Datasheet MDS3604 Datasheet (Mosfet)

Page 1
Maximum
Ratings (
Ta
=25
o
C unless otherwise noted
)
Thermal Characteri
stics
General Description
Features
Applications
D
S
Single P-Channel Trench MOSFET, -30V, -11A, 12.1m
The MDS3604 uses advanced MagnaChip’s MOSFET Technology to provide low on-state resistance.
This device is suited for Power Management and load switching applications common in Notebook Computers and Portable Battery Packs.
5(D)
6(D)
7(D)
8(D)
MDS3604
VDS = -30V  ID = -11A @VGS = -10V  R
< 18.3m @VGS = -5V
Load Switch  General purpose applications  Smart Module for Note PC Battery
DS(ON)
< 10.0m @VGS = -20V < 12.1m @VGS = -10V
MDS3604– Single P-Channel Trench MOSFET, -30V, -11A, 12.1mΩ
GSG
1(S)
2(S)
4(G)
3(S)
Characteristics Symbol Rating Unit
Drain-Source Voltage V
Gate-Source Voltage V
Continuous Drain Current (Note 1) ID -11 A
Pulsed Drain Current IDM -44 A
Power Dissipation PD 2.5 W
Single Pulse Avalanche Energy (Note 2) EAS 84.5 mJ
Junction and Storage Temperature Range TJ, T
-30 V
DSS
±25 V
GSS
-55~150
stg
Characteristics Symbol Rating
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Case R
(Note 1) R
50
θJA
25
θJC
o
C
Unit
o
C/W
May. 2011 Version 1.1 MagnaChip Semiconductor Ltd.
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Page 2
Ordering Information
Electrical Characteristics (T
= 25
o
C unless otherwise noted)
Part Number Temp. Range Package Packing Quantity RoHS Status
MDS3604URH -55~150oC SOIC-8 Tape & Reel 3000 units Halogen Free
a
Characteristics Symbol Test Condition Min
Static Characteristics
Drain-Source Breakdown Voltage BV
Gate Threshold Voltage V
Drain Cut-Off Current I
Gate Leakage Current I
Drain-Source ON Resistance R
Forward Transconductance gFS VDS = -5V, ID = -10A 25.5 - S
Dynamic Characteristics
Total Gate Charge Qg
Gate-Source Charge Qgs - 5.2 -
Gate-Drain Charge Qgd - 7.0 -
Input Capacitance C
Reverse Transfer Capacitance C
Output Capacitance C
Turn-On Delay Time t
Turn-On Rise Time tr - 12.9 -
Turn-Off Delay Time t
Turn-Off Fall Time tf - 34.6 -
Drain-Source Body Diode Characteristics
Source-Drain Diode Forward Voltage VSD IS = -1A, VGS = 0V - -0.73 -1.0 V
Body Diode Reverse Recovery Time trr
Body Diode Reverse Recovery Charge Qrr - 35.9 - nC
ID = -250µA, VGS = 0V -30 - -
DSS
VDS = VGS, ID = -250µA -1.0 -1.8 -3.0
GS(th)
VDS = -30V, VGS = 0V - -1
DSS
VGS = ±25V, VDS = 0V - - ±0.1
GSS
VGS = -20V, ID = -12A - 8.6 10
DS(ON)
iss
rss
oss
d(on)
d(off)
VGS = -10V, ID = -12A - 10 12.1
VGS = -5V, ID = -10A 14.6 18.3
VDS = -15V, ID = -12A VGS = -10V
- 212 -
- 338 -
- 50.6 -
VDS = -15V, VGS = 0V, f = 1.0MHz
VGS = -10V ,VDS = -15V,
RL = 1.25Ω, R
IF = -12A, di/dt = 100A/µs
GEN
= 3Ω
Typ Max Unit
- 30.5 -
- 1433 -
- 15.2 -
- 38.5 ns
Note :
1. Surface mounted FR-4 board by JEDEC (jesd51-7)
2. Starting TJ=25°C, L=1mH, IAS= -13A VDD=-20V, VGS=-10V.
MDS3604– Single P-Channel Trench MOSFET, -30V, -11A, 12.1mΩ
V
µA
mΩ
nC
pF
ns
May. 2011 Version 1.1 MagnaChip Semiconductor Ltd.
