Datasheet MIC2072-2PCQS, MIC2072CM, MIC2072PCM, MIC2072-2CQS, MIC2072-1CQS Datasheet (MICREL)

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Page 1
September 2000 1 MIC2012/2072
MIC2012 Micrel
MIC2012/MIC2072
USB Power Controller
Advance Information
General Description
The MIC2012 is a dual channel USB power switch designed to support the power distribution requirements for USB Wakeup from the ACPI S3 state. The MIC2012 will directly switch its two outputs between a 5V main supply and a 5V auxiliary supply normally provided in ATX style power supplies.
The MIC2012 will adjust its current-limit threshold according to the ACPI state it is in. In the normal active S0 state the current-limit is set at 500mA minimum per channel satisfying the USB continuous output current specification. In the S3 state the current-limit can be reduced to only 100mA per channel to minimize the current that is supplied by the auxiliary supply thereby ensuring that voltage regulation is maintained even during fault conditions.
The MIC2012 provides make-before-break switching to en­sure glitch-free transitions between the S3 and S0 states. Each channel is also thermally isolated from the other so that a fault in one channel does not effect the other. FAULT status output signals are also provided indicating overcurrent and thermal shutdown conditions.
The MIC2072 option latches the output off upon detecting an overcurrent condition for more than 5ms minimum. The output can be reset by either toggling the EN inputs of the MIC2072-1, -2 or by removing the load. Latching the output off provides a circuit breaker mode of operation which re­duces power consumption during fault conditions.
T ypical Application
MIC2012P
V
BUS
D+ D–
GND
MAIN AUX
OUT1
Downstream
USB
Port 1
100µF
5V MAIN
ATX Power Supply
S3# FAULT1# FAULT2#
V
BUS
D+ D–
GND
Downstream
USB
Port 2
OUT2
GND
5V STANDBY
82801AA or Equivalent
SLP S3# SLP S5#
OC0 OC1
Overcurrent Port 1
S3 Control
Overcurrent Port 1
100µF
Figure 1. USB Wakeup with Control Input
Features
• Compliant to USB power distribution specifications
• Two completely independent switches
• Integrated switching matrix supports ACPI S0/S3 state transitions without external FET circuits
• Make-before-break switching ensures glitch-free transitions
• No back-feed of auxiliary supply onto main supply during standby mode
• Bi-level current-limit preserves auxiliary supply voltage regulation in standby mode
• Thermally isolated channels
• Thermal shutdown protection
• Fault status outputs with filter prevents false assertions during hot-plug events
• Latched thermal shutdown options with auto-reset (MIC2072)
• Undervoltage lockout
Applications
• Desktop PCs
• Notebook PCs
• Notebook Docking stations
• LAN Servers
• PC Motherboards
Micrel, Inc. • 1849 Fortune Drive • San Jose, CA 95131 • USA • tel + 1 (408) 944-0800 • fax + 1 (408) 944-0970 • http://www.micrel.com
Page 2
MIC2012 Micrel
MIC2012/2072 2 September 2000
Pin Configuration
1FAULT1
S3#
AUX
GND
8FAULT2
OUT1 MAIN OUT2
7 6 5
2 3 4
8-Pin SOIC (M)
Ordering Information
Fault Circuit Breaker Temperature
Part Number Enable Output Function Range Package
MIC2012CM n/a Open-Drain 0°C to +70°C 8-lead SOIC MIC2012PCM* n/a Internal Pull-Up 0°C to +70°C 8-lead SOIC MIC2012-1CQS* Active High Open-Drain 0°C to +70°C 16-lead QSOP MIC2012-1PCQS* Active High Internal Pull-Up 0°C to +70°C 16-lead QSOP MIC2012-2CQS* Active Low Open-Drain 0°C to +70°C 16-lead QSOP MIC2012-2PCQS* Active Low Internal Pull-Up 0°C to +70°C 16-lead QSOP MIC2072CM* n/a Open-Drain 0°C to +70°C 8-lead SOIC MIC2072PCM* n/a Internal Pull-Up 0°C to +70°C 8-lead SOIC MIC2072-1CQS* Active High Open-Drain 0°C to +70°C 16-lead QSOP MIC2072-1PCQS* Active High Internal Pull-Up 0°C to +70°C 16-lead QSOP MIC2072-2CQS Active Low Open-Drain 0°C to +70°C 16-lead QSOP MIC2072-2PCQS* Active Low Internal Pull-Up 0°C to +70°C 16-lead QSOP
* Contact factory for availability.
