Datasheet mjd41c_mjd42c Datasheet

Page 1
MJD41C (NPN) MJD42C (PNP)
Complementary Power Transistors
Designed for general purpose amplifier and low speed switching
applications.
Features
• Lead Formed for Surface Mount Applications in Plastic Sleeves
(No Suffix)
• Straight Lead Version in Plastic Sleeves (“1” Suffix)
• Electrically Similar to Popular TIP41 and TIP42 Series
• Epoxy Meets UL 94 V−0 @ 0.125 in
• ESD Ratings: Human Body Model, 3B u 8000 V
Machine Model, C u 400 V
• These are Pb−Free Packages
MAXIMUM RATINGS
Rating Symbol Max Unit
Collector−Emitter Voltage V
Collector−Base Voltage V
Emitter−Base Voltage V
Collector Current − Continuous
Base Current I
Total Power Dissipation @ TC = 25°C
Derate above 25°C
Total Power Dissipation (Note 1)
@ T
= 25°C
A
Derate above 25°C
Operating and Storage Junction
Temperature Range
− Peak
TJ, T
CEO
CB
EB
I
C
B
P
D
P
D
stg
100 Vdc
100 Vdc
5 Vdc
6
10
2 Adc
20
0.16
1.75
0.014
−65 to +150 °C
Adc
W/°C
W/°C
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SILICON
POWER TRANSISTORS
6 AMPERES
100 VOLTS, 20 WATTS
MARKING
DIAGRAMS
4
AYWW
2
1
3
1
2
3
W
A = Assembly Location
W
Y = Year WW = Work Week J4xC = Device Code
G=Pb−Free Package
DPAK
CASE 369C
STYLE 1
4
DPAK−3
CASE 369D
STYLE 1
x = 1 or 2
J4xCG
AYWW J4xCG
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction−to−Case
Thermal Resistance, Junction−to−Ambient (Note 1)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
1. These ratings are applicable when surface mounted on the minimum pad sizes recommended.
© Semiconductor Components Industries, LLC, 2011
January, 2011 − Rev. 9
R
q
JC
R
q
JA
6.25 °C/W
71.4 °C/W
1 Publication Order Number:
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet.
MJD41C/D
Page 2
MJD41C (NPN) MJD42C (PNP)
ELECTRICAL CHARACTERISTICS (T
= 25_C unless otherwise noted)
C
Characteristic
OFF CHARACTERISTICS
Collector−Emitter Sustaining Voltage (Note 2)
= 30 mAdc, IB = 0)
(I
C
Collector Cutoff Current
= 60 Vdc, IB = 0)
(V
CE
Collector Cutoff Current
= 100 Vdc, VEB = 0)
(V
CE
Emitter Cutoff Current
= 5 Vdc, IC = 0)
(V
BE
ON CHARACTERISTICS (Note 2)
DC Current Gain
(IC = 0.3 Adc, VCE = 4 Vdc) (I
= 3 Adc, VCE = 4 Vdc)
C
Collector−Emitter Saturation Voltage
(IC = 6 Adc, IB = 600 mAdc)
Base−Emitter On Voltage
(I
= 6 Adc, VCE = 4 Vdc)
C
DYNAMIC CHARACTERISTICS
Current Gain − Bandwidth Product (Note 3)
(IC = 500 mAdc, VCE = 10 Vdc, f
= 1 MHz)
test
Small−Signal Current Gain
(IC = 0.5 Adc, VCE = 10 Vdc, f = 1 kHz)
2. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2%.
3. f
= ⎪hfe⎪• f
T
test
.
