Datasheet MGC3130 Datasheet

Page 1

MGC3130

Single-Zone 3D Tracking and Gesture Controller Data Sheet

Introduction:

The MGC3130 is a three-dimensional (3D) gesture recognition and tracking controller chip based on Microchip’s patented GestIC user command input with natural hand and finger movements. Utilizing the principles of electrical nearfield sensing, the MGC3130 contains all the building blocks to develop robust 3D input sensing systems. Implemented as a low-power mixed-signal configurable controller, it provides a large set of smart functional features with integrated signal driver, a frequency adaptive input path for automatic noise suppression and a digital signal processing unit. Microchip’s on-chip Colibri Suite minimizes processing needs, reduces system power consumption and results in low software development efforts for fast time-tomarket success. The MGC3130 is a unique solution that provides gesture information as well as positional data of the human hand in real time and allows realization of a new generation of user interfaces across various industries.

technology. It enables

Applications:

• Displays

• Notebooks/Keyboards/PC Peripherals

• Mobile Phones

• Tablet Computers

• Electronic Readers

• Remote Controls

• Game Controllers

Power Features:

• Variety of Several Power Operation modes include:

- Processing mode: 20 mA @ 3.3V, typical

- Programmable Self Wake-up: 110 µA @ 3.3V

- Deep Sleep: 9 µA @ 3.3V, typical

Key Features:

• Recognition of 3D Hand Gestures and x, y, z Positional Data

• Proximity and Touch Sensing Capabilities

• Built-in Colibri Gesture Suite

• Advanced 3D Signal Processing Unit

• Detection Range: 0 to 15 cm

• Receiver Sensitivity: <1 fF

• Position Rate: 200 positions/sec

• Spatial Resolution: up to 150 dpi

• Carrier Frequency: 44 kHz to 115 kHz

• Channels Supported:

- Five receive (Rx) channels

- One transmit (Tx) channel

• On-chip Auto Calibration

• Low Noise Radiation due to Low Transmit Voltage and Slew Rate Control

• Noise Susceptibility Reduction:

- On-chip analog filtering

- On-chip digital filtering

- Automatic frequency hopping

• Enables the use of Low-Cost Electrode Material including:

- Printed circuit board

- Conductive paint

- Conductive foil

- Laser Direct Structuring (LDS)

- Touch panel ITO structures

• Field Upgrade Capability

• Small Outline, 28-lead QFN package, 5x5 mm

• Operating Voltage: 2.5V to 3.465V (single supply)

• Temperature Range: -20°C to +85°C

Peripheral Features:

•2x I2C™ or SPI Interface for Configuration and Streamin g of Positional and Gesture Data

• Multi-zone Support via Master/Slave Architecture

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Page 2

MGC3130

QFN

715

VCAPS

VINDS

VSS2

RX0

RX1

RX2

RX3

RX4

CAPA

VSS3

VCAPD

EIO0

EIO1

EIO2

EIO5/SI1

EIO4/SI0

EIO3

IS2

EIO6/SI2

MCLR

SS1

VDD

EIO7/SI3

MGC3130

EXP-29

Package Type

The device is available in 28-lead QFN packaging (see

Figure 1).

FIGURE 1: 28-PIN DIAGRAM (MGC3130)

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MGC3130

TABLE 1: 28-PIN QFN PINOUT DESCRIPTION

Pin Name

VCAPS 1P— External filter capacitor (10 µF) connection for internal STEP-UP

INDS 2P

SS2 3P

RX0 4 I Analog

RX1 5 I Analog

RX2 6 I Analog

RX3 7 I Analog

RX4 8 I Analog

CAPA 9P

SS3 10 P

CAPD 11 P

EIO0 12 I/O ST Extended IO0 (EIO0)/Transfer Status (TS). TS line requires

EIO1 13 I/O ST Extended IO1 (EIO1)/Interface Selection Pin 1 (IS1).

EIO2 14 I/O ST Extended IO2 (EIO2)/IRQ0.

IS2 15 I ST Interface Selection Pin 2 (IS2).

NC 16

NC 17

NC 18

EIO3 19 I/O ST Extended IO3 (EIO3)/IRQ1/SYNC.

EIO4/SI0 20 I/O ST Extended IO4 (EIO4)/Serial Interface 0 (SI0): I2C™_SDA0/

EIO5/SI1 21 I/O ST Extended IO5 (EIO5)/Serial Interface 1 (SI1): I

EIO6/SI2 22 I/O ST Extended IO6 (EIO6)/Serial Interface 2 (SI2): I

EIO7/SI3 23 I/O ST Extended IO7 (EIO7)/Serial Interface 3 (SI3): I

MCLR

XD 25 O Analog Transmit electrode connection.

NC 26

SS1 27 P

VDD 28 P

EXP 29 P

Legend: P = Power; ST = Schmitt Trigger input with CMOS levels; O = Output; I = Input; — = N/A

Number

Pin Type Buffer Type Description

converter (optional).

—

External inductor (4.7 µH) + Schottky diode connection for internal STEP-UP converter usage (optional).

—

Ground reference for the STEP-UP converter.

Analog input channels: Receive electrode connection.

—

External filter capacitor (4.7 µF) connection for internal analog voltage regulator (3V).

—

Common ground reference for analog and digital domain.

External filter capacitor (4.7 µF) connection for internal digital voltage regulator (1.8V).

external 10 kpull-up

——

Reserved: do not connect.

SPI_MISO. When I

C™ is used, this line requires an external 1.8

kpull-up.

C™_SCL0/SPI_-

MOSI. When I

C™ is used, this line requires an external 1.8 k

pull-up.

C™_SDA1/

SPI_CS. When I

C™ is used, this line requires an external 1.8 k

pull-up.

C™_SCL1/SPI_S-

CLK. When I

C™ is used, this line requires an external 1.8 k

pull-up.

24 I/P ST Master Clear (Reset) input. This pin is an active-low Reset to the

device. It requires external 10 kpull-up.

——

—

Reserved: do not connect.

Common ground reference for analog and digital domains.

Positive supply for peripheral logic and I/O pins. It requires an external filtering capacitor (100 nF).

—

Exposed pad. It should be connected to Ground.

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MGC3130

1.0 Theory of Operation: Electrical Near-Field (E-Field Sensing).................................................................................................... 5

2.0 Feature Description.................................................................................................................................................................... 7

3.0 System Architecture ................................................................................................................................................................ 10

4.0 Functional Description ............................................................................................................................................................. 13

5.0 Application Architecture ........................................................................................................................................................... 23

6.0 Interface Description ................................................................................................................................................................ 24

7.0 Hardware Integration ............................................................................................................................................................... 33

8.0 Development Support .............................................................................................................................................................. 36

9.0 Electrical Specifications ........................................................................................................................................................... 37

10.0 Packaging Information ............................................................................................................................................................. 38

The Microchip Web Site....................................................................................................................................................................... 43

Customer Change Notification Service ................................................................................................................................................ 43

Customer Support ................................................................................................................................................................................ 43

Product Identification System .............................................................................................................................................................. 44

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Customer Notification System

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MGC3130

1.0 THEORY OF OPERATION: ELECTRICAL NEAR-FIELD (E-FIELD) SENSING

Microchip’s GestIC is a 3D sensor technology which utilizes an electric field (E-field) for advanced proximity sensing. It allows realization of new user interface applications by detection, tracking and classification of a user’s hand or finger motion in free space.

E-fields are generated by electrical charges and propagate three-dimensionally around the surface, carrying the electrical charge.

Applying direct voltages (DC) to an electrode results in a constant electric field. Applying alternating voltages (AC) makes the charges vary over time and thus, the field. When the charge varies sinusoidal with frequency f, the resulting electromagnetic wave is characterized by wavelength λ = c/f, where c is the wave propagation velocity — in vacuum, the speed of light. In cases where the wavelength is much larger than the electrode geometry, the magnetic component is practically zero and no wave propagation takes place. The result is quasi-static electrical near field that can be used for sensing conductive objects such as the human body.

Microchip’s GestIC technology uses transmit (Tx) frequencies in the range of 100 kHz which reflects a wavelength of about three kilometers. With electrode geometries of typically less than fourteen by fourteen centimeters, this wavelength is much larger in comparison.

In case a person’s hand or finger intrudes the electrical field, the field becomes distorted. The field lines are drawn to the hand due to the conductivity of the human body itself and shunted to ground. The threedimensional electric field decreases locally. Microchip’s GestIC technology uses a minimum number of four receiver (Rx) electrodes to detect the E-field variations at different positions to measure the origin of the electric field distortion from the varying signals received. The information is used to calculate the position, track movements and to classify movement patterns (gestures).

The simulation results in Figure 1-1 and Figure 1-2 show the influence of an earth-grounded body to the electric field. The proximity of the body causes a compression of the equipotential lines and shifts the Rx electrode signal levels to a lower potential which can be measured.

FIGURE 1-1: EQUIPOTENTIAL LINES

OF AN UNDISTORTED E-FIELD

FIGURE 1-2: EQUIPOTENTIAL LINES

OF A DISTORTED E-FIELD

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MGC3130

1.1 GestIC Technology Benefits

• GestIC E-field sensors are not impacted by ambient influences such as light or sound, which have a negative impact to the majority of other 3D technologies.

• The GestIC technology has a high immunity to noise, provides high update rates and resolution, low latency and is also not affected by clothing, surface texture or reflectivity.

• A carrier frequency in the range of 44-115 kHz is being used with the benefit of being outside the regulated radio frequency range. In the same manner, GestIC is not affected by radio interference.

• Usage of thin low-cost materials as electrodes allow low system cost at slim industrial housing designs.

• The further use of existing capacitive sensor structures such as a touch panel’s ITO coating allow additional cost savings and ease the integration of the technology.

• Electrodes are invisible to the users’ eye since they are implemented underneath the housing surface or integrated into a touch panel’s ITO structure.

• GestIC works centrically over the full sensing space. Thus, it provides full surface coverage without any detection blind spots.

• Only one GestIC transmitter electrode is used for E-field generations. The benefit is an overall low power consumption and low radiated EMC noise.

• Since GestIC is basically processing raw electrode signals and computes them in real time into pre-processed gestures and accurate x, y, z positional data, it provides a highly flexible user interface technology for any kind of electronic devices.

