Page 1
0.1– 6 GHz 3 V, 17 dBm Amplifier
Technical Data
MGA-82563
Features
• +17.3 dBm P
+20 dBm P
• Single +3V Supply
• 2.2 dB Noise Figure at
2.0␣ GHz
• 13.2 dB Gain at 2.0 GHz
• Ultra-miniature Package
• Unconditionally Stable
at 2.0 GHz
1 dB
at 2.0 GHz
sat
Applications
• Buffer or Driver Amp for
PCS, PHS, ISM, SATCOM
and WLL Applications
• High Dynamic Range LNA
Simplified Schematic
OUTPUT
and V
INPUT
3
6
Surface Mount Package
SOT-363 (SC-70)
Description
Hewlett-Packard’s MGA-82563 is
an economical, easy-to-use GaAs
MMIC amplifier that offers
excellent power and low noise
figure for applications from 0.1 to
6 GHz. Packaged in an ultraminiature SOT-363 package, it
requires half the board space of a
SOT-143 package.
Pin Connections and Package Marking
GND
1
GND
2
INPUT
3
Note: Package marking provides
orientation and identification.
d
82
OUTPUT
6
and V
5
GND
4 GND
The input and output of the
amplifier are matched to 50␣ Ω
(below 2:1 VSWR) across the
d
entire bandwidth, eliminating the
expense of external matching.
The amplifier allows a wide
dynamic range by offering a 2.2 dB
NF coupled with a +31 dBm
Output IP3.
The circuit uses state-of-the-art
PHEMT technology with proven
reliability. On-chip bias circuitry
allows operation from a single
+3␣ V power supply, while resistive
feedback ensures stability (K>1)
over all frequencies and
temperatures.
5965-9685E
GND
1, 2, 4, 5
BIAS
BIAS
6-208
Page 2
MGA-82563 Absolute Maximum Ratings
Absolute
Symbol Parameter Units Maximum
T
V
V
P
T
V
d
gd
in
in
ch
STG
Device Voltage, RF Output V 5.0
to Ground
Device Voltage, Gate V -6.0
to Drain
Range of RF Input Voltage V +0.5 to -1.0
to Ground
CW RF Input Power dBm +13
Channel Temperature °C 165
Storage Temperature °C - 65 to 150
[1]
Thermal Resistance
θ
= 180°C/W
ch-c
Notes:
1. Permanent damage may occur if
any of these limits are exceeded.
= 25°C (TC is defined to be the
2. T
C
temperature at the package pins
where contact is made to the
circuit board.)
[2]
:
MGA-82563 Electrical Specifications, T
Symbol Parameters and Test Conditions Units Min. Typ. Max. Std Dev
G
NF
NF
test
test
50
Gain in test circuit
Noise Figure in test circuit
Noise Figure in 50 Ω system f = 0.5 GHz dB 2.3
[1]
[1]
= 25° C, ZO = 50 Ω, Vd = 3 V
C
f = 2.0 GHz 12.0 13.2 0.35
f = 2.0 GHz 2.2 2.9 0.20
[2]
f = 1.0 GHz 2.2
f = 2.0 GHz 2.2 0.20
f = 3.0 GHz 2.2
f = 4.0 GHz 2.4
f = 6.0 GHz 2.7
2
|
|S
21
Gain in 50 Ω system f = 0.5 GHz dB 14.7
f = 1.0 GHz 14.5
f = 2.0 GHz 13.5 0.35
f = 3.0 GHz 12.1
f = 4.0 GHz 10.7
f = 6.0 GHz 8.8
P
1 dB
Output Power at 1 dB Gain Compression f = 0.5 GHz dBm 17.4
f = 1.0 GHz 17.5
f = 2.0 GHz 17.3 0.54
f = 3.0 GHz 17.1
f = 4.0 GHz 17.0
f = 6.0 GHz 16.8
IP
VSWR
VSWR
I
Notes:
1. Guaranteed specifications are 100% tested in the circuit in Figure 10 in the Applications Information section.
2. Standard deviation number is based on measurement of at least 500 parts from three non-consecutive wafer lots during
the initial characterization of this product, and is intended to be used as an estimate for distribution of the typical
specification.
