Datasheet MCP98244 Datasheet

MCP98244

DIMM MODULE

MCP98244

8-Pin 2x3 TDFN*

* Includes Exposed Thermal Pad (EP); see Tab le 3 -1 .

SCL

Event

SDA

A1

A2

1

2

3

4

8

7

6

5

GND

A0 V

DD

EP

9

DDR4 DIMM Temperature Sensor with EEPROM for SPD

Features

• Meets JEDEC Specification

- MCP98244 --> JC42.4-TSE2004B1
Temperature Sensor with 4 Kbit Serial
EEPROM for Serial Presence Detect (SPD)

•1MHz, 2-wire I

• Specified V

• Operating Current: 100 µA (typ., EEPROM Idle)

• Available Package: TDFN-8

2

C™ Interface

Range: 1.7V to 3.6V

DD

Temperature Sensor Features

• Temperature-to-Digital Converter (°C)

• Sensor Accuracy (Grade B):

- ±0.2°C/±1°C (typ./max.)

- ±0.5°C/±2°C (typ./max.)  +40°C to +125°C

- ±1°C/±3°C (typ./max.)

 +75°C to +95°C

 -40°C to +125°C

Serial EEPROM Features

• Operating Current:

-Write 250 µA (typical) for 3 ms (typical)

- Read 100 µA (typical)

• Reversible Software Write Protect

• Software Write Protection for each 1 Kbit Block

• Organized as two banks of 256 x 8-bit (2 Kbit x 2)

Typical Applications

• DIMM Modules for Servers, PCs, and Laptops

• Temperature Sensing for Solid State Drive (SSD)

• General Purpose Temperature Datalog

Description

Microchip Technology Inc.’s MCP98244 digital
temperature sensor converts temperature from -40°C
and +125°C to a digital word. This sensor meets
JEDEC Specification JC42.4-TSE3000B1 Memory
Module Thermal Sensor Component. It provides an
accuracy of ±0.2°C/±1°C (typical/maximum) from
+75°C to +95°C with an operating voltage of 1.7V to

3.6V. In addition, MCP98244 has an integrated
EEPROM with two banks of 256 by 8 bit EEPROM (4k
Bit) which can be used to store memory module details
and vendor information.

The MCP98244 digital temperature sensor comes with
user-programmable registers that provide flexibility for
DIMM temperature-sensing applications. The registers
allow user-selectable settings such as Shutdown or
Low-Power modes and the specification of
temperature Event boundaries. When the temperature
changes beyond the specified Event boundary limits,
the MCP98244 outputs an Alert signal at the Event pin.
The user has the option of setting the temperature
Event output signal polarity as either an active-low or
active-high comparator output for thermostat operation,
or as a temperature Event interrupt output for
microprocessor-based systems.

The MCP98244 EEPROM is designed specifically for
DRAM DIMMs (Dual In-line Memory Modules) Serial
Presence Detect (SPD). It has four 128 Byte pages,
which can be Software Write Protected individually.
This allows DRAM vendor and product information to
be stored and write-protected.

2

This sensor has an industry standard I
Plus compatible 1 MHz serial interface.

C Fast Mode

Package Types

 2012-2013 Microchip Technology Inc. DS22327C-page 1

MCP98244

NOTES:

DS22327C-page 2  2012-2013 Microchip Technology Inc.

MCP98244

1.0 ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings †

VDD.................................................................................. 4.0V

Voltage at all Input/Output pins ............... GND – 0.3V to 4.0V

Pin A0 .......................................................GND – 0.3V to 11V

Storage temperature .....................................-65°C to +150°C

Ambient temp. with power applied ................-40°C to +125°C

Junction Temperature (T

ESD protection on all pins (HBM:MM) ................. (4 kV:200V)

Latch-Up Current at each pin (25°C) ....................... ±200 mA

) ..........................................+150°C

J

†Notice: Stresses above those listed under “Maximum
ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied.
Exposure to maximum rating conditions for extended periods
may affect device reliability.

