Datasheet MCR310-10G Specification

MCR310

A

G

K

Pb

1

3

Thyristors

Surface Mount – 400 - 800V > MCR310

Description

Designed for industrial and consumer applications such as
temperature, light and speed control; process and remote
controls; warning systems; capacitive discharge circuits
and MPU interface.

Features

Pin Out

4

TO-220AB

Case 221A

Style 3

• Center Gate Geometry
for Uniform Current
Density

• All Diffused and Glass­Passivated Junctions for
Parameter Uniformity
and Stability

• Small, Rugged,
Thermowatt Construction
for Low Thermal
Resistance, High Heat
Dissipation and Durability

Functional Diagram

• Low Trigger Currents,
200 µA Maximum for
Direct Driving from
Integrated Circuits

• Pb−Free Packages are
Available

2

Additional Information

Datasheet

Resources

Specifications are subject to change without notice.

Samples

© 2019 Littelfuse, Inc.

Revised: 07/18/19

Thyristors

Surface Mount – 400 - 800V > MCR310

Maximum Ratings (TJ = 25°C unless otherwise noted)

Rating Part Number Symbol Value Unit

Peak Repetitive Off-State Voltage (Note 1)
(T

= -40 to +125°C, Gate Open)

J

On-State RMS Current (T

= 75°C) I

C

Peak Non-Repetitive Surge Current (1/2 Cycle, 60 Hz, T

= -40 to 110°C) I

J

MCR310-6
MCR310-8

MCR310-10

V
V

Circuit Fusing (t = 8.3 ms) I
Peak Gate Voltage (t ≤ 10 µs) V
Peak Gate Current (t ≤ 10 µs) I
Peak Gate Power (t ≤ 10 µs) P
Average Gate Power P
Operating Junction Temperature Range T
Storage Temperature Range T

DRM,

RRM

T (RMS)

TSM

2

t 40 A2sec

GM

GM

GM

G (AV)

J

stg

400
600
800

10 A

100 A

±5 V

1 A
5 W

0.75 W

-40 to +110 °C

-40 to +150 °C

Mounting Torque – 8.0 in. lb.

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating
Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.

1. VDRM and VRRM for all types can be applied on a continuous basis. Ratings apply for zero or negative gate voltage; however, positive gate voltage shall
not be applied concurrent with negative potential on the anode. Blocking voltages shall not be tested with a constant current source such that the voltage
ratings of the devices are exceeded.

Thermal Characteristics

Characterstic Symbol Value Unit

Thermal Resistance, Junction-to-Case
Thermal Resistance, Junction-to-Ambient

R

ƟJC

R

ƟJA

2.2
60

°C/W

V

Electrical Characteristics (TC = 25°C, RGK = 1 kΩ unless otherwise noted)

Characteristic Symbol Min Ty p Max Unit

DRM

)

(Note 1)

Peak Forward Blocking Current

= 110°C, VD = Rated V

(T

J

Peak Reverse Blocking Current (Note 1)
(T

= 110°C, VR = Rated V

J

On-State Voltage (I
Gate Trigger Current Continuous dc (Note 2) (V

)

DRM

= 20 A Peak, Pulse Width ≤ 1 ms, Duty Cycle ≤ 2%) V

TM

= 12 Vdc, RL = 100 Ω) I

D

Gate Trigger Voltage, Continuous dc

= Rated V

(V

D

Holding Current (V

, RL = 10 kΩ, TJ = 110°C)

DRM

= 12 V, ITM = 100 mA) I

D

Critical Rate of Rise of Forward Blocking Voltage

= Rated V

(V

D

Gate Controlled Turn-On Time (V

1. Ratings apply for negative gate voltage or RGK = 1 kΩ. Devices shall not have a positive gate voltage concurrently with a negative voltage
on the anode. Devices should not be tested with a constant current source for forward and reverse blocking capability such that the voltage

applied exceeds the rated blocking voltage.

2. Does not include RGK current.

, TJ = 110°C, Exponential Waveform)

DRM

= Rated V

D

, ITM = 20 A, IG = 2 mA) t

DRM

T

= 110ºC

C

= 25ºC − – 10

T

C

T

= 110ºC

C

= 25ºC – – 10

T

C

I

DRM

I

RRM

TM

GT

V

GT

H

dv/dt – 10 – V/µs

gt

− – 500

– – 500

– 1.7 2.2 V
– 30 200 µA
–

0.1

0.5
–

–

1.5

– – 6 mA

– 1 – µs

µA

µA

mA

Specifications are subject to change without notice.

© 2019 Littelfuse, Inc.

Revised: 07/18/19

Thyristors

Surface Mount – 400 - 800V > MCR310

Figure 1. Typical RMS Current Derating Figure 2. Peak Capacitor Discharge Current Derating

Figure 4. Maximum Power DissipationFigure 3. Current Derating

Specifications are subject to change without notice.

© 2019 Littelfuse, Inc.

Revised: 07/18/19

Thyristors

PLANE

SEATING

1

3

Surface Mount – 400 - 800V > MCR310

Dimensions

FB

Q

H

Z

L

V

Dim

A 0.590 0.620 14.99 15.75
B 0.380 0.420 9.65 10.67
C 0.178 0.188 4.52 4.78
D 0.025 0.035 0.64 0.89
F 0.142 0.147 3.61 3.73
G 0.095 0.105 2.41 2.67
H 0.110 0.130 2.79 3.30
J 0.018 0.024 0.46 0.61
K 0.540 0.575 13.72 14.61
L 0.060 0.075 1.52 1.91
N 0.195 0.205 4.95 5.21
Q 0.105 0.115 2.67 2.92
R 0.085 0.095 2.16 2.41
S 0.045 0.060 1.14 1.52
T 0.235 0.255 5.97 6.47
U 0.000 0.050 0.00 1.27
V 0.045 --- 1.15 ---
Z --- 0.080 --- 2.04

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION Z DEFINES A ZONE WHERE ALL BODY AND LEAD IRREGULARITIES ARE
ALLOWED.

4

A

12 3

K

G

D

N

Inches Millimeters

Min Max Min Max

T

U

C

S

R

J

Part Marking System

4

TO-220AB

Case 221A

Style 3

2

Y =Year
M =Month
A =Assembly Site
AKA =Diode Polarity
G =Pb-Free Package

Pin Assignment

1 Cathode
2 Anode
3 Gate
4 Anode

Ordering Information

Device Package Shipping

MCR310-6 TO-220AB

MCR310-6G

MCR310-8 TO-220AB

MCR310-8G

MCR310-10 TO-220AB

MCR310-10G

TO-220AB

(Pb-Free)

TO-220AB

(Pb-Free)

TO-220AB

(Pb-Free)

YMAXX

MCR310-xG

AKA

500 Units / Box

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test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications.
Read complete Disclaimer Notice at http://www.littelfuse.com/disclaimer-electronics.

Specifications are subject to change without notice.

© 2019 Littelfuse, Inc.

Revised: 07/18/19