Output Third Order Intercept Point f = 2.0 GHz dBm +31 1.0
3
Input VSWR f = 0.2–5.0 GHz 1.8:1
in
Output VSWR f = 0.2–5.0 GHz 1.2:1
out
Device Current mA 63 84 101
d
6-209
Page 3
MGA-82563 Typical Performance, T
= 25° C, V
C
= 3 V
d
16
14
12
10
(dB)
8
GAIN
6
4
TA = +85°C
= +25°C
T
A
2
= –40°C
T
A
0
034512 6 0 34512 6
FREQUENCY (GHz) FREQUENCY (GHz)
Figure 1. 50 Ω Power Gain vs.
Frequency and Temperature.
16
14
12
10
(dB)
8
GAIN
6
Vd = 3.3V
4
= 3.0V
V
d
2
= 2.7V
V
d
0
034512 6
FREQUENCY (GHz)
Figure 4. 50 Ω Power Gain vs.
Frequency and Voltage.
5
4
(dB)
3
2
NOISE FIGURE
TA = +85°C
1
= +25°C
T
A
= –40°C
T
A
0
Figure 2. Noise Figure (into 50 Ω)
vs. Frequency and Temperature.
5
4
(dB)
3
2
Vd = 3.3V
NOISE FIGURE
1
= 3.0V
V
d
= 2.7V
V
d
0
034512 6
FREQUENCY (GHz)
Figure 5. Noise Figure (into 50 Ω) vs.
Frequency and Voltage.
19
18
17
(dBm)
1 dB
16
P
TA = +85°C
15
14
= +25°C
T
A
= –40°C
T
A
034512 6
FREQUENCY (GHz)
Figure 3. Output Power @ 1 dB Gain
Compression vs. Frequency and
Temperature.
19
18
17
(dBm)
1 dB
16
P
Vd = 3.3V
15
= 3.0V
V
d
= 2.7V
V
d
14
034512 6
FREQUENCY (GHz)
Figure 6. Output Power @ 1 dB Gain
Compression vs. Frequency and
Voltage.
4
3.5
3
2.5
VSWR (n:1)
Input
2
1.5
Output
1
034512 6
FREQUENCY (GHz)
Figure 7. Input and Output VSWR
into 50 Ω vs. Frequency.
110
100
90
80
(mA)
70
60
50
40
30
DEVICE CURRENT
20
10
03412
TA = +85°C
= +25°C
T
A
= -40°C
T
A
DEVICE VOLTAGE (V)
Figure 8. Device Current vs. Voltage
and Temperature.
6-210
16
14
12
(dB)
10
GAIN and NF
Gain
8
6
4
2
0
NF
034512 6
FREQUENCY (GHz)
Figure 9. Minimum Noise Figure and
Associated Gain vs. Frequency.