TEMPERATURE SENSOR DC CHARACTERISTICS

Electrical Specifications: Unless otherwise indicated, V

= -40°C to +125°C.

and T

A

Parameters Sym Min Typ Max Unit Conditions

Temperature Sensor Accuracy

+75°C < T

 +95°C T

A

ACY

-1.0 ±0.2 +1.0 °C JC42.4 - TSE2004B1

+40°C < TA  +125°C -2.0 ±0.5 +2.0 °C

-40°C < T

 +125°C -3.0 ±1 +3.0 °C

A

Temperature Conversion Time

0.5°C/bit t

CONV

—30 — ms

0.25°C/bit — 65 125 ms 15 s/sec (typical) (See Section 5.2.4)

0.125°C/bit — 130 — ms

0.0625°C/bit — 260 — ms

Power Supply

Specified Voltage Range V

Operating Current I

DD_TS

Shutdown Current I

Power On Reset (POR) V

Settling Time after POR t

DD

SHDN

POR

POR

1.7 — 3.6 V

— 100 500 µA EEPROM Inactive

— 0.2 1 µA EEPROM Inactive, I2C Bus Inactive,

— 1.4 1.6 V Threshold for rising and falling V

— — 1 ms For warm and cold power cycles

Line Regulation °C — 0.2 — °C VDD = 1.7V to 3.6V

Event Output (Open-Drain output, external pull-up resistor required), see Section 5.2.3

High-Level Current (leakage) I

Low-Level Voltage V

OH

OL

—— 1 µAV

—— 0.4 VIOL= 3 mA (Active-Low, Pull-up

Thermal Response, from +25°C (Air) to +125°C (oil bath)

TDFN-8 t

RES

— 0.7 — s Time to 63% (89°C)

= 1.7V to 3.6V, GND = Ground,

DD

Grade B Accuracy Specification
V

= 1.7V to 3.6V

DD

= 85°C

T

A

= V

OH

Resistor)

DD

DD

 2012-2013 Microchip Technology Inc. DS22327C-page 3

MCP98244

MCP98244 EEPROM DC CHARACTERISTICS

Electrical Specifications: Unless otherwise indicated, V

= -40°C to +125°C.

and T

A

Parameters Sym Min Typ Max Unit Conditions

Current, EEPROM write (for tWC)I

Current, EEPROM read I

Write Cycle time (byte/page) t

Endurance T

EEPROM Write Temperature EE

EEPROM Read Temperature EE

Write Protect Voltage

SWP and CWP Voltage V

= +25°C — — 10k — cycles Write Cycles, V

A

DD_EE

DD_EE

WC

WRITE

READ

HV

— 250 2000 µA

— 100 500 µA

—3 5 ms

0— 85 °C

-40 — 125 °C For minimum read temperature, see Note 1

7 — 10 V Applied at A0 pin

Note 1: Characterized but not production tested.

2: For endurance estimates in a specific application, please consult the Total Endurance™ Model, which can

be obtained from Microchip’s web site at www.microchip.com/TotalEndurance

INPUT/OUTPUT PIN DC CHARACTERISTICS

Electrical Specifications: Unless otherwise indicated, V

= -40°C to +125°C.

T

A

Parameters Sym Min Typ Max Units Conditions

Serial Input/Output (SCL, SDA, A0, A1, A2)
Input

High-Level Voltage V

Low-Level Voltage V

Input Current I

Input Impedance (A0, A1, A2) Z

Input Impedance (A0, A1, A2) Z

Output (SDA only)

Low-Level Voltage V

High-Level Current (leakage) I

Low-Level Current I

Capacitance C

SDA and SCL Inp uts

Hysteresis

V

Spike Suppression

IN

OL

OH

OL

HYST

T

SP

0.7V

IH

IL

IN

IN

IN

= 1.7V to 3.6V, GND = Ground,

DD

Sensor in Shutdown Mode

= 3.3V (Note 1, Note 2)

DD

.

