Datasheet MGC3130 Datasheet
MGC3130
Single-Zone 3D Tracking and Gesture Controller Data Sheet
Introduction:
The MGC3130 is a three-dimensional (3D) gesture
recognition and tracking controller chip based on
Microchip’s patented GestIC
user command input with natural hand and finger
movements. Utilizing the principles of electrical nearfield sensing, the MGC3130 contains all the building
blocks to develop robust 3D input sensing systems.
Implemented as a low-power mixed-signal
configurable controller, it provides a large set of smart
functional features with integrated signal driver, a
frequency adaptive input path for automatic noise
suppression and a digital signal processing unit.
Microchip’s on-chip Colibri Suite minimizes processing
needs, reduces system power consumption and results
in low software development efforts for fast time-tomarket success. The MGC3130 is a unique solution
that provides gesture information as well as positional
data of the human hand in real time and allows
realization of a new generation of user interfaces
across various industries.
®
technology. It enables
Applications:
• Displays
• Notebooks/Keyboards/PC Peripherals
• Mobile Phones
• Tablet Computers
• Electronic Readers
• Remote Controls
• Game Controllers
Power Features:
• Variety of Several Power Operation modes
include:
- Processing mode: 20 mA @ 3.3V, typical
- Programmable Self Wake-up: 110 µA @ 3.3V
- Deep Sleep: 9 µA @ 3.3V, typical
Key Features:
• Recognition of 3D Hand Gestures and x, y, z
Positional Data
• Proximity and Touch Sensing Capabilities
• Built-in Colibri Gesture Suite
• Advanced 3D Signal Processing Unit
• Detection Range: 0 to 15 cm
• Receiver Sensitivity: <1 fF
• Position Rate: 200 positions/sec
• Spatial Resolution: up to 150 dpi
• Carrier Frequency: 44 kHz to 115 kHz
• Channels Supported:
- Five receive (Rx) channels
- One transmit (Tx) channel
• On-chip Auto Calibration
• Low Noise Radiation due to Low Transmit Voltage
and Slew Rate Control
• Noise Susceptibility Reduction:
- On-chip analog filtering
- On-chip digital filtering
- Automatic frequency hopping
• Enables the use of Low-Cost Electrode Material
including:
- Printed circuit board
- Conductive paint
- Conductive foil
- Laser Direct Structuring (LDS)
- Touch panel ITO structures
• Field Upgrade Capability
• Small Outline, 28-lead QFN package, 5x5 mm
• Operating Voltage: 2.5V to 3.465V (single supply)
• Temperature Range: -20°C to +85°C
Peripheral Features:
•2x I2C™ or SPI Interface for Configuration and
Streamin g of Positional and Gesture Data
• Multi-zone Support via Master/Slave Architecture
2012-2013 Microchip Technology Inc. Advance Information DS40001667C-page 1
MGC3130
QFN
1
2
3
4
5
6
715
8
9
10
11
12
13
14
16
17
18
19
20
21
26
25
24
23
22
28
27
VCAPS
VINDS
VSS2
RX0
RX1
RX2
RX3
RX4
V
CAPA
VSS3
VCAPD
EIO0
EIO1
EIO2
EIO5/SI1
EIO4/SI0
EIO3
NC
NC
NC
IS2
EIO6/SI2
MCLR
T
XD
NC
V
SS1
VDD
EIO7/SI3
MGC3130
EXP-29
Package Type
The device is available in 28-lead QFN packaging (see
Figure 1).
FIGURE 1: 28-PIN DIAGRAM (MGC3130)
DS40001667C-page 2 Advance Information 2012-2013 Microchip Technology Inc.
