Datasheet MIC2003, MIC2013 Datasheet (Micrel)

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General Description

MIC2003/2013

Current Limiting Circuit Protector

Features

MIC2003 and MIC2013 are high-side current limiting
devices, designed for power distribution applications in
PCs, PDAs, printers and peripheral devices.

MIC2003 and MIC2013 are thermally protected and will
shutdown should their internal temperature reach unsafe
levels, protecting both the device and the load, under
high current or fault conditions. Both devices are fully
self-contained, with the current limit value being factory
set to one of several convenient levels.

MIC2013 offers a unique new feature: Kickstart
which allows momentary high current surges to pass
unrestricted without sacrificing overall system safety.

MIC2003 and MIC2013 are excellent choices for USB
and IEEE 1394 (FireWire) applications or for any system
where current limiting and power control are desired.

The MIC2003 and MIC2013 are offered in space saving
6 pin SOT-23 and 2mm x 2mm MLF packages.

Data sheets and support documentation can be found
on Micrel’s web site at www.micrel.com.

_________________________________________________________________________________________________________

™

• 70mΩ typical on-resistance

• 2.5V - 5.5V operating range

• Pre-set current limit values of 0.5A, 0.8A and 1.2A

™

• Kickstart

• Thermal Protection

• Under voltage lock-out

• Low quiescent current

,

Applications

• USB / IEEE 1394 Power Distribution

• Desktop and Laptop PCs

• Set top boxes

• Game consoles

• PDAs

• Printers

• Docking stations

• Chargers

Typical Application

Kickstart is a trademark of Micrel, Inc

MLF and MicroLeadFrame are trademarks of Amkor Technology, Inc.

Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel [phone] • fax + 1 [phone] • http://www.micrel.com

October 2005

Figure 1. Typical Application Circuit

M9999-xxxx04

[phone]

Micrel MIC2003/MIC20013

MIC2000 Family Members

Part Number

Normal Limiting Kickstart I Limit I Adj. Enable C

Pin Function

SLEW

FAULT/ DLM*

Discharge

2003 2013 -- -- -- -- -- --

2004 2014 -- ▲ -- -- -- ▲

2005 2015 -- ▲ ▲ ▲ -- --

2006 2016

Fixed

-- ▲ ▲ -- ▲ --

2007 2017 ▲ ▲ ▲ -- -- ▲

2008 2018 ▲ ▲ ▲ -- -- --

2009 2019

Adj.

▲ ▲ -- ▲ -- --

* Dynamic Load Management Adj = Adjustable current limit Fixed = Factory programmed current limit

Ordering Information

FD05

FD08

FD12

D05

D08

D12

FL05

FL08

FL12

L05

L09

L12

(1)

Current Limit Kickstart Pb-Free Package

Yes

SOT-23-5

2mmX2mm MLF

0.5A

0.8A

1.2A

0.5A

0.8A

No

1.2A

0.5A

0.8A

1.2A

0.5A

0.8A

Yes

SOT-23-5

2mmX2mm MLF

1.2A

Part Number Marking

MIC2003-0.5YM5

MIC2003-0.8YM5

MIC2003-1.2YM5

MIC2003-0.5YML

MIC2003-0.8YML

MIC2003-1.2YML

MIC2013-0.5YM5

MIC2013-0.8YM5

MIC2013-1.2YM5

MIC2013-0.5YML

MIC2013-0.8YML

MIC2013-1.2YML

Note:

1. Under-bar symbol ( _ ) may not be to scale

Load

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Pin Configuration

GND

V

NIC

OUT

V

1

NODAP

2

6

IN

5

GND

EDISKCAB

DNUORGSI

NIC

3

V

IN

1

2

NIC

34

6-Lead 2mmX2mm MLF (ML)

Top View

NIC

Pin Description

Pin

Number

SOT-23

1 6 VIN Input

2 5 GND -- Ground.

3 4 NIC --

4 3 NIC --

2 NIC --

5 1 VOUT Output

Pin

Number

MLF

Pin

Name

Type Description

Supply input. This pin provides power to both the output switch and the
MIC2003/2013’s internal control circuitry.

