Datasheet MIC2193 Datasheet (Micrel)

Page 1
MIC2193 Micrel
V
IN
3.3V
0.012
Si9803 (×2)
3.8µH
2k
120µF
6.3V (×2)
2.2nF
MIC2193BM
VIN VDDCSOUTP
GND
COMP OUTN
FB
V
OUT
1.8V, 5A
Si9804 (×2)
22.6k
10k
220µF
6.3V (×2)
1µF
MIC2193
400kHz SO-8 Synchronous Buck Control IC
General Description
Micrel’s MIC2193 is a high efficiency, PWM synchronous buck control IC housed in the SO-8 package. Its 2.9V to 14V input voltage range allows it to efficiently step down voltages in 3.3V, 5V, and 12V systems as well as 1- or 2-cell Li Ion battery powered applications.
The MIC2193 solution saves valuable board space. The device is housed in the space-saving SO-8 package, whose low pin-count minimizes external components. Its 400kHz PWM operation allows a small inductor and small output capacitors to be used. The MIC2193 can implement all­ceramic capacitor solutions.
The MIC2193 drives a high-side P-channel MOSFET, elimi­nating the need for high-side boot-strap circuitry. This feature allows the MIC2193 to achieve maximum duty cycles of 100%, which can be useful in low headroom applications. A low output driver impedance of 4 allows the MIC2193 to drive large external MOSFETs to generate a wide range of output currents.
The MIC2193 is available in an 8 pin SOIC package with a junction temperature range of –40°C to +125°C.
Features
2.9V to 14V input voltage range
400kHz oscillator frequency
PWM current mode control
100% maximum duty cycle
Front edge blanking
4 output drivers
Cycle-by-cycle current limiting
Frequency foldback short circuit protection
8 lead SOIC package
Applications
Point of load power supplies
Distributed power systems
Wireless Modems
ADSL line cards
Servers
Step down conversion in 3.3V, 5V, and 12V systems
1-and 2-cell Li Ion battery operated equipment
T ypical Application
Adjustable Output Synchronous Buck Converter
Micrel, Inc. • 1849 Fortune Drive • San Jose, CA 95131 • USA • tel + 1 (408) 944-0800 • fax + 1 (408) 474-1000 • http://www.micrel.com
April 2004 1 M9999-042704
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MIC2193 Micrel
Ordering Information
Part Number Voltage Frequency Temperature Range Package Lead Finish
MIC2193BM Adjustable 400KHz –40°C to +125°C 8-lead SOP Standard MIC2193YM Adjustable 400KHz –40°C to +125°C 8-lead SOP Pb-Free
Pin Configuration
COMP
FB
CS
Pin Description
Pin Number Pin Name Pin Function
1 VIN Controller supply voltage. Also the (+) input to the current sense amp. 2 COMP Compensation (Output): Internal error amplifier output. Connect to a
3 FB Feedback Input: The circuit regulates this pin to 1.245V. 4 CS The (–) input to the current limit comparator. A built in offset of 110mV
5 VDD 3V internal linear-regulator output. VDD is also the supply voltage bus for the
6 GND Ground. 7 OUTN High current drive for the synchronous N-channel MOSFET. Voltage swing
8 OUTP High current drive for the high side P-channel MOSFET. Voltage swing is
1VIN 2 3 4
8 OUTP
OUTN
7
GND
6
VDD
5
8 Lead SOIC (M)
capacitor or series RC network to compensate the regulators control loop.
between VIN and CSL in conjunction with the current sense resistor sets the current limit threshold level. This is also the (–) input to the current amplifier.
chip. Bypass to GND with 1µF.
is from ground to VIN. On-resistance is typically 6 at 5VIN.
from ground to VIN. On-resistance is typically 6 at 5VIN.
