Datasheet MCR22-6G Specification

MCR22-6, MCR22-8

Preferred Device

Sensitive Gate
Silicon Controlled Rectifiers

Reverse Blocking Thyristors

Designed and tested for repetitive peak operation required for CD
ignition, fuel ignitors, flash circuits, motor controls and low−power
switching applications.

Features

• 150 A for 2 ms Safe Area

• High dv/dt

• Very Low Forward “On” Voltage at High Current

• Low−Cost TO−226 (TO−92)

• Pb−Free Packages are Available*

MAXIMUM RATINGS (T

Rating

Peak Repetitive Off−State Voltage (Note 1)
(R

= IK, TJ = *40 to +110°C, Sine Wave,

GK

50 to 60 Hz, R

On−State Current RMS
(180° Conduction Angles, T

Peak Non−repetitive Surge Current,
@T

= 25°C, (1/2 Cycle, Sine Wave, 60 Hz)

A

Circuit Fusing Considerations (t = 8.3 ms) I2t 0.9 A2s

Forward Peak Gate Power
(Pulse Width ≤ 1.0 msec, T

Forward Average Gate Power
(t = 8.3 msec, TA = 25°C)

Forward Peak Gate Current
(Pulse Width ≤ 1.0 ms, T

Reverse Peak Gate Voltage
(Pulse Width ≤ 1.0 ms, T

Operating Junction Temperature Range
@ Rated V

Storage Temperature Range T

= 1kW) MCR22−6

GK

and V

RRM

THERMAL CHARACTERISTICS

Characteristic Symbol Max Unit

Thermal Resistance, Junction−to−Case

Thermal Resistance, Junction−to−Ambient

Lead Solder Temperature
(Lead Length q 1/16″ from case, 10 S Max)

Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.

1. V

*For additional information on our Pb−Free strategy and soldering details, please

and V

DRM

apply for zero or negative gate voltage; however, positive gate voltage shall
not be applied concurrent with negative potential on the anode. Blocking
voltages shall not be tested with a constant current source such that the
voltage ratings of the devices are exceeded.

download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.

for all types can be applied on a continuous basis. Ratings

RRM

= 25°C unless otherwise noted)

J

MCR22−8

= 80°C)

C

= 25°C)

A

= 25°C)

A

= 25°C)

A

DRM

Symbol Value Unit

V

DRM,

V

RRM

I

T(RMS)

I

TSM

P

GM

P

G(AV)

I

FGM

V

RGM

T

stg

R

q

R

q

T

−40 to +110 °C

J

−40 to +150 °C

JC

JA

L

+260 °C

400
600

1.5 A

15 A

0.5 W

0.1 W

0.2 A

5.0 V

50 °C/W

160 °C/W

V

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SCRs

1.5 AMPERES RMS

400 thru 600 VOLTS

G

A

1

2

3

STRAIGHT LEAD

BULK PACK

TO−92 (TO−226)

CASE 029
STYLE 10

MARKING DIAGRAMS

MCR
22−x

AYW W G

G

MCR22−x = Device Code

A = Assembly Location
Y = Year
WW = Work Week
G = Pb−Free Package

(Note: Microdot may be in either location)

x = 6 or 8

PIN ASSIGNMENT

1

2

3

Cathode

ORDERING INFORMATION

See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.

Preferred devices are recommended choices for future use
and best overall value.

Gate

Anode

K

1

2

3

BENT LEAD

TAPE & REEL

AMMO PACK

© Semiconductor Components Industries, LLC, 2008

November, 2008 − Rev. 6

1 Publication Order Number:

MCR22−6/D

MCR22−6, MCR22−8

ELECTRICAL CHARACTERISTICS (T

= 25°C unless otherwise noted.)

C

Characteristic

OFF CHARACTERISTICS

Peak Repetitive Forward or Reverse Blocking Current

(V

AK

= Rated V

DRM

or V

; RGK = 1 kW)T

RRM

= 25°C

C

= 110°C

T

C

ON CHARACTERISTICS

Peak Forward On−State Voltage (Note 2)

= 1 A Peak)

(I

TM

Gate Trigger Current (Continuous dc) (Note 3) TC = 25°C

= 6 Vdc, RL = 100 W)T

(V

AK

= −40°C

C

Gate Trigger Voltage (Continuous dc) (Note 3) TC = 25°C

= 7 Vdc, RL = 100 W)T

(V

AK

= −40°C

C

Gate Non−Trigger Voltage

= 12 Vdc, RL = 100 W)T

(V

AK

= 110°C

C

Holding Current

= 12 Vdc, RGK = 1kW)T

(V

AK

Initiating Current = 20 mA TC = −40°C

= 25°C

C

DYNAMIC CHARACTERISTICS

Critical Rate of Rise of Off−State Voltage (R

(T

= 110°C)

C

GK

= 1kW)

2. Pulse Width = 1.0 ms, Duty Cycle v 1%.

Current not included in measurement.