No internal connection. An electrical signal to this pin will have no effect on
device operation.

No internal connection. An electrical signal to this pin will have no effect on
device operation.

No internal connection. An electrical signal to this pin will have no effect on
device operation.

Switch output. The load being driven by MIC2003/2013 is connected to this
pin.

4

NIC V

SOT 23-5 (M5)

Top View

5

OUT

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Absolute Maximum Ratings

VIN, V

............................................................ –0.3 to 6V

OUT

(1)

All other pins.................................................. –0.3 to 5.5V

Power Dissipation.................................. Internally Limited

Continuous Output Current..................................... 2.25A

Maximum Junction Temperature........................... 150°C

Storage Temperature .............................. –65°C to 150°C

Operating Ratings

Supply Voltage............................................. 2.5V to 5.5V

Continuous Output Current Range .................... 0 to 2.1A

Ambient Temperature Range ....................–40°C to 85°C

Package Thermal Resistance (θ

SOT-23-5 ............................................. 230°C/W

MLF 2x2 mm

(5)

(2)

)

JA

......................................... 90°C/W

Electrical Characteristics

VIN = 5V, T

Symbol Parameter Conditions Min Typ Max Units

V

IN

I

IN

I

IN

I

LEAK

DS(ON)

I

LIMIT

= 25°C unless specified otherwise. Bold indicates –40°C to +85°C limits.

AMBIENT

Switch Input Voltage

Internal Supply Current Switch = OFF,

ENABLE = 0V

Internal Supply Current Switch = ON, I

OUT

= 0

ENABLE = 1.5V

Output Leakage Current

= 5V, V

IN

= 0 V, ENABLE

OUT

V
= 0

Power Switch Resistance VIN = 5V, I

Current Limit: –0.5 V

= 0.8VIN to V

OUT

= 100 mA

OUT

= 1V 0.5 0.7 0.9 A

OUT

2.5

1

80

12

70 100 mΩ R

5.5

5

300

100

125

V

µA

µA

µA

mΩ

I

LIMIT

I

LIMIT

I

LIMIT_2nd

THRESHOLD

Current Limit: –0.8 V

Current Limit: –1.2 V

Secondary current limit
(Kickstart)

Over-temperature Threshold

= 0.8VIN to V

OUT

= 0.8VIN, to V

OUT

MIC2013, V

= 2.7V 2.2 4 6 A

IN

= 1V 0.8 1.1 1.5 A

OUT

= 1V 1.2 1.6 2.1 A

OUT

TJ increasing 145 OT

T

decreasing 135

J

°C

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AC Characteristics

Symbol Parameter Condition Min Typ Max Units

t

LIMIT

t

RESET

Delay before current limiting Secondary current limit

(MIC2013)

Delay before resetting
Kickstart current limit delay,
t

LIMIT

Out of current limit following a
current limit.

(MIC2013)

77

77

128

128

192

192

ms

ms

ESD

Symbol Parameter Condition Min Typ Max Units

ESD_HB

V

ESD_MCHN

Electro Static Discharge
Voltage: Human Body Model

Electro Static Discharge
Voltage; Machine Model

Notes:

1. Exceeding the absolute maximum rating may damage the device.

2. The device is not guaranteed to function outside its operating rating.

3. Devices are ESD sensitive. Handling precautions recommended. Human body model, 1.5k in series with 100pF.

4. Specification for packaged product only.

5. Requires proper thermal mounting to achieve this performance.

V

and GND ± 4 kV V

OUT

All other pins

All pins

Machine Model

± 2

± 200 V

kV

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Timing Diagrams

ENABLE

50%

t

ON_DLY

90%

50%

t

OFF_DLY

VOUT

10%

Switching Delay Times

t

RISE

t

RISE

90%

10%

Rise and Fall Times

90%

90%

10%

t

FAL L

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10%

Output Rise Time

6

VOUT

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Typical Characteristics

Supply Current

100

SUPPLY CURRENT (µA)

Output Enabled

25°C

80

60

40

20

0

23456

-40°C

VIN (V)

UVSD Threshold

248.0

247.5

247.0

246.5

246.0

THRESHOLD (mV)

245.5

245.0

1.40

1.20

1.00

0.80

(A)

0.60

LIMIT

I

0.40

0.20

0.00

vs. Temperature

-50 -30 -10 10 30 50 70 90
TEMPERATURE (°C)

I

vs. Temperature

LIMIT

(MIC20xx - 0.8)

Note:

5V

Please note that the 3

3V

plots overlay each

2.5V

-50-30-101030507090
TEMPERATURE (°C)

RON vs.