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MIC2193 Micrel
Absolute Maximum Ratings (Note 1)
Supply Voltage (V
Digital Supply Voltage (VDD) ...........................................7V
Comp Pin Voltage (V
Feedback Pin Voltage (VFB) .......................... –0.3V to +3V
) .....................................................15V
IN
)............................ –0.3V to +3V
COMP
Operating Ratings (Note 2)
Supply Voltage (V
Junction Temperature ....................... –40°C TJ +125°C
Package Thermal Resistance
θJA 8-lead SOP .................................................140°C/W
) .................................... +2.9V to +14V
IN
Current Sense Voltage (VIN – VCS)................ –0.3V to +1V
Power Dissipation (PD) ..................... 285mW @ TA = 85°C
Ambient Storage Temp ............................ –65°C to +150°C
ESD Rating Note 3 ....................................................... 2kV
Electrical Characteristics
VIN = 5V, V
Parameter Condition Min Typ Max Units Regulation
Feedback Voltage Reference (1%) 1.233 1.245 1.257 V
Feedback Bias Current 50 nA Output Voltage Line Regulation 5V ≤ VIN 12V 0.09 % / V Output Voltage Load Regulation 0mV < (VIN – VCS) < 75mV 0.9 % Output Voltage Total Regulation 5V ≤VIN 12V, 0mV < (VIN – VCS) < 75mV (±3%) 1.208 1.282 V
Input & VDD Supply
VIN Input Current (IQ) (excluding external MOSFET gate current) 1 2 mA Digital Supply Voltage (VDD)I Digital Supply Load Regulation IL = 0 to 1mA 0.1 V Undervoltage Lockout VDD upper threshold (turn on threshold) 2.65 V UVLO Hysteresis 100 mV
Current Limit
Current Limit Threshold Voltage V Error Amplifier Error Amplifier Gain 20 V/V
Current Amplifier
Current Amplifier Gain 3.0 V/V
Oscillator Section
Oscillator Frequency (fO) 360 400 440 kHz Maximum Duty Cycle VFB = 1.0V 100 % Minimum On Time VFB = 1.5V 165 ns Frequency Foldback Threshold Measured on FB 0.3 V Frequency Foldback Frequency 90 kHz
= 3.3V, TJ = 25°C, unless otherwise specified. Bold values indicate –40°C<TJ<+125°C.
OUT
(2%) 1.22 1.245 1.27 V
= 0 2.82 3.0 3.18 V
L
– VCS voltage to trip current limit 90 110 130 mV
IN
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MIC2193 Micrel
Parameter Condition Min Typ Max Units Gate Drivers
Rise/Fall Time CL = 3300pF 50 ns Output Driver Impedance Source, VIN = 12V 4 10
Sink, VIN = 12V 4 10
= 5V 6 12
IN
Driver Non-overlap Time V
Source, V Sink, VIN = 5V 6 12
= 12V 50 ns
IN
= 5V 80 ns
V
IN
VIN = 3.3V 160 ns
Note 1. Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply when
Note 2. The device is not guaranteed to function outside its operating rating. Note 3. Devices are ESD sensitive, handling precautions required. Human body model, 1.5k in series with 100pF.
operating the device outside of its operating ratings. The maximum allowable power dissipation is a function of the maximum junction temperature, T
, the junction-to-ambient thermal resistance, θJA, and the ambient temperature, TA.
J(Max)
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MIC2193 Micrel
2.80
2.85
2.90
2.95
3.00
3.05
3.10
3.15
051015
V
DD
(V)
INPUT VOLTAGE (V)
VDDvs. Input Voltage
1.200
1.210
1.220
1.230
1.240
1.250
1.260
1.270
1.280
1.290
1.300
-40 -20 0 20 40 60 80 100 120
REFERENCE VOLTAGE (V)
TEMPERATURE (°C)
Reference Voltage
vs. Temperature
VIN = 5V
90
95
100
105
110
115
120
125
130
02468101214
CURRENT LIMIT THRESHOLD (mV)
INPUT VOLTAGE (V)
Overcurrent Threshold
vs. Input Voltage
0
2
4
6
8
10
12
14
051015
IMPEDANCE (Ω)
INPUT VOLTAGE (V)
OUTN Drive Impedance vs.