Symbol
V
CEO(sus)
I
CEO
I
CES
I
EBO
h
FE
V
CE(sat)
V
BE(on)
f
T
h
fe
Min
100
−
−
−
30 15
−
−
3
20
Max
−
50
10
0.5
−
75
1.5
2
−
−
Unit
Vdc
mAdc
mAdc
mAdc
−
Vdc
Vdc
MHz
−
ORDERING INFORMATION
Device Package Type Package Shipping
MJD41CRLG DPAK
(Pb−Free)
MJD41CT4G DPAK
(Pb−Free)
369C
1800 / Tape & Reel
2500 / Tape & Reel
MJD42CG DPAK
(Pb−Free)
MJD42C1G DPAK−3
(Pb−Free)
MJD42CRLG DPAK
(Pb−Free)
MJD42CT4G DPAK
(Pb−Free)
369D
369C
75 Units / Rail
1800 / Tape & Reel
2500 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
†
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2
Page 3
, POWER DISSIPATION (WATTS)
D
P
2.5
1.5
0.5
MJD41C (NPN) MJD42C (PNP)
TYPICAL CHARACTERISTICS
T
T
C
A
25
20
2
+11 V
15
TA SURFACE MOUNT
10
1
T
C
0
tr, tf ≤ 10 ns
DUTY CYCLE = 1%
5
0
0
25
50 75 100 125 150
T, TEMPERATURE (°C)
25 ms
R
B
-9 V
51
-4 V
RB and RC VARIED TO OBTAIN DESIRED CURRENT LEVELS D
MUST BE FAST RECOVERY TYPE, e.g.:
1
MSB5300 USED ABOVE I MSD6100 USED BELOW I
≈ 100 mA
B
≈ 100 mA
B
REVERSE ALL POLARITIES FOR PNP.
V
CC
+30 V
R
C
SCOPE
D
1
Figure 1. Power Derating
500
300 200
100
70
TJ = 150°C
25°C
50
30
, DC CURRENT GAIN
20
FE
h
-55°C
10
7 5
0.06
0.1
0.3 1
0.2 0.4 4
I
, COLLECTOR CURRENT (AMP)
C
Figure 3. DC Current Gain
2
TJ = 25°C
1.6
1.2
V
0.8
V, VOLTAGE (VOLTS)
0.4
0
0.06 0.2 0.4 40.3 1
@ IC/IB = 10
CE(sat)
VBE @ VCE = 4 V
V
BE(sat)
0.1
@ IC/IB = 10
IC, COLLECTOR CURRENT (AMP)
Figure 2. Switching Time Test Circuit
2
VCE = 2 V
1
0.7
0.5
0.3
0.2
t
r
t, TIME (s)μ
0.1
0.07
0.05
0.03
0.02
0.6 2 6
0.06 0.2 0.4 41
0.1
I
, COLLECTOR CURRENT (AMP)
C
0.6 2 6
Figure 4. Turn−On Time
5
3 2
t
1
0.7
0.5
t, TIME (s)μ
0.3
0.2
0.1
0.07
0.6 2 6 0.06 0.2 0.4 41
3
0.05
0.1
s
t
f
0.6 2
IC, COLLECTOR CURRENT (AMP)
td @ V
TJ = 25°C V
= 30 V
CC
= 10
I
C/IB
≈ 5 V
BE(off)
TJ = 25°C V
= 30 V
CC
= 10
I
C/IB
I
= I
B1
B2
6
Figure 5. “On” Voltages Figure 6. Turn−Off Time
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Page 4
MJD41C (NPN) MJD42C (PNP)
0
0
2
TJ = 25°C
1.6
2.5 A
IB, BASE CURRENT (mA)
5 A
1000500300200100503020
, COLLECTOR-EMITTER VOLTAGE (VOLTS)
CE
V
1.2
0.8
0.4
IC = 1 A
0
10
Figure 7. Collector Saturation Region
1
0.7 D = 0.5
0.5
0.3
0.2
0.1
0.07
0.05
0.03
RESISTANCE (NORMALIZED)
0.02
r(t), EFFECTIVE TRANSIENT THERMAL
0.01
0.2
0.1
0.05
0.02
SINGLE PULSE
0.01 0.05 1 2 5 10 20 50 100 200 5000.1 0.50.2 100
0.01
0.03 0.3 3 30 3000.02
300
200
100
70
C, CAPACITANCE (pF)
50
30
0.5
R
= r(t) R
q
JC(t)
R
q
JC
D CURVES APPLY FOR POWER PULSE TRAIN SHOWN READ TIME AT t T
J(pk)
t, TIME (ms)
q
- TC = P
JC
1
(pk) qJC(t)
= 6.25°C/W MAX
C
ib
C
ob
1 3 10 30
2 5 20 50
VR, REVERSE VOLTAGE (VOLTS)
Figure 8. Capacitance
P
(pk)
t
1
t
2
DUTY CYCLE, D = t1/t
TJ = 25°C
2
10
5 3
2
1
0.5
0.3
0.1
0.05
, COLLECTOR CURRENT (AMP)
C
I
0.03
0.01
500ms
dc
5ms
WIRE BOND LIMIT THERMAL LIMIT
CURVES APPLY BELOW RATED V
TC = 25°C SINGLE PULSE T
J
SECOND BREAKDOWN LIMIT
CEO
= 150°C
V
, COLLECTOR-EMITTER VOLTAGE (VOLTS)
CE
Figure 10. Maximum Forward Bias
Safe Operating Area
MJD41C, 42C
Figure 9. Thermal Response
100ms
1ms
There are two limitations on the power handling ability of a transistor: average junction temperature and second breakdown. Safe operating area curves indicate I limits of the transistor that must be observed for reliable operation; i.e., the transistor must not be subjected to greater dissipation than the curves indicate.