Page 4
MGA-82563 Typical Scattering Parameters
Freq. S
11
S
21
[1]
, T
= 25° C, ZO = 50 Ω, Vd = 3 V
C
S
12
S
22
GHz Mag Ang dB Mag Ang dB Mag Ang Mag Ang Factor
0.1 0.48 -39 15.71 6.10 164 -23 0.070 27 0.16 -99 1.02
0.2 0.35 -35 14.81 5.50 165 -22 0.076 14 0.12 -134 1.20
0.5 0.29 -37 14.34 5.21 159 -22 0.079 6 0.11 177 1.29
1.0 0.29 -57 13.95 4.98 144 -22 0.080 3 0.11 156 1.33
1.5 0.29 -78 13.50 4.73 128 -22 0.082 2 0.10 142 1.37
2.0 0.29 -99 12.99 4.46 114 -22 0.085 1 0.10 131 1.41
2.5 0.29 -118 12.45 4.19 99 -21 0.089 -1 0.10 124 1.44
3.0 0.28 -138 11.84 3.91 86 -21 0.093 -3 0.11 118 1.48
3.5 0.28 -158 11.24 3.65 74 -21 0.098 -6 0.12 111 1.51
4.0 0.29 -177 10.67 3.42 61 -20 0.103 -9 0.13 106 1.52
4.5 0.30 166 10.11 3.20 50 -20 0.107 -13 0.15 100 1.53
5.0 0.32 151 9.58 3.01 38 -19 0.112 -18 0.16 94 1.54
5.5 0.34 136 9.07 2.84 27 -19 0.117 -23 0.18 87 1.55
6.0 0.36 123 8.57 2.68 16 -19 0.121 -29 0.19 82 1.54
6.5 0.38 110 8.06 2.53 5 -19 0.125 -35 0.22 74 1.55
7.0 0.40 97 7.51 2.37 -5 -18 0.126 -41 0.24 66 1.59
K
MGA-82563 Typical Noise Parameters
[1]
TC = 25° C, ZO = 50 Ω, Vd = 3 V
Frequency NF
O
Γ
opt
GHz dB Mag. Ang. —
0.5 2.10 0.15 25 1.20
1.0 2.10 0.15 45 0.60
1.5 2.10 0.14 65 0.29
2.0 2.12 0.15 75 0.27
2.5 2.12 0.15 94 0.25
3.0 2.15 0.144 113 0.23
3.5 2.16 0.14 134 0.21
4.0 2.16 0.15 155 0.19
4.5 2.19 0.17 177 0.18
5.0 2.18 0.20 -166 0.18
5.5 2.19 0.22 -152 0.18
6.0 2.23 0.25 -138 0.19
6.5 2.28 0.27 -125 0.23
7.0 2.39 0.29 -111 0.28
Note:
1. Reference plane per Figure 11 in Applications Information section.
R
/ 50 Ω
n
6-211
Page 5
MGA-82563 Applications Information
Introduction
This medium power GaAs MMIC
amplifier was developed for
commercial wireless applications
from 100 MHz to 6 GHz. The
MGA-82563 runs on only 3 volts
and typically requires only 84 mA
to deliver over 17 dBm of output
power at 1 dB gain compression.
The 17.3 dBm output power
(P
) makes the MGA-82563
1␣ dB
extremely useful for pre-driver
and driver stages in transmit
cascades or for final output stages
in lower power systems. For
transmitter gain stage applications
that require even higher output
power, the MGA-82563 can
provide 100 mW (20 dBm) of
saturated output power with a
power added efficiency approaching 50%. The low cost of the
MGA-82563 makes it feasible to
power combine two (or more)
devices for even higher output
power amplifiers.
The MGA-82563 offers an excellent combination of high linearity
(+31 dBm output IP3) and very
low noise figure (2.2 dB) for
applications requiring a very high
dynamic range.
The MGA-82563 uses resistive
feedback to simultaneously
achieve flat gain over a wide
bandwidth and to match the input
and output impedances to 50 Ω.
The MGA-82563 is also unconditionally stable (K>1) over its
entire frequency range, making it
both very easy to use and yielding
consistent performance in the
manufacture of high volume
wireless products.
An innovative internal bias circuit
regulates the device’s internal
current to enable the MGA-82563
to operate over a wide temperature range with a single, positive
power supply of 3 volts. The
MGA-82563 will operate with
reduced power and gain with a
bias supply as low as 1.5 volts.
Test Circuit
The circuit shown in Figure 10 is
used for 100% RF testing of Gain
and Noise Figure. The test circuit
is merely a 50 Ω input/output PC
board with a RFC at the output to
apply DC bias to the device under
test. Tests in this circuit are used
to guarantee the NF
test
and G
test
parameters shown in the table of
Electrical Specifications.
RF
INPUT
Figure 10. Test Circuit.
82
100 pF
22 nH
RFC
100 pF
RF
OUTPUT
V
d
Phase Reference Planes
The positions of the reference
planes used to specify the
S-Parameters and Noise Parameters for this device are shown in
Figure 11. As seen in the illustration, the reference planes are
located at the point where the
package leads contact the test
circuit.