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MGC3130

Digital Signal Processing

Colibri Suite

Position

Tracking

Gesture

Recognition

Approach Detection

2.0 FEATURE DESCRIPTION

2.1 Gesture Definition

A hand gesture is the movement of the hand to express an idea or meaning. The GestIC technology accurately allows sensing of a user’s free space hand motion for contact free position tracking, as well as three-dimensional (3D) gesture recognition based on classified movement patterns.

2.2 GestIC Library

MGC3130 is being provided with a GestIC Library, stored on the chip’s Flash memory. The library includes:

• Colibri Suite: Digital Signal Processing (DSP) algorithms and feature implementations.

• System Control: MGC3130 hardware control features such as Analog Front End (AFE) access, interface control and parameters storage.

• Library Loader: GestIC Library update through the application host’s interface.

2.2.1 COLIBRI SUITE

The Colibri Suite combines data acquisition, digital signal processing and interpretation.

The Colibri Suite functional features are illustrated in

Figure 2-1 and described in the following sections.

FIGURE 2-1: COLIBRI SUITE CORE

2.2.1.1 Position Tracking

The Colibri Suite’s Position Tracking feature provides three-dimensional hand position over time and area. The absolute position data is provided according to the defined origin of the Cartesian coordinate system (x, y, z). Position Tracking data is continuously acquired in parallel to Gesture Recognition. With a position rate of up to 200 positions/sec., a maximum spatial resolution of 150 dpi is achieved.

ELEMENTS

2.2.1.2 Gesture Recognition

The Colibri Suite’s gesture recognition model detects and classifies hand movement patterns performed inside the sensing area.

Using advanced stochastic classification based on Hidden Markov Model (HMM), industry best gesture recognition rate is being achieved. In addition, there are some gestures derived from the combination of Gesture Recognition and spatial information.

The Colibri Suite includes a set of predefined hand gestures which contains flick, circular and symbol gestures as the ones outlined below:

• Flick gestures

A flick gesture is a unidirectional gesture in a quick flicking motion. An example may be a hand movement from West to East within the sensing area, from South to North, etc.

• Circular gestures

A circular gesture is a round-shaped hand movement defined by direction (clockwise/counterclockwise) without any specific start position of the user’s hand. Two types of circular gestures are distinguished by GestIC technology:

1. Discrete Circles

Discrete Circles are recognized after performing a hand movement inside the sensing area. The recognition result (direction: clockwise/ counterclockwise) is provided after the hand movement stops or the hand exits the detection area. The Discrete Circles are typically used as dedicated application control commands.

2. AirWheel

An AirWheel is the recognition of continuouslyperformed circles inside the sensing area and provides information about the rotational movement in real time. It starts after at least one quadrant of a circle is recognized and provides continuously counter information which increments/decrements according to the movement’s direction (clockwise/ counterclockwise). The AirWheel can be adjusted for convenient usage in various applications (e.g., volume control, sensitivity adjustment or light dimming).

ensor Touch Gestures

•S

A Sensor Touch is a multi-zone gesture that reports up to five concurrently-performed touches on the system’s electrodes.

The Sensor Touch provides information about Touch and Tapping:

1. Touch

The Sensor Touch indicates an event during which a GestIC electrode is touched. This allows distinction between short and long touches.

2. Tap and Double Tap

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MGC3130

Touch

detected

Tap

detected

Single Tap Duration

0s-1s

Double Tap

detected

Double Tap Duration

0s-1s

The Tap and Double Tap signalize short taps and double taps on each system electrode. The Tap length and Double Tap interval are adjustable.

- Single Tap Delay: A Single Tap is detected when touching the surface of an electrode first and after the hand is pulled out of the touch area. The Single Tap is only detected when the timing between the touch and the release of the touch event is smaller than the adjusted delay. Increasing the time allows the user more time to perform the tap. The range for the adjusted delay can be between 0s and 1s.

- Double Tap Delay: The double tap is detected

FIGURE 2-2: SENSOR TOUCH DIAGRAM

when two taps are performed within the adjusted delay. The range for the adjusted delay can be between 0s and 1s. The smaller the selected delay is, the faster the two taps have to be executed.

• Gesture Port

The Gesture Port enables a flexible mapping of Colibri Suite feature events to certain output signals at defined MGC3130’s pins. The individual feature events can be mapped to one of five EIO Pins and trigger a variety of signal changes (Permanent high, Permanent low, Toggle, Pulse (5 ms), High Active, Low Active). The Gesture Port simplifies and enhances embedded system integration.

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Page 9

2.2.1.3 Approach Detection

Current

time

Periodic Approach Scans

Calibration

Scan

Periodic Approach Scans

Calibration

Scan

Periodic Approach Scans

Calibration

Scan

Periodic Approach Scans

Scan Interval 20ms-150ms

Calibrati on Start Scan Interv al

2s-10s

sleep

= 9µA

5CHSCAN

= 20mA

5CHSCAN

: Scan Phase with 5 active RX channel s: Calibrat ion Scan

sleep

: Sleep Phase

Calibrati on Final Scan Interv al

2s-1024s

Calibrati on Transition Ti me (Non-user act ivity timeout)

2s-255s

Processing

Mode

Idle Timeout

5s-1024s

Self Wake-up mode

Approach Detection is an embedded power-saving feature of Microchip’s Colibri Suite. It sends MGC3130 to Sleep mode and scans periodically the sensing area to detect the presence of a human hand.

Utilizing the in-built Self Wake-up mode, Approach Detection alternates between Sleep and Scan phases. During the Scan phases, the approach of a human hand can be detected while very low power is consumed. For more details, please see

Section 4.2.4.3 “Self Wake-up Mode”.

A detected approach of a user exceeding configured threshold criteria will alternate the MGC3130 from Self Wake-up to Processing mode or even the application host in the overall system.

Within the Approach Detection sequence, the following scans are performed:

• Approach Scan

during the Scan phase of the MGC3130’s Self Wake-up mode. Typically, 1 Rx channel is active but more channels can be activated via GestIC Library. The time interval (Scan Interval) between two consecutive Approach Scans is configurable. For typical applications, the scan cycle is in a range of 20 ms to 150 ms. During the Approach Scan, the activated Rx channels are monitored for signal changes which are caused by, for example, an approaching human hand and exceeding the defined threshold. This allows an autonomous wake-up of the MGC3130 and host applications at very low-power consumption.

: An Approach Scan is performed

MGC3130

(1)

• Calibration Scan feature includes the possibility to perform additional Calibration Scans for the continuous adaptation of the electrode system to environmental changes. A Calibration Scan is performed during the Scan phase of the MGC3130’s Self Wake-up mode. Five Rx channels are active to calibrate the sensor signals. The Calibration Scan is usually performed in configurable intervals from 2s to 1024s. To reduce the power consumption, the number of scans per second can be decreased after a certain time of non-user activity. Colibri Suite provides a full user flexibility to configure the starting Calibration Scans rate (Calibration Start Scan Interval), non-user activity time-out (Calibration Transition Time) and the Calibration Scans rate (Calibration Final Scan Interval) which will be used afterwards. A typical implementation uses Calibration Scans every 2s during the first two minutes, and every 10s afterwards, until an approach is detected.

Note 1: The Calibration Scan is only needed for

applications using the Position Tracking feature.

The timing sequence of the Approach Detection feature is illustrated in Figure 2-3.

: The Approach Detection

FIGURE 2-3: APPROACH DETECTION SEQUENCE

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MGC3130

Controller

Analog Front End

Communications

Interfaces

GestIC

Library

External

Electrodes

Rx5

Signal Processing

Unit

To application

host

3.0 SYSTEM ARCHITECTURE

The MGC3130 is the first product based on Microchip’s GestIC technology. It is developed as a mixed-signal configurable controller. The entire system solution is composed by three main building blocks (see

Figure 3-1):

• MGC3130 Controller

• GestIC Library

• External Electrodes

3.1 MGC3130 Controller

The MGC3130 features the following main building blocks:

• Low Noise Analog Front End (AFE)

• Digital Signal Processing Unit (SPU)

• Flexible Communication Interfaces

It provides a transmit signal to generate the E-field, conditions the analog signals from the receiving electrodes and processes these data digitally on the SPU. Data exchange between the MGC3130 and the host is conducted via the controller’s communication interface. For details, please refer to Section 4.0

“Functional Description”.

3.2 GestIC Library

The embedded GestIC Library is optimized to ensure continuous and real-time free-space Position Tracking and Gesture Recognition concurrently. It is fullyconfigurable and allows required parameterization for individual application and external electrodes.

3.3 External Electrodes

Electrodes are connected to MGC3130. An electrode needs to be individually designed for optimal E-field distribution and detection of E-field variations inflicted by a user.

FIGURE 3-1: MGC3130 CONTROLLER SYSTEM ARCHITECTURE

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MGC3130

RxTx

TxG

RxG

System ground

Transmitter signal

Electrode signal

Earth ground

E-field

To MGC3130

System Ground

RxBuf

RxTx

RxGCH

---------------------------------------------- -=

3.3.1 ELECTRODE EQUIVALENT CIRCUIT

The hand Position Tracking and Gesture Recognition capabilities of a GestIC system depends on the electrodes design and their material characteristics.

A simplified equivalent circuit model of a generic GestIC electrode system is illustrated in Figure 3-2.

FIGURE 3-2: ELECTRODES CAPACITIVE EQUIVALENT CIRCUITRY EARTH GROUNDED

•VTX: Tx electrode voltage

•V

•C

•e

The Rx and Tx electrodes in a GestIC electrode system build a capacitance voltage divider with the capacitances C the electrode design. C capacitance to system ground driven by the Tx signal. The Rx electrode measures the potential of the generated E-field. If a conductive object (e.g., a hand) approaches the Rx electrode, C capacitance. This minuscule change in the femtofarad range is detected by the MGC3130 receiver.

The equivalent circuit formula for the earth-grounded circuitry is described in Equation 3-1.

: MGC3130 Rx input voltage

RXBUf

: Capacitance between receive electrode and

hand (earth ground). The user’s hand can always be considered as earth-grounded due to the comparable large size of the human body.

: Capacitance between receive and transmit

RXTX

electrodes

: Capacitance of the receive (Rx) electrode

RXG

to system ground + input capacitance of the MGC3130 receiver circuit

: Capacitance of the transmit (Tx) electrode

TxG

to system ground

: Rx electrode

: Tx electrode

RxTx

and C

which are determined by

RxG

represents the Tx electrode

TxG

changes its

EQUATION 3-1: ELECTRODES

EQUIVALENT CIRCUIT

A common example of an earth-grounded device is a notebook, even with no ground connection via power supply or ethernet connection. Due to its larger form factor, it presents a high earth-ground capacitance in the range of 50 pF and thus, it can be assumed as an earth-grounded GestIC system.