MGC3130
TABLE 1: 28-PIN QFN PINOUT DESCRIPTION
Pin Name
VCAPS 1P— External filter capacitor (10 µF) connection for internal STEP-UP
V
INDS 2P
SS2 3P
V
RX0 4 I Analog
RX1 5 I Analog
RX2 6 I Analog
RX3 7 I Analog
RX4 8 I Analog
CAPA 9P
V
SS3 10 P
V
CAPD 11 P
V
EIO0 12 I/O ST Extended IO0 (EIO0)/Transfer Status (TS). TS line requires
EIO1 13 I/O ST Extended IO1 (EIO1)/Interface Selection Pin 1 (IS1).
EIO2 14 I/O ST Extended IO2 (EIO2)/IRQ0.
IS2 15 I ST Interface Selection Pin 2 (IS2).
NC 16
NC 17
NC 18
EIO3 19 I/O ST Extended IO3 (EIO3)/IRQ1/SYNC.
EIO4/SI0 20 I/O ST Extended IO4 (EIO4)/Serial Interface 0 (SI0): I2C™_SDA0/
EIO5/SI1 21 I/O ST Extended IO5 (EIO5)/Serial Interface 1 (SI1): I
EIO6/SI2 22 I/O ST Extended IO6 (EIO6)/Serial Interface 2 (SI2): I
EIO7/SI3 23 I/O ST Extended IO7 (EIO7)/Serial Interface 3 (SI3): I
MCLR
T
XD 25 O Analog Transmit electrode connection.
NC 26
SS1 27 P
V
VDD 28 P
EXP 29 P
Legend: P = Power; ST = Schmitt Trigger input with CMOS levels; O = Output; I = Input; — = N/A
Pin
Number
Pin Type Buffer Type Description
converter (optional).
—
External inductor (4.7 µH) + Schottky diode connection for internal
STEP-UP converter usage (optional).
—
Ground reference for the STEP-UP converter.
Analog input channels: Receive electrode connection.
—
External filter capacitor (4.7 µF) connection for internal analog
voltage regulator (3V).
—
—
Common ground reference for analog and digital domain.
External filter capacitor (4.7 µF) connection for internal digital
voltage regulator (1.8V).
external 10 kpull-up
——
——
——
Reserved: do not connect.
Reserved: do not connect.
Reserved: do not connect.
SPI_MISO. When I
2
C™ is used, this line requires an external 1.8
kpull-up.
2
C™_SCL0/SPI_-
MOSI. When I
2
C™ is used, this line requires an external 1.8 k
pull-up.
2
C™_SDA1/
SPI_CS. When I
2
C™ is used, this line requires an external 1.8 k
pull-up.
2
C™_SCL1/SPI_S-
CLK. When I
2
C™ is used, this line requires an external 1.8 k
pull-up.
24 I/P ST Master Clear (Reset) input. This pin is an active-low Reset to the
device. It requires external 10 kpull-up.
——
—
—
Reserved: do not connect.
Common ground reference for analog and digital domains.
Positive supply for peripheral logic and I/O pins.
It requires an external filtering capacitor (100 nF).
—
Exposed pad. It should be connected to Ground.
2012-2013 Microchip Technology Inc. Advance Information DS40001667C-page 3
MGC3130
Table of Contents
1.0 Theory of Operation: Electrical Near-Field (E-Field Sensing).................................................................................................... 5
2.0 Feature Description.................................................................................................................................................................... 7
3.0 System Architecture ................................................................................................................................................................ 10
4.0 Functional Description ............................................................................................................................................................. 13
5.0 Application Architecture ........................................................................................................................................................... 23
6.0 Interface Description ................................................................................................................................................................ 24
7.0 Hardware Integration ............................................................................................................................................................... 33
8.0 Development Support .............................................................................................................................................................. 36
9.0 Electrical Specifications ........................................................................................................................................................... 37
10.0 Packaging Information ............................................................................................................................................................. 38
The Microchip Web Site....................................................................................................................................................................... 43
Customer Change Notification Service ................................................................................................................................................ 43
Customer Support ................................................................................................................................................................................ 43
Product Identification System .............................................................................................................................................................. 44
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DS40001667C-page 4 Advance Information 2012-2013 Microchip Technology Inc.