The data of Figure 10 is based on T variable depending on conditions. Second breakdown pulse limits are valid for duty cycles to 10% provided T
v 150_C. T
J(pk)
Figure 9. At high case temperatures, thermal limitations will reduce the power that can be handled to values less than the
5030201075321
70
10
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limitations imposed by second breakdown.
4
= 150_C; TC is
J(pk)
may be calculated from the data in
J(pk)
C
− V
CE
Page 5
L3
L4
b2
e
E
b3
4
12 3
A
B
D
b
0.005 (0.13) C
MJD41C (NPN) MJD42C (PNP)
PACKAGE DIMENSIONS
DPAK
CASE 369C−01
ISSUE D
C
A
c2
DETAIL A
c
M
H
GAUGE
L2
PLANE
L
L1
DETAIL A
ROTATED 90 CW5
A1
SOLDERING FOOTPRINT*
6.20
0.244
2.58
0.101
0.118
H
C
3.0
Z
SEATING PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. THERMAL PAD CONTOUR OPTIONAL WITHIN DI­MENSIONS b3, L3 and Z.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.006 INCHES PER SIDE.
5. DIMENSIONS D AND E ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY.
6. DATUMS A AND B ARE DETERMINED AT DATUM PLANE H.
DIM MIN MAX MIN MAX
A 0.086 0.094 2.18 2.38
A1 0.000 0.005 0.00 0.13
b 0.025 0.035 0.63 0.89 b2 0.030 0.045 0.76 1.14 b3 0.180 0.215 4.57 5.46
c 0.018 0.024 0.46 0.61 c2 0.018 0.024 0.46 0.61
D 0.235 0.245 5.97 6.22 E 0.250 0.265 6.35 6.73
e 0.090 BSC 2.29 BSC
H 0.370 0.410 9.40 10.41
L 0.055 0.070 1.40 1.78 L1 0.108 REF 2.74 REF L2 0.020 BSC 0.51 BSC L3 0.035 0.050 0.89 1.27 L4 −−− 0.040 −−− 1.01
Z 0.155 −−− 3.93 −−−
STYLE 1:
PIN 1. BASE
2. COLLECTOR
3. EMITTER
4. COLLECTOR
MILLIMETERSINCHES
5.80
0.228
1.6
0.063
SCALE 3:1
6.172
0.243
ǒ
inches
mm
Ǔ
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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5
Page 6
MJD41C (NPN) MJD42C (PNP)
PACKAGE DIMENSIONS
DPAK−3
CASE 369D−01
ISSUE B
V
S
−T−
SEATING PLANE
F
B
R
4
123
G
A
K
3 PL
D
0.13 (0.005) T
C
E
J
H
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM MIN MAX MIN MAX
Z
A 0.235 0.245 5.97 6.35 B 0.250 0.265 6.35 6.73 C 0.086 0.094 2.19 2.38 D 0.027 0.035 0.69 0.88 E 0.018 0.023 0.46 0.58 F 0.037 0.045 0.94 1.14
0.090 BSC 2.29 BSC
G
H 0.034 0.040 0.87 1.01 J 0.018 0.023 0.46 0.58 K 0.350 0.380 8.89 9.65 R 0.180 0.215 4.45 5.45 S 0.025 0.040 0.63 1.01 V 0.035 0.050 0.89 1.27 Z 0.155 −−− 3.93 −−−
STYLE 1:
PIN 1. BASE
2. COLLECTOR
3. EMITTER
4. COLLECTOR
MILLIMETERSINCHES
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MJD41C/D
6
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