Input Voltage
Source (Ω)
Sink (Ω)
Typical Characteristics
Quiescent Current
vs. Supply Voltage
6
5
4
3
2
1
QUIESCENT CURRENT (mA)
0
0 5 10 15
SUPPLY VOLTAGE (V)
VDDvs. Load
0 0.2 0.4 0.6 0.8 1 1.2
VDD LOAD CURRENT (mA)
(V) V
3.10
3.08
3.06
3.04
3.02
3.00
DD
2.98
2.96
2.94
2.92
2.90
VIN = 12V
VIN =5V
VIN = 3.3V
Quiescent Current
vs. Temperature
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
QUIESCENT CURRENT (mA)
0
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (°C)
VDDvs. Temperature
3.50
3.40
3.30
3.20
3.10
3.00
2.90
VDD (V)
2.80
2.70
2.60
2.50
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (°C)
VIN = 5V
VIN = 5V
2.5
2.0
1.5
1.0
0.5 0
-0.5
-1.0
-1.5
FREQUENCY VARIATION (%)
-2.0 0 5 10 15
Current Limit Threshold
120 115 110 105 100
April 2004 5 M9999-042704
95 90 85 80
CURRENT LIMIT THREHOLD (mV)
-40 -20 0 20 40 60 80 100 120
Switching Frequency
vs. Input Voltage
INPUT VOLTAGE (V)
vs. Temperature
VIN = 5V
TEMPERATURE (°C)
Switching Frequency
vs. Temperature
5
0
-5
-10
-15
FREQUENCY VARIATION (%)
-20
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (°C)
OUTN Drive Impedance
vs. Input Voltage
14.0
12.0
10.0
8.0
6.0
4.0
IMPEDANCE (Ω)
2.0
0.0 02468101214
INPUT VOLTAGE (V)
VIN = 5V
Source (Ω)
Sink (Ω)
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MIC2193 Micrel
Functional Diagram
V
IN
VDD 5
C
DECOUP
VDD
VIN
BIAS
C
IN
1
OVERCURRENT
VREF
1.245V
ON
COMPARATOR
CURRENT
SENSE
AMP
VIN
GAIN
R
SENSE
3
CSL4
COMP
fs/4
OSC
COMPARATOR
2
CONTROL
RESET
SLOPE
COMPENSATION
PWM
100k
fs/4
gm = 0.0002 gain = 20
FREQUENCY
FOLDBACK
ERROR
AMP
0.3V
OUTP8
OUTN7
V
REF
FB
3
GND6
Q1
Q2
D1
L1
V
OUT
C
OUT
Figure 1. MIC2193 Block Diagram
Functional Characteristics
Controller Overview and Functional Description
The MIC2193 is a BiCMOS, switched mode, synchronous step down (buck) converter controller. It uses both N- and P­channel MOSFETs, which allows the controller to operate at 100% duty cycle and eliminates the need for a high-side drive boot-strap circuit. Current mode control is used to achieve superior transient line and load regulation. An internal correc­tive ramp provides slope compensation for stable operation above a 50% duty cycle. The controller is optimized for high efficiency, high performance DC-DC converter applications.
Figure 1 is a block diagram of the MIC2193 configured as a synchronous buck converter. At the beginning of the switch-
ing cycle, the OUTP pin pulls low and turns on the high-side P-Channel MOSFET, Q1. Current flows from the input to the output through the current sense resistor, MOSFET, and inductor. The current amplitude increases, controlled by the inductor. The voltage developed across the current sense resistor, R
, is amplified inside the MIC2193 and com-
SENSE
bined with an internal ramp for stability. This signal is com­pared to the output of the error amplifier. When the current signal equals the error voltage signal, the P-channel MOSFET is turned off. The inductor current flows through the diode, D1, until the synchronous, N-channel MOSFET turns on. The voltage drop across the MOSFET is less than the forward voltage drop of the diode, which improves the converter efficiency. At the end of the switching period, the synchro­nous MOSFET is turned off and the switching cycle repeats.
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MIC2193 Micrel
The MIC2193 controller is broken down into five functions.
Control loop
- PWM operation
- Current mode control
Current limit
Reference and V
DD
MOSFET gate drive
Oscillator
Control Loop
PWM Control Loop
The MIC2193 uses current mode control to regulate the output voltage. This dual control loop method (illustrated in Figure 2) senses the output voltage (outer loop) and the inductor current (inner loop). It uses inductor current and output voltage to determine the duty cycle of the buck converter. Sampling the inductor current effectively removes the inductor from the control loop, which simplifies compen­sation.
V
IN
Switching
Converter
Switch Driver
I
INDUCTOR
V
ERROR
t
ON
t
PER
V
ERROR
D = tON/t
PER
I
INDUCTOR
V
REF
V
OUT
Voltage
Divider
Figure 2. Current Mode Control Example
As shown in Figure 1, the inductor current is sensed by measuring the voltage across the resistor, R
SENSE
. A ramp is added to the amplified current sense signal to provide slope compensation, which is required to prevent unstable opera­tion at duty cycles greater than 50%.