MGC3130
1.0 THEORY OF OPERATION: ELECTRICAL NEAR-FIELD (E-FIELD) SENSING
Microchip’s GestIC is a 3D sensor technology which
utilizes an electric field (E-field) for advanced proximity
sensing. It allows realization of new user interface
applications by detection, tracking and classification of
a user’s hand or finger motion in free space.
E-fields are generated by electrical charges and
propagate three-dimensionally around the surface,
carrying the electrical charge.
Applying direct voltages (DC) to an electrode results in
a constant electric field. Applying alternating voltages
(AC) makes the charges vary over time and thus, the
field. When the charge varies sinusoidal with frequency
f, the resulting electromagnetic wave is characterized
by wavelength λ = c/f, where c is the wave propagation
velocity — in vacuum, the speed of light. In cases
where the wavelength is much larger than the electrode
geometry, the magnetic component is practically zero
and no wave propagation takes place. The result is
quasi-static electrical near field that can be used for
sensing conductive objects such as the human body.
Microchip’s GestIC technology uses transmit (Tx)
frequencies in the range of 100 kHz which reflects a
wavelength of about three kilometers. With electrode
geometries of typically less than fourteen by fourteen
centimeters, this wavelength is much larger in
comparison.
In case a person’s hand or finger intrudes the electrical
field, the field becomes distorted. The field lines are
drawn to the hand due to the conductivity of the human
body itself and shunted to ground. The threedimensional electric field decreases locally. Microchip’s
GestIC technology uses a minimum number of four
receiver (Rx) electrodes to detect the E-field variations
at different positions to measure the origin of the
electric field distortion from the varying signals
received. The information is used to calculate the
position, track movements and to classify movement
patterns (gestures).
The simulation results in Figure 1-1 and Figure 1-2
show the influence of an earth-grounded body to the
electric field. The proximity of the body causes a compression of the equipotential lines and shifts the Rx
electrode signal levels to a lower potential which can be
measured.
FIGURE 1-1: EQUIPOTENTIAL LINES
OF AN UNDISTORTED
E-FIELD
FIGURE 1-2: EQUIPOTENTIAL LINES
OF A DISTORTED E-FIELD
2012-2013 Microchip Technology Inc. Advance Information DS40001667C-page 5
MGC3130
1.1 GestIC Technology Benefits
• GestIC E-field sensors are not impacted by
ambient influences such as light or sound, which
have a negative impact to the majority of other 3D
technologies.
• The GestIC technology has a high immunity to
noise, provides high update rates and resolution,
low latency and is also not affected by clothing,
surface texture or reflectivity.
• A carrier frequency in the range of 44-115 kHz is
being used with the benefit of being outside the
regulated radio frequency range. In the same
manner, GestIC is not affected by radio
interference.
• Usage of thin low-cost materials as electrodes
allow low system cost at slim industrial housing
designs.
• The further use of existing capacitive sensor
structures such as a touch panel’s ITO coating
allow additional cost savings and ease the
integration of the technology.
• Electrodes are invisible to the users’ eye since
they are implemented underneath the housing
surface or integrated into a touch panel’s ITO
structure.
• GestIC works centrically over the full sensing
space. Thus, it provides full surface coverage
without any detection blind spots.
• Only one GestIC transmitter electrode is used for
E-field generations. The benefit is an overall low
power consumption and low radiated EMC noise.
• Since GestIC is basically processing raw
electrode signals and computes them in real time
into pre-processed gestures and accurate x, y, z
positional data, it provides a highly flexible user
interface technology for any kind of electronic
devices.
DS40001667C-page 6 Advance Information 2012-2013 Microchip Technology Inc.