A brief overview of the typical values of the electrodes capacitances is summarized in Tab le 3- 1.

TABLE 3-1: ELECTRODES

CAPACITANCES TYPICAL VALUES

Capacity Typical Value

RXTX

TXG

RXG

10...30 pF

10...1000 pF

10...30 pF

<1 pF

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MGC3130

South

West

East

Center

North

Top Layer (Lateral Rx)

Top Layer (Center Rx)

Tx Layer

Note: Ideal designs have low C

ensure higher sensitivity of the electrode system. Optimal results are achieved with C

RxTx

range.

and C

values being in the same

RxG

RxTx

and C

RxG

3.3.2 STANDARD ELECTRODE DESIGN

The MGC3130 electrode system is typically a doublelayer design with a Tx transmit electrode at the bottom layer to shield against device ground and thus, ensure high receive sensitivity. Up to five comparably smaller Rx electrodes are placed above the Tx layer providing the spatial resolution of the GestIC system. Tx and Rx

FIGURE 3-3: FRAME SHAPE ELECTRODES

are separated by a thin isolating layer. The Rx electrodes are typically arranged in a frame configuration as shown in Figure 3-3. The frame defines the inside sensing area with maximum dimensions of 14x14 centimeters. An optional fifth electrode in the center of the frame may be used to improve the distance measurement and add simple touch functionality.

The electrodes’ shapes can be designed solid or structured. In addition to the distance and the material between the Rx and Tx electrodes, the shape structure density also controls the capacitance C the sensitivity of the system.

RXTX

and thus,

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MGC3130

Host

Signal

Processing

Unit (SPU)

Power Management

Unit (PMU)

Internal clockTX Signal Generation

External

Electrodes

Communication

control

I2C

SPI

MGC3130

Controller

Signal

conditioning

ADC

Signal

conditioning

ADC

Signal

conditioning

ADC

Signal

conditioning

ADC

Signal

conditioning

ADC

FLASH

memory

IOs

Reset block

Voltage Reference

REF)

TXD

RX0

RX1

RX2

RX3

RX4

MCLR

SI0

SI1

SI2

SI3

EIO1

EIO2

EIO3

IS2

EIO0

INTERNAL BUS

Low-Power

Wake-up

4.0 FUNCTIONAL DESCRIPTION

Zone Design) or a single MGC3130 and another circuit with a corresponding interface, such as a touch screen

Microchip Technology’s MGC3130 configurable controller uses up to five E-field receiving electrodes. Featuring a Signal Processing Unit (SPU), a wide range of 3D gesture applications are being preprocessed on the MGC3130, which allows short development cycles.

Always-on 3D sensing, even for battery-driven mobile devices, is enabled due to the chip’s low-power design and variety of programmable power modes. A Self Wake-up mode triggers interrupts to the application host reacting to interaction of a user with the device and supporting the host system in overall power

controller.

GestIC sensing electrodes are driven by a low-voltage signal with a frequency in the range of 100 kHz, which allows their electrical conductive structure to be made of any low-cost material. Even the reuse of existing conductive structures, such as a display’s ITO coating, is feasible, making the MGC3130 an overall, very costeffective system solution.

Figure 4-1 provides an overview of the main building

blocks of MGC3130. These blocks will be described in the following sections.

reduction.

Featuring a programmable 4-pin digital interface, the MGC3130 matches a multitude of hardware requirements. Developers have the choice of data exchange via I

C interfaces, developers have the option to set up a

C or SPI. Since the device provides two

master-slave architecture between two MGC3130 devices to add an additional sensing area (e.g., Two-

FIGURE 4-1: MGC3130 CONTROLLER BLOCK DIAGRAM

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MGC3130

MCLR

Glitch Filter

Deep sleep

WDTR

Software Reset (SWR)

WDT Time-out

SYSRST

SPU

Digital

Peripherals

Reset Block

Internal Osc.

VDDC Domain

Analog voltage

regulator

Digital voltage

regulator

Flash

Memory

Wake-up logic

WDTR

EIO

VDDM Domain

STEP-UP converter

VCAPS

VSS2

VDD

VSS1

CAPA

SS3

ADC

Signal Conditioning Blocks

VDDA Domain

VCAPD

VINDS

VDD Domain

4.1 Reset Block

The Reset block combines all Reset sources. It controls the device system’s Reset signal (SYSRST). The following is a list of device Reset sources:

•MCLR

• SWR: Software Reset available through GestIC

• WDTR: Watchdog Timer Reset

A simplified block diagram of the Reset block is illustrated in Figure 4-2.

FIGURE 4-2: SYSTEM RESET BLOCK

: Master Clear Reset pin

Library

DIAGRAM

• V

DDA Domain: This domain is powered by

DDA = 3.0V. It is generated by an embedded low-

V impedance and fast linear voltage regulator. During Deep Sleep mode, the analog voltage regulator is switched off. V

DDA is the internal

analog power supply voltage for the ADCs and the signal conditioning. An external block capacitor, C

• V

DDM Domain: This domain is powered by DDM = 3.3V. VDDM is the internal power supply

EFCA, is required on VCAPA pin.

voltage for the internal Flash memory. This power supply is depending on VDD voltage range. If

DD ≥ 3.3V, the memory is directly powered

V through the V

DD pin. In case of VDD < 3.3V, the

Flash power supply is generated internally by an embedded STEP-UP converter.

FIGURE 4-3: POWER SCHEME BLOCK

DIAGRAM

4.2 Power Control and Clocks

4.2.1 POWER MANAGEMENT UNIT (PMU)

The device requires a 3.3V ±5% supply voltage at VDD. Enabling the internal STEP-UP converter extends the voltage range to 2.5 to 3.465V.

According to Figure 4-3, the used power domains are as follows:

DD Domain: This domain is powered by

• V

DD = 2.5V to 3.465V (typical VDD = 3.3V). VDD is

V the external power supply for EIO, wake-up logic, WDTR, internal regulators and STEP-UP converter. It is provided externally through the

DD pin.

• V

DDC Domain: This domain is powered by DDC = 1.8V. It is generated by an embedded low-

V impedance and fast linear voltage regulator. The voltage regulator is working under all conditions (also during Deep Sleep mode) preserving the MGC3130 data context. V power supply voltage for digital blocks, Reset block and RC oscillators. An external block capacitor, C

DS40001667C-page 14 Advance Information  2012-2013 Microchip Technology Inc.

EFCD, is required on VCAPD pin.

DDC is the internal

• STEP-UP Converter: The STEP-UP converter is generating 3.3V from the connected supply voltage V

DD (if it is lower than 3.3V). This voltage

is required by the internal Flash memory. The required voltage reference is taken from the voltage reference block. During Deep Sleep mode, the converter is switched off. It requires an external connected inductor, a filtering capacitor and a Schottky diode connected to the V

CAPS pins. If the supply voltage is high enough,

INDS and

the STEP-UP converter will be disabled. Please refer to Section 9.0 “Electrical Specifications” for more details.

Page 15

MGC3130

MCLR

STEP-UP

1.5V

STEP-UP

VDD

2.5V

time

3.465V

3.3V

t1: t

RSTDLY

: Reset delay typically 200 μs, 120 μs minimum

t2: t

PWRT

: Power-up Time-out

Hysteresis

4.2.2 POWER SUPERVISORS

During the Power-up sequence, the system is kept under Reset condition for approximately 200 µs (Reset delay: t (1.2V minimum). During this delay, the system Reset will remain low and the VDD should reach typically 2V.

When the Reset delay is elapsed, the system Reset is released (high) and the system starts Power-up/Timeout (t

PWRT

the target application (if the STEP-UP will be used or not) and on the used V out period (t (see Tab le 4- 3).

STEP-UP applications (2.5V

The system starts when (see Figure 4-5):

• Power-up/Time-out period (t

DD = 2.5V is already reached before the end of

•V t

STEP-UP

) after the VDD =1.5V voltage is reached

RSTDLY

) sequence. The system start depends on

DD voltage. The Power-up/Time-

) after Reset takes 36 LSO cycles.

PWRT

 VDD < 3.3V):

) is elapsed

PWRT

during the t

(See Table 4-3). 2.5V is

PWRT

The STEP-UP converter starts automatically from 2.5V if the external STEP-UP components are assembled. It stays activated until a 3.465V V reached.

For V converter will automatically stop operating and the GestIC Library can disable it. For more details, please refer to Figure 4-5.

The power-up sequence begins by increasing the voltage on the V rise time is faster than 6 V/ms, the system starts correctly.

If the slope is less than 6 V/ms, the MCLR be held low, by external circuitry, until a valid operating VDD level is reached.

the minimum voltage needed to power the STEP-UP.

FIGURE 4-4: STEP-UP APPLICATIONS START-UP

DD voltage level is

DD input beyond this level, the STEP-UP

DD pin (from 0V). If the slope of the VDD

pin should

 2012-2013 Microchip Technology Inc. Advance Information DS40001667C-page 15

Page 16

MGC3130

MCLR

1.5V

time

3.3V

t1: t

RSTDLY

: Reset delay typically 200 μs, 120 μs minimum

t2: t

PWRT

: Power-up Time-out

Standard applications (without STEP-UP) (3.3V  VDD  3.465V):

The system starts when (see Figure 4-5):

• Power-up/Time-out period (t

•V

DD = 3.3V is already reached before the end of

timing

PWRT

The power-up sequence begins by increasing the voltage on the V

DD pin (from 0V). If the slope of the VDD

rise time is faster than 4.5 V/ms, the system starts correctly.

If the slope is less than 4.5 V/ms, the MCLR be held low, by external circuitry, until a valid operating VDD level is reached.

FIGURE 4-5: POWER SUPERVISORS

PWRT

) is elapsed

pin must

DS40001667C-page 16 Advance Information  2012-2013 Microchip Technology Inc.

Page 17

MGC3130

4.2.3 CLOCKS

The MGC3130 is embedding two internal oscillators, high speed and low speed. The High-Speed Oscillator (HSO) is factory-trimmed, achieving high accuracy.

• High-Speed Oscillator (HSO)

The MGC3130 is clocked by an internal HSO running at 22.5 MHz ±10% and consuming very low power. This clock is used to generate the Tx signal, to trigger the ADC conversions and to run the SPU. During Deep Sleep mode, the HSO clock is switched off.

