
P-Channel 30V (D-S)MOSFET
MI3471
General Description
This miniature surface mount MOSFET uses ad vanced
Trench process,low RDS(ON ) assures minimal power
lo ss and ene rgy co nvert , wh ich m akes t his de vice
ideal f or u se i n p ower m anagement c ircuit.
Applications
Load switching
Low current DC-DC co nve rte rs
Small power management
Features
VD S (V)=-30V
ID (A)=-2.9A(VGS =-10V)
RD S(on) = 120 mΩ @ VGS=-10V
RD S(on) = 210 mΩ @ VGS=-4.5V
ESD Rating:3000V HBM
Low gate charge
Fast switching speed
High performance trench techn olo gy
D
.
.
G
Top Vi ew
S
Absolute Maximum Ratings (TA = 25℃ Unless Otherwise Not ed)
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain Current
Continuous Source Current (Di ode C ond uct ion )
Power Dissipation
Operating Junction and Storag e Temperature Range
a
b
a
a
TA =25℃
TA =70℃
TA =25℃
TA =70℃
Symbol
VD S
VG S
ID
ID M
IS
PD
TJ ,Tstg
Thermal Resistance Ratings
Symbol
R θJA
Maximum Junction-to-Ambie nt
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Parameter
a
t<= 10 sec
Steady-State
1
Maximum Units
-30
±20
-2.9
-2.2
-11
-1.5
1.4
0.9
-55 to 150
Maximum
90
130
Feb.20 12 Re v.2.0
V
A
A
W
℃
Units
℃/W

Package Outlines and Ordering Information
Device
MI3471
Device Marking
M02S
Reel Size
7’’
Specifications (TA = 25℃ Unless Otherwise Noted)
Parameter
Static
Drain-Source Breakdown Voltage
Gate-Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
Drain-Source On-Resist anc e
Forward Tranconductance
Diode Forward Voltage
Dynamic
Input Capacitance
Output Capacitance
Reverse Tra nsf er Ca pac ita nce
Switching
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Tur n-O n Del ay Tim e
Rise Time
Tur n-O ff Delay Time
Fall-Time
Notes: a . Sur face Moun ted on 1” x 1” FR 4 Boa rd.
b. Pulse w idt h limited b y maximum j unc tion temp erature
c. Pulse t est : PW <= 300us d uty cycle < = 2%.
c
c
c
Symbol
V( BR)D SS
VG S(th )
IG SS
ID SS
ID (on)
RD S(on )
g
fs
VS D
Ci ss
Co ss
Cr ss
Qg
Qg s
Qg d
td (on)
tr
td (off)
tf
Test Conditions
VG S=0V,ID=-250uA
VD S =VGS,ID = -250 u A
VD S=0V,VGS=±20V
VDS=-24V,VGS=0V
VDS=-24V,VGS=0V,TJ=85℃
VDS=-5V,VGS=-4.5V
VGS=-10V,ID=-2.9A
VGS =-4.5 V, ID =-1.7A
VD S=-5V,ID =-2.9A
IS =-1.2A,VGS=0V
VD S=-15V,VGS =0V
f=1MHz
VD S=-15V,VGS=- 10V
ID =-2.9A
VDS=-15V, ID=-2.2A,
RG=10 ohm,VGEN=-10V
Tape Width
8mm
Limits
Min Typ Max
-30
-1.3
-1.8
-11
95
155
5
-0.8
305
35
20
6.2
1.3
1.2
7
11
17
3.2
Quantity
3000 units
-2.5
±10
-1
-30
120
210
-1.1
9
14
22
32
6
MI3471
Units
V
uA
uA
A
mΩ
S
V
pF
nC
ns
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2
Feb.20 12 Re v.2.0