REFERENCE
PLANES
TEST CIRCUIT
Figure 11. Phase Reference Planes.
Specifications and Statistical Parameters
Several categories of parameters
appear within this data sheet.
Parameters may be described with
values that are either “minimum
or maximum,” “typical,” or
“standard deviations.”
The values for parameters are
based on comprehensive product
characterization data, in which
automated measurements are
made on of a minimum of
500␣ parts taken from 3 nonconsecutive process lots of
semiconductor wafers. The data
derived from product characterization tends to be normally
distributed, e.g., fits the standard
“bell curve.”
Parameters considered to be the
most important to system performance are bounded by minimum
or maximum values. For the
MGA-82563, these parameters are:
Gain (G
and Device Current (Id). Each of
these guaranteed parameters is
100% tested.
Values for most of the parameters
in the table of Electrical Specifications that are described by typical
data are the mathematical
mean␣ ( µ), of the normal distribution taken from the characterization data. For parameters where
measurements or mathematical
averaging may not be practical,
such as the Noise and S-parameter
tables or performance curves, the
data represents a nominal part
taken from the “center” of the
characterization distribution.
Typical values are intended to be
used as a basis for electrical
design.
), Noise Figure (NF
test
test
),
6-212
Page 6
To assist designers in optimizing
not only the immediate circuit
using the MGA-82563, but to also
optimize and evaluate trade-offs
that affect a complete wireless
system, the standard
deviation␣(σ) is provided for
many of the Electrical Specifications parameters (at 25°) in
addition to the mean. The standard deviation is a measure of the
variability about the mean. It will
be recalled that a normal distribution is completely described by
the mean and standard deviation.
Standard statistics tables or
calculations provide the probability of a parameter falling between
any two values, usually symmetrically located about the mean.
Referring to Figure 12 for example, the probability of a parameter being between ± 1σ is 68.3%;
between ± 2σ is 95.4%; and between ± 3σ is 99.7%.
68%
95%
99%
-3σ -2σ -1σ +1σ +2σ +3σ
Figure 12. Normal Distribution.
Mean (µ)
(typical)
Parameter Value
RF Layout
The RF layout in Figure 13 is
suggested as a starting point for
microstripline designs using the
MGA-82563 amplifier. Adequate
grounding is needed to obtain
optimum performance and to
maintain stability. All of the
ground pins of the MMIC should
be connected to the RF
groundplane on the backside of
the PCB by means of plated
through holes (vias) that are
placed near the package terminals. As a minimum, one via
should be located next to each
ground pin to ensure good RF
grounding. It is a good practice to
use multiple vias to further
minimize ground path inductance.
50 Ω
82
RF Input
Figure 13. RF Layout.
RF Output
and V
50 Ω
d
In addition to the RF considerations, the use of multiple vias for
grounding is important for the
purpose of providing a lower
resistance thermal path to the
heatsink.
It is recommended that the PCB
pads for the ground pins not be
connected together underneath
the body of the package. PCB
traces hidden under the package
cannot be adequately inspected
for SMT solder quality.
PCB Material
FR-4 or G-10 printed circuit board
materials are a good choice for
most low cost wireless applications. Typical board thickness is
0.020 to 0.031 inches. The width of
the 50 Ω microstriplines on PC
boards in this thickness range is
also very convenient for mounting
chip components such as the
series inductor at the input or DC
blocking and bypass capacitors.
For higher frequencies or for
noise figure critical applications,
the additional cost of PTFE/glass
dielectric materials may be
warranted to minimize transmission line loss at the amplifier’s
input. A 0.5 inch length of 50␣ Ω
microstripline on FR-4, for
example, has approximately
0.3␣ dB loss at 4 GHz. This loss will
add directly to the noise figure of
the MGA-82563.
