Datasheet MIC2075-2BM, MIC2075-1BM, MIC2025-1BMM, MIC2025-2BM, MIC2025-2BMM Datasheet (MICREL)
...Page 1
MIC2025/2075 Micrel
MIC2025/2075
Single-Channel Power Distribution Switch
Preliminary Information
General Description
The MIC2025 and MIC2075 are high-side MOSFET switches
optimized for general-purpose power distribution requiring
circuit protection.
The MIC2025/75 are internally current limited and have
thermal shutdown that protects the device and load. The
MIC2075 offers “smart” thermal shutdown that reduces current consumption in fault modes. When a thermal shutdown
fault occurs, the output is latched off until the faulty load is
removed. Removing the load or toggling the enable input will
reset the device output.
Both devices employ soft-start circuitry that minimizes inrush
current in applications where highly capacitive loads are
employed. A fault status output flag is provided that is
asserted during overcurrent and thermal shutdown conditions.
The MIC2025/75 is available in the MM8™ 8-lead MSOP and
8-lead SOP.
Features
• 140mΩ maximum on-resistance
• 2.7V to 5.5V operating range
• 500mA minimum continuous output current
• Short-circuit protection with thermal shutdown
• Fault status flag with 3ms filter eliminates false asser-
tions
• Undervoltage lockout
• Reverse current flow blocking (no “body diode”)
• Circuit breaker mode (MIC2075) reduces power
consumption
• Logic-compatible input
• Soft-start circuit
• Low quiescent current
• Pin-compatible with MIC2525
Applications
• USB peripherals
• General purpose power switching
• ACPI power distribution
• Notebook PCs
• PDAs
• PC card hot swap
Typical Application
1µF
10k
VIN
OVERCURRENT
ON/OFF
GND
MIC2025/75Logic Controller
EN OUT
FLG IN
GND OUT
NC
NC
V
CC
2.7V to 5.5V
0.1µF
Load
MM8 is a trademark of Micrel, Inc.
Micrel, Inc. • 1849 Fortune Drive • San Jose, CA 95131 • USA • tel + 1 (408) 944-0800 • fax + 1 (408) 944-0970 • http://www.micrel.com
March 2000 1 MIC2025/2075
Page 2
MIC2025/2075 Micrel
Ordering Information
Part Number Enable Temperature Range Package
MIC2025-1BM Active High –40°C to +85°C 8-lead SOP
MIC2025-2BM Active Low –40°C to +85°C 8-lead SOP
MIC2025-1BMM Active High –40°C to +85°C 8-lead MSOP
MIC2025-2BMM Active Low –40°C to +85°C 8-lead MSOP
MIC2075-1BM Active High –40°C to +85°C 8-lead SOP
MIC2075-2BM Active Low –40°C to +85°C 8-lead SOP
MIC2075-1BMM Active High –40°C to +85°C 8-lead MSOP
MIC2075-2BMM Active Low –40°C to +85°C 8-lead MSOP
Pin Configuration
EN
FLG
GND
NC
Pin Description
Pin Number Pin Name Pin Function
1 EN Switch Enable (Input): Active-high (-1) or active-low (-2).
2 FLG Fault Flag (Output): Active-low, open-drain output. Indicates overcurrent or
3 GND Ground
4 NC not internally connected
5 NC not internally connected
6, 8 OUT Supply (Output): Pins must be connected together.
7 IN Supply Voltage (Input).
MIC2025/75
1
2
3
4
OUT
8
IN
7
OUT
6
NC
5
8-Lead SOP (BM)
8-Lead MSOP (BMM)
thermal shutdown conditions. Overcurrent condition must exceed tD in order
to assert FLG.