• Low-Speed Oscillator (LSO)

This low-speed and ultra-low-power oscillator is typically 32 kHz with a tolerance of ±10 kHz. It is used during power-saving modes.

4.2.4 OPERATION MODES

MGC3130 offers three operation modes that allow the user to balance power consumption with device functionality. In all of the modes described in this section, power saving is configured by GestIC Library messages.

4.2.4.1 Processing Mode

In this mode, all power domains are enabled and the SPU is running continuously. All peripheral digital blocks are active. Each Rx channel can be activated individually by GestIC Library depending on the application. Gesture Recognition and Position Tracking require the Processing Operation mode.

4.2.4.2 Deep Sleep Mode

During the Deep Sleep mode, VDDM and VDDA are turned off, and V of the SPU.

The mode includes the following characteristics:

• The SPU is halted

• The High-Speed Oscillator is shut down

• The Low-Speed Oscillator is running

• The Watchdog is switched off

• Host interface pins are active for wake-up

This leads to the lowest possible power consumption of MGC3130.

The MGC3130 will resume from Deep Sleep if one of the following events occurs:

• External Interrupt (IRQ0) or I Detection

• On MCLR Reset

The Deep Sleep mode can be enabled by GestIC Library messages.

DDC is still powered to retain the data

C0 Start Bit

4.2.4.3 Self Wake-up Mode

The Self Wake-up mode is a Low-Power mode allowing an autonomous wake-up of the MGC3130 and application host. In this mode, the MGC3130 is automatically and periodically alternating between Sleep and Scan phases.

The MGC3130’s fast wake-up, typically below 1 ms, allows to perform scans in very efficient periods and to maximize the Sleep phase.

The periodic Wake-up sequence is triggered by a programmable wake-up timer running at LSO frequency and which can be adjusted by the Approach Detection feature.

The MGC3130 enters the Self Wake-up mode by a GestIC Library message or by a non-activity time-out. Non-activity means no user detection within the sensing area.

The MGC3130 will resume from Self Wake-up on one of the following events:

• Wake-up timer overflow event

• External Interrupt (IRQ0) or I detection

• On MCLR or WDTR

C0 Start Bit

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Page 18

MGC3130

Wake-up IRQ from host

or I²C

start detected

Approach detected

No user interaction

(Time-out)

(1)

=9µA

PEAK

(1)

= 20mA

SW1

(1)

= 200µA

Deep Sleep Self Wake-up Self Wake-upProcessing

PEAK

: Processing mode with 5 Rx Channels

SW1

: Self Wake-up with 150 ms Approach Scan and 10s Calibration Scan

SW2

: Self Wake-up with 150 ms Approach Scan and without Calibration Scan

: Deep Sleep

(1) These are preliminary values @ 3.3V, typical

SW2

(1)

= 110µA

peak

10 N

RxChannels

2+mA=

4.2.4.4 MGC3130 Power Profile

The MGC3130 power profile is illustrated in Figure 4-6.

FIGURE 4-6: MGC3130 POWER PROFILE

MGC3130 current consumption for the different operation modes are summarized in Ta bl e 4 -1 .

TABLE 4-1: CURRENT CONSUMPTION OVERVIEW

Mode Current Consumption Conditions

Processing mode 20 mA V

Self Wake-up mode 110 µA V

Deep Sleep mode 9 µA VDD = 3.3V

The Processing mode current consumption depends on the number of active Rx channels, N can be determined by Equation 4-1.

EQUATION 4-1: PROCESSING MODE

RxChannels

CURRENT CONSUMPTION

DD = 3.3V

5 Rx Channels activated

DD = 3.3V

No Calibration Scan Approach Scan each 150 ms

200 µA VDD = 3.3V

Calibration Scan each 10s Approach Scan each 150 ms

Changing these parameters results in different current

, and

consumption values.

Figure 4-7 and Figure 4-8 describe the Self Wake-up

mode current consumption according to the Approach Scan and Calibration Scan period change.

The Self Wake-up mode current consumption depends on the Approach Detection feature configuration: Approach Scan and Calibration Scan repetition period.

DS40001667C-page 18 Advance Information  2012-2013 Microchip Technology Inc.

Page 19

MGC3130

0,11

0,77

0,57

1,21

0,20

0,86

0,00

0,20

0,40

0,60

0,80

1,00

1,20

1,40

0 50 100 150 200

Current Consumption [mA]

Time Interval between Approach Scans[ms]

no Calibration Scan

Calibration Scan every 2s

Calibration Scan every 10s

1,21

1,07

0,99

0,95

0,92

0,90

0,88

0,87

0,86

0,00

0,20

0,40

0,60

0,80

1,00

1,20

1,40

024681012

Current Consumption (mA)

Time interval between Calibration Scans (s)

FIGURE 4-7: CURRENT CONSUMPTION FOR VARYING TIME INTERVALS BETWEEN

APPROACH SCANS AND CALIBRATION SCANS

FIGURE 4-8: CURRENT CONSUMPTION FOR A FIXED TIME INTERVAL BETWEEN

APPROACH SCANS OF 20 ms

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Page 20

MGC3130

LSO

SPU CLK

STEP-UP enable

SPU halted SPU running

Power-Up

Processing operation

HSO enable

REF enable

Reset or Deep

Sleep

PWRT

HSO

STEP-UP

SPUCLK

4.2.4.5 Operation Modes Summary

Table 4-2 summarizes the MGC3130 operation modes.

TABLE 4-2: OPERATION MODES SUMMARY

Mode Entry Exit Comments

Processing I

C™0/IRQ0/Approach/

/WDTR/SW Reset

MCLR

Self Wake-up Time-out/GestIC

Message

Deep Sleep GestIC

Library Message I2C™0/IRQ0/MCLR - SPU halted, Analog Voltage

Library

GestIC

Library Message/Non-

Activity Time-out/WDTR

I2C™0/IRQ0/Wake-up Timer/

/WDTR

MCLR

- Processing mode with up to five electrodes continuously running

- Full positioning and Gesture Recognition capabilities

- Scan phase with a configurable number of Rx active channels, wake-up timer is used to resume the system

- Approach detection capability

- Fast wake-up time

- Very low-power consumption

Regulator OFF, STEP-UP OFF, Watchdog OFF

- No positioning or gesture detection

- Extreme low-power consumption

- Needs trigger from application host to switch into Self Wake-up or Processing mode

4.2.5 POWER-UP/DOWN SEQUENCE

Figure 4-9 represents the power-up sequence timings

after a Reset or Deep Sleep state.

FIGURE 4-9: POWER-UP SEQUENCE TIMINGS

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Page 21

Power-up Phases

LSO

SPU CLK

STEP-UP enable

SPU halted

SPU running

HSO enable

REF

enable

Processing operation

Power

down

Request

Deep Sleep

• Reset or Deep Sleep: The system is kept in Reset or is in Deep Sleep mode

• Power-up: Phase when the system starts up after Reset/Deep Sleep has been released

• Processing operation: Processing mode is started

• Power-up Time-out

TABLE 4-3: POWER-UP TIME-OUT (t

Signal Symbol

VREF Enable t

HSO Enable t

STEP-UP t

SPU CLK t

Power-Up Time-Out

VREF

HSO

STEP-UP

SPUCLK

PWRT

MGC3130

)

Delay in LSO Cycles

After Reset

After Deep Sleep

(STEP-UP On)

000

222

44x

30 30 8

36 36 10

After Deep Sleep

(STEP-UP Off)

Signal References

Figure 4-10 illustrates the power-down sequence

timings.

• LSO: Low-Speed Oscillator clock

• HSO: High-Speed Oscillator clock

•VREF Enable: Voltage Reference enable signal

• HSO Enable: High-Speed Oscillator enable signal

• STEP-UP Enable: STEP-UP converter enable signal

FIGURE 4-10: POWER-DOWN SEQUENCE TIMINGS

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Page 22

MGC3130

Rx gain

VDDA/2

Signal Conditioning Block

Rx Input

Signal

matching

Buffer

Power-down Phases

• Processing Operation: Processing mode is activated

• Request: Request to enter Deep Sleep mode

• Power-down: Power-down state (all analog signals are down)

• Deep Sleep: Deep Sleep mode has been entered

Signal References

• LSO: Low-Speed Oscillator clock

• HSO: High-Speed Oscillator clock

•VREF Enable: Voltage Reference enable signal

• HSO Enable: High-Speed Oscillator enable signal

• STEP-UP enable: STEP-UP converter enable signal

4.3 Transmit Signal Generation

The Tx signal generation block provides a bandwidth limited square wave signal for the transmit electrode. Frequency hopping adjusts automatically the Tx carrier frequency in the range of 44-115 kHz, depending on the environmental noise conditions. GestIC Library automatically selects the lowest noise working frequency in case the sensor signal is compromised. Frequencies can be enabled/disabled via the GestIC Library.

4.4 Receive (Rx) Channels

There are five identical Rx channels that can be used for five respective receive electrodes. Four receive electrodes are required for Position Tracking and Gesture Recognition. A fifth electrode can be used for touch detection and to improve distance measurement. Each channel has its own analog signal conditioning stage, followed by a dedicated ADC. For specific features such as Approach Detection, individual Rx channels can be activated or deactivated via the GestIC Library. According to the electrode characteristics, the channels have to be parameterized.

The signal conditioning block contains analog filtering and amplification as shown in Figure 4-11.

FIGURE 4-11: SIGNAL CONDITIONING

BLOCK

For individual electrode characteristics, the Rx channels can be configured as follows:

• Signal matching: The received signal is sampled at a sampling rate, equal to twice the Tx frequency providing a high and low ADC sample. The signal matching block adjusts the received signal towards the same value of high and low ADC samples. The offset can be adjusted accordingly.

• The matched signal output is amplified using a programmable gain amplifier to achieve a better sensitivity.

4.5 Analog-to-Digital Converter (ADC)

As outlined in Section 4.4 “Receive (Rx) Channels”, each Rx channel features a dedicated ADC. The ADC trigger source can be selected between the internal clock and an external sync signal. ADC samples are synchronous with twice the Tx transmit frequency. The external sync signal is reserved for dual chip/dual zone designs.