A transconductance amplifier is used for the error amplifier, which compares an attenuated sample of the output voltage with a reference voltage. The output of the error amplifier is the compensation pin (COMP), which is compared to the current sense waveform in the PWM block. When the current signal becomes greater than the error signal, the comparator turns off the high-side drive. The COMP pin provides access to the output of the error amplifier and allows the use of external components to stabilize the voltage loop.
Current Limit
The output current is detected by the voltage drop across the external current sense resistor (R
in Figure 1.). The
SENSE
current sense resistor must be sized using the minimum current limit threshold. The external components must be designed to withstand the maximum current limit. The current sense resistor value is calculated by the equation below:
MIN CURRENT SENSE THRESHOLD
R
SENSE
___
=
I
_
OUT MAX
The maximum output current is:
MAX CURRENT SENSE THRESHOLD
I
OUT MAX
_
___
=
R
SENSE
The current sense pins VIN (pin 1) and CSL (pin 4) are noise sensitive due to the low signal level and high input impedance and switching noise on the VIN pin. The PCB traces should be short and routed close to each other. A 10nF capacitor across the pins will attenuate high frequency switching noise.
When the peak inductor current exceeds the current limit threshold, the overcurrent comparator turns off the high side MOSFET for the remainder of the switching cycle, effectively decreasing the duty cycle. The output voltage drops as additional load current is pulled from the converter. When the voltage at the feedback pin (FB) reaches approximately 0.3V, the circuit enters frequency foldback mode and the oscillator frequency will drop to approximately 1/4 of the switching frequency. This limits the maximum output power delivered to the load under a short circuit condition.
Reference and V
Circuits
DD
The output drivers are enabled when the VDD voltage (pin 5) is greater than its undervoltage threshold.
The internal bias circuit generates an internal 1.245V band­gap reference voltage for the voltage error amplifier and a 3V VDD voltage for the internal control circuitry. The VDD pin must be decoupled with a 1µF ceramic capacitor. The capaci­tor must be placed close to the VDD pin. The other end of the capacitor must be connected directly to the ground plane.
MOSFET Gate Drive
The MIC2193 is designed to drive a high-side, P-Channel MOSFET and a low side, N-Channel MOSFET. The source pin of the P-channel MOSFET is connected to the input of the power supply. It is turned on when OUTP pulls the gate of the MOSFET low. The advantage of using a P-channel MOSFET is that it does not required a bootstrap circuit to boost the gate voltage higher than the input, as would be required for an N­channel MOSFET.
The VIN pin (pin 1) supplies the drive voltage to both gate drive pins, OUTN and OUTP. The VIN pin must be well decoupled to prevent noise from affecting the current sense circuit, which uses VIN as one of the sense pins.
A non-overlap time is built into the MOSFET driver circuitry. This dead time prevents the high-side and low-side MOSFET drivers from being on at the same time. Either an external diode or the low-side MOSFET internal parasitic diode con­ducts the inductor current during the dead time.
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MIC2193 Micrel
MOSFET Selection
The P-channel MOSFET must have a VGS threshold voltage equal to or lower than the input voltage when used in a buck converter topology. There is a limit to the maximum gate charge the MIC2193 will drive. MOSFETs with higher gate charge will have slower turn-on and turn-off times. Slower transition times will cause higher power dissipation in the MOSFETs due to higher switching transition losses. The MOSFETs must be able to completely turn on and off within the driver non-overlap time If both MOSFETs are conducting at the same time, shoot-through will occur, which greatly increases power dissipation in the MOSFETs and reduces converter efficiency.
The MOSFET gate charge is also limited by power dissipation in the MIC2193. The power dissipated by the gate drive circuitry is calculated below:
P
GATE_DRIVE
= Q
GATE
× VIN × f
S
where:
Q
is the total gate charge of both the N and P-
GATE
channel MOSFETs. fS is the switching frequency VIN is the gate drive voltage
The graph in Figure 3 shows the total gate charge that can be driven by the MIC2193 over the input voltage range, for different values of switching frequency.
