Datasheet mjd5731-d Datasheet

Page 1
MJD5731
High Voltage PNP Silicon Power Transistors
Designed for line operated audio output amplifier, SWITCHMODEt power supply drivers and other switching applications.
Features
• 350 V (Min) − V
• 1.0 A Rated Collector Current
• PNP Complements to the MJD47 thru MJD50 Series
• Epoxy Meets UL 94 V−0 @ 0.125 in
• ESD Ratings: Human Body Model, 3B u 8000 V
• These are Pb−Free Packages
MAXIMUM RATINGS
Collector−Emitter Voltage V
Emitter−Base Voltage V
Collector Current − Continuous
Total Power Dissipation @ TC = 25°C
Derate above 25°C
Total Power Dissipation (Note 1)
@ T
= 25°C
A
Derate above 25°C
Unclamped Inductive Load Energy
(See Figure 10)
Operating and Storage Junction
Temperature Range
THERMAL CHARACTERISTICS
Thermal Resistance, Junction−to−Case
Thermal Resistance, Junction−to−Ambient (Note 1)
Lead Temperature for Soldering T
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
1. These ratings are applicable when surface mounted on the minimum pad
sizes recommended.
CEO(sus)
Machine Model, C u 400 V
Rating Symbol Max Unit
CEO
EB
I
− Peak
Characteristic Symbol Max Unit
C
P
D
P
D
E 20 mJ
TJ, T
stg
R
q
JC
R
q
JA
L
350 Vdc
5 Vdc
1.0
3.0
15
0.12
1.56
0.0125
−55 to +150 °C
8.33 °C/W
80 °C/W
260 °C
Adc
W
W/°C
W
W/°C
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SILICON
POWER TRANSISTORS
1.0 AMPERE
350 VOLTS, 15 WATTS
4
2
1
3
DPAK
CASE 369C
STYLE 1
MARKING DIAGRAM
AYWW
J
5731G
A = Assembly Location Y = Year WW = Work Week J5731 = Device Code G = Pb−Free Package
ORDERING INFORMATION
Device Package Shipping
MJD5731T4G DPAK
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
2500/Tape & Reel
†
© Semiconductor Components Industries, LLC, 2011
January, 2011 − Rev. 4
1 Publication Order Number:
MJD5731/D
Page 2
MJD5731
ELECTRICAL CHARACTERISTICS (T
= 25°C unless otherwise noted)
C
Characteristic
OFF CHARACTERISTICS
Collector−Emitter Sustaining Voltage (Note 2)
(IC = 30 mAdc, IB = 0)
Collector Cutoff Current
(V
= 250 Vdc, IB = 0)
CE
Collector Cutoff Current
(V
= 350 Vdc, VBE = 0)
CE
Emitter Cutoff Current
(V
= 5.0 Vdc, IC = 0)
BE
ON CHARACTERISTICS (Note 2)
DC Current Gain
(I
= 0.3 Adc, VCE = 10 Vdc)
C
(IC = 1.0 Adc, VCE = 10 Vdc)
Collector−Emitter Saturation Voltage
(I
= 1.0 Adc, IB = 0.2 Adc)
C
Base−Emitter On Voltage
(I
= 1.0 Adc, VCE = 10 Vdc)
C
DYNAMIC CHARACTERISTICS
Current Gain − Bandwidth Product
(I
= 0.2 Adc, VCE = 10 Vdc, f = 2.0 MHz)
C
Small−Signal Current Gain
(I
= 0.2 Adc, VCE = 10 Vdc, f = 1.0 kHz)
C
2. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2.0%.