120

100

80

60

(mOhm)

ON

40

R

20

0

-50-30-101030507090

Temperature

3.3V

TEMPERATURE (°C)

2.5V

85°C

5V

Supply Current

1.00

0.90

0.80

0.70

0.60

0.50

0.40

0.30

0.20
SUPPLY CURRENT (µA)

0.10

1.65

1.60

1.55

1.50

(A)

1.45

LIMIT

I

1.40

1.35

1.30

1.25

0.75

0.73

0.71

0.69

0.67

(A)

0.65

LIMIT

0.63

I

0.61

0.59

0.57

0.55

Output Disabled

-40°C

85°C

0

234567

-50-30-101030507090

VIN (V)

I

vs. Temperature

LIMIT

(MIC20xx-1.2)

VIN = 2.5V

VIN = 3V

VIN = 5V

TEMPERATURE (°C)

I

vs. Temperature

LIMIT

25°C

(MIC20xx - 0.5)

5V

3V

2.5V

-50-30-101030507090
TEMPERATURE (°C)

Switch Leakage Current - OFF

1.00

0.90

0.80

0.70

0.60

0.50

(µA)

0.40

0.30

0.20

0.10

0

-50 -30 -10 10 30 50 70 90
TEMPERATURE (°C)

I

vs.

LIMIT

1.4

1.2

1.0

0.8

(A)

0.6

LIMIT

I

0.4

0.2

-50 -30 -10 10 30 50 70 90

Temperature

0

TEMPERATURE (°C)

RON vs.

100

(mOhm)

ON

R

Supply Voltage

80

60

40

20

0

22.533.544.555.5
VIN (V)

0.8A

0.5A

1.2A

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Functional Characteristics

V

(1V/div)

I

(250mA/div)

V

OUT

(1V/div)

Current Limit Response Thermal Shutdown

VIN = 5.0V
R

LOAD

C

= 47µF

LOAD

OUT

OUT

0

50 100 150

200 250

300 350 400 450 500 550

Time (ms)

V

(1V/div)

I

(0.5A/div)

OUT

OUT

Kickstart Response

No Load to Short Circuit

V

OUT

(1V/div)

Normal Load with Temporary High Load

0

50 100 150

Normal Load with Temporary Short Circuit

Kickstart Response

200 250

300 350 400 450 500 550

Time (ms)

Kickstart Response

I

OUT

(0.5A/div)

V

OUT

(1V/div)

I

OUT

(200mA/div)

October 2005

0

50 100 150

10µF

0

4812

200 250

Time (ms)

Inrush Current Response

MIC20xx-0.5

0µF

22µF

100µF

47µF

16 20

Time (ms)

300 350 400 450 500 550

220µF

24 28 32 36 40

470µF

I

OUT

(0.5A/div)

0

50 100 150

200 250

300 350 400 450 500 550

Time (ms)

Turn-On/Turn-Off

= 5.0V

V

IN

R

LOAD

C

= 100nF

LOAD

V

OUT

(1V/div)

I

OUT

(200mA/div)

0

246

Time (ms)

810

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V

(1V/div)

(1/div)

V

(1V/div)

OUT

V

IN

OUT

0

4 8 12 16

UVLO Decreasing

20 24 28 32 36 40 44

Time (µs)

UVSD

UVLO Increasing

V

OUT

(1V/div)

V

IN

(1/div)

48

0

4 8 12 16

20 24 28 32 36 40 44

Time (µs)

48

V

IN

(1/div)

0

20 40

60

100 120 140 160 180

80

Time (µs)