Max. Gate Charge
100
90 80 70 60 50 40 30 20 10
MAXIMUM GATE CHARGE (nC)
0
02468101214
INPUT VOLTAGE (V)
Figure 3. MIC2193 Frequency vs Max. Gate Charge
Oscillator
The internal oscillator is free running and requires no external components. The maximum duty cycle is 100%. This is another advantage of using a P-channel MOSFET for the high-side drive: it can continuously turned on.
A frequency foldback mode is enabled if the voltage on the feedback pin (pin 3) is less than 0.3V. In frequency foldback, the oscillator frequency is reduced by approximately a factor of 4. Frequency foldback is used to limit the energy delivered to the output during a short circuit fault condition.
Voltage Setting Components
The MIC2193 requires two resistors to set the output voltage as shown in Figure 4.
V
MIC2193
Voltage
Amplifier
V
1.245V
Pin 3
REF
OUT
R1
R2
Figure 4
The output voltage is determined by the equation below.
R
VV
OUT
Where: V
+1
REF
for the MIC2193 is typically 1.245V.
REF
1
R
2
Lower values of R1 are preferred to prevent noise from appearing on the FB pin. A typically recommended value is 10k. If R1 is too small in value it will decrease the efficiency of the power supply, especially at low output loads.
Once R1 is selected, R2 can be calculated with the following formula.
VR
×
R
REF
21=
VV
OUT
REF
Efficiency Considerations
Efficiency is the ratio of output power to input power. The difference is dissipated as heat in the buck converter. Under light output load, the significant contributors are:
The VIN supply current
To maximize efficiency at light loads:
Use a low gate charge MOSFET or use the smallest MOSFET, which is still adequate for maximum output current.
Use a ferrite material for the inductor core, which has less core loss than an MPP or iron power core.
Under heavy output loads the significant contributors to power loss are (in approximate order of magnitude):
Resistive on time losses in the MOSFETs
Switching transition losses in the high side MOSFET
Inductor resistive losses
Current sense resistor losses
Input capacitor resistive losses (due to the capacitors
ESR)
To minimize power loss under heavy loads:
Use low on resistance MOSFETs. Use low threshold logic level MOSFETs when the input voltage is below 5V. Multiplying the gate charge by the on resistance gives a figure of merit, providing a good balance between low load and high load efficiency.
Slow transition times and oscillations on the voltage and current waveforms dissipate more power during the turn on and turn off of the MOSFETs. A clean layout will minimize parasitic inductance and capaci­tance in the gate drive and high current paths. This will allow the fastest transition times and waveforms without oscillations. Low gate charge MOSFETs will
M9999-042704 8 April 2004
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MIC2193 Micrel
transition faster than those with higher gate charge requirements.
For the same size inductor, a lower value will have fewer turns and therefore, lower winding resistance. However, using too small of a value will require more output capacitors to filter the output ripple, which will force a smaller bandwidth, slower transient response and possible instability under certain conditions.
Lowering the current sense resistor value will de crease the power dissipated in the resistor. However, it will also increase the overcurrent limit and will require larger MOSFETs and inductor components.
Use low ESR input capacitors to minimize the power dissipated in the capacitors ESR.
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MIC2193 Micrel
Package Information
0.026 (0.65) MAX)
PIN 1
0.157 (3.99)
0.150 (3.81)
0.050 (1.27)
0.064 (1.63)
0.045 (1.14)
TYP
0.197 (5.0)
0.189 (4.8)
DIMENSIONS:
INCHES (MM)
0.020 (0.51)
0.013 (0.33)
0.0098 (0.249)
0.0040 (0.102)
0°–8°
SEATING
PLANE
8-Pin SOIC (M)
45°
0.050 (1.27)
0.016 (0.40)
0.244 (6.20)
0.228 (5.79)
0.010 (0.25)
0.007 (0.18)
MICREL, INC. 1849 FORTUNE DRIVE SAN JOSE, CA 95131 USA
TEL + 1 (408) 944-0800 FAX + 1 (408) 474-1000 WEB http://www.micrel.com
The information furnished by Micrel in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can
reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s
use or sale of Micrel Products for use in life support appliances, devices or systems is at Purchasers own risk and Purchaser agrees to fully indemnify
M9999-042704 10 April 2004
Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
Micrel for any damages resulting from such use or sale.
© 2004 Micrel, Incorporated.
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