MIC2025/2075 2 March 2000
Page 3
MIC2025/2075 Micrel
Absolute Maximum Ratings (Note 1)
Supply Voltage (V
Fault Flag Voltage (V
Fault Flag Current (I
Output Voltage (V
Output Current (I
Enable Input (I
) ........................................ –0.3V to 6V
IN
)..............................................+6V
FLG
) ............................................25mA
FLG
) ..................................................+6V
OUT
)...............................Internally Limited
OUT
).....................................–0.3V to VIN +3V
EN
Operating Ratings (Note 2)
Supply Voltage (V
Ambient Temperature (T
Junction Temperature (T
Thermal Resistance
SOP (θJA) ..........................................................160°C/W
MSOP(θJA) ........................................................206°C/W
) ................................... +2.7V to +5.5V
IN
).........................–40°C to +85°C
A
) .......................Internally Limited
J
Storage Temperature (TS) ....................... –65°C to +150°C
ESD Rating, Note 3
Electrical Characteristics
VIN = +5V; TA = 25°C, bold values indicate –40°C ≤ TA ≤ +85°C; unless noted
Symbol Parameter Condition Min Typ Max Units
I
DD
V
EN
I
EN
R
DS(on)
t
ON
t
R
t
OFF
t
F
I
LIMIT
t
D
Supply Current MIC20x5-1, V
OUT = open
MIC20x5-2, V
OUT = open
MIC20x5-1, V
OUT = open
MIC20x5-2, V
OUT = open
≤ 0.8V, (switch off), 0.75 5 µA
EN
≥ 2.4V, (switch off), 0.75 5 µA
EN
≥ 2.4V, (switch on), 160 µA
EN
≤ 0.8V, (switch on), 160 µA
EN
Enable Input Voltage low-to-high transition 2.1 2.4 V
high-to-low transition 0.8 1.9 V
Enable Input Hysteresis 200 mV
Enable Input Current V
= 0V to 5.5V –1 0.01 1 µA
EN
Control Input Capacitance 1 pF
Switch Resistance VIN = 5V, I
VIN = 3.3V, I
= 500mA 90 140 mΩ
OUT
= 500mA 100 160 mΩ
OUT
Output Leakage Current MIC2025/2075 (output off) 10 µA
OFF Current in Latched MIC2075 50 µA
Thermal Shutdown (during thermal shutdown state)
Output Turn-On Delay RL = 10Ω, CL = 1µF, see “Timing Diagrams” 1 2.5 6 ms
Output Turn-On Rise Time RL = 10Ω, CL = 1µF, see “Timing Diagrams” 0.5 2.3 5.9 ms
Output Turnoff Delay RL = 10Ω, CL = 1µF, see “Timing Diagrams” 50 100 µs
Output Turnoff Fall Time RL = 10Ω, CL = 1µF, see “Timing Diagrams” 50 100 µs
Short-Circuit Output Current V
= 0V, enabled into short-circuit. 0.5 0.7 1.25 A
OUT
Current-Limit Threshold ramped load applied to output, Note 4 0.85 1.25 A
Short-Circuit Response Time V
Overcurrent Flag Response VIN = 5V, apply V
Delay
= 0V to I
OUT
(Short applied to output)
VIN = 3.3V, apply V
= I
OUT
LIMIT
= 0V until FLG low 1.5 3 7 ms
OUT
OUT
24 µs
= 0V until FLG low 1.5 3 8 ms
Undervoltage Lockout VIN rising 2.2 2.5 2.7 V
Threshold
VIN falling 2.0 2.3 2.5 V
March 2000 3 MIC2025/2075
Page 4
MIC2025/2075 Micrel
Symbol Parameter Condition Min Typ Max Units
Error Flag Output IL = 10mA, VIN = 5V 8 25 Ω
Resistance
Error Flag Off Current V
I
= 10mA, VIN = 3.3V 11 40 Ω
L
= 5V 10 µA
FLAG
Overtemperature Threshold TJ increasing 140 °C
TJ decreasing 120 °C
Note 1. Exceeding the absolute maximum rating may damage the device.
Note 2. The device is not guaranteed to function outside its operating rating.
Note 3. Devices are ESD sensitive. Handling precautions recommended.
Note 4. See “Functional Characteristics: Current-Limit Response” graph.
