MDS3604– Single P-Channel Trench MOSFET, -30V, -11A, 12.1mΩ
V
µA
mΩ
nC
pF
ns
May. 2011 Version 1.1 MagnaChip Semiconductor Ltd.
2
Page 3
Fig.5 Transfer Characterist
ics
Fig.2 On
-
Resistance Variation with
Fig.3 On
-
Resistance Variation with
Fig.4 On
-
Resistance Variation with
Fig.6 Body Diode Forward Voltage
MDS3604– Single P-Channel Trench MOSFET, -30V, -11A, 12.1mΩ
50
45
-10.0V
40
35
30
25
[A]
D
-I
20
15
10
5
0
0.00.51.01.52.02.5
-8.0V
-6.0V
-5.0V
-4.0V
VGS=-3.5V
VGS=-3.0V
VGS=-2.5V
25
20
15
[mΩ ]
10
DS(ON)
R
5
0
010203040
-VDS [V]
Fig.1 On-Region Characteristics
Drain Current and Gate Voltage
VGS=-5V
VGS=-10V
-ID [A]
1.8
*Note; ID=-12A
1.6
1.4
1.2
VGS=-10V
, (Normalized)
1.0
DS(ON)
R
0.8
Drain-Source On-Resistance [mΩ ]
0.6
-50-250255075100125150
TJ, Junction Temperature [ ]℃
Temperature
30
* Note ; VDS=-5V
25
30
25
20
*Note ; ID=-12A
[mΩ ]
DS(ON)
15
R
10
5
2345678910
-VGS [V]
Gate to Source Voltage
Notes :※
VGS = 0V
20
15
[A]
D
-I
10
5
0
0.00.51.01.52.02.53.03.54.04.55.0
May. 2011 Version 1.1 MagnaChip Semiconductor Ltd.
-VGS [V]
1
10
, Reverse Drain Current [A]
S
-I
0
10
0.00.20.40.60.81.01.21.4
-VSD, Source-Drain voltage [V]
Variation with Source Current and
Temperature
3
Page 4
Fig.10 Maximum Drain Current vs.
MDS3604– Single P-Channel Trench MOSFET, -30V, -11A, 12.1mΩ
10
* Note :VDS = -15V
ID = -12A
8
6
[V]
GS
4
-V
2
0
010203040
Fig.7 Gate Charge Characteristics
-Qg [nC]
2.5n
2.0n
C
1.5n
iss
1.0n
Capacitance [pF]
C
500.0p
0.0
051015202530
oss
C
rss
C
= Cgs + Cgd (Cds = shorted)
iss
C
= Cds + C
oss
gd
C
= C
rss
gd
Notes ;※
1. VGS = 0 V
2. f = 1 MHz
-VDS [V]
Fig.8 Capacitance Characteristics
2
10
100 us
1 ms
1
10
10 ms
100 ms
0
10
[A]
D
-I
-1
10
-2
10
10
Operation in This Area
is Limited by R
Single Pulse
R
=50 /W℃
θ ja
Ta=25℃
-1
DS(on)
0
10
DC
100s
10s
1s
1
10
-VDS [V]
Fig.9 Maximum Safe Operating Area
1
10
0
10
D=0.5
0.2
0.1
-1
10
0.05
0.02
, Normalized Thermal Response [t]
0.01
-2
θ Ja
10
Z
single pulse
10-510-410-310-210-110010110210
t1, Rectangular Pulse Duration [s]
* Notes :
Duty Factor, D=t1/t
PEAK TJ = PDM * Z
R
=50 /W℃
ΘJA
2
θ JA
16
14
12
10
8
[A]
D
-I
6
4
2
2
10
0
255075100125150
Ta [ ]℃
Ambient Temperature
* R
(t) + T
θ JA
A
3
Fig.11 Transient Thermal Response Curve
May. 2011 Version 1.1 MagnaChip Semiconductor Ltd.
4
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Physical Dimensions
MDS3604– Single P-Channel Trench MOSFET, -30V, -11A, 12.1mΩ
8 Leads, SOIC
Dimensions are in millimeters unless otherwise specified
May. 2011 Version 1.1 MagnaChip Semiconductor Ltd.
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Page 6
DISCLAIMER:
The Products are not designed for use in hostile environments, including, without limitation, aircraft, nuclear power
generation, medical appliances, and devices or systems in which malfunction of any Product can reasonably be
expected to result in a personal injury. Seller’s customers using or selling Seller’s products for use in such
applications do so at their own risk and agree to fully defend and indemnify Seller.
MagnaChip reserves the right to change the specifications and circuitry without notice at any time. MagnaChip does not consider responsibility
for use of any circuitry other than circuitry entirely included in a MagnaChip product. is a registered trademark of MagnaChip
Semiconductor Ltd.
MDS3604– Single P-Channel Trench MOSFET, -30V, -11A, 12.1mΩ
May. 2011 Version 1.1 MagnaChip Semiconductor Ltd.
6
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