Datasheet MII200-12A4, MID200-12A4, MDI200-12A4 Datasheet (IXYS)

Page 1
© 2000 IXYS All rights reserved
1 - 4
IGBT Modules
Short Circuit SOA Capability Square RBSOA
MII 200-12 A4 MID 200-12 A4
MDI 200-12 A4
CES
TJ= 25°C to 150°C 1200 V
V
CGR
TJ= 25°C to 150°C; RGE = 20 kW 1200 V
V
GES
Continuous ±20 V
V
GEM
Transient ±30 V
I
C25
TC= 25°C 270 A
I
C80
TC= 80°C 180 A
I
CM
TC= 80°C, tp = 1 ms 360 A
t
SC
VGE = ±15 V, VCE = V
CES
, TJ = 125°C10ms
(SCSOA) RG= 6.8 W, non repetitive RBSOA VGE= ±15 V, TJ = 125°C, RG = 6.8 W ICM = 360 A
Clamped inductive load, L = 100 mHV
CEK
< V
CES
P
tot
TC= 25°C 1130 W
T
J
150 °C
T
stg
-40 ... +150 °C
V
ISOL
50/60 Hz, RMS t = 1 min 4000 V~ I
ISOL
£ 1 mA t = 1 s 4800 V~
Insulating material: Al2O
3
M
d
Mounting torque (module) 2.25-2.75 Nm
20-25 lb.in.
(teminals) 2.5-3.7 Nm
22-33 lb.in.
d
S
Creepage distance on surface 1 0 mm
d
A
Strike distance through air 9.6 mm
a Max. allowable acceleration 50 m/s
2
Weight Typical 250 g
8.8 oz.
Data according to a single IGBT/FRED unless otherwise stated.
8
9
1
2
3
11
10
10
11
9
8
2
1
3
MII
2
1
3
10
11
MID
2
1
3
9
8
MDI
E 72873
I
C25
= 270 A
V
CES
= 1200 V
V
CE(sat) typ.
= 2.2 V
Features
NPT IGBT technology
low saturation voltage
low switching losses
switching frequency up to 30 kHz
square RBSOA, no latch up
high short circuit capability
positive temperature coefficient for easy parallelling
MOS input, voltage controlled
ultra fast free wheeling diodes
package with DCB ceramic base plate
isolation voltage 4800 V
UL registered E72873
Advantages
space and weight savings
reduced protection circuits
Typical Applications
AC and DC motor control
AC servo and robot drives
power supplies
welding inverters
030
Page 2
© 2000 IXYS All rights reserved
2 - 4
MII 200-12 A4 MID 200-12 A4
MDI 200-12 A4
Symbol Conditions Characteristic Values
(TJ = 25°C, unless otherwise specified)
min. typ. max.
V
(BR)CES
VGE = 0 V 1200 V
V
GE(th)
IC = 6 mA, VCE = V
GE
4.5 6.5 V
I
CES
VCE= V
CES
TJ = 25°C10mA TJ = 125°C15mA
I
GES
VCE= 0 V, VGE = ±20 V ±700 nA
V
CE(sat)
IC = 150 A, VGE = 15 V 2.2 2.7 V
C
ies
11 nF
C
oes
VCE = 25 V, VGE = 0 V, f = 1 MHz 1.5 nF
C
res
0.65 nF
t
d(on)
100 ns
t
r
50 ns
t
d(off)
650 ns
t
f
50 ns
E
on
24.2 mJ
E
off
21 mJ
R
thJC
0.11 K/W
R
thJS
with heatsink compound 0.22 K/W
Reverse Diode (FRED) Characteristic Values
(T
J
= 25°C, unless otherwise specified)
min. typ. max.
V
F
IF = 150 A, VGE = 0 V, 2.2 2.5 V IF = 150 A, VGE = 0 V, TJ = 125°C 1.8 1.9 V
I
F
TC = 25°C 300 A TC = 80°C 200 A
I
RM
IF = 150 A, VGE = 0 V, -diF/dt = 1200 A/ms 125 A
t
rr
TJ = 125°C, VR = 600 V 200 ns
R
thJC
0.23 K/W
R
thJS
with heatsink compound 0.45 K/W
Inductive load, TJ = 125°C
I
C
= 150 A, VGE = ±15 V
VCE = 600 V, RG = 6.8 W
Dimensions in mm (1 mm = 0.0394")
Equivalent Circuits for Simulation
Conduction
IGBT (typ. at VGE = 15 V; TJ = 125°C)
V0 = 1.5 V; R0 = 7.0 mW
Free Wheeling Diode (typ. at TJ = 125°C)
V0 = 1.3 V; R0 = 3.4 mW
Thermal Response
IGBT (typ.)