Symbol
V
CEO(sus)
I
CEO
I
CES
I
EBO
h
FE
V
CE(sat)
V
BE(on)
f
T
h
fe
Min
350
−
−
−
30 10
−
−
10
25
Max
−
0.1
0.01
0.5
175
−
1.0
1.5
−
−
Unit
Vdc
mAdc
mAdc
mAdc
−
Vdc
Vdc
MHz
−
200
VCE = 10 V
100
TJ = 150°C
50
30
25°C
-55°C
20
10
, DC CURRENT GAIN
FE
h
5.0
3.0
2.0
0.02 0.03 0.05 0.1 0.2 0.5 1.0 2.0 IC, COLLECTOR CURRENT (AMPS)
Figure 1. DC Current Gain
1.4
1.2
1
0.8
TJ = 25°C
0.6
0.4
0.2 V
@ IC/IB = 5.0
0
0.02
CE(sat))
0.03
0.05 0.3
0.1
I
, COLLECTOR CURRENT (AMPS)
C
0.2
, COLLECTOR-EMITTER VOLTAGE (VOLTS)
CE
V
Figure 2. Collector−Emitter Saturation Voltage
0.50.3
-55°C 150°C
1.0 2.0
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MJD5731
V, VOLTAGE (V)
10
5.0
2.0
1.0
0.5
0.2
0.1
0.05
, COLLECTOR CURRENT (AMP)
C
I
0.02
0.01
5.0
1.4
1.2
1.0
0.8
0.6
0.4
0.2
V
@ IC/IB = 5.0
BE(sat)
0
0.05 0.2 2.00.1 0.50.3 1.00.02 0.03
IC, COLLECTOR CURRENT (AMPS)
Figure 3. Base−Emitter Voltage
1.0ms
TC = 25°C
BONDING WIRE LIMIT THERMAL LIMIT SECOND BREAKDOWN LIMIT
10 20
VCE, COLLECTOR-EMITTER VOLTAGE (VOLTS)
dc
30 100
50
TJ = - 55°C
25°C
150°C
100 ms
500 ms
200 300 500
1.4
1.2
1
V
@ IC/IB = 5 V
BE(sat)
V
@ VCE = 4 V
BE(on)
TJ = 25°C
V
@ IC/IB = 5 V
CE(sat)
0.06 0.2 20.1 0.6 I
, COLLECTOR CURRENT (AMPS)
C
0.4 1
V, VOLTAGE (VOLTS)
0.8
0.6
0.4
0.2
0
0.02
0.04
Figure 4. “On” Voltages
There are two limitations on the power handling ability of a transistor: average junction temperature and second breakdown. Safe operating area curves indicate I
C
− V limits of the transistor that must be observed for reliable operation; i.e., the transistor must not be subjected to greater dissipation than the curves indicate.
The data of Figure 5 is based on T
= 150°C; TC is
J(pk)
variable depending on conditions. Second breakdown pulse limits are valid for duty cycles to 10% provided T v 150°C. T
may be calculated from the data in
J(pk)
J(pk)
Figure 6. At high case temperatures, thermal limitations will reduce the power that can be handled to values less than the limitations imposed by second breakdown.
CE
Figure 5. Forward Bias Safe Operating Area
1
0.7
0.5
0.3
0.2
0.1
0.07
0.05
r(t), TRANSIENT THERMAL
0.03
RESISTANCE (NORMALIZED)
0.02
0.01
D = 0.5
0.2
0.1
0.05
0.02
0.01
SINGLE PULSE
0.02 0.03 0.05 0.1 0.2 0.3 0.5 1 2 3 5 10 20 30 50 100 200 300 500
0.01
R
= r(t) R
q
JC(t)
R
q
JC
D CURVES APPLY FOR POWER PULSE TRAIN SHOWN READ TIME AT t T
J(pk)
t, TIME (ms)
q
- TC = P
JC
(pk) qJC(t)
= 8.33°C/W MAX
Figure 6. Thermal Response
P
(pk)
t
1
1
t
2
DUTY CYCLE, D = t1/t
2
1 k
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Page 4
V
BE(off)
TURN-ON PULSE
t
1
V
in
AP
PROX.