Test Circuit
V
Device
Under
Test
OUT
I
OUT
C
R
L
L
OUT
Timing Diagrams
t
R
V
OUT
90%
10%
90%
10%
t
F
Output Rise and Fall Times
V
EN
V
OUT
50%
t
OFF
t
ON
90%
10%
Active-Low Switch Delay Times (MIC20x5-2)
V
EN
50%
t
OFF
t
ON
V
OUT
90%
10%
Active-High Switch Delay Times (MIC20x5-1)
MIC2025/2075 4 March 2000
Page 5
MIC2025/2075 Micrel
0
1
2
3
4
5
-40 -20 0 20 40 60 80 100
RISE TIME (ms)
TEMPERATURE (°C)
Turn-On Rise Time
vs. Temperature
RL=10Ω
C
L
=1µF
VIN = 5V
VIN = 3.3V
0
1.0
2.0
3.0
4.0
5.0
2.5 3.0 3.5 4.0 4.5 5.0 5.5
RISE TIME (ms)
INPUT VOLTAGE (V)
Turn-On Rise Time
vs. Input Voltage
RL=10Ω
C
L
=1µF
+85°C
+25°C
-40°C
0
0.5
1.0
1.5
2.0
2.5
2.5 3.0 3.5 4.0 4.5 5.0 5.5
ENABLE THRESHOLD (V)
INPUT VOLTAGE (V)
Enable Threshold
vs. Input Voltage
TA = 25°C
VEN FALLING
VEN RISING
0
0.5
1.0
1.5
2.0
2.5
-40 -20 0 20 40 60 80 100
ENABLE THRESHOLD (V)
TEMPERATURE (°C)
Enable Threshold
vs. Temperature
VIN = 5V
VEN RISING
VEN FALLING
Supply On-Current
180
160
140
120
100
CURRENT (µA)
vs. Temperature
5V
80
60
40
20
3.3V
0
-40 -20 0 20 40 60 80 100
TEMPERATURE (°C)
Supply On-Current
vs. Input Voltage
200
150
100
CURRENT (µA)
50
+85°C
0
2.5 3.0 3.5 4.0 4.5 5.0 5.5
INPUT VOLTAGE (V)
-40°C
+25°C
On-Resistance
160
140
120
100
ON-RESISTANCE (mΩ)
vs. Temperature
3.3V
OUT
5V
= 500mA
80
60
40
20
0
-40 -20 0 20 40 60 80 100
I
TEMPERATURE (°C)
On-Resistance
200
150
100
RESISTANCE (mΩ)
vs. Input Voltage
+85°C
+25°C
50
0
2.5 3.0 3.5 4.0 4.5 5.0 5.5
-40°C
I
= 500mA
OUT
INPUT VOLTAGE (V)
CURRENT LIMIT (mA)
March 2000 5 MIC2025/2075
Short-Circuit Current-Limit
1000
800
600
400
200
vs. Temperature
VIN = 3.3V
VIN = 5V
0
-40 -20 0 20 40 60 80 100
TEMPERATURE (°C)
Short-Circuit Current-Limit
vs. Input Voltage
800
700
600
500
400
300
200
CURRENT LIMIT (mA)
100
0
2.5 3.0 3.5 4.0 4.5 5.0 5.5
INPUT VOLTAGE (V)
+85°C
+25°C
-40°C
Current-Limit Threshold
1200
1000
800
600
400
200
CURRENT LIMIT THRESHOLD (mA)
vs. Temperature
VIN = 3.3V
VIN = 5V
0
-40 -20 0 20 40 60 80 100
TEMPERATURE (°C)
Current-Limit Threshold
1200
1100
1000
900
800
700
600
500
400
300
200
100
CURRENT LIMIT THRESHOLD (mA)
vs. Input Voltage
+85°C +25°C -40°C
0
2.5 3.0 3.5 4.0 4.5 5.0 5.5
INPUT VOLTAGE (V)
Page 6
MIC2025/2075 Micrel
Flag Delay
vs. Temperature
5
4
3
2
DELAY TIME (ms)
1
0
-40 -20 0 20 40 60 80 100
VIN = 3.3V
VIN = 5V
TEMPERATURE (°C)
Flag Delay
vs. Input Voltage
5
4
3
2
DELAY TIME (ms)
1
0
+85°C
+25°C
-40°C
2.5 3.0 3.5 4.0 4.5 5.0 5.5
INPUT VOLTAGE (V)
UVLO Threshold
vs. Temperature
3.0
2.5
2.0
1.5
1.0
0.5
UVLO THRESHOLD (V)
0
-40 -20 0 20 40 60 80 100
VIN RISING
VIN FALLING
TEMPERATURE (°C)
MIC2025/2075 6 March 2000
Page 7
MIC2025/2075 Micrel
Functional Characteristics
V
V
V
I
V
V
IN
FLG
OUT
OUT
EN
FLG
UVLO—VIN Rising
(MIC2025-1)
IN
2.5V
(1V/div.)