Biasing
The MGA-82563 is a voltagebiased device and is designed to
operate from a single, +3 volt
power supply with a typical
current drain of 84 mA. The
internal current regulation circuit
allows the amplifier to be operated with voltages as low as
+1.5␣ volts. Refer to the section
titled “Operation at Bias Voltages
Other than 3 Volts” for information on performance and precautions when using other voltages.
Typical Application Example
The printed circuit layout in
Figure 14 can serve as a design
guide. This layout is a
microstripline design (solid
groundplane on the backside of
the circuit board) with a 50 Ω
input and output. The circuit is
fabricated on 0.031-inch thick
FR-4 dielectric material. Plated
through holes (vias) are used to
bring the ground to the top side of
the circuit where needed. Multiple
vias are used to reduce the
inductance of the paths to ground.
H
OUT
IN
+V
MGA-8-A
Figure 14. PCB Layout.
6-213
Page 7
A schematic diagram of the
application circuit is shown in
Figure 15. DC blocking capacitors
(C1 and C2) are used at the input
and output of the MMIC to isolate
the device from adjacent circuits.
While the input terminal of the
MGA-82563 is at ground potential,
it is not a current sink. If the input
is connected to a preceding stage
that has a voltage present, the use
of the DC blocking capacitor (C1)
is required.
C2
RF
Input
C1
Figure 15. Schematic Diagram.
RFC
C2
V
d
C4
RF
Output
DC bias is applied to the
MGA-82563 through the RF
Output pin. An inductor (RFC), or
length of high impedance transmission line (preferably λ/4 at the
band center), is used to isolate the
RF from the DC supply.
The power supply is bypassed to
ground with capacitor C3 to keep
RF off of the DC lines and to
prevent gain dips or peaks in the
response of the amplifier.
An additional bypass capacitor,
C4, may be added to the bias line
near the Vd connection to eliminate unwanted feedback through
bias lines that could cause oscillation. C4 will not normally be
needed unless several stages are
cascaded using a common power
supply.
When multiple bypass capacitors
are used, consideration should be
given to potential resonances. It is
important to ensure that the
capacitors when combined with
additional parasitic L’s and C’s on
the circuit board do not form
resonant circuits. The addition of
a small value resistor in the bias
supply line between bypass
capacitors will often “de-Q” the
bias circuit and eliminate the
effect of a resonance.
The value of the DC blocking and
RF bypass capacitors (C1 - C3)
should be chosen to provide a
small reactance (typically
<5␣ ohms) at the lowest operating
frequency. The reactance of the
RF choke (RFC) should be high
(e.g., several hundred ohms) at
the lowest frequency of operation.
The MGA-82563’s response at low
frequencies is limited to approximately 100 MHz by the size of
capacitors integrated on the
MMIC chip.
The input and output of the
MGA-82563 are well matched to
50␣ Ω. Without external matching
elements, the input VSWR of the
MGA-82563 is ≤ 2.0:1 from
300␣ MHz to 6 GHz and the Output
VSWR is ≤ 1.6:1 from 100 MHz
through 6 GHz.
For applications requiring minimum
noise figure (NF
), some improve-
o
ment over a 50 Ω match is possible
by matching the signal input to the
optimum noise match impedance,
Γ
, as specified in the “Typical
o
Noise Parameters” table. The data
in the table shows the noise match
to be very close to 50 Ω.
The completed application
amplifier with all components and
SMA connectors is shown in
Figure 16.
H
C1
IN
MGA-8-A
Figure 16. Complete Application Circuit.
OUT
C2
RFC
C3
+V
C4
6-214
Page 8
Operation in Saturation for Higher Output Power
For applications such as predriver, driver, and output stages in
transmitters, the MGA-82563 can
be operated in saturation to
deliver up to 100 mW (20 dBm) of
output power. The power added
efficiency approaches 50% at
these power levels.
There are several design considerations related to reliability and
performance that should be taken
into account when operating the
amplifier in saturation.
First of all, it is important that the
stage preceding the MGA-82563
not overdrive the device. Referring to the “Absolute Maximum
Ratings” table, the maximum
allowable input power is
+13␣ dBm. This should be regarded
as the input power level above
which the device could be permanently damaged.
