
P-Channel 20V (D-S)MOSFET
MI3473
General Description
This miniature surface mount MOSFET uses ad vanced
Trench process,low RDS(ON ) assures minimal power
lo ss and ene rgy co nvert , wh ich m akes t his de vice
ideal f or u se i n p ower m anagement c ircuit.
Applications
Load switching
Low current DC-DC co nve rte rs
Small power management
Features
VD S (V)=-20V
ID (A)=-3.6A(VGS =-4.5V)
RD S(on) = 70 mΩ @ VGS=-4.5V
RD S(on) = 110 m Ω @ VGS =-2.5V
RD S(on) = 250 mΩ @ VGS=-1.8V
ESD Rating:3000V HBM
Low gate charge
Fast switching speed
High performance trench techn olo gy
D
.
.
G
Top Vi ew
S
Absolute Maximum Ratings (TA = 25℃ Unless Otherwise Not ed)
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain Current
Continuous Source Current (Di ode C ond uct ion )
Power Dissipation
Operating Junction and Storag e Temperature Range
a
b
a
a
TA =25℃
TA =70℃
TA =25℃
TA =70℃
Symbol
VD S
VG S
ID
ID M
IS
PD
TJ ,Tstg
Thermal Resistance Ratings
Symbol
R θJA
Maximum Junction-to-Ambie nt
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Parameter
a
t<= 10 sec
Steady-State
1
Maximum Units
-20
±12
-3.6
-2.8
-14
-2.3
1.4
0.9
-55 to 150
Maximum
90
130
Feb.20 12 Re v.2.0
V
A
A
W
℃
Units
℃/W

Package Outlines and Ordering Information
Device
MI3473
Device Marking
M04S
Reel Size
7’’
Specifications (TA = 25℃ Unless Otherwise Noted)
Parameter
Static
Drain-Source Breakdown Voltage
Gate-Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
Drain-Source On-Resist anc e
Forward Tranconductance
Diode Forward Voltage
Dynamic
Input Capacitance
Output Capacitance
Reverse Tra nsf er Ca pac ita nce
Switching
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Tur n-O n Del ay Tim e
Rise Time
Tur n-O ff Delay Time
Fall-Time
Notes: a . Sur face Moun ted on 1” x 1” FR 4 Boa rd.
b. Pulse w idt h limited b y maximum j unc tion temp erature
c. Pulse t est : PW <= 300us d uty cycle < = 2%.
c
c
c
Symbol
V( BR)D SS
VG S(th )
IG SS
ID SS
ID (on)
RD S(on )
g
fs
VS D
Ci ss
Co ss
Cr ss
Qg
Qg s
Qg d
td (on)
tr
td (off)
tf
Test Conditions
VG S=0V,ID=-250uA
VD S =VGS,ID = -250 u A
VD S=0V,VGS=±12V
VDS=-20V,VGS=0V
VDS=-20V,VGS=0V,TJ=85℃
VDS=-5V,VGS=-4.5V
VGS=-4.5V,ID=-3.6A
VGS =-2.5 V, ID=-2A
VGS =-1.8 V, ID=-1A
VD S=-5V,ID =-3.6A
IS =-1.2A,VGS=0V
VD S=-10V,VGS =0V
f=1MHz
VD S=-10V,VGS=- 4.5 V
ID =-3.6A
VDS=-10V, ID=-2.2A,
RG=6 ohm,VGEN=-4.5V
Tape Width
8mm
Limits
Min Typ Max
-20
-0.5
-0.75
-14
55
80
135
11
-0.7
550
90
80
6.2
1.3
1.2
5
12
30
22
Quantity
3000 units
-1
±10
-1
-30
70
110
250
-1.1
9
8
24
65
37
MI3473
Units
V
uA
uA
A
mΩ
S
V
pF
nC
ns
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2
Feb.20 12 Re v.2.0