1FAULT1
EN1
S3#
NC
AUX
NC NC
GND
16 FAULT2
EN2 OUT1 OUT1 MAIN MAIN OUT2 OUT2
15 14 13 12 11 10
9
2 3 4 5 6 7 8
16-Pin QSOP (QS)
Page 3
September 2000 3 MIC2012/2072
MIC2012 Micrel
Pin Description
Pin Number Pin Number Pin Name Pin Function
(MIC2012)
(MIC2012-1, -2)
1 1 FAULT1 Fault Status (Output): Internal pull-up or open-drain. Asserted LOW when
Channel is in a thermal shutdown state or overcurrent condition for more than 5ms. MIC2072 latches this output in its asserted state upon an overcurrent condition. Toggling EN1 or removing the load will reset the circuit breaker latch and deassert FAULT1.
n/a 2 EN1 Enable (Input): Channel 1, active-high (–1) or active-low (–2). Toggling this
input also resets the latched output of the MIC2072.
2 3 S3# Control (Input): When this input is HIGH, the MAIN inputs are connected to
OUT1 and OUT2 via 100m MOSFET switches. When this input is LOW the AUX inputs are connected to OUT1 and OUT2 via 500m MOSFET switches.
3 5 AUX Auxiliary 5V Supply (Input): Also used as power supply for internal circuitry.
n/a 4, 6, 7 NC No Connection: This pin may be connected to other pins without restriction.
4 8 GND Ground 5 9, 10 OUT2 Channel 2 (Output): For MIC2012-1, -2 both pins must be externally
connected together.
6 11, 12 MAIN 5V Main Supply (Input): All MAIN inputs must be connected together
externally.
7 13, 14 OUT1 Channel 1 (Output): For MIC2012-1, -2 both pins must be externally
connected together.
n/a 15 EN2 Enable (Input): Channel 2, active-high (–1) or active-low (–2). Toggling this
input also resets the latched output of the MIC2072.
8 16 FAULT2 Fault Status (Output): Internal pull-up or open-drain. Asserted LOW when
Channel 2 is in a thermal shutdown state or overcurrent condition for more than 5ms. MIC2072 latches this output in its asserted state upon an overcurrent condition. Toggling EN2 or removing the load will reset the circuit breaker latch and deassert FAULT2.
Page 4
MIC2012 Micrel
MIC2012/2072 4 September 2000
Absolute Maximum Ratings (Note 1, Note 4)
Supply Voltage (V
IN, VMAIN, VAUX
) ................... –0.3V to 6V
EN1, EN2, S3# Input Pins................................ –0.3V to 6V
FAULT#, OUT1, OUT2 Output Pins................. –0.3V to 6V
FAULT Output Current ...............................................25mA
ESD Rating, Note 3 ...................................................... 2kV
Operating Ratings (Note 2)
Supply Voltage (V
MAIN, VAUX
) ..................... +4.5V to +5.5V
Ambient Temperature (T
A
)...........................–0°C to +70°C
Junction Temperature (T
J
) ....................... Internally Limited
Package Thermal Resistance
QSOP JA) .......................................................163°C/W
SOIC
JA
).........................................................160°C/W
Electrical Characteristics
V
MAIN
= 5V; AUX = 5V; TA = 25°C; unless noted
Symbol Parameter Condition Min Typ Max Units
V
MAIN
MAIN Supply Voltage 4.5 5.0 5.5 V
I
MAIN (ON)
MAIN Supply Current Switches On S3# = 1, no load 16 22 µA
Note 5
I
MAIN (OFF)
MAIN Supply Current Switches Off S3# = 1, no load 5 µA Note 5, (MIC20x2-1, MIC20x2-2 only)
I
LEAK
MAIN Reverse Leakage Current, S3# = 0, both switches ON, V
MAIN
= 0V –10 +10 µA
V
AUX
AUX Supply Voltage 4.5 5.0 5.5 V
I
AUX ON
AUX Supply Current, No load .6 1 mA both switches on, Note 5 S3# = 0
I
AUX OFF
