Datasheet MF34-800, MF34-1000, MF34-1200, MF34-1400, MF34-1600 Datasheet (DYNEX)

MF34

MF34

Fast Recovery Diode

Replaces March 1998 version, DS4624-2.1 DS4624-3.0 January 2000

APPLICATIONS

■ Inverse, Parallel Or Series Connected Diode

■ Power Supplies

■ High Frequency Applications

FEATURES

■ Glass Passivation

■ High Voltage Capability

■ Fast Recovery Characteristics

VOLTAGE RATINGS

Type Number Repetitive Peak

Reverse Voltage

V

RRM

V

MF34 - 1600
MF34 -1400
MF34 - 1200
MF34 -1000
MF34 - 800

1600
1400
1200
1000

800

Conditions

= V

V

RSM

RRM

+100V

KEY PARAMETERS

V

RRM

I

F(AV)

I

FSM

Q

r

t

rr

1600V

40A

400A
25µC

0.25ns

Lower voltage grades available.
For stud anode add suffix 'R' to type number. e.g. MF34-1600R.

See Package Details for further information.

Outline type code: DO5.

CURRENT RATINGS

Symbol Parameter Conditions UnitsMax.

I

F(AV)

I

F(RMS)

I

Mean forward current

RMS value

F

Continuous (direct) forward current

Half sine wave resistive load, T

T

= 65oC63A

case

T

= 65oC50A

case

= 65oC40A

case

1/7

MF34

SURGE RATINGS

ParameterSymbol

FSM

Surge (non-repetitive) forward currentI

THERMAL AND MECHANICAL DATA

Symbol

th(j-c)

th(c-h)

T

vj

stg

Thermal resistance - junction to caseR
Thermal resistance - case to heatsinkR

Virtual junction temperature

Parameter

Conditions

10ms half sine; with V

RRM

10ms half sine; Tj = 125oC

Conditions Max. Units

dc

≤ 10V, Tj = 125oC

Max. Units

400 A

800 A

Min.

- 0.8

Mounting torque 3.5Nm
with mounting compound

Forward (conducting) - 125
Reverse (blocking)

- 125

125-55Storage temperature rangeT

4.03.5Mounting torque-

o

C/W

o

C/W- 0.2

o

o

˚C

Nm

2

sI2t for fusingI2t

C
C

CHARACTERISTICS

Symbol Typ. Units

V

FM

I

RM

t

rr

Q

V

TO

r

T

Forward voltage

Peak reverse current

Reverse recovery time

Recovered charge

R

Threshold voltage

Slope resistance At Tvj = 125oC - 7.0 mΩ

Parameter

Conditions Max.

At 120A peak, T
At V

, T

RRM

case

= 1A, di

I

F

VR = 100V

= 50A, di

I

F

VR = 100V

RR/

RR/

= 25oC - 2.0 V

case

= 100oC-mA

dt = 25A/µs, T

dt = 50A/µs, T

= 25˚C,

case

case

= 25˚C,

- 250

-25µC

5

At Tvj = 125oC - 1.2 V

ns

2/7

CURVES

200

Measured under pulse

conditions

MF34

400

350

150

Tj = 25˚C

Tj = 125˚C

100

50

Instantaneous forward current - (A)

0

0 1.0 2.0 3.0

Instantaneous forward voltage - (V)

Fig.1 Maximum (limit) forward characteristics

T

case

V

R

= 125˚C

= V

RRM

1.00

0.75

d.c.

300

250

0.50

0.25

Thermal impedance - ˚C/W

200

Peak half sinewave forward current - (A)

1235410 50

Cycles at 50Hz

0

0.001 0.01 0.1 1.0 10
Time - (s)

Duration

Fig.2 Surge (non-repetitive) forward current vs time Fig.3 Maximum transient thermal impedance

3/7

MF34

500

T

case

100

10000

5000

2500

1000

500

300

Peak current - (A)

10

10 100 1000 10000

Pulse width - (µs)

Fig.4 Frequency curves - square waveform

500

T

case

= 65˚

50Hz

100

= 85˚

100

10000

5000

2500

1000

500

Peak current - (A)

10

10 100 1000 10000

Pulse width - (µs)

Fig.5 Frequency curves - square waveform

500

1.00.50.20.10.05

2.0J

100

Peak current - (A)

300

50Hz

100

4/7

10

10 100 1000 10000

Pulse width - (µs)

Fig.6 Energy per pulse - square waveform

MF34

500

T

case

100

10000

5000

2500

1000

500

300

Peak current - (A)

10

10 100 1000 10000

Pulse width - (µs)

Fig.7 Frequency curves - sine waveform

500

T

case

100

10000

5000

2500

1000

500

300

= 65˚

50Hz

100

= 85˚

50Hz

100

Peak current - (A)

10

10 100 1000 10000

Pulse width - (µs)

Fig.8 Frequency curves - sine waveform

500

1.00.50.20.10.05

100

Peak current - (A)

10

10 100 1000 10000

Pulse width - (µs)

2.0J

Fig.9 Energy per pulse - sine waveform

5/7

MF34

PACKAGE DETAILS

For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless stated otherwise.
DO NOT SCALE.

Hex. 17.35mm AF max

Ø4.0

2311.5

Thread 1/4 in
28 UNF 2A

Weight: 20g

Package outline type code: DO5

ASSOCIATED PUBLICATIONS

Title Application Note

Number

Calculating the junction temperature or power semiconductors AN4506
Thyristor and diode measurement with a multi-meter AN4853
Use of V

, rT on-state characteristic AN5001

TO

6/7

MF34

POWER ASSEMBLY CAPABILITY

The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconduc­tor, and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and
current capability of our semiconductors.

We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The
Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of
our customers.

Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete
solution (PACs).

DEVICE CLAMPS

Disc devices require the correct clamping force to ensure their safe operation. The PACs range offers a varied selection of pre­loaded clamps to suit all of our manufactured devices. This include cube clamps for single side cooling of ‘T’ 22mm

Clamps are available for single or double side cooling, with high insulation versions for high voltage assemblies.
Please refer to our application note on device clamping, AN4839

HEATSINKS

Power Assembly has it’s own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the
performance or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on
request.

For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or the
factory.

http://www.dynexsemi.com

e-mail: [email protected]

HEADQUARTERS OPERATIONS

DYNEX SEMICONDUCTOR LTD

Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.
Tel: [phone]
Fax: [phone]

DYNEX POWER INC.

Unit 7 - 58 Antares Drive,
Nepean, Ontario, Canada K2E 7W6.
Tel: [phone]
Fax: [phone]
Toll Free: 1.888.33.DYNEX (39639)

Datasheet Annotations:

Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:-

Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.

This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as
a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves
the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such
methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication
or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury

or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.

All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.

CUSTOMER SERVICE CENTRES

France, Benelux, Italy and Spain Tel: [phone]. Fax: [phone]
North America Tel: [phone]. Fax: [phone]
UK, Germany, Scandinavia & Rest Of World Tel: [phone]. Fax: [phone]

SALES OFFICES

France, Benelux, Italy and Spain Tel: [phone]. Fax: [phone]
Germany Tel: [phone]
North America Tel: [phone]. Fax: [phone]. Toll Free: 1.888.33.DYNEX (39639) /

Tel: [phone]. Fax: [phone] / Tel: [phone]. Fax: [phone].
UK, Germany, Scandinavia & Rest Of World Tel: [phone]. Fax: [phone]
These offices are supported by Representatives and Distributors in many countries world-wide.
© Dynex Semiconductor 2000 Publication No. DS4624-3 Issue No. 3.0 January 2000
TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM

7/7