Driving the amplifier into saturation will also affect electrical
performance. Figure 17 presents
the Output Power, Third Order
Intercept Point (Output IP3), and
Power Added Efficiency (PAE) as
a function of Input Power. This
data represents performance into
a 50 Ω load. Since the output
impedance of the device changes
when driven into saturation, it is
possible to obtain even more
output power with a “power
match.” The optimum impedance
match for maximum output power
is dependent on specific frequency and actual output power
level and can be arrived at
empirically.
50
40
30
20
(dBm), PAE (%)
3
10
0
Pout and IP
-10
-20 -5 0 5-15 -10 10
POWER IN (dBm)
Figure 17. Output Power, IP
Power-Added-Efficiency vs. Input
Power. (Vd = 3.0 V)
PAE
IP
3
Power
, and
3
As the input power is increased
beyond the linear range of the
amplifier, the gain becomes more
compressed. Gain as a function of
either input or output power may
be derived from Figure 17. Gain
compression renders the amplifier
less sensitive to variations in the
power level from the preceding
stage. This can be a benefit in
systems requiring fairly constant
output power levels from the
MGA-82563.
Increased efficiency (up to 45% at
full output power) is another
benefit of saturated operation. At
high output power levels, the bias
supply current drops by about
15%. This is normal and is taken
into account for the PAE data in
Figure 17.
Like other active devices, the
intermodulation products of the
MGA-82563 increase as the device
is driven further into nonlinear
operation. The 3rd, 5th, and 7th
order intermodulation products of
the MGA-82563 are shown in
Figure 18 along with the funda-
mental response. This data was
measured in the test circuit in
Figure 10.
30
20
10
Pout
0
-10
-20
-30
-40
3rd
-50
Pout, 3rd, 5th, 7th HARMONICS (dBm)
-60
-30 -5 0 5 10 15-15 -10 20
Figure 18. Intermodulation Products
vs. Input Power. (Vd = 3.0 V)
5th
FREQUENCY (GHz)
7th
Operation at Bias Voltages
Other than 3 Volts
While the MGA-82563 is designed
primarily for use in +3 volt
applications, the internal bias
regulation circuitry allows it to be
operated with power supply
voltages from +1.5 to +4 volts.
Performance of Gain, Noise
Figure, and Output Power over a
wide range of bias voltage is
shown in Figure 19. (This data
was measured in the test circuit in
Figure 10.) As can be seen, the
gain and NF are fairly flat, but an
increase in output power is
possible by using higher voltages.
The use of +4 volts increases the
P
by over 2 dBm.
1dB
If bias voltages greater than
3␣ volts are used, particular
attention should be given to
thermal management. Refer to the
“Thermal Design Considerations”
section for more details.
6-215
Page 9
22
20
18
16
(dB)
14
1 dB
12
10
8
6
NF, GAIN, P
4
2
0
03412
SUPPLY VOLTAGE (V)
Figure 19. Gain, Noise Figure, and
Output Power vs. Supply Voltage.
Power
Gain
NF
There are several means of biasing
the MGA-82563 at 3 volts in
systems that use higher power
supply voltages. The simplest
method, shown in Figure 20a, is to
use a series resistor to drop the
device voltage to 3 volts. For
example, a 24 Ω resistor will drop
a 5-volt supply to 3 volts at the
nominal current of 84 mA. Some
variation in performance could be
expected for this method due to
variations in current within the
specified 63 to 101 mA min/max
range.
+5 V
24 Ω
(a)
Figure 20. Biasing From Higher
Supply Voltages.
+5 V
Silicon
Diodes
(b)
+5 V
Zener
Diode
(c)
A second method illustrated in
Figure 20b, is to use forwardbiased diodes in series with the
power supply. For example, three
silicon diodes connected in series
will drop a 5-volt supply to
approximately 3 volts.
The use of the series diode
approach has the advantage of
less dependency on current
variation in the amplifiers since
the forward voltage drop of a
diode is somewhat current
independent.