MGC3130
Digital Signal Processing
Colibri Suite
Position
Tracking
Gesture
Recognition
Approach
Detection
2.0 FEATURE DESCRIPTION
2.1 Gesture Definition
A hand gesture is the movement of the hand to express
an idea or meaning. The GestIC technology accurately
allows sensing of a user’s free space hand motion for
contact free position tracking, as well as three-dimensional (3D) gesture recognition based on classified
movement patterns.
2.2 GestIC Library
MGC3130 is being provided with a GestIC Library,
stored on the chip’s Flash memory. The library
includes:
• Colibri Suite: Digital Signal Processing (DSP)
algorithms and feature implementations.
• System Control: MGC3130 hardware control
features such as Analog Front End (AFE) access,
interface control and parameters storage.
• Library Loader: GestIC Library update through the
application host’s interface.
2.2.1 COLIBRI SUITE
The Colibri Suite combines data acquisition, digital
signal processing and interpretation.
The Colibri Suite functional features are illustrated in
Figure 2-1 and described in the following sections.
FIGURE 2-1: COLIBRI SUITE CORE
2.2.1.1 Position Tracking
The Colibri Suite’s Position Tracking feature provides
three-dimensional hand position over time and area.
The absolute position data is provided according to the
defined origin of the Cartesian coordinate system (x, y,
z). Position Tracking data is continuously acquired in
parallel to Gesture Recognition. With a position rate of
up to 200 positions/sec., a maximum spatial resolution
of 150 dpi is achieved.
ELEMENTS
2.2.1.2 Gesture Recognition
The Colibri Suite’s gesture recognition model detects
and classifies hand movement patterns performed
inside the sensing area.
Using advanced stochastic classification based on
Hidden Markov Model (HMM), industry best gesture
recognition rate is being achieved. In addition, there
are some gestures derived from the combination of
Gesture Recognition and spatial information.
The Colibri Suite includes a set of predefined hand
gestures which contains flick, circular and symbol
gestures as the ones outlined below:
• Flick gestures
A flick gesture is a unidirectional gesture in a quick
flicking motion. An example may be a hand movement
from West to East within the sensing area, from South
to North, etc.
• Circular gestures
A circular gesture is a round-shaped hand movement
defined by direction (clockwise/counterclockwise)
without any specific start position of the user’s hand.
Two types of circular gestures are distinguished by
GestIC technology:
1. Discrete Circles
Discrete Circles are recognized after performing a
hand movement inside the sensing area. The
recognition result (direction: clockwise/
counterclockwise) is provided after the hand movement
stops or the hand exits the detection area. The Discrete
Circles are typically used as dedicated application
control commands.
2. AirWheel
An AirWheel is the recognition of continuouslyperformed circles inside the sensing area and provides
information about the rotational movement in real time.
It starts after at least one quadrant of a circle is
recognized and provides continuously counter
information which increments/decrements according to
the movement’s direction (clockwise/
counterclockwise). The AirWheel can be adjusted for
convenient usage in various applications (e.g., volume
control, sensitivity adjustment or light dimming).
ensor Touch Gestures
•S
A Sensor Touch is a multi-zone gesture that reports up
to five concurrently-performed touches on the system’s
electrodes.
The Sensor Touch provides information about Touch
and Tapping:
1. Touch
The Sensor Touch indicates an event during which a
GestIC electrode is touched. This allows distinction
between short and long touches.
2. Tap and Double Tap
2012-2013 Microchip Technology Inc. Advance Information DS40001667C-page 7
MGC3130
Touch
Touch
detected
Tap
Tap
detected
Single Tap Duration
0s-1s
Double Tap
Double Tap
detected
Double Tap Duration
0s-1s
The Tap and Double Tap signalize short taps and
double taps on each system electrode. The Tap length
and Double Tap interval are adjustable.
- Single Tap Delay: A Single Tap is detected
when touching the surface of an electrode
first and after the hand is pulled out of the
touch area. The Single Tap is only detected
when the timing between the touch and the
release of the touch event is smaller than the
adjusted delay. Increasing the time allows the
user more time to perform the tap. The range
for the adjusted delay can be between 0s and
1s.