Typical Electrical and Thermal Ch aracteristics
MI3473
12
VGS =-3,-4, -5, -6, -7,-8 ,-9 ,-10V
10
-2.5V
8
6
-2V
4
-ID-Dr ain Curre nt( A)
2
0
0. 0 0. 5 1.0 1 .5 2.0 2. 5 3. 0
-VDS Drain-t o-So urce Volta ge(V )
Figure 1: Out put Chara cter istics
-1.5V
240
210
180
VGS =-1.8V
150
120
VGS =-2.5V
90
60
RD S(on)- On -Resi stance( mΩ)
30
0
0 2 4 6 8 10 12
Figure 3 : On-R esistan ce vs Dr ain Curre nt
VGS =-4.5V
-ID- Dra inCu rrent(A )
1. 6
0. 03
VGS =-10V
0. 025
IDS =-3.6A
0. 02
0. 015
0. 01
RD S(ON) -On Re sist ance
(Norma lize d)
0. 005
0
-50 -25 0 25 5 0 75 10 0 125 150
TJ -Jun ctio n Tem peratur e(℃)
Figure 2 : On-R esistan ce vs. Junctio n Tem pera ture
150
140
130
120
)
110
(mΩ
ce
100
n
a
t
90
is
s
80
Re
70
On
)-
60
ON
(
50
DS
R
40
30
1 2 3 4 5 6 7 8 9 10
-VGS Gate-to -Sou rce Voltag e(V)
Figure 4 : On-R esis tance vs. Gate -to- Sou rce Vol tage
10
ID= -3. 6A
1. 4
1. 2
1. 0
0. 8
-VG S(th) Va rian ce(V)
0. 6
0. 4
0. 2
-50 -25 0 25 5 0 75 10 0 125 150
Figure 5: Thr esho ld Voltage
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TJ- Tempe ratu er(℃)
ID= -25 0uA
Tj= 150℃
1
-Is-So urce C urre nt(A)
0. 1
0 0. 3 0. 6 0.9 1 .2 1.5
-VSD -So urce -to- Drain Volt age( V)
Figure 6: Sou rce- Drain Dio de For ward Vo lta ge
Tj= 25℃
3
Feb.20 12 Re v.2.0

Typical Electrical and Thermal Ch aracteristics
MI3473
t
n
ie
n
a
ive r s
t T
c
e
f
f
E
e
z d
ma i
Nor l
5
VD S=-10V
)-
ID= -3.6A
(
4
ge
lt V
Vo
3
c a
u e
o
-S r
2
e
t -to
SG Ga
1
V
0
0 1 2 3 4 5 6 7
Qg-Total G ate Ch arge(nC )
Figur 7 :G ate Ch ange
100.0
T
=150°C
J(M ax)
T A =25°C
R
10.0
DS( ON)
limited
(A mps )
D
I
1.0
0.1s
10ms
1s
10s
0.1
0.1
1 1
DC
VDS (Volts)
Figure 9 : Max imum Forw ard Biase d Saf e
Operat ing Ar ea (Note d)
10
D=T on/T
.
T
J,P K=TA +PDM
e
c
e n
p da
e
d
l
ma
r
0.1
e
h
T
1
Rθ JA=130 W℃/
Z
JA
θ
100 µ s
1ms
0 100
800
Freque ncy =1MHz
700
600
Ciss
500
400
300
Capaci tanc e(pF )
200
100
Coss
Crss
0
0 4 8 12 16 20
-VDS Dai n-to -Source Vo ltag e(V)
Figure 8 : Capa citance
40
T
30
)
W
(
r
20
e
w
o
P
T A =25°C
10
0
0.001 0. 01 0.1
1 1
Pulse Wi dth ( s)
Figure 1 0: Si ngle Puls e Power Rat ing J unction -to-
Ambien t (No te d)
In desce ndi ng order
D=0.5, 0 .3, 0 .1, 0.05, 0 .02, 0.01 , single pu lse
P
D
T
o n
T
=150°C
J(M ax)
0 10 0 1000
0.01
0.00001 0.0001 0.001 0.01 0.1 1 1 0 100 1000
Pulse Wi dth ( s)
Figure 11 : Normali zed Maxim um Tra nsient Therma l Imp edance
Note d:
These te sts a re perfor med with th e device mo unt ed on 1 in FR -4 bo ard with 2o z. Copper, i n a sti ll air envi ronment w ith
T A=25 °C. The SOA cu rve provi des a s ingle pul se rating .
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2
4
Feb.20 12 Re v.2.0

Package
SOT -23 3-Lead
MI3473
D
3
1 2
e
e1
T OP VIEW
E1 E
A
SYMBOL MIN NOM MAX
A 0.70 1.15
1.00
A1 0.00 0.13
b 0.30 0.50
c 0.20
0.08
D 2. 80 3.1 0
E 2 .60 3. 00
E1 1. 40 1.80
0.40
0.13
2.90
2.80
1.60
e 0.95 BSC
e1 1. 90 BS C
L 0 .40 0 REF
L1 0 .54 0 REF
0 º 8 º
θ
θ
5º
b
A1
SIDE VIEW
Notes:
(1) All dimensions are i n mil lim eters. Angles in degre es.
(2) Complies with JEDE C TO -23 6.
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L1 L
END VIEW
5
c
Doc.SOT233-090701
Feb.20 12 Re v.2.0