V
V
(2V/div.)
FLG
(2V/div.)
UVLO—VIN Falling
(MIC2025-1)
2.3V
(1V/div.)
VEN = V
IN
VIN = 5V
= 57µF
C
(2V/div.)
L
R
L
= 35Ω
V
I
OUT
(2V/div.)
OUT
VEN = V
VIN = 5V
= 57µF
C
L
= 35Ω
R
L
IN
(100mA/div.)
(100mA/div.)
TIME (10ms/div.)
Turn-On Response
(MIC2025-1)
EN
(10V/div.)
(5V/div.)
V
V
(10V/div.)
FLG
(5V/div.)
TIME (25ms/div.)
Turnoff Response
(MIC2025-1)
V
I
V
V
I
OUT
OUT
EN
FLG
OUT
OUT
(5V/div.)
640mA
VIN = 5V
= 147µF
C
L
= 35Ω
R
L
144mA
(200mA/div.)
V
I
OUT
(5V/div.)
VIN = 5V
= 147µF
C
L
= 35Ω
R
144mA
L
(200mA/div.)
TIME (1ms/div.)
Inrush Current Response
(MIC2025-1)
EN
(10V/div.)
(5V/div.)
CL = 310µF
VIN = 5V
= 35Ω
R
L
CL = 210µF
CL = 110µF
CL = 10µF
(200mA/div.)
V
V
V
I
FLG
OUT
OUT
(10V/div.)
(5V/div.)
3.1ms (tD)
(2V/div.)
TIME (2.5ms/div.)
Enable Into Short
(MIC2025-1)
VIN = 5V
640mA
Short-Circuit
Current
(500mA/div.)
TIME (1ms/div.)
TIME (1ms/div.)
March 2000 7 MIC2025/2075
Page 8
MIC2025/2075 Micrel
V
V
V
I
IN
(10V/div.)
FLG
(5V/div.)
OUT
(5V/div.)
OUT
(500mA/div.)
Current-Limit Response
(Ramped Load Into Short—MIC2025-1)
Short Removed
Current-Limit
Threshold
(780mA)
Short-Circuit
Current (650mA)
Thermal
Shutdown
TIME (100ms/div.)
Current-Limit Transient Response
(MIC2025-1)
No
Load
Load
VIN = 5V
= 47µF
C
L
VIN = 5V
= 47µF
C
L
Current-Limit Transient Response
(Enable Into Short—MIC2025-1)
No
Load
Load
FLG
V
(5V/div.)
OUT
V
(5V/div.)
OUT
I
(5A/div.)
640mA
Short-Circuit Current
TIME (500µs/div.)
Thermal Shutdown Response
(Output Reset by Removing Load—MIC2075-1)
EN
V
(10V/div.)
FLG
V
(5V/div.)
VIN = 5V
= 47µF
C
L
V
I
OUT
OUT
OUT
V
I
(5V/div.)
OUT
(500mA/div.)
(5V/div.)
(5A/div.)
24µs
640mA
Short-Circuit Current
TIME (10µs/div.)
Output
Latched Off
Ramped Load to a Short
Thermal
Shutdown
TIME (100ms/div.)