- Double Tap Delay: The double tap is detected
FIGURE 2-2: SENSOR TOUCH DIAGRAM
when two taps are performed within the
adjusted delay. The range for the adjusted
delay can be between 0s and 1s. The smaller
the selected delay is, the faster the two taps
have to be executed.
• Gesture Port
The Gesture Port enables a flexible mapping of Colibri
Suite feature events to certain output signals at defined
MGC3130’s pins. The individual feature events can be
mapped to one of five EIO Pins and trigger a variety of
signal changes (Permanent high, Permanent low, Toggle, Pulse (5 ms), High Active, Low Active). The Gesture Port simplifies and enhances embedded system
integration.
DS40001667C-page 8 Advance Information 2012-2013 Microchip Technology Inc.
2.2.1.3 Approach Detection
Current
time
Periodic Approach Scans
Calibration
Scan
Periodic Approach Scans
Calibration
Scan
Periodic Approach Scans
Calibration
Scan
Periodic Approach Scans
Scan Interval
20ms-150ms
Calibrati on Start Scan Interv al
2s-10s
I
sleep
= 9µA
I
5CHSCAN
= 20mA
I
5CHSCAN
: Scan Phase with 5 active RX channel s: Calibrat ion Scan
I
sleep
: Sleep Phase
Calibrati on Final Scan Interv al
2s-1024s
Calibrati on Transition Ti me (Non-user act ivity timeout)
2s-255s
Processing
Mode
Idle Timeout
5s-1024s
Self Wake-up mode
Approach Detection is an embedded power-saving
feature of Microchip’s Colibri Suite. It sends MGC3130
to Sleep mode and scans periodically the sensing area
to detect the presence of a human hand.
Utilizing the in-built Self Wake-up mode, Approach
Detection alternates between Sleep and Scan phases.
During the Scan phases, the approach of a human
hand can be detected while very low power is
consumed. For more details, please see
Section 4.2.4.3 “Self Wake-up Mode”.
A detected approach of a user exceeding configured
threshold criteria will alternate the MGC3130 from Self
Wake-up to Processing mode or even the application
host in the overall system.
Within the Approach Detection sequence, the following
scans are performed:
• Approach Scan
during the Scan phase of the MGC3130’s Self
Wake-up mode. Typically, 1 Rx channel is active
but more channels can be activated via GestIC
Library. The time interval (Scan Interval) between
two consecutive Approach Scans is configurable.
For typical applications, the scan cycle is in a
range of 20 ms to 150 ms. During the Approach
Scan, the activated Rx channels are monitored for
signal changes which are caused by, for example,
an approaching human hand and exceeding the
defined threshold. This allows an autonomous
wake-up of the MGC3130 and host applications at
very low-power consumption.
: An Approach Scan is performed
MGC3130
(1)
• Calibration Scan
feature includes the possibility to perform
additional Calibration Scans for the continuous
adaptation of the electrode system to
environmental changes.
A Calibration Scan is performed during the Scan
phase of the MGC3130’s Self Wake-up mode.
Five Rx channels are active to calibrate the
sensor signals. The Calibration Scan is usually
performed in configurable intervals from 2s to
1024s.
To reduce the power consumption, the number of
scans per second can be decreased after a
certain time of non-user activity. Colibri Suite
provides a full user flexibility to configure the
starting Calibration Scans rate (Calibration Start
Scan Interval), non-user activity time-out
(Calibration Transition Time) and the Calibration
Scans rate (Calibration Final Scan Interval) which
will be used afterwards. A typical implementation
uses Calibration Scans every 2s during the first
two minutes, and every 10s afterwards, until an
approach is detected.
Note 1: The Calibration Scan is only needed for
applications using the Position Tracking
feature.
The timing sequence of the Approach Detection feature
is illustrated in Figure 2-3.