4.6 Signal Processing Unit (SPU)

The MGC3130 features a Signal Processing Unit (SPU) to control the hardware blocks and process the advanced DSP algorithms included in the GestIC Library. It provides filtered sensor data, continuous position information and recognized gestures to the application host. The host combines the information and controls its application.

4.7 Parameters Storage

DS40001667C-page 22 Advance Information  2012-2013 Microchip Technology Inc.

The MGC3130 provides an embedded 32 kBytes Flash memory which is dedicated for the GestIC Library and storage of the individual configuration parameters. These parameters have to be set according to the individual electrode design and application. The GestIC Library and parameters are loaded into MGC3130 with the provided software tools or, alternatively, via GestIC Library messages by the application host. For more details on the MGC3130 tools, please refer to Section 8.0 “Development

Support”.

Page 23

MGC3130

Single Zone

I2CTM0 I2C

GPIOEIO0

Host

MGC3130 Dual Zone

Master

I2CTM0

I2C

GPIOEIO0

Host

EIO2

I2CTM1

MGC3130 Dual Zone

Slave

I2CTM0

EIO0

EIO3

5.0 APPLICATION ARCHITECTURE

MGC3130 supports two different implementations: single-zone design and dual-zone design.

Note: Currently, only single-zone I2C™ Slave

mode is supported. Other modes are planned for future releases of GestIC Library. Please contact your Microchip representative for further details.

5.1 Single-Zone Design

The standard MGC3130 implementation is a singlezone design. This configuration is based on one MGC3130 connected to an application host. The interface can be either configured as I slave, SPI master or SPI slave, depending on the overall system design (see Figure 5-1).

Data reporting and flow-control scenarios are described below for either I

• If MGC3130 is I

C or SPI slave and the host is I2C

C or SPI configurations:

or SPI master:

- Host interface is I2C0

- EIO0 is toggled indicating that new data is available and checking whether the host has already started data reading or not.

• If MGC3130 is I

C or SPI slave:

C or SPI master and the host is

- Data is sent to the host automatically when ready

- Data is sent on an EIO toggle of the host system

C master, I2C

5.2 Dual-Zone Design

In addition to a single-zone design, the MGC3130’s 4-pin digital interface also allows dual-zone designs by adding a second MGC3130, as shown in Figure 5-2. A dual-zone design allows detection of users hand motion in two independent zones (e.g., one for each hand) to expand user input options. In such a configuration, one MGC3130 acts as the dual-zone master device and the second acts as dual-zone slave device. The communication data flow is as follows: Position tracking data and recognized gestures from the dual-zone slave is transferred to the host via the MGC3130 dual-zone master.

FIGURE 5-2: DUAL-ZONE DESIGN

FIGURE 5-1: SINGLE-ZONE DESIGN

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Page 24

MGC3130

6.0 INTERFACE DESCRIPTION

The MGC3130 supports two communication interfaces: I

Note: Currently, only single-zone I

6.1 Interface Selection

The MGC3130 interface selection pin, IS2, is used to select I addresses.

TABLE 6-1: MGC3130 INTERFACE

IS2 IS1 Mode (Address)

00 I

10 I2C™0 Slave Address 2 (0x43)

6.2 Extended Input Output (EIO)

The MGC3130 provides four input/output pins with extended features. These pins are controlled by GestIC Library and listed in Table 6-2.

TABLE 6-2: MGC3130 EXTENDED IOS

Pin Pin Number Multiplexed Functions

EIO0 12 TS

EIO1 13 IS1/Gesture Port

EIO2 14 IRQ0/Gesture Port

EIO3 19 IRQ1/SYNC/Gesture Port

EIO4 20 I

EIO5 21 I2C0

EIO6 22 I2C1/Gesture Port

EIO7 23 I

C and SPI.

mode with I modes are planned for future releases of GestIC Microchip representative for further details.

C slave address. There are two different

C0 is supported. Other

Library. Please contact your

C™ Slave

SELECTION PINS

C™0 Slave Address 1 (0x42)

FUNCTIONS

C1/Gesture Port

6.3 Interrupt Requests

MGC3130 IRQ0 and IRQ1 interrupt lines are used by the host to wake-up the MGC3130 from Deep Sleep and Self Wake-up modes. If a wake-up event is detected on IRQ0 or IRQ1 lines, the MGC3130 switches to the Processing mode.

The IRQ0 and IRQ1 lines are only used when MGC3130 is configured as I

C master.

6.4 Synchronization

The MGC3130 Tx signal can be output on the SYNC pin. The SYNC pin can be also used as an ADC trigger input. In future, this configuration is used for dual-zone design implementations. The Tx signal is output on the SYNC pin of the dual-zone master and connected to the SYNC pin of the dual-zone slave.

6.5 Gesture Port

The MGC3130 provides five output pins which can be used to output the Colibri Suite features events. These pins are controlled by GestIC Library to signal to the host that an event occurred. The host does not need to monitor the I only has to monitor the Gesture Port pins. This feature is used in parallel to I2C communication.

The Colibri Suite Gesture Port feature mapping is illustrated in Figure 6-1.

C bus to get GestIC Library events, but

DS40001667C-page 24 Advance Information  2012-2013 Microchip Technology Inc.

Page 25

FIGURE 6-1: GESTURE PORT MAPPING

EventOutput1..8

To EIOs

Gesture Selection

[0:2]

Electrode Selection

[0:2]

Gesture

Wake-up after Approach Detection

Action Selection

[0:2]

EventInput

Selection [0:1]

Sensor Touch

Flick West -> East

Flick East -> West

Flick North -> South

Flick South -> North

Circle ClockWise

Circle Counter-ClockWise

Permanent high

Permanent low

Sensor Touch

Selection [0:1]

Touch

Tap

Double Tap

Colibri Suite Events

MGC3130 Pins Events mapping

High active

Low active

Toggle

Pulse (5ms)

EIO1,2,3,6,7

EventOutput 1

EventOutput 8

...

MGC3130

The Colibri Suite can generate up to eight event outputs which can be mapped to any EIO (1, 2, 3, 6 or

7). It is also possible to map more than one event output by one EIO.

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Page 26

MGC3130

TABLE 6-3: COLIBRI SUITE EVENTS

Gesture Port Mapping Parameter Description

Gesture Selection Selects the gestures which will be used as event.

Gesture Selection can be:

• Flick West/East

• Flick East/West

• Flick North/South

• Flick South/North

• Circle clockwise

• Circle Counter clockwise

Sensor Touch Selection Selects the sensor touch which will be used as event.

Sensor Touch Selection can be:

•Touch

•Tap

• Double Tap

Electrode Selection Selects the electrode which will be used for Sensor Touch.

Electrode Selection can be:

•West

•East

•North

•South

•Center

Event Input Selection Selects the event which will trigger an event output on the

EIOs. Event Input Selection can be:

•Gesture

• Sensor Touch

• Wake-up after Approach Detection

Action Selection Selects the signal format which will be output on the EIOs.

See Figure 6-2 and Ta bl e 6 -4 . Action Selection can be:

• Permanent High

• Permanent Low

• Toggle

•Pulse (5 ms)

• High Active

• Low Active

DS40001667C-page 26 Advance Information  2012-2013 Microchip Technology Inc.

Page 27

FIGURE 6-2: GESTURE PORT ACTION

Permanent high

Toggle

Event

Event Event Event

Pulse (5ms)

Event

Permanent low

Event

High active

Touch detected Touch released

Low active

Touch detected Touch released

MGC3130

TABLE 6-4: GPIO PORT ACTION MAPPING

Action

Event

Gesture X X X X

Touch X X X X X X

Single Tap X X X X

Double Tap X X X X

Wake-up after Approach Detection X X

Permanent

High

Permanent

Low

Toggle Pulse (5 ms) High Active Low Active

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MGC3130

6.6 Communication Interfaces

6.6.1 I2C

The MGC3130 supports two I2C interfaces. Only I2C0 is used in a single-zone configuration.

I2C0 and I2C1 features:

• Two ports: SCL0, SDA0 and SCL1, SDA1

• Master and Slave mode

• Up to 400 kHz

• 7-bit Addressing mode

• Hardware state machine for basic protocol handling

• Support for repeated start and clock stretching (Byte mode)

• No multi-master support

C Hardware Interface

A summary of the hardware interface pins is shown below in Tab le 6 -5 .

TABLE 6-5: I2C™ PIN DESCRIPTION

MGC3130 Pin Multiplexed Functions

SCL Serial Clock to Master I2C™

SDA Serial Data to Master I2C™

•SCL Pin

- The SCL (Serial Clock) pin is electrically

open-drain and requires a pull-up resistor of typically 1.8 kΩ (for a maximum bus load capacitance of 200 pF), from SCL to V SCL Idle state is high.

•SDA Pin

- The SDA (Serial Data) pin is electrically

open-drain and requires a pull-up resistor of typically 1.8 kΩ (for a maximum bus load capacitance of 200 pF), from SDA to V

- SDA Idle state is high.

- Master write data is latched in on SCL rising

edges.

- Master read data is latched out on SCL falling

edges to ensure it is valid during the subsequent SCL high time.

C Addressing:

The MGC3130 Device ID 7-bit address is: 0x42 (0b1000010) or 0x43 (0b1000011) depending on the interface selection pin configuration (IS2). Please refer to Tab le 6- 6.

TABLE 6-6: I2C™ DEVICE ID ADDRESS

Device ID Address, 7-bit

A6 A5 A4 A3 A2 A1 A0

100001IS2

DD.

TABLE 6-7: I2C™ DEVICE WRITE ID

ADDRESS (0x84 OR 0x86)

I2C™ Device Write ID Address

A7 A6 A5 A4 A3 A2 A1 A0

100001IS2 0

TABLE 6-8: I2C™ DEVICE READ ID

ADDRESS (0x85 OR 0x87)

I2C™ Device Read ID Address

A7 A6 A5 A4 A3 A2 A1 A0

100001IS2 1

C Master Read Bit Timing (MGC3130 I2C Slave)

Master read is to receive position data, gesture reports and command responses from the MGC3130. The timing diagram is shown in Figure 6-4.

• Address bits are latched into the MGC3130 on the rising edges of SCL.

• Data bits are latched out of the MGC3130 on the rising edges of SCL.

• ACK bit:

- MGC3130 presents the ACK bit on the ninth

clock for address acknowledgment

C master presents the ACK bit on the ninth

-I

clock for data acknowledgment

•The I2C master must monitor the SCL pin prior to asserting another clock pulse, as the MGC3130 may be holding off the I the clock.