3. R

GK

Symbol Min Typ Max Unit

I

, I

DRM

RRM

V

TM

I

GT

V

GT

V

GD

I

H

−

−

−

10

−

200

− 1.2 1.7 V

−

30−200

−

−

−

500

−

0.8

−

1.2

0.1 − − V

−

2.0−5.0

−

10

dv/dt − 25 −

mA
mA

mA

V

mA

V/ms

Symbol Parameter

V

I

DRM

V

I

RRM

V

I

H

DRM

RRM

TM

Peak Repetitive Off State Forward Voltage

Peak Forward Blocking Current

Peak Repetitive Off State Reverse Voltage

Peak Reverse Blocking Current

Peak on State Voltage

Holding Current

Voltage Current Characteristic of SCR

on state

at V

I

RRM

Reverse Avalanche Region

Anode −

RRM

Reverse Blocking Region

(off state)

+ Current

V

TM

I

H

Forward Blocking Region

(off state)

I

DRM

Anode +

at V

DRM

+ Voltage

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2

MCR22−6, MCR22−8

CURRENT DERATING

140

CASE TEMPERATURE ( C)°

100

60

20

0

0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 2.0

C

T , MAXIMUM ALLOWABLE

α = 180°

α = CONDUCTION

ANGLE

I

, AVERAGE ON-STATE CURRENT (AMPS)

T(AV)

dc

1.6

Figure 1. Maximum Case Temperature Figure 2. Maximum Ambient Temperature

5.0

3.0

2.0

1.0

140

120

AMBIENT TEMPERATURE ( C)°

100

80

60

40

20

1.8 0 0.2 0.4 0.6 0.8

TJ = 110°C

A

T , MAXIMUM ALLOWABLE

0

α = CONDUCTION ANGLE

I

T(AV)

25°C

α = 180°

, AVERAGE ON-STATE CURRENT (AMP)

dc

1.0

0.7

0.5

0.3

0.2

0.1

0.07

T

I , INSTANTANEOUS ON‐STATE CURRENT (AMP)

0.05

0.03

0.02

0.01
0 0.5 1.0 2.0

V

, INSTANTANEOUS ON-STATE VOLTAGE

T

Figure 3. Typical Forward Voltage

(VOLTS)

1.5

2.5

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3

1.0

0.7

0.5

0.3

0.2

0.1

0.07

0.05

0.03

0.02

MCR22−6, MCR22−8

0.01

0.1

r(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED)

0.8

0.7

0.6

0.5

0.4

GT

V , GATE TRIGGER VOLTAGE (VOLTS)

0.3

-75 -50 0 25 7550-25

1000

t, TIME (ms)

Figure 4. Thermal Response

TYPICAL CHARACTERISTICS

100

VAK = 7.0 V

R

= 100

L

A)

50

μ

30

20

10

5.0

3.0

2.0

GT

I GATE TRIGGER CURRENT (

1.0

110

, JUNCTION TEMPERATURE (°C)

T

J

100

0-40 -20

20 40 60 80 100

JUNCTION TEMPERATURE (°C)

T

J

Figure 5. Typical Gate Trigger Voltage Figure 6. Typical Gate Trigger Current

1000050000.2 200050020010020 50105.02.01.00.5

110

H

I , HOLDING CURRENT (mA)

5.0

2.0

1.0

-4010-20

V

= 12 V

AK

R

= 100 W

L

20

01101006040

T

, JUNCTION TEMPERATURE (°C)

J

80

Figure 7. Typical Holding Current

2.0

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0

(AV)

P MAXIMUM AVERAGE POWER DISSIPATION (WATTS)

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4

120

90°

30°

60°

°

dc

0.2 0.6

, AVERAGE ON-STATE CURRENT (AMPS)

I

T(AV)

0.8

Figure 8. Power Dissipation

180°

1.0

1.4

1.61.20.40

MCR22−6, MCR22−8

TO−92 EIA RADIAL TAPE IN FAN FOLD BOX OR ON REEL

H2A H2A

H

W2

H4

H5

L1

H1

W1

W

F1

F2

P2 P2

P1

P

L

D

H2B H2B

T1

T

T2

Figure 9. Device Positioning on Tape

Specification

Inches Millimeter

Item

Symbol

Tape Feedhole Diameter D

Component Lead Thickness Dimension D2

Component Lead Pitch F1, F2

Bottom of Component to Seating Plane H

Feedhole Location H1

Deflection Left or Right H2A

Deflection Front or Rear H2B

Feedhole to Bottom of Component H4

Feedhole to Seating Plane H5

Defective Unit Clipped Dimension L

Lead Wire Enclosure L1

Feedhole Pitch P

Feedhole Center to Center Lead P1

First Lead Spacing Dimension P2

Adhesive Tape Thickness T

Overall Taped Package Thickness T1

Carrier Strip Thickness T2

Carrier Strip Width W

Adhesive Tape Width W1

Adhesive Tape Position W2

NOTES:

1. Maximum alignment deviation between leads not to be greater than 0.2 mm.

2. Defective components shall be clipped from the carrier tape such that the remaining protrusion (L) does not exceed a maximum of 11 mm.