= 1.7V to 3.6V, GND = Ground and

DD

DD

— — 0.3V

— — ±5 µA SDA and SCL only

—1—M VIN > V

— 200 — k VIN < V

——0.4VI

—— 1µAV

20 — — mA VOL = 0.4V; VDD ≥ 2.2V

6——mAV

—5—pF

— 0.05V

— — 50 ns

——V

V

DD

OL

OH

OL

—V

DD

IH

IL

= 3 mA

= V

= 0.6V

DD

TEMPERATURE CHARACTERISTICS

Electrical Specifications: Unless otherwise indicated, V

= -40°C to +125°C.

and T

A

Parameters Sym Min Typ Max Units Conditions

Temperature Ranges

Specified Temperature Range T

Operating Temperature Range T

Storage Temperature Range T

A

A

A

Thermal Package Resistances

Thermal Resistance, 8L-TDFN 

Note 1: Operation in this range must not cause T

DS22327C-page 4  2012-2013 Microchip Technology Inc.

JA

J

= 1.7V to 3.6V, GND = Ground,

DD

-40 — +125 °C Note 1

-40 — +125 °C

-65 — +150 °C

—52.5— °C/W

to exceed Maximum Junction Temperature (+150°C).

SERIAL INTERFACE TIMING SPECIFICATIONS

t

SU:S

TO

t

SU:DI

t

SU:DI

t

SU:STO

t

B:FR

EE

S

C

L

SD

A

t

H

D

:D

I

/

t

H

D:

D

O

t

HIGH

t

L

OW

t

O

U

T

t

R

,

t

F

Start Condition

Data Transmission

Stop Condition

Electrical Specifications: Unless otherwise indicated, GND = Ground, T
(Note 1).

= 1.7V to 3.6V VDD= 2.2V to 3.6V

V

DD

100 kHz

Parameters Sym Min Max

2-Wire I

Serial port frequency (Note 2, 4)f
Low Clock (Note 2)t

High Clock t

Rise time

Fall time (Note 5)t
Data in Setup time (Note 3)
Data in Hold time (Note 6)t
Data out Hold time (Note 4)t

Start Condition Setup time t

Start Condition Hold time t

Stop Condition Setup time t

Bus Idle/Free t

Time out t

Bus Capacitive load C

Note 1: All values referred to V

2

C Interface

SCL

LOW

t

SU:DAT

HD:DO

SU:STA

HD:STA

SU:STO

B-FREE

IL MAX

HIGH

R

F

HD:DI

OUT

b

and V

(Note 5)t

2: If t

LOW

> t

, the temperature sensor I2C interface will time out. A Repeat Start command is required for

OUT

10 100 10 400 10 1000 kHz

4700 — 1300 — 500 — ns

4000 — 600 — 260 — ns

— 1000 20 300 — 120 ns

20 300 20 300 — 120 ns

250 — 100 —50—ns

0— 0 —0—ns

200 900 200 900 0 350 ns

4700 — 600 — 260 — ns

4000 — 600 — 260 — ns

4000 — 600 — 260 — ns

4700 — 1300 — 500 — ns

25 35 25 35 25 35 ms

—— — 400 — 100 pf

IH MIN

levels.

communication.

2

3: This device can be used in a Standard-mode I

C-bus system, but the requirement t
be met. This device does not stretch SCL Low period. It outputs the next data bit to the SDA line within
t

RMAX

+ t

SU:DAT MIN

= 1000 ns + 250 ns = 1250 ns (according to the Standard-mode I2C-bus specification)

before the SCL line is released.

4: As a transmitter, the device provides internal minimum delay time t

region (min. 200 ns) of the falling edge of SCL t

to avoid unintended generation of Start or Stop

F MAX

conditions.

5: Characterized but not production tested.
6: As a receiver, SDA should not be sampled at the falling edge of SCL. SDA can transition t

SCL toggles Low.

= -40°C to +125°C, and CL = 80 pF

A

400 kHz 1000 KHz

Min Max Min Max Units

HD:DAT MIN

MCP98244

 250 ns must

SU:DAT

to bridge the undefined

0 ns after

HD:DI

TIMING DIAGRAM

 2012-2013 Microchip Technology Inc. DS22327C-page 5

MCP98244

-1.0

0.0

1.0

2.0

3.0

rature Accuracy (°C)

VDD= 1.7 V to 3.6 V

16 units

Spec. Limits

+Std. Dev.

verage

-3.0

-2.0

-40 -20 0 20 40 60 80 100 120

Tem p

e

TA(°C)

g

-Std. Dev.