200

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Functional Diagram

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rotceteD

tnerruC

TEFrorriM

rewoP

TEF

VIN

cigoLlortnoC

remiTyaleDdna

lamrehT

rosneS

V

etaRwelS

lortnoC

FER

yrotcaF

detsujda

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timiLtnerruC

pooLlortnoc

Figure 2 MIC2003/2013 Block Diagram

VOUT

GND

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Functional Description

Input and Output

V

is both the power supply connection for the internal

IN

circuitry driving the switch and the input (Source
connection) of the power MOSFET switch. V

OUT

is the
Drain connection of the power MOSFET and supplies
power to the load. In a typical circuit, current flows from

to V

V

IN

directional when enabled, if V
current will flow from V

toward the load. Since the switch is bi-

OUT

is greater than VIN,

OUT

to VIN.

OUT

When the switch is disabled, current will not flow to the
load, except for a small unavoidable leakage current of
a few microamps. However, should V

exceed VIN by

OUT

more than a diode drop (~0.6V), while the switch is
disabled, current will flow from output to input via the
power MOSFET’s body diode. This effect can be used
to advantage when large bypass capacitors are placed
on MIC2003/2013’s’s output. When power to the switch
is removed, the output capacitor will be automatically
discharged.

If discharging C

is required by your application,

LOAD

consider using MIC2003/2013 or MIC2007/2017 in place
of MIC2003/2013. These MIC2000 family members are
equipped with a discharge FET to insure complete
discharge of C

LOAD

.

Current Sensing and Limiting

MIC2003/2013 protects the system power supply and
load from damage by continuously monitoring current
through the on-chip power MOSFET. Load current is
monitored by means of a current mirror in parallel with
the power MOSFET switch. Current limiting is invoked
when the load exceeds an internally set over-current
threshold. When current limiting is activated the output
current is constrained to the limit value, and remains at
this level until either the load/fault is removed, the load’s
current requirement drops below the limiting value, or
the MIC2003/2013 goes into thermal shutdown.

Kickstart (MIC2013 only)

The MIC2013 is designed to allow momentary current
surges (Kickstart) before the onset of current limiting,
which permits dynamic loads, such as small disk drives
or portable printers to draw the energy needed to
overcome inertial loads without sacrificing system
safety. In this respect, the MIC2013 differs markedly
from MIC2003 and its peers, which immediately limit
load current, potentially starving the motor and causing
the appliance to stall or stutter.

During this delay period, typically 128 ms, a secondary
current limit is in effect. If the load demands a current in
excess the secondary limit, MIC2013 acts immediately
to restrict output current to the secondary limit for the

October 2005

duration of the Kickstart period. After this time the
MIC2013 reverts to its normal current limit. An example
of Kickstart operation is shown below.

TUO

TUO

Figure 3. Kickstart Operation

Picture Key:

A) MIC2013 is enabled into an excessive load (slew

rate limiting not visible at this time scale) The initial
current surge is limited by either the overall circuit
resistance and power supply compliance, or the
secondary current limit, whichever is less.

B) R

C) Kickstart period.
D) Current limiting initiated. FAULT/ goes LOW.
E) V

F) Thermal shutdown followed by thermal cycling.
G) Excessive load released, normal load remains.

H) FAULT/ delay period followed by FAULT/ going

Slew Rate Control

Large capacitive loads can create significant current
surges when charged through a high-side switch such
as the MIC2003/2013. For this reason, MIC2003/2013
provides built-in slew rate control to limit the initial inrush
currents upon enabling the power MOSFET switch.

Slew rate control is active upon powering up, and upon
re-enabling the load. At shutdown, the discharge slew
rate is controlled by the external load and output
capacitor.

11

of the power FET increases due to internal

ON

heating (effect exaggerated for emphasis).

is non-zero (load is heavy, but not a dead short

OUT

where V

= 0. Limiting response will be the same

OUT

for dead shorts).

MIC2013 drops out of current limiting.

HIGH.

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Thermal Shutdown

Thermal shutdown is employed to protect
MIC2003/2013 from damage should the die temperature
exceed safe operating levels. Thermal shutdown shuts
off the output MOSFET and asserts the FAULT/ output if
the die temperature reaches 145°C.