AUX Supply Current, switches No load 5 µA off. (MIC20x2-1, MIC20x2-2 only) S3# = 0
V
UV/AUX
AUX Undervoltage Lockout V
AUX
increasing 3.5 3.7 4.0 V
Threshold V
AUX
decreasing 3.3 3.5 3.8 V
V
HYS
AUX Undervoltage Lockout 200 mV Hysteresis
R
DSMAIN
MAIN On-Resistance, Each Output S3# = 1, I
OUT
= 500mA 100 140 m
R
DSAUX
AUX On-Resistance, Each Output S3# = 0, I
OUT
= 100mA 500 700 m
I
LIMIT(MAIN)
MAIN Current-Limit Threshold S3# = 1, V
OUT
= 4.0V, ramped load 0.5 1.25 A
MAIN Short-Circuit Current-Limit V
OUT
= 0V 0.5 1.25 A
I
LIMIT(AUX)
AUXCurrent-Limit Threshold S3# = 0, V
OUT
= 4.0V, ramped load 105 150 195 mA
AUX Short-Circuit Current-Limit V
OUT
= 0V, C
OUT
= 100µF80mA
V
TH
S3#, EN1, EN2. Input High-to-Low transition .8 1.5 V Threshold Voltage
Low-to-High transition 1.7 2.0 V
(EN1, EN2, for MIC20x2-x only)
V
HYS
EN1, EN2 and S3# Input Hysteresis 200 mV (EN1, EN2, for MIC20x2-x only)
I
IN
S3#, EN1, EN2 Input Current V
S3/EN
= 5V, 0V –11µA
(EN1, EN2, for MIC20x2-x only)
I
OFF
OUT1, OUT2 Leakage Current Outputs are off, V
OUT
= 0 –10 10 µA
(MIC2012-x, MIC2072-x only) Pull-Up Current During Latched Outputs latched off 1 mA
Output State (MIC2072-1, -2)
Page 5
September 2000 5 MIC2012/2072
MIC2012 Micrel
Symbol Parameter Condition Min Typ Max Units
V
TH LATCH
Latch Reset Threshold V
OUT
Rising 1.95 V
(MIC2072, MIC2072-x only) Minimum Output Slew Rate .4 V/s
to Reset Latch (MIC2072, MIC2072-x only), Note 6
Overtemperature Threshold T
J
increasing, single channel 140 °C
T
J
decreasing, single channel 120 °C
T
J
increasing, both channels 160 °C
TJ decreasing, both channels 150 °C
V
OL
FAULT Output Low Voltage I
FAULT
= 5mA 0.2 V
V
OH
FAULT Output High Voltage I
FAULT
= –20µA4V
(MIC2012-1P,-2P),(MIC2072-1P,-2P) FAULT Output Off Current V
FAULT
= 5V .2 10 µA
(Not Applicable to 'P' Options)
T
H
MAIN to S3# Hold Time, Note 6 Figure 5 5 ms
T
S
MAIN to S3# Set-up Time, Note 6 Figure 5 0 ms
t
DLY
FAULT Delay Filter Response Time Output shorted to ground, Figure 4 5 10 20 ms (Overcurrent only), Note 7
t
OC
Overcurrent Response Time Output shorted to ground, Figure 4
MAIN output 2 µs AUX output 2 µs
t
ON(MAIN)
MAIN Output Turn-On Time RL = 10, CL = 1µF, Figure 3 2 ms
t
OFF(MAIN)
MAIN Output Turn-Off Time RL = 10, CL = 1µF, Figure 3 35 µs (MIC20x2-x only)
t
r(MAIN)
MAIN Output Rise Time RL = 10, CL = 1µF, Figure 3 2 ms
t
f(MAIN)
MAIN Output Fall Time RL = 10, CL = 1µF, Figure 3 32 µs (MIC20x2-x only)
t
ON(AUX)
AUX Output Turn-On Time RL = 50, CL = 1µF, Figure 3 0.6 ms
t
OFF(AUX)
AUX Output Turn-Off Time RL = 50, CL = 1µF, Figure 3 120 µs (MIC20x2-x only)
t
r(AUX)
AUX Output Rise Time RL = 50, CL = 1µF, Figure 3 0.5 ms
t
f(AUX)
AUX Output Fall Time RL = 50, CL = 1µF, Figure 3 115 µs (MIC20x2-x only)
t
XMA
MAIN to AUX S3# transition to 0 5 7.5 ms Cross Conduction Time, Note 8
t
XAM
AUX to MAIN S3# transition to 1 5 7.5 ms Cross Conduction Time, Note 8
Note 1. Exceeding the absolute maximum rating may damage the device. Note 2. The device is not guaranteed to function outside its operating rating. Note 3. Devices are ESD sensitive. Handling precautions recommended. Human body model, 1.5k in series with 100pF. Note 4. All voltages are referenced to ground. Note 5. For MIC20x2-1(P) OFF occurs when VEN < 0.8V and ON occurs when VEN > 2.4V. For MIC20x2-2(P) OFF occurs when VEN > 2.4V and ON
occurs when VEN < 0.8V.