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Fig.5 Transfer Characterist
ics
Fig.2 On
-
Resistance Variation with
Fig.3 On
-
Resistance Variation with
Fig.4 On
-
Resistance Variation with
Fig.6 Body Diode Forward Voltage
MDS3604– Single P-Channel Trench MOSFET, -30V, -11A, 12.1mΩ
50
45
-10.0V
40
35
30
25
[A]
D
-I
20
15
10
5
0
0.0 0.5 1.0 1.5 2.0 2.5
-8.0V
-6.0V
-5.0V
-4.0V
VGS=-3.5V
VGS=-3.0V
VGS=-2.5V
25
20
15
[mΩ ]
10
DS(ON)
R
5
0
0 10 20 30 40
-VDS [V]
Fig.1 On-Region Characteristics
Drain Current and Gate Voltage
VGS=-5V
VGS=-10V
-ID [A]
1.8
*Note; ID=-12A
1.6
1.4
1.2
VGS=-10V
, (Normalized)
1.0
DS(ON)
R
0.8
Drain-Source On-Resistance [mΩ ]
0.6
-50 -25 0 25 50 75 100 125 150
TJ, Junction Temperature [ ]
Temperature
30
* Note ; VDS=-5V
25
30
25
20
*Note ; ID=-12A
[mΩ ]
DS(ON)
15
R
10
5
2 3 4 5 6 7 8 9 10
-VGS [V]
Gate to Source Voltage
Notes :
VGS = 0V
20
15
[A]
D
-I
10
5
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
May. 2011 Version 1.1 MagnaChip Semiconductor Ltd.
-VGS [V]
1
10
, Reverse Drain Current [A]
S
-I
0
10
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4
-VSD, Source-Drain voltage [V]
Variation with Source Current and Temperature
3
Page 4
Fig.10 Maximum Drain Current vs.
MDS3604– Single P-Channel Trench MOSFET, -30V, -11A, 12.1mΩ
10
* Note :VDS = -15V ID = -12A
8
6
[V]
GS
4
-V
2
0
0 10 20 30 40
Fig.7 Gate Charge Characteristics
-Qg [nC]
2.5n
2.0n
C
1.5n
iss
1.0n
Capacitance [pF]
C
500.0p
0.0 0 5 10 15 20 25 30
oss
C
rss
C
= Cgs + Cgd (Cds = shorted)
iss
C
= Cds + C
oss
gd
C
= C
rss
gd
Notes ;
1. VGS = 0 V
2. f = 1 MHz
-VDS [V]
Fig.8 Capacitance Characteristics
2
10
100 us
1 ms
1
10
10 ms
100 ms
0
10
[A]
D
-I
-1
10
-2
10
10
Operation in This Area is Limited by R
Single Pulse R
=50 /W
θ ja
Ta=25
-1
DS(on)
0
10
DC
100s
10s
1s
1
10
-VDS [V]
Fig.9 Maximum Safe Operating Area
1
10
0
10
D=0.5
0.2
0.1
-1
10
0.05
0.02
, Normalized Thermal Response [t]
0.01
-2
θ Ja
10
Z
single pulse
10-510-410-310-210-110010110210
t1, Rectangular Pulse Duration [s]
* Notes : Duty Factor, D=t1/t PEAK TJ = PDM * Z R
=50 /W
ΘJA
2
θ JA
16
14
12
10
8
[A]
D
-I
6
4
2
2
10
0
25 50 75 100 125 150
Ta [ ]
Ambient Temperature
* R
(t) + T
θ JA
A
3
Fig.11 Transient Thermal Response Curve
May. 2011 Version 1.1 MagnaChip Semiconductor Ltd.
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Physical Dimensions
MDS3604– Single P-Channel Trench MOSFET, -30V, -11A, 12.1mΩ
8 Leads, SOIC
Dimensions are in millimeters unless otherwise specified
May. 2011 Version 1.1 MagnaChip Semiconductor Ltd.
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DISCLAIMER:
The Products are not designed for use in hostile environments, including, without limitation, aircraft, nuclear power generation, medical appliances, and devices or systems in which malfunction of any Product can reasonably be expected to result in a personal injury. Seller’s customers using or selling Seller’s products for use in such
applications do so at their own risk and agree to fully defend and indemnify Seller.
MagnaChip reserves the right to change the specifications and circuitry without notice at any time. MagnaChip does not consider responsibility for use of any circuitry other than circuitry entirely included in a MagnaChip product. is a registered trademark of MagnaChip Semiconductor Ltd.
MDS3604– Single P-Channel Trench MOSFET, -30V, -11A, 12.1mΩ
May. 2011 Version 1.1 MagnaChip Semiconductor Ltd.
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