Output is Reset
(Load Removed)
VIN = 5V
Thermal Shutdown
(Output Reset by Toggling Enable—MIC2075-1)
V
V
V
I
EN
(10V/div.)
FLG
(5V/div.)
OUT
(5V/div.)
OUT
(500mA/div.)
V
RL = 35Ω
= 5V
IN
Ramped Load to a Short
TIME (100ms/div.)
Enable Reset
Thermal
Shutdown
Output Reset
R
= 35Ω
L
MIC2025/2075 8 March 2000
Page 9
MIC2025/2075 Micrel
Block Diagram
EN
OSC.
CHARGE
PUMP
THERMAL
SHUTDOWN
Functional Description
Input and Output
IN is the power supply connection to the logic circuitry and the
drain of the output MOSFET. OUT is the source of the output
MOSFET. In a typical circuit, current flows from IN to OUT
toward the load. If V
from OUT to IN since the switch is bidirectional when enabled. The output MOSFET and driver circuitry are also
designed to allow the MOSFET source to be externally forced
to a higher voltage than the drain (V
switch is disabled. In this situation, the MIC2025/75 avoids
undesirable current flow from OUT to IN.
Thermal Shutdown
Thermal shutdown is employed to protect the device from
damage should the die temperature exceed safe margins
due mainly to short circuit faults. Each channel employs its
own thermal sensor. Thermal shutdown shuts off the output
MOSFET and asserts the FLG output if the die temperature
reaches 140°C. The MIC2025 will automatically reset its
output should the die temperature cool down to 120°C. The
MIC2025 output and FLG signal will continue to cycle on and
off until the device is disabled or the fault is removed. Figure
2 depicts typical timing. If the MIC2075 goes into thermal
shutdown, its output will latch off and a pull-up current source
is activated. This allows the output latch to automatically reset
when the load (such as a USB device) is removed. The output
can also be reset by toggling EN. Refer to Figure 1 for details.
Depending on PCB layout, package, ambient temperature,
etc., it may take several hundred milliseconds from the
incidence of the fault to the output MOSFET being shut off.
The worst-case scenario of thermal shutdown is that of a
short-circuit fault and is shown in the in the “Function Characteristics: Thermal Shutdown Response” graph.
is greater than VIN, current will flow
OUT
> VIN) when the
OUT
UVLO
GND
GATE
CONTROL
1.2V
REFERENCE
RESPONSE
DELAY
CURRENT
LIMIT
FLAG
IN
OUT
FLG
Power Dissipation
The device’s junction temperature depends on several factors such as the load, PCB layout, ambient temperature and
package type. Equations that can be used to calculate power
dissipation of each channel and junction temperature are
found below.
PD = R
DS(on)
× I
OUT
2
Total power dissipation of the device will be the summation of
PD for both channels. To relate this to junction temperature,
the following equation can be used:
TJ = PD × θJA + T
A
where:
TJ = junction temperature
TA = ambient temperature
θJA = is the thermal resistance of the package
Current Sensing and Limiting
The current-limit threshold is preset internally. The preset
level prevents damage to the device and external load but still
allows a minimum current of 500mA to be delivered to the
load.
The current-limit circuit senses a portion of the output MOSFET switch current. The current-sense resistor shown in the
block diagram is virtual and has no voltage drop. The reaction
to an overcurrent condition varies with three scenarios:
Switch Enabled into Short-Circuit
If a switch is enabled into a heavy load or short-circuit, the
switch immediately enters into a constant-current mode,
reducing the output voltage. The FLG signal is asserted
indicating an overcurrent condition. See the Short-Circuit
Response graph under Functional Characteristics.
March 2000 9 MIC2025/2075
Page 10
MIC2025/2075 Micrel
Short-Circuit Applied to Enabled Output
When a heavy load or short-circuit is applied, a large transient
current may flow until the current-limit circuitry responds.
Once this occurs the device limits current to less than the
short-circuit current limit specification. See the Short-Circuit
Transient Response graph under Functional Characteristics.