Note 6. Guaranteed by design. Not production tested. Note 7. Assumes only one channel in current-limit. Delay circuitry is shared among channels so it is possible for t
DLY
to be 40ms max if one channel
enters current-limit as the other is about to time-out.
Note 8. Cross conduction time is the duration in which both MAIN and AUX internal switches are on subsequent to S3# transitioning.
Page 6
MIC2012 Micrel
MIC2012/2072 6 September 2000
Test Circuit
Device Under Test
C
L
OUT
R
L
V
OUT
I
OUT
90%
V
OUT
10%
90%
10%
t
r
t
f
Page 7
September 2000 7 MIC2012/2072
MIC2012 Micrel
Timing Diagrams
V
EN
50%
90%
V
OUT
10%
t
OFF
t
ON
Figure 2. MIC2012/72-1
V
EN
50%
90%
V
OUT
10%
t
OFF
t
ON
Figure 3. MIC2012/72-2
Output shorted to ground
V
OUT
FAULT#
I
LIMIT
t
OC
t
DLY
I
OUT
Figure 4. Overcurrent Response Timing
MAIN
t
H
S3#
1.5V
t
S
1.5V
Figure 5. MAIN to S3# Timing
Page 8
MIC2012 Micrel
MIC2012/2072 8 September 2000
Functional Description
The MIC2012/2072 are designed to support the power distri­bution requirements for USB wakeup from the ACPI S3 state. It integrates two independent channels under control of input S3#. When S3# is asserted LOW (S3 state) the MIC2012/ 2072 will switch a 500m, 100mA MOSFET switch from the AUX input to each of its two outputs. Conversely when the S3# input is HIGH (S0 state) the MIC2012/72 will switch a 100m, 500mA MOSFET switch from the MAIN input to each of its two outputs. The lower current limit during the ACPI S3 state helps to ensure that the standby supply maintains regulation even during fault conditions.
Thermal Shutdown
Thermal shutdown is employed to protect the device from damage should the die temperature exceed safe margins due mainly to short circuit faults. Thermal shutdown shuts off the output MOSFET and asserts the FAULT output if the die temperature reaches 140°C and the overheated channel is in current limit. The other channel is not affected. If, however, the die temperature exceeds 160°C, both channels will be shut off even if neither channel is in current limit.
Power Dissipation
The devices junction temperature depends on several fac­tors such as the load, PCB layout, ambient temperature and package type. The power dissipated in each channel is
PD = R
DS(on)
× I
OUT
2
where R
DS(on)
is the on-resistance of the
internal MOSFETs and I
OUT
is the continuous output current.
Total power dissipation of the device will be the summation of PD for both channels. To relate this to junction temperature, the following equation can be used:
TJ = PD × θJA + T
A
where:
Functional Diagram
Current
Limit
10ms
Timer
Charge Pump
+
Gate Control
S3#
EN
Current
Limit
MAIN
OUT
AUX
/FAULT
AUX
Latch
To Other Channel
*
MAIN FET
AUX FET
*MIC2070-1/2 Only
Thermal
Sense
* 'P' options only
TJ = junction temperature TA = ambient temperature
θJA = is the thermal resistance of the package
Current Sensing and Limiting
The current-limit thresholds are preset internally for each state. The preset level prevents damage to the device and external load but still allows a minimum current of 100mA or 500mA to be delivered to the load depending on the state of the device according to the S3# input. When S3# is LOW the current-limit is set at 100mA minimum. When S3# is HIGH the current-limit is set at 500mA minimum.
