Designed for general purpose amplifier and low speed switching
applications.
Features
• Lead Formed for Surface Mount Applications in Plastic Sleeves
(No Suffix)
• Straight Lead Version in Plastic Sleeves (“1” Suffix)
• Electrically Similar to Popular TIP41 and TIP42 Series
• Epoxy Meets UL 94 V−0 @ 0.125 in
• ESD Ratings: Human Body Model, 3B u 8000 V
Machine Model, C u 400 V
• These are Pb−Free Packages
MAXIMUM RATINGS
RatingSymbolMaxUnit
Collector−Emitter VoltageV
Collector−Base VoltageV
Emitter−Base VoltageV
Collector Current− Continuous
Base CurrentI
Total Power Dissipation @ TC = 25°C
Derate above 25°C
Total Power Dissipation (Note 1)
@ T
= 25°C
A
Derate above 25°C
Operating and Storage Junction
Temperature Range
− Peak
TJ, T
CEO
CB
EB
I
C
B
P
D
P
D
stg
100Vdc
100Vdc
5Vdc
6
10
2Adc
20
0.16
1.75
0.014
−65 to +150°C
Adc
W/°C
W/°C
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SILICON
POWER TRANSISTORS
6 AMPERES
100 VOLTS, 20 WATTS
MARKING
DIAGRAMS
4
AYWW
2
1
3
1
2
3
W
A= Assembly Location
W
Y= Year
WW = Work Week
J4xC = Device Code
G=Pb−Free Package
DPAK
CASE 369C
STYLE 1
4
DPAK−3
CASE 369D
STYLE 1
x = 1 or 2
J4xCG
AYWW
J4xCG
THERMAL CHARACTERISTICS
CharacteristicSymbolMaxUnit
Thermal Resistance, Junction−to−Case
Thermal Resistance, Junction−to−Ambient
(Note 1)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. These ratings are applicable when surface mounted on the minimum pad
sizes recommended.
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
MJD41C/D
Page 2
MJD41C (NPN) MJD42C (PNP)
ELECTRICAL CHARACTERISTICS (T
= 25_C unless otherwise noted)
C
Characteristic
OFF CHARACTERISTICS
Collector−Emitter Sustaining Voltage (Note 2)
= 30 mAdc, IB = 0)
(I
C
Collector Cutoff Current
= 60 Vdc, IB = 0)
(V
CE
Collector Cutoff Current
= 100 Vdc, VEB = 0)
(V
CE
Emitter Cutoff Current
= 5 Vdc, IC = 0)
(V
BE
ON CHARACTERISTICS (Note 2)
DC Current Gain
(IC = 0.3 Adc, VCE = 4 Vdc)
(I
= 3 Adc, VCE = 4 Vdc)
C
Collector−Emitter Saturation Voltage
(IC = 6 Adc, IB = 600 mAdc)
Base−Emitter On Voltage
(I
= 6 Adc, VCE = 4 Vdc)
C
DYNAMIC CHARACTERISTICS
Current Gain − Bandwidth Product (Note 3)
(IC = 500 mAdc, VCE = 10 Vdc, f
= 1 MHz)
test
Small−Signal Current Gain
(IC = 0.5 Adc, VCE = 10 Vdc, f = 1 kHz)
2. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2%.
3. f
= ⎪hfe⎪• f
T
test
.
Symbol
V
CEO(sus)
I
CEO
I
CES
I
EBO
h
FE
V
CE(sat)
V
BE(on)
f
T
h
fe
Min
100
−
−
−
30
15
−
−
3
20
Max
−
50
10
0.5
−
75
1.5
2
−
−
Unit
Vdc
mAdc
mAdc
mAdc
−
Vdc
Vdc
MHz
−
ORDERING INFORMATION
DevicePackage TypePackageShipping
MJD41CRLGDPAK
(Pb−Free)
MJD41CT4GDPAK
(Pb−Free)
369C
1800 / Tape & Reel
2500 / Tape & Reel
MJD42CGDPAK
(Pb−Free)
MJD42C1GDPAK−3
(Pb−Free)
MJD42CRLGDPAK
(Pb−Free)
MJD42CT4GDPAK
(Pb−Free)
369D
369C
75 Units / Rail
1800 / Tape & Reel
2500 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
†
http://onsemi.com
2
Page 3
, POWER DISSIPATION (WATTS)
D
P
2.5
1.5
0.5
MJD41C (NPN) MJD42C (PNP)
TYPICAL CHARACTERISTICS
T
T
C
A
25
20
2
+11 V
15
TA SURFACE MOUNT
10
1
T
C
0
tr, tf ≤ 10 ns
DUTY CYCLE = 1%
5
0
0
25
5075100125150
T, TEMPERATURE (°C)
25 ms
R
B
-9 V
51
-4 V
RB and RC VARIED TO OBTAIN DESIRED CURRENT LEVELS
D
MUST BE FAST RECOVERY TYPE, e.g.:
1
MSB5300 USED ABOVE I
MSD6100 USED BELOW I
≈ 100 mA
B
≈ 100 mA
B
REVERSE ALL POLARITIES FOR PNP.