25%

50%

75%

100%

Occurrences

TA= +85 °C
V

DD

= 1.7 V - 3.6 V

16 units

0%

-1.00

-0.75

-0.50

-0.25

0.00

0.25

0.50

0.75

1.00

Temperature Accuracy (°C)

25%

50%

75%

100%

Occurrences

TA= +25 °C
V

DD

= 1.7 V - 3.6 V

16 units

0%

-1.00

-0.75

-0.50

-0.25

0.00

0.25

0.50

0.75

1.00

Temperature Accuracy (°C)

150

200

250

300

I

DD

(µA)

EEPROM Write (Sensor in Shutdown Mode)

EEPROM Read (Sensor in Shutdown Mode)

50

100

-40 -20 0 20 40 60 80 100 120
T

A

(°C)

Sensor (EEPROM Inactive)

0.50

0.75

1.00

I

SHDN

(µA)

0.00

0.25

-40 -20 0 20 40 60 80 100 120

T

A

(°C )

1

1.2

1.4

1.6

1.8

V

POR

(V)

Falling V

DD

Rising V

DD

0.6

0.8

-40 -20 0 20 40 60 80 100 120
T

A

(°C)

2.0 TYPICAL PERFORMANCE CURVES

Note: The graphs and tables provided following this note are a statistical summary based on a limited number of

samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

Note: Unless otherwise indicated, V

= -40°C to +125°C.

T

A

A

= 1.7V to 3.6V, GND = Ground, SDA/SCL pulled-up to VDD, and

DD

FIGURE 2-1: Temperature Accuracy.

FIGURE 2-4: Supply Current Vs.

Temperature.

FIGURE 2-2: Temperature Accuracy
Histogram, T

FIGURE 2-3: Temperature Accuracy
Histogram, T

DS22327C-page 6  2012-2013 Microchip Technology Inc.

= + 85 °C.

A

= + 105 °C.

A

FIGURE 2-5: Shutdown Current Vs. Temperature.

FIGURE 2-6: Power On Reset Threshold Voltage Vs. Temperature.

MCP98244

0.2

0.3

0.4

nt & SDA V

OL

(V)

SDA, IOL= 20 mA
V

DD

= 2.2 V to 3.6 V

0

0.1

-40 -20 0 20 40 60 80 100 120

Ev

e

TA(°C)

Event, IOL= 3 mA

75

100

125

150

175

200

t

CONV

(ms)

0.0625 °C/LSb

0.125 °C/LSb

0

25

50

-40 -20 0 20 40 60 80 100 120
T

A

(°C)

0.25 °C/LSb

0.5 °C/LSb

30

40

50

SDA I

OL

(mA)

VOL= 0.6V

10

20

-40 -20 0 20 40 60 80 100 120
T

A

(°C)

-1.0

0.0

1.0

2.0

3.0

ized Temp. Error (°C)

VDD= 1.7 V
V

DD

= 3.6 V

-3.0

-2.0

-40 -20 0 20 40 60 80 100 120

Norma

l

TA(°C)

30

35

Bus t

OUT

(ms)

25

-40 -20 0 20 40 60 80 100 120

I

2

C

TA(°C)

Note: Unless otherwise indicated, V

= -40°C to +125°C.

T

A

= 1.7V to 3.6V, GND = Ground, SDA/SCL pulled-up to VDD, and

DD

FIGURE 2-7: Event Output and SDA VOL Vs. Temperature.

FIGURE 2-10: Line Regulation: Change in
Temperature Accuracy Vs. Change in V

DD

.

FIGURE 2-8: Temperature Conversion Rate Vs. Temperature.

FIGURE 2-9: SDA I

 2012-2013 Microchip Technology Inc. DS22327C-page 7

Vs. Temperature.

OL

FIGURE 2-11: I2C Protocol Time-out Vs. Temperature.

MCP98244

3.0 PIN DESCRIPT ION

The descriptions of the pins are listed in Tab l e 3 -1 .

TABLE 3-1: PIN FUNCTION TABLES

MCP98244

TDFN

1 A0 Slave Address and EEPROM Software Write Protect High Voltage Input (V

2 A1 Slave Address

3 A2 Slave Address

4 GND Ground

5 SDA Serial Data Line

6 SCL Serial Clock Line

7 Event Temperature Alert Output

8V

9 EP Exposed Thermal Pad (EP); can be connected to GND.

3.1 Address Pins (A0, A1, A2)

These pins are device address input pins.