Should an over-current condition last longer than t
DLY
, the MIC2072 will latch the faulty output off. The output will remain off until either the load is removed or the EN signal (MIC2072­1, -2) is toggled. When the MIC2072 enters a latched output condition a 1mA pull-up current source is activated. This provides a way to automatically reset the output once the load is removed without the need to toggle the enable input such as in the MIC2072. Please refer to Figure 7 for timing details.
The MIC2012 will automatically reset its output when the die temperature cools down to 120°C. The MIC2012 output and FAULT signal will continue to cycle on and off until the device is disabled or the fault is removed. Figure 6 depicts typical timing. Depending on PCB layout, package, ambient tem­perature, etc., it may take several hundred milliseconds from the incidence of the fault to the output MOSFET being shut off. This time duration will be shortest in the case of a dead short on the output.
Page 9
September 2000 9 MIC2012/2072
MIC2012 Micrel
Fault Status Output
The FAULT signal is an active-low output with an open-drain or weak pull-up configuration. FAULT is asserted (active-low) when either an overcurrent or thermal shutdown condition occurs. In the case of an overcurrent condition, FAULT will be asserted only after the flag response delay time, t
DLY
, has elapsed. This ensures that FAULT is asserted only upon valid overcurrent conditions and that erroneous error reporting is eliminated. For example, false overcurrent conditions can occur during hot-plug events when a highly capacitive load is connected and causes a high transient inrush current that exceeds the current-limit threshold. The FAULT response delay time t
DLY
is typically 10ms.
Undervoltage Lockout
Undervoltage lockout (UVLO) prevents the output MOSFET from turning on until the AUX input exceeds approximately
3.5V. UVLO ensures that the output MOSFETs remain off to prevent high transient inrush current due to stray or bulk load capacitance. This helps to ensure that the power supply voltage regulation is preserved and also prevents possible damage to sensitive components.
EN
(MIC2010-2)
V
OUT
Overcurrent Fault
Thermal Shutdown
Reached
FAULT
Figure 6. MIC2012 System Timing
EN
(MIC2070-2)
V
OUT
Overcurrent Fault
Load Removed–
Output Reset
FAULT
Figure 7. MIC2072 System Timing
Output Resets When Load is Removed
Page 10
MIC2012 Micrel
MIC2012/2072 10 September 2000
Package Information
45°
0.2284 (5.801)
0.2240 (5.690)
SEATING
PLANE
0.009 (0.2286) REF
0.012 (0.30)
0.008 (0.20)
0.157 (3.99)
0.150 (3.81)
0.050 (1.27)
0.016 (0.40)
0.0688 (1.748)
0.0532 (1.351)
0.196 (4.98)
0.189 (4.80)
0.025 (0.635) BSC
PIN 1
DIMENSIONS: INCHES (MM)
0.0098 (0.249)
0.0040 (0.102)
0.0098 (0.249)
0.0075 (0.190)
8° 0°
16-Pin QSOP (QS)
45°
0°–8°
0.244 (6.20)
0.228 (5.79)
0.197 (5.0)
0.189 (4.8)
SEATING
PLANE
0.026 (0.65) MAX)
0.010 (0.25)
0.007 (0.18)
0.064 (1.63)
0.045 (1.14)
0.0098 (0.249)
0.0040 (0.102)
0.020 (0.51)
0.013 (0.33)
0.157 (3.99)
0.150 (3.81)
0.050 (1.27) TYP
PIN 1
DIMENSIONS:
INCHES (MM)
0.050 (1.27)
0.016 (0.40)
8-Pin SOIC (M)
MICREL INC. 1849 FORTUNE DRIVE SAN JOSE, CA 95131 USA
TEL + 1 (408) 944-0800 FAX + 1 (408) 944-0970 WEB http://www.micrel.com
This information is believed to be accurate and reliable, however no responsibility is assumed by Micrel for its use nor for any infringement of patents or
other rights of third parties resulting from its use. No license is granted by implication or otherwise under any patent or patent right of Micrel Inc.
© 2000 Micrel Incorporated
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