I2C Communication Steps

1. SCL and SDA lines are Idle high.

2. I

C master presents Start bit to the MGC3130 by taking SDA high-to-low, followed by taking SCL high-to-low.

3. I2C master presents 7-bit address, followed by a = 1 (Read mode) bit to the MGC3130 on

R/W SDA, at the rising edge of eight master clock (SCL) cycles.

4. MGC3130 compares the received address to its

Device ID. If they match, the MGC3130 acknowledges (ACK) the master sent address by presenting a low on SDA, followed by a lowhigh-low on SCL.

5. I

C master monitors SCL, as the MGC3130 may be clock stretching, holding SCL low to indicate that the I2C master should wait.

C master by stretching

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Page 29

MGC3130

6. I2C master receives eight data bits (MSB first) presented on SDA by the MGC3130, at eight sequential I2C master clock (SCL) cycles. The data is latched out on SCL falling edges to ensure it is valid during the subsequent SCL high time.

7. If data transfer is not complete, then:

-I2C master acknowledges (ACK) reception of the eight data bits by presenting a low on SDA, followed by a low-high-low on SCL.

- Go to step 5.

8. If data transfer is complete, then:

-I2C master acknowledges (ACK) reception of the eight data bits and a completed data transfer by presenting a high on SDA, followed by a low-high-low on SCL.

C Master Write Bit Timing (MGC3130 Slave)

I2C master write is to send supported commands to the MGC3130. The timing diagram is shown in Figure 6-5.

• Address bits are latched into the MGC3130 on the rising edges of SCL.

• Data bits are latched into the MGC3130 on the rising edges of SCL.

• ACK bit:

- MGC3130 presents the ACK bit on the ninth

clock for address acknowledgment

C master presents the ACK bit on the ninth

-I

clock for data acknowledgment

• The master must monitor the SCL pin prior to asserting another clock pulse, as the MGC3130 may be holding off the master by stretching the clock.

I2C Communication Steps

1. SCL and SDA lines are Idle high.

2. I2C master presents Start bit to the MGC3130 by taking SDA high-to-low, followed by taking SCL high-to-low.

C master presents 7-bit address, followed by a

3. I

= 0 (Write mode) bit to the MGC3130 on

R/W SDA, at the rising edge of eight master clock (SCL) cycles.

4. MGC3130 compares the received address to its Device ID. If they match, the MGC3130 acknowledges (ACK) the I

C master sent address by presenting a low on SDA, followed by a low-high-low on SCL.

5. I2C master monitors SCL, as the MGC3130 may be clock stretching, holding SCL low to indicate

C master should wait.

the I

6. I2C master presents eight data bits (MSB first) to the MGC3130 on SDA, at the rising edge of eight master clock (SCL) cycles.

7. MGC3130 acknowledges (ACK) receipt of the eight data bits by presenting a low on SDA, followed by a low-high-low on SCL.

8. If data transfer is not complete, then go to step

9. Master presents a Stop bit to the MGC3130 by taking SCL low-high, followed by taking SDA low-to-high.

6.6.2 TRANSFER STATUS LINE

MGC3130 requires a dedicated Transfer Status line (TS) which features a data transfer status function. It is used by both I2C Master and Slave to control data flow.

The TS (Transfer Status) line is electrically open-drain and requires a pull-up resistor of typically 10 k, from TS to V

The MGC3130 (I host controller (I which can be transferred. The host controller uses the TS line to indicate that data is being transferred and prevents MGC3130 from updating its data buffer.

Table 6-9 shows how the TS line is used in the different

states of communication.

DD. TS Idle state is high.

C Slave) uses this line to inform the

C Master) that there is data available

 2012-2013 Microchip Technology Inc. Advance Information DS40001667C-page 29

Page 30

MGC3130

Transfer Status

(TS)

I2CTM Bus

MGC3130 Related Transfer MGC3130 Related Transfer

TS line pulled low by master when transfer

is started

TS line released

by master and

MGC3130 when

transfer is

finished

TS line pulled by MGC3130

to request a

data transfer

MGC3130 buffer

can be updated

Non MGC3130 related transfer or Bus Idle

TS line pulled low by master

when transfer is

started

MGC3130 buffer

can be updated

TS line pulled by MGC3130

to request a

data transfer

TS line released

by master and

MGC3130 when

transfer is

finished

TABLE 6-9: USAGE OF TRANSFER STATUS LINE

MGC3130 Host Controller TS Line Status

Released (H) Released (H) High Host finished reading data (Transfer end). No more data to

be transferred to the host. MGC3130 is allowed to update the data buffer.

Asserted (L) Released (H) Low Data from MGC3130 is available to be sent, but the host has

not yet started reading. If the host is busy and did not start reading before the next data update (5 ms), the MGC3130 will assert the TS line high while updating the data buffer.

Asserted (L) Asserted (L) Low Host starts reading. MGC3130 data buffer will not be updated

until the end of transfer (host releases TS high).

Released (H) Asserted (L) Low MGC3130 is ready to update the data buffer, but the host is

still reading the previous data. MGC3130 is allowed to update the data only when the host releases the TS high.

MGC3130 can update the I2C buffer only when the TS is released by both chips and a data transfer can only be started when MGC3130 pulls the TS low.

This procedure secures that:

• the host is always informed when new sensor data is available

• buffer updates in MGC3130 are always completed before data is sent to the I

Figure 6-3 shows the complete communication

protocol.

C bus

FIGURE 6-3: MGC3130 COMMUNICATION PROTOCOL

Note 1: The stop condition after an I2C™ data

transmission is generated by the host controller (I2C Master) after the data transfer is completed. Thus, it is recommended to verify the amount of bytes to be read in the message header (Size field).

2: Transfer Status is only needed for data

transfer from MGC3130 to the host controller. Writing to MGC3130 does not require the additional TS signal.

In addition to the standard I2C interface, the communication between MGC3130 and the host controller requires a proper handling of the Transfer Status.

DS40001667C-page 30 Advance Information  2012-2013 Microchip Technology Inc.

Page 31

6.6.3 SPI

SPI features:

• One Port: SCLK, CS, MOSI, MISO

• Master and Slave mode

• Up to 3 MHz

• Support of all clock edge and polarity options

Note: Currently, only single-zone I

mode with I modes are planned for future releases of GestIC Microchip representative for further details.

SPI Hardware Interface

A summary of the hardware interface pins is shown below in Tab le 6 - 10 .

C0 is supported. Other

Library. Please contact your

C™ Slave

TABLE 6-10: SPI PIN DESCRIPTION

MGC3130 Pin Description

SCLK Master Clock

MISO Master Input Slave Output

MOSI Master Output Slave Input

Chip Select

MGC3130

• SCLK Pin:

- The MGC3130 controller’s SCLK pin drives the communication bus clock.

- The Idle state of the SCLK should be low.

- Data is transmitted on the falling edge of SCLK.

•MOSI Pin:

- The MGC3130 controller’s MOSI pin sends/ reads serial data to/from the slave/host.

•MISO Pin:

- The MGC3130 controller’s MISO pin reads/ sends serial data from/to the slave/host.

Pin:

•CS

- The MGC3130 controller’s CS device selection functionality.

pin provides

TABLE 6-11: SPI CS PIN DESCRIPTION

CS Pin Description

SS Active

VDD Inactive

 2012-2013 Microchip Technology Inc. Advance Information DS40001667C-page 31

Page 32

DS40001667C-page 32 Advance Information  2012-2013 Microchip Technology Inc.

312 456789 312 456789 312 456789

A7 A6 A5 A4 A3 A2 A1

D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0

Address R/W ACK ACK ACKData Data

Address Bits Latched in Data Bits Valid Out Data Bits Valid Out

SCL may be stretched SCL may be stretched

Start Bit

Stop Bit

SDA

SCL

312 456789 312 456789 312 456789

A7 A6 A5 A4 A3 A2 A1

D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0

Address R/W ACK ACK ACKData Data

Address Bits Latched in Data Bits Valid Out Data Bits Valid Out

SCL may be stretched SCL may be stretched

Start Bit

Stop Bit

SDA

SCL

FIGURE 6-4: I2C™ MASTER READ BIT TIMING DIAGRAM

MGC3130

FIGURE 6-5: I

C™ MASTER WRITE BIT TIMING DIAGRAM

Page 33

MGC3130

VDD

VSS1

VSS3

VDD

100 nF

4.7 μF

IS2

MCLR

SI0

SI1

EIO0

SDA

SCL

GPIO/IRQ

HOST

VDD

1.8 kΩ

RESET

10 kΩ

VDD

TXD

RX0

RX1

RX2

RX3

RX4

VDD

VINDS

VCAPS

VCAPA

VCAPD

EXP

VSS1

VSS2

EIO7

EIO1

EIO6

North Electrode

South Electrode

East Electrode

WestElectrode

Center Electrode

IS1

IS2

R9 (10 kΩ)

10 kΩ

IS1

IS2

VDD VDD

R5 (n.p)

R7 (n.p)

R10 (10 kΩ)

R11 (10 kΩ)

R12 (10 kΩ)

R13 (10 kΩ)

VDD

10 kΩ

EIO2

EIO3

n.p: not populated

Gesture Port

EIO7

EIO1

EIO6

EIO2

EIO3

Interface Selection

Note: R5 and R7 are not populated.

7.0 HARDWARE INTEGRATION

7.3 Irradiated High-Frequency Noise

In order to suppress irradiated high-frequency signals,

7.1 ESD Considerations

The MGC3130 provides Electrostatic Discharge (ESD) Voltage protection up to 2 kV (HBM). Additional ESD countermeasures may be implemented individually to meet application-specific requirements.

7.2 Power Noise Considerations

the five Rx channels of the chip are connected to the electrodes via serial 10 kresistors, as close as possible to MGC3130. The 10 k resistor and the MGC3130 input capacitance are building a low-pass filter with a corner frequency of 3 MHz.

7.4 Standard Schematic (3.3V V

DD  3.465V)

MGC3130 filtering capacitors are included in the reference design schematic (Please refer to Figure 7-1).

A standard application schematic for the 28-lead QFN package pinout is depicted below in Figure 7-1. For more details, please refer to Figure 1.