The address pins correspond to the Least Significant
bits (LSb) of address bits. The Most Significant bits
(MSb) are (A6, A5, A4, A3). This is shown in Table 3-2.

TABLE 3-2: MCP98244 ADDRESS BYTE

Device Address Code Slave

Sensor 0011
EEPROM 1010

EEPROM
Write Protect

Note 1: User-selectable address is shown by X,

where X is 1 or 0 for V
respectively.

2: The address pins are ignored for all Write

Protect commands.

Symbol Description

DD

Power Pin

3.3 Serial Data Line (SDA)

SDA is a bidirectional input/output pin, used to serially
transmit data to/from the host controller. This pin

requires a pull-up resistor. (See Section 4.0 “Serial

Communication”).

3.4 Serial Clock Line (SCL)

Address

A6 A5 A4 A3 A2 A1 A0

1X1X1

X

and GND,

DD

2—2—2

0110—

The SCL is a clock input pin. All communication timing
is relative to the signal on this pin. The clock is gener­ated by the host or master controller on the bus. (See

Section 4.0 “Serial Communication”).

3.5 Temperature Alert, Open-Drain Output (Event)

The MCP98244 temperature Event output pin is an
open-drain output. The device outputs a signal when
the ambient temperature goes beyond the user-pro-

grammed temperature limit. (see Section 5.2.3 “Event

Output Configuration”).

3.6 Power Pin (VDD)

The A0 Address pin is a multi-function pin. This input
pin is also used for high voltage input V
EEPROM Software Write Protect feature, for more

information see Section 5.3.3 “Bank or page selec-

tion for EEPROM Read/write operation”.

All address pin have an internal pull-down resistors.

to enable the

HV

3.2 Ground Pin (GND)

The GND pin is the system ground pin.

VDD is the power pin. The operating voltage range, as
specified in the DC electrical specification table, is
applied on this pin.

3.7 Exposed Thermal Pad (EP)

There is an internal electrical connection between the
Exposed Thermal Pad (EP) and the GND pin; they can
be connected to the same potential on the Printed
Circuit Board (PCB). This provides better thermal
conduction from the PCB to the die.

HV

)

DS22327C-page 8  2012-2013 Microchip Technology Inc.

MCP98244

123456789

SCL

SDA

0 0 1 1 A2 A1 A0

Start

Address Byte

Slave

Address

R/W

MCP98244 Response

Code

Address

A
C
K

4.0 SERIAL COMMUNICATION

4.1 2-Wire Standard Mode I2C™ Protocol-Compatible Interface

The MCP98244 serial clock input (SCL) and the
bidirectional serial data line (SDA) form a 2-wire
bidirectional Standard mode I

communication port (refer to the Input/Output Pin DC

Characteristics Table and Serial Interface Timing
Specifications Table).

The following bus protocol has been defined:

TABLE 4-1: MCP98244 SERIAL BUS

PROTOCOL DESCRIPTIONS

Term Description

Master The device that controls the serial bus,

typically a microcontroller.

Slave The device addressed by the master,

such as the MCP98244.

Transmitter Device sending data to the bus.

Receiver Device receiving data from the bus.

START A unique signal from master to initiate

serial interface with a slave.

STOP A unique signal from the master to

terminate serial interface from a slave.

Read/Write A read or write to the MCP98244

registers.

ACK A receiver Acknowledges (ACK) the

reception of each byte by polling the
bus.

NAK A receiver Not-Acknowledges (NAK) or

releases the bus to show End-of-Data
(EOD).

Busy Communication is not possible

because the bus is in use.

Not Busy The bus is in the idle state, both SDA

and SCL remain high.

Data Valid SDA must remain stable before SCL

becomes high in order for a data bit to
be considered valid. During normal
data transfers, SDA only changes state
while SCL is low.

2

C-compatible

This device supports the Receive Protocol. The
register can be specified using the pointer for the initial
read. Each repeated read or receive begins with a Start
condition and address byte. The MCP98244 retains the
previously selected register. Therefore, they output
data from the previously-specified register (repeated
pointer specification is not necessary).