C
th1
= 0.40 J/K; R
th1
= 0.110 K/W
C
th2
= 0.93 J/K; R
th2
= 0.003 K/W
Free Wheeling Diode (typ.)
C
th1
= 0.28 J/K; R
th1
= 0.226 K/W
C
th2
= 0.51 J/K; R
th2
= 0.005 K/W
Page 3
© 2000 IXYS All rights reserved
3 - 4
0 200 400 600 800 1000
0
20
40
60
80
100
0
50
100
150
200
250
01234
0
100
200
300
400
500
600
0.0 0.5 1.0 1.5 2.0 2.5 3.0
0
50
100
150
200
250
300
350
0 200 400 600 800
0
5
10
15
20
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
0
50
100
150
200
250
300
350
13V
11V
TJ = 25°C
VGE=17V
T
J
= 125°C
VCE = 600V I
C
= 150A
15V
567891011
0
50
100
150
200
250
300
350
13V 11V
VGE=17V
15V
VCE = 20V T
J
= 25°C
9V
9V
V
CE
V
A
I
C
V
CE
A
I
C
V
V
V
V
GE
V
F
A
I
C
A
I
F
nC
Q
G
-di/dt
V
V
GE
A
I
RM
t
rr
ns
A/ms
200-12
TJ = 125°C V
R
= 600V
I
F
= 150A
TJ = 25°C
T
J
= 125°C
I
RM
t
rr
Fig. 1 Typ. output characteristics Fig. 2 Typ. output characteristics
Fig. 3 Typ. transfer characteristics Fig. 4 Typ. forward characteristics of
free wheeling diode
Fig. 5 Typ. turn on gate charge Fig. 6 Typ. turn off characteristics of
free wheeling diode
MII 200-12 A4 MID 200-12 A4
MDI 200-12 A4
Page 4
© 2000 IXYS All rights reserved
4 - 4
Fig. 7 Typ. turn on energy and switching Fig. 8 Typ. turn off energy and switching
times versus collector current times versus collector current
Fig. 9 Typ. turn on energy and switching Fig.10 Typ. turn off energy and switching
times versus gate resistor times versus gate resistor
Fig. 11 Reverse biased safe operating area Fig. 12 Typ. transient thermal impedance
RBSOA
0 100 200 300
0
30
60
90
0
40
80
120
0 100 200 300
0
20
40
60
80
0
200
400
600
800
0.00001 0.0001 0.001 0.01 0.1 1
0.00001
0.0001
0.001
0.01
0.1
1
0 4 8 1216202428
0
10
20
30
40
50
0
400
800
1200
1600
2000
0 4 8 12 16 20 24 28
0
10
20
30
40
50
0
40
80
120
160
200
single pulse
VCE = 600V V
GE
= ±15V
R
G
= 6.8
W
TJ = 125°C
200-12
V
CE
= 600V
V
GE
= ±15V
I
C
= 150A
T
J
= 125°C
0 200 400 600 800 1000 1200
0
100
200
300
400
RG = 6.8
W
T
J
= 125°C
V
CEK
< V
CES
VCE = 600V V
GE
= ±15V
R
G
= 6.8
W
TJ = 125°C
E
on
V
CE
= 600V
V
GE
= ±15V
I
C
= 150A
T
J
= 125°C
t
d(on)
t
r
E
off
t
d(off)
t
f
E
on
t
d(on)
t
r
E
off
t
d(off)
t
f
I
C
A
I
C
A
mJ
E
off
mJ
E
on
ns
t
ns
t
R
G
W
R
G
W
V
CE
t
s
mJ
E
on
mJ
E
off
ns
t
ns
t
I
CM
K/W
Z
thJC
IGBT
diode
V
A
MII 200-12 A4 MID 200-12 A4
MDI 200-12 A4
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