Reverse breakdown diodes (e.g.,
Zener diodes) could also be used
as in Figure 20c. However, care
should be taken to ensure that the
noise generated by diodes in
either Zener or reverse breakdown is adequately filtered (e.g.,
bypassed to ground) such that the
diode’s noise is not added to the
amplifier’s signal.
Note that the voltage-dropping
component in each of these three
methods must be able to safely
dissipate up to 200 mW.
Thermal Design Considerations
Good thermal design is important
in the application of medium
power devices, especially when
housed in miniature packages
such as the SOT-363/SC-70.
As previously mentioned in the
“RF Layout” section, the use of
multiple vias near all of the
ground pins provides an important
part of the heatsinking function.
For reliable operation, the channel
temperature should be kept within
the 165° C indicated in the “Absolute Maximum Ratings” table.
As an illustration of a thermal
calculation, consider the example
of a MGA-82563 biased at 3.0 volts
for an application with a MTTF
goal of 106 hours (114 years).
Operating life tests have established a MTTF in excess of
106␣ hours (114 years) for a channel temperature of 150° C. The
maximum device current specification is 101 mA at 3 volts. From
Figure 8, it can be seen that the
current will increase by approximately 9 mA to 110 mA at an
elevated temperature. The device
power dissipation is then:
Pd = 3.0 volts * 110 mA,
which is equal to 330 mW. The
channel-to-“case” thermal resistance (θ
) from the “Absolute
ch-c
Maximum Ratings” table is
180°␣ C/watt. Note that “case” is
defined as the interface between
the SOT-363 package pins and the
mounting surface (i.e., PCB).
The temperature rise from the
mounting surface to the MMIC
channel is:
∆T = 0.330 watt * 180° C/watt,
or 59° C. To achieve the MTTF
goal of 106 hours, the circuit to
which the device is mounted
should not exceed:
T
= 150° - 59° C,
case
which is equal to 91° C.
For other MTTF goals and/or
operating temperatures, HewlettPackard publishes reliability data
sheets based on operating life
tests to enable designers to arrive
at a thermal design for their
particular operating environment.
For a reliability data sheet covering the MGA-82563, request
Hewlett-Packard publication
number 5964-4128E, titled “GaAs
MMIC Amplifier Reliability Data.”
(This reliability data sheet covers
the MGA-82563 as part of this
family of GaAs MMICs.)
6-216
Page 10
SOT-363 PCB Footprint
A recommended PCB pad layout
for the miniature SOT-363 (SC-70)
package used by the MGA-82563 is
shown in Figure 21 (dimensions
are in inches). This layout provides ample allowance for package placement by automated
assembly equipment without
adding parasitics that could
impair the high frequency RF
performance of the MGA-82563.
The layout is shown with a
nominal SOT-363 package footprint superimposed on the PCB
pads.
0.026
0.075
0.035
0.016
Figure 21. PCB Pad Layout
(dimensions in inches).
SMT Assembly
Reliable assembly of surface
mount components is a complex
process that involves many
250
200
150
TEMPERATURE (°C)
100
50
Preheat
Zone
material, process, and equipment
factors, including: method of
heating (e.g., IR or vapor phase
reflow, wave soldering, etc.)
circuit board material, conductor
thickness and pattern, type of
solder alloy, and the thermal
conductivity and thermal mass of
components. Components with a
low mass, such as the SOT-363
package, will reach solder reflow
temperatures faster than those
with a greater mass.
The MGA-82563 is has been
qualified to the time-temperature
profile shown in Figure 22. This
profile is representative of an IR
reflow type of surface mount
assembly process.
After ramping up from room
temperature, the circuit board
with components attached to it
(held in place with solder paste)
passes through one or more
preheat zones. The preheat zones
increase the temperature of the
board and components to prevent
thermal shock and begin evaporating solvents from the solder paste.
The reflow zone briefly elevates
the temperature sufficiently to
produce a reflow of the solder.