4.1.2 MASTER/SLAVE

The bus is controlled by a master device (typically a
microcontroller) that controls the bus access and
generates the Start and Stop conditions. The
MCP98244 is a slave device and does not control other
devices in the bus. Both master and slave devices can
operate as either transmitter or receiver. However, the
master device determines which mode is activated.

4.1.3 START/STOP CONDITION

A high-to-low transition of the SDA line (while SCL is
high) is the Start condition. All data transfers must be
preceded by a Start condition from the master. A low­to-high transition of the SDA line (while SCL is high)
signifies a Stop condition.

If a Start or Stop condition is introduced during data
transmission, the MCP98244 releases the bus. All data
transfers are ended by a Stop condition from the
master.

4.1.4 ADDRESS BYTE

Following the Start condition, the host must transmit an
8-bit address byte to the MCP98244. The address for
the MCP98244 Temperature Sensor is
‘0011,A2,A1,A0’ in binary, where the A2, A1 and A0
bits are set externally by connecting the corresponding
pins to V
transmitted in the serial bit stream must match the
selected address for the MCP98244 to respond with an
ACK. Bit 8 in the address byte is a read/write bit.
Setting this bit to ‘1’ commands a read operation, while
‘0’ commands a write operation (see Figure 4-1).

‘1’ or GND ‘0’. The 7-bit address

DD

4.1.1 DATA TRANSFER

Data transfers are initiated by a Start condition
(START), followed by a 7-bit device address and a
read/write bit. An Acknowledge (ACK) from the slave
confirms the reception of each byte. Each access must
be terminated by a Stop condition (STOP).

Repeated communication is initiated after t

This device does not support sequential register read/
write. Each register needs to be addressed using the
Register Pointer.

 2012-2013 Microchip Technology Inc. DS22327C-page 9

B-FREE

FIGURE 4-1: Device Addressing.

4.1.5 DATA VALID

.

After the Start condition, each bit of data in
transmission needs to be settled for a time specified by
t

SU-DATA

Serial Interface Timing Specifications table).

before SCL toggles from low-to-high (see

MCP98244

4.1.6 ACKNOWLEDGE (ACK/NAK)

Each receiving device, when addressed, is obliged to
generate an ACK bit after the reception of each byte.
The master device must generate an extra clock pulse
for ACK to be recognized.

The acknowledging device pulls down the SDA line for
t

SU-DATA

the master. SDA also needs to remain pulled down for
t

H-DATA

During read, the master must signal an End-of-Data
(EOD) to the slave by not generating an ACK bit (NAK)
once the last bit has been clocked out of the slave. In
this case, the slave will leave the data line released to
enable the master to generate the Stop condition.

before the low-to-high transition of SCL from

after a high-to-low transition of SCL.

4.1.7 TIME OUT (T

If the SCL stays low or high for time specified by t
the MCP98244 resets the serial interface. This dictates
the minimum clock speed as indicated in the
specification.

OUT

)

OUT

,

DS22327C-page 10  2012-2013 Microchip Technology Inc.

MCP98244

Clear Event

0.5°C/bit

0.25°C/bit

0.125°C/bit

0.0625°C/bit

Temperature

T

UPPER

T

LOWER

Configuration

 ADC

Band-Gap

Temperature

Sensor

Event Status

Output Control

Critical Event only

Event Polarity

Event Comp/Int

T

CRIT

Capability

Temp. Range

Accuracy

Output Feature

Register

Pointer

Critical Trip Lock

Alarm Win. Lock Bit

Shutdown

Hysteresis

Manufacturer ID

Resolution

Device ID/Rev

Selected Resolution

Standard I2C

Interface

A0

A1

A2

Event

SDA

SCL

V

DD

GND

I2C Bus Time-out

Accepts V

HV

Shutdown Status

MCP98244 Temperature Sensor

MCP98244 EEPROM

Memory
Control

Logic

XDEC

HV Generator

Software write

Write Protect
Circuitry

YDEC

SENSE AMP
R/W CONTROL

protected area

(00h-7Fh)

(7Fh-FFh)

Software write
protected area

(00h-7Fh)

(7Fh-FFh)

Software write
protected area

Software write
protected area

5.0 FUNCTIONAL DESCRIPTION

The MCP98244 temperature sensors consists of a
band-gap type temperature sensor, a Delta-Sigma
Analog-to-Digital Converter ( ADC), user-program-

mable registers and a 2-wire I
serial interface. Figure 5-1 shows a block diagram of
the register structure.