: The Approach Detection
FIGURE 2-3: APPROACH DETECTION SEQUENCE
2012-2013 Microchip Technology Inc. Advance Information DS40001667C-page 9
MGC3130
MGC3130
Controller
Analog Front End
Communications
Interfaces
GestIC
®
Library
External
Electrodes
Tx
Rx5
Signal Processing
Unit
To application
host
3.0 SYSTEM ARCHITECTURE
The MGC3130 is the first product based on Microchip’s
GestIC technology. It is developed as a mixed-signal
configurable controller. The entire system solution is
composed by three main building blocks (see
Figure 3-1):
• MGC3130 Controller
• GestIC Library
• External Electrodes
3.1 MGC3130 Controller
The MGC3130 features the following main building
blocks:
• Low Noise Analog Front End (AFE)
• Digital Signal Processing Unit (SPU)
• Flexible Communication Interfaces
It provides a transmit signal to generate the E-field,
conditions the analog signals from the receiving
electrodes and processes these data digitally on the
SPU. Data exchange between the MGC3130 and the
host is conducted via the controller’s communication
interface. For details, please refer to Section 4.0
“Functional Description”.
3.2 GestIC Library
The embedded GestIC Library is optimized to ensure
continuous and real-time free-space Position Tracking
and Gesture Recognition concurrently. It is fullyconfigurable and allows required parameterization for
individual application and external electrodes.
3.3 External Electrodes
Electrodes are connected to MGC3130. An electrode
needs to be individually designed for optimal E-field
distribution and detection of E-field variations inflicted
by a user.
FIGURE 3-1: MGC3130 CONTROLLER SYSTEM ARCHITECTURE
DS40001667C-page 10 Advance Information 2012-2013 Microchip Technology Inc.
MGC3130
C
RxTx
C
TxG
C
RxG
System ground
Transmitter signal
Electrode signal
C
H
Earth ground
E-field
To MGC3130
V
Tx
System
Ground
e
Rx
e
Tx
V
RxBuf
V
RxBuf
V
Tx
C
RxTx
C
RxTx
C
RxGCH
++
---------------------------------------------- -=
3.3.1 ELECTRODE EQUIVALENT CIRCUIT
The hand Position Tracking and Gesture Recognition
capabilities of a GestIC system depends on the
electrodes design and their material characteristics.
A simplified equivalent circuit model of a generic
GestIC electrode system is illustrated in Figure 3-2.
FIGURE 3-2: ELECTRODES CAPACITIVE EQUIVALENT CIRCUITRY EARTH GROUNDED
•VTX: Tx electrode voltage
•V
•C
•C
•C
•C
•e
•e
The Rx and Tx electrodes in a GestIC electrode system
build a capacitance voltage divider with the
capacitances C
the electrode design. C
capacitance to system ground driven by the Tx signal.
The Rx electrode measures the potential of the
generated E-field. If a conductive object (e.g., a hand)
approaches the Rx electrode, C
capacitance. This minuscule change in the femtofarad
range is detected by the MGC3130 receiver.
The equivalent circuit formula for the earth-grounded
circuitry is described in Equation 3-1.
: MGC3130 Rx input voltage
RXBUf
: Capacitance between receive electrode and
H
hand (earth ground). The user’s hand can always
be considered as earth-grounded due to the
comparable large size of the human body.
: Capacitance between receive and transmit
RXTX
electrodes
: Capacitance of the receive (Rx) electrode
RXG
to system ground + input capacitance of the
MGC3130 receiver circuit
: Capacitance of the transmit (Tx) electrode
TxG
to system ground
: Rx electrode
Rx
: Tx electrode
Tx
RxTx
and C
which are determined by
RxG
represents the Tx electrode
TxG
changes its
H
EQUATION 3-1: ELECTRODES
EQUIVALENT CIRCUIT
A common example of an earth-grounded device is a
notebook, even with no ground connection via power
supply or ethernet connection. Due to its larger form
factor, it presents a high earth-ground capacitance in
the range of 50 pF and thus, it can be assumed as an
earth-grounded GestIC system.