FIGURE 7-1: STANDARD SCHEMATIC FOR 3.3V  VDD  3.465V VOLTAGE RANGE

 2012-2013 Microchip Technology Inc. Advance Information DS40001667C-page 33

Page 34

MGC3130

VDD

VSS1

VSS3

VDD

100 nF

4.7 μF

MCLR

SDA

SCL

GPIO/IRQ

HOST

VDD

1.8 kΩ

RESET

10 kΩ

VDD

TXD

RX0

RX1

RX2

RX3

RX4

VINDS

VCAPS

VCAPA

VCAPD

EXP

VSS2

EIO7

IS2

SI0

SI1

EIO0

EIO1

EIO6

10 μF

4.7 μH

IS2

IS1

North Electrode

South Electrode

East Electrode

WestElectrode

Center Electrode

R9 (10 kΩ)

R10 (10 kΩ)

R11 (10 kΩ)

R12 (10 kΩ)

R13 (10 kΩ)

VDD

10 kΩ

IS1

IS2

VDD VDD

R5 (n.p)

R7 (n.p)

n.p: not populated

Interface Selection

EIO2

EIO3

Gesture Port

EIO7

EIO1

EIO6

EIO2

EIO3

7.5 Bill of Materials (3.3V  VDD 

3.465V)

Modifying, removing or adding components may adversely affect MGC3130 performance.

TABLE 7-1: BILL OF MATERIALS FOR 3.3V  V

Label Qty Value Description

R1, R4, R5, R6, R7, R8 3 10 k Res Thick Film 10 k

C1 1 100 nF Capacitor – Ceramic, 0.1 µF, 10%, 6.3V

C2 1 4.7 µF Capacitor – Ceramic, 4.7 µF, 10%, 6.3V

C3 1 4.7 µF Capacitor – Ceramic, 4.7 µF, 10%, 6.3V

R2, R3 2 1.8 k Res Thick Film 1.8 k

R9, R10, R11, R12, R13 5 10 k Res Thick Film 10 k

7.6 Standard Schematic Step-Up Setup (2.5V V

FIGURE 7-2: SCHEMATIC STEP-UP SETUP FOR 2.5V  VDD  3.465V VOLTAGE RANGE

DD  3.465V)

DD  3.465V

DS40001667C-page 34 Advance Information  2012-2013 Microchip Technology Inc.

Page 35

MGC3130

7.7 Bill of Materials (2.5V  VDD 

3.465V)

Modifying, removing, or adding components may adversely affect MGC3130 performance.

TABLE 7-2: BILL OF MATERIALS FOR 2.5V  VDD  3.465V

Label Qty Value Description

R1, R4, R5, R6, R7, R8 3 10 k Res Thick Film 10 k

C1 1 100 nF Capacitor – Ceramic, 0.1 µF, 10%, 6.3V

C2 1 4.7 µF Capacitor – Ceramic, 4.7 µF, 10%, 6.3V

C3 1 4.7 µF Capacitor – Ceramic, 4.7 µF, 10%, 6.3V

R2, R3 2 1.8 k Res Thick Film 1.8 k

C4 1 10 µF Capacitor – Ceramic, 10 µF, 20%, 6.3V

L1 1 4.7 µH Inductor, 4.7 µH 20%

D1 1

R9, R10, R11, R12, R13 5 10 k Res Thick Film 10 k

—

7.8 Layout Recommendation

Diode Schottky, 20V, 0.5A

This section will provide a brief description of layout hints for a proper system design.

The PCB layout requirements for MGC3130 follow the general rules for a mixed signal design. In addition, there are certain requirements to be considered for the sensor signals and electrode feeding lines.

The chip should be placed as close as possible to the electrodes to keep their feeding lines as short as possible. Furthermore, it is recommended to keep MGC3130 away from electrical and thermal sources within the system.

Analog and digital signals should be separated from each other during PCB layout in order to minimize crosstalk.

The individual electrode feeding lines should be kept as far as possible apart from each other.

DD lines should be routed as wide as possible. For

V designs using the STEP-UP circuitry, the additional components required should be placed as close as possible to the MGC3130.

MGC3130 requires a proper ground connection on all

SS pins, including the exposed pad (pin 29).

 2012-2013 Microchip Technology Inc. Advance Information DS40001667C-page 35

Page 36

MGC3130

8.0 DEVELOPMENT SUPPORT

Microchip provides software and hardware development tools for the MGC3130:

• Software:

- MGC3130 Software Package – Aurea GUI and GestIC Library

- MGC3130 Software Development Kit (SDK)

- MGC3130 PIC18F14K50 Host Reference Code

•Schematics:

- MGC3130 Hillstar Hardware References

• Evaluation and Development Kits:

- MGC3130 – Sabrewing Single-Zone Evaluation Kit (DM160217)

- MGC3130 Single-Zone Development Kit Hillstar (DM160218)

8.1 MGC3130 Software Package – Aurea GUI and GestIC Library

The Aurea evaluation software demonstrates Microchip’s GestIC applications. Aurea provides visualization of the MGC3130 generated data and access to GestIC Library controls and configuration parameters.

That contains the following:

• Visualization of hand position and user gestures

• Visualization of sensor data

• Real-time control of sensor features

• MGC3130 GestIC Library update

• Analog front end parameterization

• Colibri parameterization

• Electrode capacitance measurement

• Logging of sensor values and storage in a log file

technology and its features and

8.4 MGC3130 Hillstar Hardware References

Microchip provides the Gerber files for Hillstar Boards and Reference electrodes.

8.5 Evaluation and Demonstration Kits

A variety of demonstration, development and evaluation boards allow quick application development on fully-functional systems. The demonstration and development boards can be used in teaching environments, for prototyping custom circuits and for learning about various GestIC MGC3130 applications.

The first MGC3130 evaluation board is the Sabrewing Single-Zone Evaluation Board. It contains the MGC3130 reference circuitry and built-in frame electrodes with a 140 x 90 mm sensitive area.

In combination with Aurea Visualization and Control Software, Sabrewing can be used as a starter kit. The set contains all materials required for first MGC3130 evaluation experience.

The first development board is the Hillstar Development Kit. It is designed to support an easy integration of Microchip’s MGC3130 3D Tracking and Gesture Controller into the customer’s applications. It provides MGC3130 system hardware modules and a set of electrode reference designs which can be used by customers to develop their own GestIC system. Aurea Visualization and Control Software provides full support of the Hillstar Development Kit and an easy parameterization of the customer’s applications.

For the complete list of demonstration, development and evaluation kits, please refer to the Microchip web site (http://www.microchip.com/GestICGettingStarted).

8.2 MGC3130 Software Development Kit (SDK)

Microchip provides a standard C reference code with a Software Development Kit. The code will support developers to integrate the MGC3130 solution into the target application.

8.3 MGC3130 PIC18F14K50 Host Reference Code

Microchip provides a reference code for PIC18F14K50, including GestIC Library I decoding.

DS40001667C-page 36 Advance Information  2012-2013 Microchip Technology Inc.

C code and basic message

8.6 GestIC Library Update

The MGC3130 devices are manufactured only with a built-in Library Loader to perform basic device programming operations or individual configuration parameters storage over a serial I

The user has to download the latest GestIC Library and upload it to the MGC3130 Flash memory.

The GestIC Library can be updated through two methods:

1. Aurea Visualization and Control Software: Please refer to MGC3130 Aurea Graphical User Interface User Guide (DS40001681) for more details.

2. GestIC Library messages: Please refer to MGC3130 GestIC Library Interface Description User Guide (DS40001718) for more details.

C interface.

Page 37

9.0 ELECTRICAL SPECIFICATIONS

MGC3130

9.1 Absolute Maximum Ratings

Ambient temperature under bias......................................................................................................... -20°C to +85°C

Storage temperature ........................................................................................................................ -55°C to +125°C

Voltage on pins with respect to V

on VDD pin ............................................................................................................................ -0.3V to +3.465V

on all other pins.............................................................................................................. -0.3V to (V

Total power dissipation................................................................................................................................... 100 mW

ESD protection on all pins .................................................................................................................................... 2 kV

† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.

† NOTICE: This device is sensitive to ESD damage and must be handled appropriately. Failure to properly handle and protect the device in an application may cause partial to complete failure of the device.

† NOTICE: -20°C temperature operation is characterized but not tested.

(†)

DD + 0.3V)

 2012-2013 Microchip Technology Inc. Advance Information DS40001667C-page 37

Page 38

MGC3130

28-Lead QFN (5x5x0.9 mm) Example

PIN 1 PIN 1

MGC3130

-I/MQ

1318017

Legend: XX...X Customer-specific information

Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC

designator for Matte Tin (Sn)

* This package is Pb-free. The Pb-free JEDEC designator ( )

can be found on the outer packaging for this package.

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available characters for customer-specific information.

10.0 PACKAGING INFORMATION

10.1 Package Marking Information

DS40001667C-page 38 Advance Information  2012-2013 Microchip Technology Inc.

Page 39

10.2 Package Details

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

The following sections give the technical details of the packages.

MGC3130

 2012-2013 Microchip Technology Inc. Advance Information DS40001667C-page 39

Page 40

MGC3130

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

DS40001667C-page 40 Advance Information  2012-2013 Microchip Technology Inc.

Page 41

28-Lead Plastic Quad Flat, No Lead Package (MQ) – 5x5 mm Body [QFN] Land Pattern With 0.55 mm Contact Length

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Microchip Technology Drawing C04-2140A

MGC3130

 2012-2013 Microchip Technology Inc. Advance Information DS40001667C-page 41

Page 42

MGC3130

APPENDIX A: DATA SHEET

REVISION HISTORY

Revision A (11/2012)

Initial release of this data sheet.

Revision B (08/2013)

Updated the Power Features section; Updated Table 1; Updated section 2, Feature Description; Updated section 4.2.2; Updated Figures 4-4, 4-5 and 4-6; Updated Equation 4-1, Table 4-1; Updated Figures 4-9, 5-1 and 5-2; Updated section 6, Interface Description, Updated Figures 7-1 and 7-2; Added section 7-3, Irradiated High-Frequency Noise; Updated Tables 7-1 and 7-2; Updated section 8, Development Support; Updated the Packaging Information section; Other minor corrections.

Revision C (11/2013)

Updated Figure 1 and Table 1; Updated Section 2, Feature Description; Updated Section 4, Functional Description; Updated Section 6, Interface Description; Updated Figure 7-1 and 7-2; Updated Section 8, Development Support; Other minor corrections.

DS40001667C-page 42 Advance Information  2012-2013 Microchip Technology Inc.