T
MAX
Reflow
Zone
Cool Down
Zone
The rates of change of temperature for the ramp-up and cooldown zones are chosen to be low
enough to not cause deformation
of the board or damage to components due to thermal shock. The
maximum temperature in the
reflow zone (T
) should not
MAX
exceed 235 ° C.
These parameters are typical for a
surface mount assembly process
for the MGA-82563. As a general
guideline, the circuit board and
components should be exposed
only to the minimum temperatures and times necessary to
achieve a uniform reflow of
solder.
Electrostatic Sensitivity
GaAs MMICs are
electrostatic discharge
(ESD) sensitive
devices. Although the
MGA-82563 is robust in design,
permanent damage may occur to
these devices if they are subjected
to high energy electrostatic
discharges. Electrostatic charges
as high as several thousand volts
(which readily accumulate on the
human body and on test equipment) can discharge without
detection and may result in
degradation in performance or
failure. The MGA-82563 is a ESD
Class 1 device. Therefore, proper
ESD precautions are recommended when handling, inspecting, and assembling these devices
to avoid damage.
0
0
Figure 22. Surface Mount Assembly Profile.
60
120 180 240 300
TIME (seconds)
6-217
Page 11
Package Dimensions
Outline 63 (SOT-363/SC-70)
1.30 (0.051)
REF.
2.20 (0.087)
2.00 (0.079)
0.10 (0.004)
0.00 (0.00)
0.25 (0.010)
0.15 (0.006)
2.20 (0.087)
1.80 (0.071)
DIMENSIONS ARE IN MILLIMETERS (INCHES)
1.35 (0.053)
1.15 (0.045)
0.650 BSC (0.025)
1.00 (0.039)
0.80 (0.031)
0.30 REF.
10°
0.30 (0.012)
0.10 (0.004)
0.425 (0.017)
TYP.
0.20 (0.008)
0.10 (0.004)
MGA-82563 Part Number Ordering Information
Part Number No. of Devices Container
MGA-82563-TR1 3000 7" Reel
MGA-82563-BLK 100 antistatic bag
6-218
Page 12
Device Orientation
REEL
CARRIER
8 mm
TAPE
USER
FEED
DIRECTION
COVER TAPE
Tape Dimensions and Product Orientation
For Outline 63
P
P
0
C
TOP VIEW
4 mm
82 82 82 82
D
END VIEW
P
2
E
F
W
CAVITY
PERFORATION
CARRIER TAPE
COVER TAPE
DISTANCE
(CARRIER TAPE THICKNESS) Tt (COVER TAPE THICKNESS)
t
1
8° MAX.
A
0
DESCRIPTION SYMBOL SIZE (mm) SIZE (INCHES)
A
LENGTH
WIDTH
DEPTH
PITCH
BOTTOM HOLE DIAMETER
DIAMETER
PITCH
POSITION
WIDTH
THICKNESS
WIDTH
TAPE THICKNESS
CAVITY TO PERFORATION
(WIDTH DIRECTION)
CAVITY TO PERFORATION
(LENGTH DIRECTION)
B
K
P
D
D
P
E
W
t
1
C
T
F
P
0
0
0
1
0
t
2
2.24 ± 0.10
2.34 ± 0.10
1.22 ± 0.10
4.00 ± 0.10
1.00 + 0.25
1.55 ± 0.05
4.00 ± 0.10
1.75 ± 0.10
8.00 ± 0.30
0.255 ± 0.013
5.4 ± 0.10
0.062 ± 0.001
3.50 ± 0.05
2.00 ± 0.05
K
0
0.088 ± 0.004
0.092 ± 0.004
0.048 ± 0.004
0.157 ± 0.004
0.039 + 0.010
0.061 ± 0.002
0.157 ± 0.004
0.069 ± 0.004
0.315 ± 0.012
0.010 ± 0.0005
0.205 ± 0.004
0.0025 ± 0.00004
0.138 ± 0.002
0.079 ± 0.002
6-219
D
1
5° MAX.
B
0
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