A brief overview of the typical values of the electrodes
capacitances is summarized in Tab le 3- 1.
TABLE 3-1: ELECTRODES
CAPACITANCES TYPICAL
VALUES
Capacity Typical Value
C
RXTX
C
TXG
C
RXG
C
H
10...30 pF
10...1000 pF
10...30 pF
<1 pF
2012-2013 Microchip Technology Inc. Advance Information DS40001667C-page 11
MGC3130
South
West
East
Center
North
Top Layer (Lateral Rx)
Top Layer (Center Rx)
Tx Layer
Note: Ideal designs have low C
ensure higher sensitivity of the electrode
system. Optimal results are achieved with
C
RxTx
range.
and C
values being in the same
RxG
RxTx
and C
RxG
to
3.3.2 STANDARD ELECTRODE DESIGN
The MGC3130 electrode system is typically a doublelayer design with a Tx transmit electrode at the bottom
layer to shield against device ground and thus, ensure
high receive sensitivity. Up to five comparably smaller
Rx electrodes are placed above the Tx layer providing
the spatial resolution of the GestIC system. Tx and Rx
FIGURE 3-3: FRAME SHAPE ELECTRODES
are separated by a thin isolating layer. The Rx
electrodes are typically arranged in a frame
configuration as shown in Figure 3-3. The frame
defines the inside sensing area with maximum
dimensions of 14x14 centimeters. An optional fifth
electrode in the center of the frame may be used to
improve the distance measurement and add simple
touch functionality.
The electrodes’ shapes can be designed solid or
structured. In addition to the distance and the material
between the Rx and Tx electrodes, the shape structure
density also controls the capacitance C
the sensitivity of the system.
RXTX
and thus,
DS40001667C-page 12 Advance Information 2012-2013 Microchip Technology Inc.
MGC3130
Host
Signal
Processing
Unit (SPU)
Power Management
Unit (PMU)
Internal clockTX Signal Generation
External
Electrodes
Communication
control
I2C
TM
SPI
MGC3130
Controller
Signal
conditioning
ADC
Signal
conditioning
ADC
Signal
conditioning
ADC
Signal
conditioning
ADC
Signal
conditioning
ADC
FLASH
memory
IOs
Reset block
Voltage Reference
(V
REF)
TXD
RX0
RX1
RX2
RX3
RX4
MCLR
SI0
SI1
SI2
SI3
EIO1
EIO2
EIO3
IS2
EIO0
INTERNAL BUS
Low-Power
Wake-up
4.0 FUNCTIONAL DESCRIPTION
Zone Design) or a single MGC3130 and another circuit
with a corresponding interface, such as a touch screen
Microchip Technology’s MGC3130 configurable
controller uses up to five E-field receiving electrodes.
Featuring a Signal Processing Unit (SPU), a wide
range of 3D gesture applications are being preprocessed on the MGC3130, which allows short
development cycles.
Always-on 3D sensing, even for battery-driven mobile
devices, is enabled due to the chip’s low-power design
and variety of programmable power modes. A Self
Wake-up mode triggers interrupts to the application
host reacting to interaction of a user with the device
and supporting the host system in overall power
controller.
GestIC sensing electrodes are driven by a low-voltage
signal with a frequency in the range of 100 kHz, which
allows their electrical conductive structure to be made
of any low-cost material. Even the reuse of existing
conductive structures, such as a display’s ITO coating,
is feasible, making the MGC3130 an overall, very costeffective system solution.
Figure 4-1 provides an overview of the main building
blocks of MGC3130. These blocks will be described in
the following sections.
reduction.