MIC2003/2013 will automatically resume operation
when the die temperature cools down to 135°C. If
resumed operation results in reheating of the die,
another shutdown cycle will occur and the

MIC2003/2013 will continue cycling between ON and
OFF states until the offending load has been removed.

Depending on PCB layout, package type, ambient
temperature, etc., hundreds of milliseconds may elapse
from the incidence of a fault to the output MOSFET
being shut off. This delay is due to thermal time
constants within the system itself. In no event will the
device be damaged due to thermal overload because
die temperature is monitored continuously by on-chip
circuitry.

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Application Information

I

vs. I

LIMIT

MIC2003/2013’s’s current limiting circuitry is designed to
act as a constant current source to the load. As the load
tries to pull more than the allotted current, V
and the input to output voltage differential increases.
When V
reduce the drain of fault current on the system’s power
supply and to limit internal heating of MIC2003/2013.

When measuring I
dependence in mind, otherwise the measurement data
may appear to indicate a problem when none really
exists. This voltage dependence is illustrated in Figures
4 and 5.

In Figure 4 output current is measured as V
below V
below V
remains constant throughout the remainder of the test.
In Figure 5 this test is repeated but with V
exceeding 1V.

When V
circuitry responds by decreasing I
Figure 5. In this demonstration, V
and I
applications V
Ohm’s law by the load and the limiting current.

measured

OUT

drops

OUT

IN -VOUT

IN

IN

IN

OUT

exceeds 1V, I

it is important to bear this voltage

OUT

, with the test terminating when V
. Observe that once I

- V

> 1V, MIC2003/2013’s current limiting

OUT

is the measured quantity. In real life

is determined in accordance with

OUT

drops below I

OUT

OUT

is reached I

LIMIT

, as can be seen in

OUT

is being controlled

OUT

LIMIT

is pulled

is 1V

OUT

- V

IN

to

OUT

OUT

Figure 5. I

This folding back of I

as a function of V

I

LIMIT

of V

between I

OUT

1) is determined by R

in Current Limiting for V

OUT

can be generalized by plotting

LIMIT

, as shown below. The slope

OUT

= 0 and I

OUT

of MIC2003/2013 and I

ON

OUT

= I

Normalized Output Current

vs. Output Voltage (5V)

1.2

LIMIT

OUT

(where I

>1V

LIMIT

LIMIT

=

.

Figure 4. I

in Current Limiting for V

OUT

OUT

≤1V

1.0

0.8

0.6

0.4

0.2

0

0123456

NORMALIZED OUTPUT CURRENT (A)

OUTPUT VOLTAGE (V)

Figure 6.

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V

(

+×=

Normalized Output Current

vs. Output Voltage (2.5V)

1.2

1.0

0.8

0.6

0.4

0.2

0

0 0.5 1.0 1.5 2.0 2.5 3.0

NORMALIZED OUTPUT CURRENT (A)

OUTPUT VOLTAGE (V)

Figure 7.

Kickstart (MIC2013)

Kickstart allows brief current surges to pass to the load
before the onset of normal current limiting, which
permits dynamic loads to draw bursts of energy without
sacrificing system safety.

Functionally, Kickstart is a forced override of the normal
current limiting function provided by MIC2013. The
Kickstart period is governed by an internal timer which
allows current to pass unimpeded to the load for 128ms
and then normal (primary) current limiting goes into
action.

During Kickstart a secondary current limiting circuit is
monitoring output current to prevent damage to the
MIC2013, as a hard short combined with a robust power
supply can result in currents of many tens of amperes.
This secondary current limit is nominally set at 4 Amps
and reacts immediately and independently of the
Kickstart period. Once the Kickstart timer has finished its
count the primary current limiting circuit takes over and
holds I
excessive load persists.

Once MIC2013 drops out of current limiting the Kickstart
timer initiates a lock-out period of 128ms such that no
further bursts of current above the primary current limit,
will be allowed until the lock-out period has expired.

Kickstart may be over-ridden by the thermal protection
circuit and if sufficient internal heating occurs, Kickstart
will be terminated and I
load is still present I

to its programmed limit for as long as the

OUT

Æ 0. Upon cooling, if the

OUT

OUT

Æ I

LIMIT

, not I

KICKSTART

.