3. Component lead to tape adhesion must meet the pull test requirements.

4. Maximum non−cumulative variation between tape feed holes shall not exceed 1 mm in 20 pitches.

5. Holddown tape not to extend beyond the edge(s) of carrier tape and there shall be no exposure of adhesive.

6. No more than 1 consecutive missing component is permitted.

7. A tape trailer and leader, having at least three feed holes is required before the first and after the last component.

8. Splices will not interfere with the sprocket feed holes.

Min Max Min Max

0.1496 0.1653 3.8 4.2

0.015 0.020 0.38 0.51

0.0945 0.110 2.4 2.8

.059 .156 1.5 4.0

0.3346 0.3741 8.5 9.5

0 0.039 0 1.0

0 0.051 0 1.0

0.7086 0.768 18 19.5

0.610 0.649 15.5 16.5

0.3346 0.433 8.5 11

0.09842 − 2.5 −

0.4921 0.5079 12.5 12.9

0.2342 0.2658 5.95 6.75

0.1397 0.1556 3.55 3.95

0.06 0.08 0.15 0.20

− 0.0567 − 1.44

0.014 0.027 0.35 0.65

0.6889 0.7481 17.5 19

0.2165 0.2841 5.5 6.3

.0059 0.01968 .15 0.5

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5

MCR22−6, MCR22−8

ORDERING & SHIPPING INFORMATION: MCR22 Series Packaging Options, Device Suffix

Europe

U.S.

MCR22−6

MCR22−6G

MCR22−8

MCR22−8G

MCR22−6RLRA

MCR22−6RLRAG

MCR22−6RLRP

MCR22−6RLRPG

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

Equivalent

MCR22−8RL1

MCR22−8RL1G

Shipping

2000 / Tape & Reel Flat side of TO−92 and adhesive tape visible

5000 Units / Box N/A, Bulk

2000 / Tape & Reel Round side of TO−92 and adhesive tape visible

2000 / Tape & Ammo Pack Flat side of TO−92 and adhesive tape visible

†

Description of TO−92 Tape Orientation

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6

SEATING
PLANE

MCR22−6, MCR22−8

PACKAGE DIMENSIONS

TO−92 (TO−226)

CASE 29−11

ISSUE AM

A

B

STRAIGHT LEAD

BULK PACK

R

P

L

K

XX

V

1

G

H

C

N

D

J

SECTION X−X

N

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.

4. LEAD DIMENSION IS UNCONTROLLED IN P AND
BEYOND DIMENSION K MINIMUM.

DIM MIN MAX MIN MAX

A 0.175 0.205 4.45 5.20
B 0.170 0.210 4.32 5.33
C 0.125 0.165 3.18 4.19
D 0.016 0.021 0.407 0.533
G 0.045 0.055 1.15 1.39
H 0.095 0.105 2.42 2.66
J 0.015 0.020 0.39 0.50
K 0.500 --- 12.70 ---
L 0.250 --- 6.35 ---
N 0.080 0.105 2.04 2.66
P --- 0.100 --- 2.54
R 0.115 --- 2.93 ---
V 0.135 --- 3.43 ---

MILLIMETERSINCHES

R

A

B

BENT LEAD

TAPE & REEL

AMMO PACK

P

T

SEATING
PLANE

XX

G

K

D

J

V

1

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
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Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

C

SECTION X−X

N

NOTES:

1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. CONTOUR OF PACKAGE BEYOND
DIMENSION R IS UNCONTROLLED.

4. LEAD DIMENSION IS UNCONTROLLED IN P
AND BEYOND DIMENSION K MINIMUM.

MILLIMETERS

DIM MIN MAX

A 4.45 5.20
B 4.32 5.33
C 3.18 4.19

D 0.40 0.54
G 2.40 2.80
J 0.39 0.50
K 12.70 ---
N 2.04 2.66
P 1.50 4.00
R 2.93 ---
V 3.43 ---

STYLE 10:

PIN 1. CATHODE

2. GATE

3. ANODE

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MCR22−6/D