Typical Electrical and Thermal Ch aracteristics
MI3471
9
VGS =-5,-6 ,-7 ,-8,- 9,-10
8
7
6
-4V
5
4
3
-ID-Dr ain Curre nt( A)
2
-3.5V
-3V
1
0
0. 0 0. 5 1.0 1 .5 2.0 2. 5 3. 0
-VDS Drain-t o-So urce Volta ge(V )
Figure 1: Out put Chara cter istics
220
200
180
VGS =-4.5V
160
140
120
VGS =-10V
100
80
RD S(on)- On -Resi stance( mΩ)
60
40
0 1 2 3 4 5 6 7 8 9
-ID- Dra inCu rrent(A )
Figure 3 : On-R esistan ce vs Dr ain Curre nt
1. 6
ID= -25 0uA
1. 4
2. 0
VGS =-10V
1. 8
IDS =-2.9A
1. 6
1. 4
1. 2
1. 0
0. 8
0. 6
RD S(ON) -On Re sist ance
(Norma lize d)
0. 4
0. 2
0
-50 -25 0 25 5 0 75 10 0 125 150
TJ -Jun ctio n Tem peratur e(℃)
Figure 2 : On-R esistan ce vs. Junctio n Tem pera ture
RON @Tj= 25℃;9 5mΩ
240
220
200
mΩ)
(
180
e
cR
an
t
160
is
s
e
R
140
n
-O
)
120
ON
(
S
D
100
80
0 1 2 3 4 5 6 7 8 9 10
-VGS Gate-to -Sou rce Voltag e(V)
Figure 4 : On-R esis tance vs. Gate -to- Sou rce Vol tage
10
ID= -2. 9A
1. 2
1. 0
0. 8
0. 6
-VG S(th) Va rian ce(V)
0. 4
0. 2
0. 0
-50 -25 0 25 5 0 75 10 0 125 150
Figure 5: Thr esho ld Voltage
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TJ- Tempe ratu er(℃)
Tj= 150℃
1
-Is-So urce C urre nt(A)
0. 1
0 0. 2 0. 4 0.6 0 .8 1.0 1. 2 1. 4 1.6
-VSD -So urce -to- Drain Volt age( V)
Figure 6: Sou rce- Drain Dio de For ward Vo lta ge
Tj= 25℃
3
Feb.20 12 Re v.2.0

Typical Electrical and Thermal Ch aracteristics
MI3471
10
( )-
8
ge
lt V
Vo
6
c a
u e
o
-S r
4
e
t -to
SG Ga
2
V
0
0 1 2 3 4 5 6 7
Qg-Total G ate Ch arge(nC )
Figur 7 :G ate Ch ange
100.0
T
=150°C
J(M ax)
T A =25°C
10.0
R
DS( ON)
limited
(A mps )
D
I
1.0
0.1s
1s
10s
0.1
0.1
1 1
DC
VDS (Volts)
Figure 9 : Max imum Forw ard Biase d Saf e
Operat ing Ar ea (Note d)
10
t
n
ie
n
a
e
c
ive r s
t T
e n
c
p da
e
f
e
f
d
l
E
e
ma
r
z d
0.1
e
h
T
ma i
Nor l
1
D=T on/T
T
J,P K=TA +PDM
Rθ JA=130 W℃/
.
Z
JA
θ
100 µ s
1ms
10ms
0 100
360
320
Freque ncy =1MHz
280
240
200
160
Capaci tanc e(pF )
120
80
40
Crss
0
0 5 10 15 20 25 30
-VDS Dai n-to -Source Vo ltag e(V)
Coss
Figure 8 : Capa citance
40
T
30
)
W
(
r
20
e
w
o
P
T A =25°C
10
0
0.001 0. 01 0.1
1 1
Pulse Wi dth ( s)
Figure 1 0: Si ngle Puls e Power Rat ing J unction -to-
Ambien t (No te d)
In desce ndi ng order
D=0.5, 0 .3, 0 .1, 0.05, 0 .02, 0.01 , single pu lse
P
D
T
o n
T
Ciss
=150°C
J(M ax)
0 10 0 1000
0.01
0.00001 0.0001 0.001 0.01 0.1 1 1 0 100 1000
Pulse Wi dth ( s)
Figure 11 : Normali zed Maxim um Tra nsient Therma l Imp edance
Note d:
T A=25 °C. The SOA cu rve provi des a s ingle pul se rating .
These te sts a re perfor med with th e device mo unt ed on 1 in FR -4 bo ard with 2o z. Copper, i n a sti ll air envi ronment w ith
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2
4
Feb.20 12 Re v.2.0

Package
SOT -23 3-Lead
MI3471
D
3
1 2
e
e1
T OP VIEW
E1 E
A
SYMBOL MIN NOM MAX
A 0.70 1.15
1.00
A1 0.00 0.13
b 0.30 0.50
c 0.20
0.08
D 2. 80 3.1 0
E 2 .60 3. 00
E1 1. 40 1.80
0.40
0.13
2.90
2.80
1.60
e 0.95 BSC
e1 1. 90 BS C
L 0 .40 0 REF
L1 0 .54 0 REF
0 º 8 º
θ
θ
5º
b
A1
SIDE VIEW
Notes:
(1) All dimensions are i n mil lim eters. Angles in degre es.
(2) Complies with JEDE C TO -23 6.
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L1 L
END VIEW
5
Feb.20 12 Re v.2.0
c
Doc.SOT233-090701