Current-Limit Response—Ramped Load
The MIC2025/75 current-limit profile exhibits a small foldback
effect of about 200mA. Once this current-limit threshold is
exceeded the device switches into a constant current mode.
It is important to note that the device will supply current until
the current-limit threshold is exceeded. See the Current-Limit
Response graph under Functional Characteristics.
V
EN
Short-Circuit Fault
Fault Flag
The FLG signal is an N-channel open-drain MOSFET output.
FLG is asserted (active-low) when either an overcurrent or
thermal shutdown condition occurs. In the case where an
overcurrent condition occurs, FLG will be asserted only after
the flag response delay time, tD, has elapsed. This ensures
that FLG is asserted only upon valid overcurrent conditions
and that erroneous error reporting is eliminated. For example, false overcurrent conditions can occur during hot-plug
events when a highly capacitive load is connected and
causes a high transient inrush current that exceeds the
current-limit threshold. The FLG response delay time t
is
D
typically 3ms.
Undervoltage Lockout
Undervoltage lockout (UVLO) prevents the output MOSFET
from turning on until VIN exceeds approximately 2.5V. Undervoltage detection functions only when the switch is enabled.
Load Removed
(Output Reset)
V
OUT
I
LIMIT
I
I
V
DC
OUT
FLG
Thermal Shutdown
Reached
t
D
Figure 1. MIC2075-2 Timing: Output Reset by Removing Load
V
V
OUT
I
LIMIT
I
OUT
V
EN
I
DC
FLG
Thermal Shutdown
Reached
Short-Circuit Fault
t
D
Load/Fault
Removed
Figure 2. MIC2025-2 Timing
MIC2025/2075 10 March 2000
Page 11
MIC2025/2075 Micrel
Applications Information
Supply Filtering
A 0.1µF to 1µF bypass capacitor positioned close to VIN and
GND of the device is strongly recommended to control supply
transients. Without a bypass capacitor, an output short may
cause sufficient ringing on the input (from supply lead inductance) to damage internal control circuitry.
Printed Circuit Board Hot-Plug
The MIC2025/75 are ideal inrush current-limiters suitable for
hot-plug applications. Due to the integrated charge pump,
the MIC2025/75 presents a high impedance when off and
slowly becomes a low impedance as it turns on. This “soft-
start” feature effectively isolates power supplies from highly
capacitive loads by reducing inrush current during hot-plug
events. Figure 3 shows how the MIC2075 may be used in a
hot-plug application.
In cases of extremely large capacitive loads (>400µF), the
length of the transient due to inrush current may exceed the
delay provided by the integrated filter. Since this inrush
current exceeds the current-limit delay specification, FLG will
be asserted during this time. To prevent the logic controller
from responding to FLG being asserted, an external RC filter,
as shown in Figure 4, can be used to filter out transient FLG
assertion. The value of the RC time constant will be selected
to match the length of the transient.
Universal Serial Bus (USB) Power Distribution
The MIC2025/75 is ideally suited for USB (Universal Serial
Bus) power distribution applications. The USB specification
defines power distribution for USB host systems such as PCs
and USB hubs. Hubs can either be self-powered or buspowered (that is, powered from the bus). Figure 5 below
shows a typical USB Host application that may be suited for
mobile PC applications employing USB. The requirements
for USB host systems is that the port must supply a minimum
of 500mA at an output voltage of 5V ±5%. In addition, the
output power delivered must be limited to below 25VA. Upon
an overcurrent condition, the host must also be notified. To
support hot-plug events, the hub must have a minimum of
120µF of bulk capacitance, preferably low-ESR electrolytic or
tantulum. Refer to Application Note 17 for more details on
designing compliant USB hub and host systems.
For bus-powered hubs, USB requires that each downstream
port be switched on or off under control by the host. Up to four
downstream ports each capable of supplying 100mA at 4.4V
minimum are allowed. In addition, to reduce voltage droop on
the upstream V
, soft-start is necessary. Although the hub
BUS
can consume up to 500mA from the upstream bus the hub
must consume only 100mA max at start-up, until it enumerates with the host prior to requesting more power. The same
requirements apply for bus-powered peripherals that have no
downstream ports. Figure 6 shows a bus-powered hub.