V
CC
+30 V
R
C
SCOPE
D
1
Figure 1. Power Derating
500
300
200
100
70
TJ = 150°C
25°C
50
30
, DC CURRENT GAIN
20
FE
h
-55°C
10
7
5
0.06
0.1
0.31
0.20.44
I
, COLLECTOR CURRENT (AMP)
C
Figure 3. DC Current Gain
2
TJ = 25°C
1.6
1.2
V
0.8
V, VOLTAGE (VOLTS)
0.4
0
0.060.20.440.31
@ IC/IB = 10
CE(sat)
VBE @ VCE = 4 V
V
BE(sat)
0.1
@ IC/IB = 10
IC, COLLECTOR CURRENT (AMP)
Figure 2. Switching Time Test Circuit
2
VCE = 2 V
1
0.7
0.5
0.3
0.2
t
r
t, TIME (s)μ
0.1
0.07
0.05
0.03
0.02
0.626
0.060.20.441
0.1
I
, COLLECTOR CURRENT (AMP)
C
0.626
Figure 4. Turn−On Time
5
3
2
t
1
0.7
0.5
t, TIME (s)μ
0.3
0.2
0.1
0.07
0.6260.060.20.441
3
0.05
0.1
s
t
f
0.62
IC, COLLECTOR CURRENT (AMP)
td @ V
TJ = 25°C
V
= 30 V
CC
= 10
I
C/IB
≈ 5 V
BE(off)
TJ = 25°C
V
= 30 V
CC
= 10
I
C/IB
I
= I
B1
B2
6
Figure 5. “On” VoltagesFigure 6. Turn−Off Time
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3
Page 4
MJD41C (NPN) MJD42C (PNP)
0
0
2
TJ = 25°C
1.6
2.5 A
IB, BASE CURRENT (mA)
5 A
1000500300200100503020
, COLLECTOR-EMITTER VOLTAGE (VOLTS)
CE
V
1.2
0.8
0.4
IC = 1 A
0
10
Figure 7. Collector Saturation Region
1
0.7
D = 0.5
0.5
0.3
0.2
0.1
0.07
0.05
0.03
RESISTANCE (NORMALIZED)
0.02
r(t), EFFECTIVE TRANSIENT THERMAL
0.01
0.2
0.1
0.05
0.02
SINGLE PULSE
0.010.051251020501002005000.10.50.2100
0.01
0.030.33303000.02
300
200
100
70
C, CAPACITANCE (pF)
50
30
0.5
R
= r(t) R
q
JC(t)
R
q
JC
D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t
T
J(pk)
t, TIME (ms)
q
- TC = P
JC
1
(pk) qJC(t)
= 6.25°C/W MAX
C
ib
C
ob
131030
252050
VR, REVERSE VOLTAGE (VOLTS)
Figure 8. Capacitance
P
(pk)
t
1
t
2
DUTY CYCLE, D = t1/t
TJ = 25°C
2
10
5
3
2
1
0.5
0.3
0.1
0.05
, COLLECTOR CURRENT (AMP)
C
I
0.03
0.01
500ms
dc
5ms
WIRE BOND LIMIT
THERMAL LIMIT
CURVES APPLY BELOW RATED V
TC = 25°C SINGLE PULSE
T
J
SECOND BREAKDOWN LIMIT
CEO
= 150°C
V
, COLLECTOR-EMITTER VOLTAGE (VOLTS)
CE
Figure 10. Maximum Forward Bias
Safe Operating Area
MJD41C, 42C
Figure 9. Thermal Response
100ms
1ms
There are two limitations on the power handling ability of
a transistor: average junction temperature and second
breakdown. Safe operating area curves indicate I
limits of the transistor that must be observed for reliable
operation; i.e., the transistor must not be subjected to greater
dissipation than the curves indicate.
The data of Figure 10 is based on T
variable depending on conditions. Second breakdown pulse
limits are valid for duty cycles to 10% provided
T
v 150_C. T
J(pk)
Figure 9. At high case temperatures, thermal limitations will
reduce the power that can be handled to values less than the
5030201075321
70
10
http://onsemi.com
limitations imposed by second breakdown.
4
= 150_C; TC is
J(pk)
may be calculated from the data in
J(pk)
C
− V
CE
Page 5
L3
L4
b2
e
E
b3
4
12 3
A
B
D
b
0.005 (0.13)C
MJD41C (NPN) MJD42C (PNP)
PACKAGE DIMENSIONS
DPAK
CASE 369C−01
ISSUE D
C
A
c2
DETAIL A
c
M
H
GAUGE
L2
PLANE
L
L1
DETAIL A
ROTATED 90 CW5
A1
SOLDERING FOOTPRINT*
6.20
0.244
2.58
0.101
0.118
H
C
3.0
Z
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. THERMAL PAD CONTOUR OPTIONAL WITHIN DIMENSIONS b3, L3 and Z.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL
NOT EXCEED 0.006 INCHES PER SIDE.
5. DIMENSIONS D AND E ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY.
6. DATUMS A AND B ARE DETERMINED AT DATUM
PLANE H.
DIM MINMAXMIN MAX
A 0.086 0.0942.182.38
A1 0.000 0.0050.000.13
b 0.025 0.0350.630.89
b2 0.030 0.0450.761.14
b3 0.180 0.2154.575.46
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
5
Page 6
MJD41C (NPN) MJD42C (PNP)
PACKAGE DIMENSIONS
DPAK−3
CASE 369D−01
ISSUE B
V
S
−T−
SEATING
PLANE
F
B
R
4
123
G
A
K
3 PL
D
0.13 (0.005)T
C
E
J
H
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM MINMAXMIN MAX
Z
A 0.235 0.2455.976.35
B 0.250 0.2656.356.73
C 0.086 0.0942.192.38
D 0.027 0.0350.690.88
E 0.018 0.0230.460.58
F 0.037 0.0450.941.14
0.090 BSC2.29 BSC
G
H 0.034 0.0400.871.01
J 0.018 0.0230.460.58
K 0.350 0.3808.899.65
R 0.180 0.2154.455.45
S 0.025 0.0400.631.01
V 0.035 0.0500.891.27
Z 0.155−−−3.93−−−
STYLE 1:
PIN 1. BASE
2. COLLECTOR
3. EMITTER
4. COLLECTOR
MILLIMETERSINCHES
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
http://onsemi.com
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MJD41C/D
6
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