-11 V
MJD5731
0 V
t
≤ 7.0 ns
1
100 ≤ t
< 500 ms
2
< 15 ns
t
3
t
2
t
3
V
CC
R
C
SCOPE
R
V
in
51
B
<< C
C
jd
eb
APPROX. +9.0 V
+4.0 V
DUTY CYCLE ≈ 2.0%
TURN-OFF PULSE
Figure 7. Switching Time Equivalent Circuit
1.0
0.5
t
r
0.3 t
0.2
d
0.1
t, TIME (s)μ
0.05
0.03
0.02
0.01
0.02 0.2 2.00.1
0.03 0.3
0.05
TJ = 25°C V
= 200 V
CC
= 5.0
I
C/IB
0.5 1.0
IC, COLLECTOR CURRENT (AMPS)
5.0
3.0
t
s
2.0
t
1.0
f
0.5
t, TIME (s)μ
0.3
0.2
0.1
0.05
0.02 0.2 2.00.1
0.03
0.05
0.3
, COLLECTOR CURRENT (AMPS)
I
C
Figure 8. Turn−On Resistive Switching Times Figure 9. Resistive Turn−Off Switching Times
TJ = 25°C V
= 200 V
CC
= 5.0
I
C/IB
0.5 1.0
INPUT
Test Circuit Voltage and Current Waveforms
tw ≈ 3 ms
V
MONITOR
CE
INPUT
R
=
MJE171
BB1
150 W
50
50
= 10 V
V
BB1
R 100 W
+
-
BB2
=
V 0
BB2
TUT
=
100 mH
+
VCC = 20 V
-
MONITOR
I
C
R
=
S
0.1 W
VOLTAGE
COLLECTOR CURRENT
COLLECTOR VOLTAGE
0 V
-5 V
0.63 A
0 V
V
CER
(SEE NOTE 1)
100 ms
10 V
V
CE(sat)
Figure 10. Inductive Load Switching
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Page 5
L3
L4
b2
e
E
b3
4
12 3
A
B
D
b
0.005 (0.13) C
DETAIL A
M
MJD5731
PACKAGE DIMENSIONS
DPAK
CASE 369C−01
ISSUE D
C
A
c2
H
c
GAUGE
L2
PLANE
L
L1
DETAIL A
ROTATED 90 CW5
SOLDERING FOOTPRINT*
6.20
0.244
2.58
0.101
A1
H
3.0
0.118
C
Z
SEATING PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. THERMAL PAD CONTOUR OPTIONAL WITHIN DI­MENSIONS b3, L3 and Z.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.006 INCHES PER SIDE.
5. DIMENSIONS D AND E ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY.
6. DATUMS A AND B ARE DETERMINED AT DATUM PLANE H.
DIM MIN MAX MIN MAX
A 0.086 0.094 2.18 2.38
A1 0.000 0.005 0.00 0.13
b 0.025 0.035 0.63 0.89 b2 0.030 0.045 0.76 1.14 b3 0.180 0.215 4.57 5.46
c 0.018 0.024 0.46 0.61 c2 0.018 0.024 0.46 0.61
D 0.235 0.245 5.97 6.22
E 0.250 0.265 6.35 6.73
e 0.090 BSC 2.29 BSC
H 0.370 0.410 9.40 10.41
L 0.055 0.070 1.40 1.78 L1 0.108 REF 2.74 REF L2 0.020 BSC 0.51 BSC L3 0.035 0.050 0.89 1.27 L4 −−− 0.040 −−− 1.01
Z 0.155 −−− 3.93 −−−
STYLE 1:
PIN 1. BASE
2. COLLECTOR
3. EMITTER
4. COLLECTOR
MILLIMETERSINCHES
5.80
0.228
1.6
0.063
SCALE 3:1
6.172
0.243
ǒ
inches
mm
Ǔ
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
SWITCHMODE is a trademark of Semiconductor Components Industries, LLC (SCILLC).
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MJD5731/D
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