V
CC
to "Hot"
Receptacle
GND
MIC2025-2
18
EN OUT
27
FLG
0.1
µF
36
GND OUT
4
NC
Adaptor Card
IN
NC
Figure 3. Hot Plug Application
V+
Logic Controller
OVERCURRENT
10k
R
C
MIC2025
18
EN OUT
27
FLG
36
GND OUT
45
NC NC
Figure 4. Transient Filter
Backend
Function
5
C
BULK
IN
March 2000 11 MIC2025/2075
Page 12
MIC2025/2075 Micrel
V
CC
5.0V
4.50V to 5.25V
Upstream V
100mA max.
BUS
V
BUS
D+
D–
GND
1µF
MIC5203-3.3
IN OUT
GND
3.3V
VIN
1µF
10k
ON/OFF
OVERCURRENT
GND
MIC2025/753.3V USB Controller
EN OUT
FLG IN
GND OUT
NC
NC
0.1µF
120µF
Ferrite
Beads
0.01µF
V
BUS
D+
D–
GND
USB
Port
USB Upstream
Connector
V
D+
D–
GND
BUS
Data
MIC5203-3.3
(LDO)
IN OUT
GND
0.1µF 0.1µF
Data
1.5K
Figure 5 USB Host Application
3.3V
USB Logic Controller
VIN
1.5k
ON/OFF
OVERCURRENT
GND
MIC2025/75
EN OUT
FLG IN
GND OUT
NC
Figure 6. USB Bus-Powered Hub
NC
0.1µF
Data
120µF
Ferrite
Beads
Data
0.01µF
V
BUS
D+
D–
GND
USB Downstream
Connector
(Up to four
ganaged ports)
MIC2025/2075 12 March 2000
Page 13
MIC2025/2075 Micrel
Package Information
0.026 (0.65)
MAX)
PIN 1
0.157 (3.99)
0.150 (3.81)
0.064 (1.63)
0.045 (1.14)
0.122 (3.10)
0.112 (2.84)
0.036 (0.90)
0.032 (0.81)
0.050 (1.27)
TYP
0.197 (5.0)
0.189 (4.8)
0.020 (0.51)
0.013 (0.33)
0.0098 (0.249)
0.0040 (0.102)
SEATING
PLANE
8-Lead SOP (M)
0.199 (5.05)
0.187 (4.74)
0.120 (3.05)
0.116 (2.95)
0.043 (1.09)
0.038 (0.97)
DIMENSIONS:
INCHES (MM)
0°–8°
0.012 (0.30) R
45°
0.050 (1.27)
0.016 (0.40)
0.244 (6.20)
0.228 (5.79)
DIMENSIONS:
INCH (MM)
0.010 (0.25)
0.007 (0.18)
0.007 (0.18)
0.005 (0.13)
0.012 (0.03)
0.0256 (0.65) TYP
0.008 (0.20)
0.004 (0.10)
5° MAX
0° MIN
MM8™ 8-Pin MSOP (MM)
0.012 (0.03) R
0.039 (0.99)
0.035 (0.89)
0.021 (0.53)
March 2000 13 MIC2025/2075
Page 14
MIC2025/2075 Micrel
MIC2025/2075 14 March 2000
Page 15
MIC2025/2075 Micrel
March 2000 15 MIC2025/2075
Page 16
MIC2025/2075 Micrel
MICREL INC. 1849 FORTUNE DRIVE SAN JOSE, CA 95131 USA
TEL + 1 (408) 944-0800 FAX + 1 (408) 944-0970 WEB http://www.micrel.com
This information is believed to be accurate and reliable, however no responsibility is assumed by Micrel for its use nor for any infringement of patents or
other rights of third parties resulting from its use. No license is granted by implication or otherwise under any patent or patent right of Micrel Inc.
© 2000 Micrel Incorporated
MIC2025/2075 16 March 2000
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