2

C protocol compatible

FIGURE 5-1: Functional Block Diagram.

 2012-2013 Microchip Technology Inc. DS22327C-page 11

MCP98244

5.1 Registers

The MCP98244 device has several registers that are
user-accessible. These registers include the Capability
register, Configuration register, Event Temperature
Upper-Boundary and Lower-Boundary Trip registers,
Critical Temperature Trip register, Temperature
register, Manufacturer Identification register and
Device Identification register.

The Temperature register is read-only, used to access
the ambient temperature data. The data is loaded in
parallel to this register after t
Temperature Upper-Boundary and Lower-Boundary
Trip registers are read/writes. If the ambient
temperature drifts beyond the user-specified limits, the
MCP98244 device outputs a signal using the Event pin

(refer to Section 5.2.3 “Event Output

Configuration”). In addition, the Critical Temperature

Trip register is used to provide an additional critical
temperature limit.

. The Event

CONV

The Capability register is used to provide bits
describing the MCP98244’s capability in measurement
resolution, measurement range and device accuracy.
The device Configuration register provides access to
configure the MCP98244’s various features. These
registers are described in further detail in the following
sections.

The registers are accessed by sending a Register
Pointer to the MCP98244 using the serial interface.
This is an 8-bit write-only pointer, and Register 5-1
describes the pointer assignment.

REGISTER 5-1: REGISTER POINTER (WRITE ONLY)

W-0 W-0 W-0 W-0 W-0 W-0 W-0 W-0

— — — — Pointer Bits

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 7-4 Writable Bits: Write ‘0’
bit 3-0 Pointer Bits:

0000 = Capability register
0001 = Configuration register (CONFIG)
0010 = Event Temperature Upper-Boundary Trip register (T
0011 = Event Temperature Lower-Boundary Trip register (T
0100 = Critical Temperature Trip register (T
0101 = Temperature register (T
0110 = Manufacturer ID register
0111 = Device ID/Revision register
1000 = TSE2004av Device ID and Vendor Silicon Revision Register
1001 = Resolution register
1XXX = Unused (The device will not acknowledge commands to other pointer locations.).

)

A

CRIT

)

UPPER

LOWER

)

)

DS22327C-page 12  2012-2013 Microchip Technology Inc.

MCP98244

TABLE 5-1: BIT ASSIGNMENT SUMMARY FOR ALL TEMPERATURE SENSOR REGISTERS

(SEE SECTION 5.4)

Register

Pointer

(Hex)

MSB/

LSB

76543210

0x00 MSB 00000000

LSB SHDN Status t

Range V

OUT

0x01 MSB 00000Hysteresis SHDN

LSB Crt Loc Win Loc Int Clr Evt Stat Evt Cnt Evt Sel Evt Pol Evt Mod

0x02 MSB 000SIGN 2

LSB 2

3

°C 22°C 21°C 20°C 2-1°C 2-2°C 0 0

0x03 MSB 000SIGN 2

3

LSB 2

°C 22°C 21°C 20°C 2-1°C 2-2°C 0 0

0x04 MSB 000SIGN 2

3

LSB 2

0x05 MSB T

LSB 2

°C 22°C 21°C 20°C 2-1°C 2-2°C 0 0

T

A

CRITTA

3

°C 22°C 21°C 20°C 2-1°C 2-2°C 2-3°C 2-4°C

T

UPPERTA

T

0x06 MSB 00000000

LSB 01010100

0x07 MSB 00100010

LSB 00000001

0x08 MSB 00100010

LSB 00000001

0x09 MSB 00000000

LSB 000000Resolution

HV

LOWER

Bit Assignment

Resolution Range Accuracy Event

7

°C 26°C 25°C 24°C

7

°C 26°C 25°C 24°C

7

°C 26°C 25°C 24°C

SIGN 27°C 26°C 25°C 24°C

 2012-2013 Microchip Technology Inc. DS22327C-page 13

MCP98244

5.1.1 CAPABILITY REGISTER

This is a read-only register used to identify the
temperature sensor capability. The device capability bit
assignments are specified by TSE2004av, and this
device is factory configured to meet the default
conditions as described in Register 5-2 (these values
can not be changed).