OUT

Kickstart

Current Limiting

I

OUT

Load Removed

0

100 200 300

Time (ms)

400 500

600

Figure 9. Kickstart

Supply Filtering

A 0.1µF to 1µF bypass capacitor positioned close to the
V

and GND pins of MIC2003/2013 is both good design

IN

practice and required for proper operation of
MIC2003/2013. This will control supply transients and
ringing. Without a bypass capacitor, large current surges
or an output short may cause sufficient ringing on V
(from supply lead inductance) to cause erratic operation
of MIC2003/2013’s control circuitry. Good quality, low
ESR capacitors, such as Panasonic’s TE or ECJ series,
are suggested.

When bypassing with capacitors of 10µF and up, it is
good practice to place a smaller value capacitor in
parallel with the larger to handle the high frequency
components of any line transients. Values in the range
of 0.01µF to 0.1µF are recommended. Again, good
quality, low ESR capacitors should be chosen.

Power Dissipation

Power dissipation depends on several factors such as
the load, PCB layout, ambient temperature, and supply
voltage. Calculation of power dissipation can be
accomplished by the following equation:

2

)

IRP ×=

OUTDS(ON)D

To relate this to junction temperature, the following
equation can be used:

TRPT

θ

AA)-(JDJ

IN

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Where: TJ = junction temperature,

T

= ambient temperature

A

R

is the thermal resistance of the package

θ(J-A)

In normal operation MIC2003/2013’s Ron is low enough
that no significant I2R heating occurs. Device heating is
most often caused by a short circuit, or very heavy load,
when a significant portion of the input supply voltage
appears across MIC2003/2013’s power MOSFET.
Under these conditions the heat generated will exceed
the package and PCB’s ability to cool the device and
thermal limiting will be invoked.

In Figure 10 die temperature is plotted against I
assuming a constant case temperature of 85°C. The
plots also assume a worst case RON of 140 mΩ at a die
temperature of 135°C. Under these conditions it is clear
that an SOT-23 packaged device will be on the verge of
thermal shutdown, typically 140°C die temperature,
when operating at a load current of 1.25A. For this
reason we recommend using MLF packaged
MIC2003/2013s for any design intending to supply
continuous currents of 1A or more.

Die Temperature vs. Iout for Tcase = 85°C

160

140

120

100

80

60

40

Die Temperature - °C

20

0

0.20 0.40 0.60 0.80 1.00 1.20 1.40 1.60 1.80 2.00

Iout - Amps

Figure 10. Die Temperature vs. I

SOT-23

MLF

OUT

OUT

MIC2003/MIC20013

When operating at higher current levels or in higher
temperature environments use of Micrel’s MLF
packaging is recommended. MLF packages provide an
exposed power paddle on the back side to which
electrical and thermal contact can be made with the
device. This significantly reduces the package’s thermal
resistance and thus extends the MIC2005/2013’s
operating range.

2 Vias

0.3 mm diam.

to Ground Plane

1.4 mm

0.8 mm

Figure 11. Pad for thermal mounting to PCB

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4

F

Package Information

1.90 (0.075) RE

0.95 (0.037) REF

MIC2003/MIC20013

3.02 (0.119)

2.80 (0.110)

0.50 (0.020)

0.35 (0.014)

1.75 (0.069)

1.50 (0.059)

1.30 (0.051)

0.90 (0.035)

0.15 (0.006)

0.00 (0.000)

3.00 (0.118)

2.60 (0.102)

10°

0°

5-Pin SOT-23 (M5)

DIMENSIONS:

MM (INCH)

0.60 (0.024)

0.10 (0.004)

0.20 (0.008)

0.09 (0.00

)

6 Pin 2mmX2mm MLF (ML)

MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA

TEL [phone] FAX [phone] WEB http:/www.micrel.com

The information furnished by Micrel in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for

Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a

product can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for

surgical implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant

injury to the user. A Purchaser’s use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser’s own risk

October 2005

its use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.

and Purchaser agrees to fully indemnify Micrel for any damages resulting from such use or sale.

© 2005 Micrel, Incorporated.

16

M9999-102605

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