J
R
K
L
D
3 PL
M
M
0.25 (0.010) Y
B
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH
3. 221D-01 THRU 221D-02 OBSOLETE, NEW STANDARD 221D-03.
INCHES
DIMAMIN MAX MIN MAX
0.617 0.635 15.67 16.12
B 0.392 0.419 9.96 10.63 C 0.177 0.193 4.50 4.90 D 0.024 0.039 0.60 1.00
F 0.116 0.129 2.95 3.28 G 0.100 BSC 2.54 BSC H 0.118 0.135 3.00 3.43
J 0.018 0.025 0.45 0.63 K 0.503 0.541 12.78 13.73
L 0.048 0.058 1.23 1.47 N 0.200 BSC 5.08 BSC Q 0.122 0.138 3.10 3.50 R 0.099 0.117 2.51 2.96
S 0.092 0.113 2.34 2.87 U 0.239 0.271 6.06 6.88
STYLE 2:
PIN 1. BASE
2. COLLECTOR
3. EMITTER
MILLIMETERS
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MJE18008G, MJF18008G
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
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MJE18008/D
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