Page 43

MGC3130

THE MICROCHIP WEB SITE

Microchip provides online support via our WWW site at

www.microchip.com. This web site is used as a means

to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information:

• Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software

• General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing

• Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives

CUSTOMER CHANGE NOTIFICATION SERVICE

CUSTOMER SUPPORT

Users of Microchip products can receive assistance through several channels:

• Distributor or Representative

• Local Sales Office

• Field Application Engineer (FAE)

• Technical Support

Customers should contact their distributor, representative or Field Application Engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document.

Technical support is available through the web site at: http://microchip.com/support

Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest.

To register, access the Microchip web site at

www.microchip.com. Under “Support”, click on

“Customer Change Notification” and follow the registration instructions.

 2012-2013 Microchip Technology Inc. Advance Information DS40001667C-page 43

Page 44

MGC3130

PART NO. X /XX XXX

PatternPackageTemperature

Range

Device

Device: MGC3130

Tape and Reel Option:

Blank = Standard packaging (tube or tray) T = Tape and Reel

(1)

Temperature Range:

I= -40C to +85C (Industrial)

Package:

(2)

MQ = QFN

Pattern: QTP, SQTP, Code or Special Requirements

(blank otherwise)

Examples:

a) MGC3130 - I/MQ

Industrial temperature, QFN package

Note 1: Tape and Reel identifier only appears in the

catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option.

2: For other small form-factor package

availability and marking information, please visit www.microchip.com/packaging or contact your local sales office.

[X]

(1)

Tape and Reel

Option

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

DS40001667C-page 44 Advance Information  2012-2013 Microchip Technology Inc.

Page 45

Note the following details of the code protection feature on Microchip devices:

YSTEM

CERTIFIED BY DNV

== ISO/TS 16949 ==

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.

. Microchip disclaims all liability

Trademarks

The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, K PICSTART, PIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A.

Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries.

Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.

GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries.

All other trademarks mentioned herein are property of their respective companies.

Printed on recycled paper.

ISBN: 9781620776612

EELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,

logo, rfPIC, SST, SST Logo, SuperFlash

QUALITY MANAGEMENT S

 2012-2013 Microchip Technology Inc. Advance Information DS40001667C-page 45

Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.

MCUs and dsPIC® DSCs, KEELOQ

code hopping

Page 46

Worldwide Sales and Service

AMERICAS

Corporate Office

2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support:

http://www.microchip.com/ support

Web Address:

www.microchip.com

Atlanta

Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455

Austin, TX

Tel: 512-257-3370

Boston

Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088

Chicago

Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075

Cleveland

Independence, OH Tel: 216-447-0464 Fax: 216-447-0643

Dallas

Addison, TX Tel: 972-818-7423 Fax: 972-818-2924

Detroit

Novi, MI Tel: 248-848-4000

Houston, TX

Tel: 281-894-5983

Indianapolis

Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453

Los Angeles

Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608

New York, NY

Tel: 631-435-6000

San Jose, CA

Tel: 408-735-9110

Canada - Toronto

Tel: 905-673-0699 Fax: 905-673-6509

ASIA/PACIFIC

Asia Pacific Office

Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431

Australia - Sydney

Tel: 61-2-9868-6733 Fax: 61-2-9868-6755

China - Beijing

Tel: 86-10-8569-7000 Fax: 86-10-8528-2104

China - Chengdu

Tel: 86-28-8665-5511 Fax: 86-28-8665-7889

China - Chongqing

Tel: 86-23-8980-9588 Fax: 86-23-8980-9500

China - Hangzhou

Tel: 86-571-2819-3187 Fax: 86-571-2819-3189

China - Hong Kong SAR

Tel: 852-2943-5100 Fax: 852-2401-3431

China - Nanjing

Tel: 86-25-8473-2460 Fax: 86-25-8473-2470

China - Qingdao

Tel: 86-532-8502-7355 Fax: 86-532-8502-7205

China - Shanghai

Tel: 86-21-5407-5533 Fax: 86-21-5407-5066

China - Shenyang

Tel: 86-24-2334-2829 Fax: 86-24-2334-2393

China - Shenzhen

Tel: 86-755-8864-2200 Fax: 86-755-8203-1760

China - Wuhan

Tel: 86-27-5980-5300 Fax: 86-27-5980-5118

China - Xian

Tel: 86-29-8833-7252 Fax: 86-29-8833-7256

China - Xiamen

Tel: 86-592-2388138 Fax: 86-592-2388130

China - Zhuhai

Tel: 86-756-3210040 Fax: 86-756-3210049

ASIA/PACIFIC

India - Bangalore

Tel: 91-80-3090-4444 Fax: 91-80-3090-4123

India - New Delhi

Tel: 91-11-4160-8631 Fax: 91-11-4160-8632

India - Pune

Tel: 91-20-3019-1500

Japan - Osaka

Tel: 81-6-6152-7160 Fax: 81-6-6152-9310

Japan - Tokyo

Tel: 81-3-6880- 3770 Fax: 81-3-6880-3771

Korea - Daegu

Tel: 82-53-744-4301 Fax: 82-53-744-4302

Korea - Seoul

Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934

Malaysia - Kuala Lumpur

Tel: 60-3-6201-9857 Fax: 60-3-6201-9859

Malaysia - Penang

Tel: 60-4-227-8870 Fax: 60-4-227-4068

Philippines - Manila

Tel: 63-2-634-9065 Fax: 63-2-634-9069

Singapore

Tel: 65-6334-8870 Fax: 65-6334-8850

Taiwan - Hsin Chu

Tel: 886-3-5778-366 Fax: 886-3-5770-955

Taiwan - Kaohsiung

Tel: 886-7-213-7830

Taiwan - Taipei

Tel: 886-2-2508-8600 Fax: 886-2-2508-0102

Thailand - Bangkok

Tel: 66-2-694-1351 Fax: 66-2-694-1350

EUROPE

Austria - Wels

Tel: 43-7242-2244-39 Fax: 43-7242-2244-393

Denmark - Copenhagen

Tel: 45-4450-2828 Fax: 45-4485-2829

France - Paris

Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79

Germany - Dusseldorf

Tel: 49-2129-3766400

Germany - Munich

Tel: 49-89-627-144-0 Fax: 49-89-627-144-44

Germany - Pforzheim

Tel: 49-7231-424750

Italy - Milan

Tel: 39-0331-742611 Fax: 39-0331-466781

Italy - Venice

Tel: 39-049-7625286

Netherlands - Drunen

Tel: 31-416-690399 Fax: 31-416-690340

Poland - Warsaw

Tel: 48-22-3325737

Spain - Madrid

Tel: 34-91-708-08-90 Fax: 34-91-708-08-91

Sweden - Stockholm

Tel: 46-8-5090-4654

UK - Wokingham

Tel: 44-118-921-5800 Fax: 44-118-921-5820

10/28/13

DS40001667C-page 46 Advance Information  2013 Microchip Technology Inc.

Datasheet MGC3130 Datasheet

Specifications and Main Features

Frequently Asked Questions

User Manual

Introduction:

Applications:

Power Features:

Key Features:

Peripheral Features:

Package Type

Table of Contents

Most Current Data Sheet

Errata

Customer Notification System

1.0 THEORY OF OPERATION: ELECTRICAL NEAR-FIELD (E-FIELD) SENSING

1.1 GestIC Technology Benefits

2.0 FEATURE DESCRIPTION

2.1 Gesture Definition

2.2 GestIC Library

2.2.1 COLIBRI SUITE

FIGURE 2-2: SENSOR TOUCH DIAGRAM

FIGURE 2-3: APPROACH DETECTION SEQUENCE

3.0 SYSTEM ARCHITECTURE

3.1 MGC3130 Controller

3.2 GestIC Library

3.3 External Electrodes

FIGURE 3-1: MGC3130 CONTROLLER SYSTEM ARCHITECTURE

3.3.1 ELECTRODE EQUIVALENT CIRCUIT

FIGURE 3-2: ELECTRODES CAPACITIVE EQUIVALENT CIRCUITRY EARTH GROUNDED

3.3.2 STANDARD ELECTRODE DESIGN

FIGURE 3-3: FRAME SHAPE ELECTRODES

4.0 FUNCTIONAL DESCRIPTION

FIGURE 4-1: MGC3130 CONTROLLER BLOCK DIAGRAM

4.1 Reset Block

4.2 Power Control and Clocks

4.2.1 POWER MANAGEMENT UNIT (PMU)

4.2.2 POWER SUPERVISORS

FIGURE 4-4: STEP-UP APPLICATIONS START-UP

FIGURE 4-5: POWER SUPERVISORS

4.2.3 CLOCKS

4.2.4 OPERATION MODES

FIGURE 4-6: MGC3130 POWER PROFILE

TABLE 4-1: CURRENT CONSUMPTION OVERVIEW

TABLE 4-2: OPERATION MODES SUMMARY

4.2.5 POWER-UP/DOWN SEQUENCE

FIGURE 4-9: POWER-UP SEQUENCE TIMINGS

Power-up Phases

Signal References

FIGURE 4-10: POWER-DOWN SEQUENCE TIMINGS

Power-down Phases

Signal References

4.3 Transmit Signal Generation

4.4 Receive (Rx) Channels

4.5 Analog-to-Digital Converter (ADC)

4.6 Signal Processing Unit (SPU)

4.7 Parameters Storage

5.0 APPLICATION ARCHITECTURE

5.1 Single-Zone Design

5.2 Dual-Zone Design

FIGURE 5-2: DUAL-ZONE DESIGN

FIGURE 5-1: SINGLE-ZONE DESIGN

6.0 INTERFACE DESCRIPTION

6.1 Interface Selection

6.2 Extended Input Output (EIO)

6.3 Interrupt Requests

6.4 Synchronization

6.5 Gesture Port

FIGURE 6-1: GESTURE PORT MAPPING

TABLE 6-3: COLIBRI SUITE EVENTS

FIGURE 6-2: GESTURE PORT ACTION

TABLE 6-4: GPIO PORT ACTION MAPPING

6.6 Communication Interfaces

6.6.1 I2C

TABLE 6-5: I2C™ PIN DESCRIPTION

TABLE 6-6: I2C™ DEVICE ID ADDRESS

6.6.2 TRANSFER STATUS LINE

TABLE 6-9: USAGE OF TRANSFER STATUS LINE

FIGURE 6-3: MGC3130 COMMUNICATION PROTOCOL

6.6.3 SPI

TABLE 6-10: SPI PIN DESCRIPTION