Featuring a programmable 4-pin digital interface, the
MGC3130 matches a multitude of hardware
requirements. Developers have the choice of data
exchange via I
2
C interfaces, developers have the option to set up a
I
2
C or SPI. Since the device provides two
master-slave architecture between two MGC3130
devices to add an additional sensing area (e.g., Two-
FIGURE 4-1: MGC3130 CONTROLLER BLOCK DIAGRAM
2012-2013 Microchip Technology Inc. Advance Information DS40001667C-page 13
MGC3130
MCLR
Glitch Filter
Deep sleep
WDTR
Software Reset (SWR)
WDT Time-out
SYSRST
SPU
Digital
Peripherals
Reset Block
Internal Osc.
VDDC Domain
Analog voltage
regulator
Digital voltage
regulator
Flash
Memory
Wake-up logic
WDTR
EIO
VDDM Domain
STEP-UP converter
VCAPS
VSS2
VDD
VSS1
V
CAPA
V
SS3
ADC
Signal Conditioning Blocks
VDDA Domain
VCAPD
VINDS
VDD Domain
4.1 Reset Block
The Reset block combines all Reset sources. It
controls the device system’s Reset signal (SYSRST).
The following is a list of device Reset sources:
•MCLR
• SWR: Software Reset available through GestIC
• WDTR: Watchdog Timer Reset
A simplified block diagram of the Reset block is
illustrated in Figure 4-2.
FIGURE 4-2: SYSTEM RESET BLOCK
: Master Clear Reset pin
Library
DIAGRAM
• V
DDA Domain: This domain is powered by
DDA = 3.0V. It is generated by an embedded low-
V
impedance and fast linear voltage regulator.
During Deep Sleep mode, the analog voltage
regulator is switched off. V
DDA is the internal
analog power supply voltage for the ADCs and
the signal conditioning. An external block
capacitor, C
• V
DDM Domain: This domain is powered by
DDM = 3.3V. VDDM is the internal power supply
V
EFCA, is required on VCAPA pin.
voltage for the internal Flash memory. This power
supply is depending on VDD voltage range. If
DD ≥ 3.3V, the memory is directly powered
V
through the V
DD pin. In case of VDD < 3.3V, the
Flash power supply is generated internally by an
embedded STEP-UP converter.
FIGURE 4-3: POWER SCHEME BLOCK
DIAGRAM
4.2 Power Control and Clocks
4.2.1 POWER MANAGEMENT UNIT (PMU)
The device requires a 3.3V ±5% supply voltage at VDD.
Enabling the internal STEP-UP converter extends the
voltage range to 2.5 to 3.465V.
According to Figure 4-3, the used power domains are
as follows:
DD Domain: This domain is powered by
• V
DD = 2.5V to 3.465V (typical VDD = 3.3V). VDD is
V
the external power supply for EIO, wake-up logic,
WDTR, internal regulators and STEP-UP
converter. It is provided externally through the
DD pin.
V
• V
DDC Domain: This domain is powered by
DDC = 1.8V. It is generated by an embedded low-
V
impedance and fast linear voltage regulator. The
voltage regulator is working under all conditions
(also during Deep Sleep mode) preserving the
MGC3130 data context. V
power supply voltage for digital blocks, Reset
block and RC oscillators. An external block
capacitor, C
DS40001667C-page 14 Advance Information 2012-2013 Microchip Technology Inc.
EFCD, is required on VCAPD pin.
DDC is the internal
• STEP-UP Converter: The STEP-UP converter is
generating 3.3V from the connected supply
voltage V
DD (if it is lower than 3.3V). This voltage
is required by the internal Flash memory. The
required voltage reference is taken from the
voltage reference block. During Deep Sleep
mode, the converter is switched off. It requires an
external connected inductor, a filtering capacitor
and a Schottky diode connected to the V
CAPS pins. If the supply voltage is high enough,
V
INDS and
the STEP-UP converter will be disabled. Please
refer to Section 9.0 “Electrical Specifications”
for more details.
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