For example, the MCP98244 device is capable of
providing temperature at 0.25°C resolution, measuring
temperature below and above 0°C, providing ±1°C and
±2°C accuracy over the active and monitor temperature
ranges (respectively) and providing user­programmable temperature event boundary trip limits.

These functions are described in further detail in the
following sections.

REGISTER 5-2: CAPABILITY REGISTER (READ-ONLY)  ADDRESS ‘0000 0000’b

U-0 U-0 U-0 U-0 U-0 U-0 U-0 U-0

————————

bit 15 bit 8

R-1 R-1 R-1 R-0 R-1 R-1 R-1 R-1

SHDN Status t

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

Range V

OUT

HV

Resolution Meas. Range Accuracy Temp Alarm

bit 15-8 Unimplemented: Read as ‘0’
bit 7 Event output status during Shutdown (SHDN Status):

0 = Event output remains in previous state. If the output asserts before shutdown command, it

remains asserted during shutdown.

1 = Event output deasserts during shutdown. After shutdown, it takes t

output (power-up default)

bit 6 I

bit 5 High Voltage Input

bit 4-3 Resolution:

bit 2 Temperature Measurement Range (Meas. Range):

2

C Bus time-out (t

0 = Bus time-out range is 10 ms to 60 ms
1 = Bus time-out range is 25 ms to 35 ms (power-up default)

0 = Pin A0 does not accept High Voltage
1 = Pin A0 accepts High Voltage for the EEPROM Write Protect feature (power-up default)

00 = 0.5°C
01 = 0.25°C (power up default)
10 = 0.125°C
11 = 0.0625°C

These bits reflect the selected resolution (see Section 5.2.4 “Temperature Resolution”)

0 =T
1 = The part can measure temperature below 0°C (power-up default)

0 (decimal) for temperature below 0°C

A

OUT

Range):

to re-assert the Event

CONV

DS22327C-page 14  2012-2013 Microchip Technology Inc.

MCP98244

SDA

A
C
K

0011

A

Capability Pointer

0000

A
C
K

S

2A1A0

12345678 12345678

SCL

0

Address Byte

A
C
K

0011

A

MSB Data

A
C
K

N
A
K

S P

2A1A0

12345678 12345678 12345678

Address Byte

LSB Data

R

MCP98244

MCP98244

MCP98244

Master

Master

W

SDA

SCL

000

00000

000 00001

111

REGISTER 5-2: CAPABILITY REGISTER (READ-ONLY)  ADDRESS ‘0000 0000’b (CONTINUED)

bit 1 Accuracy:

0 =Accuracy ±2°C from +75°C to +95°C (Active Range) and ±3°C from +40°C to +125°C

(Monitor Range)

1 =Accuracy ±1°C from +75°C to +95°C (Active Range) and ±2°C from +40°C to +125°C

(Monitor Range)

bit 0 Temperature A larm:

0 = No defined function (This bit will never be cleared or set to ‘0.’)
1 = The part has temperature boundary trip limits (T

temperature event output (JC 42.4 required feature)

UPPER/TLOWER/TCRIT

registers) and a

FIGURE 5-2: Timing Diagram for Reading the Capability Register (See Section 4.0 “Serial

Communication”).

 2012-2013 Microchip Technology Inc. DS22327C-page 15

MCP98244

5.1.2 SENSOR CONFIGURATION
REGISTER (CONFIG)

The MCP98244 device has a 16-bit Configuration reg­ister (CONFIG) that allows the user to set various func­tions for a robust temperature monitoring system. Bits
10 thru 0 are used to select Event output boundary
hysteresis, device Shutdown or Low-Power mode,
temperature boundary and critical temperature lock, or
temperature Event output enable/disable. In addition,
the user can select the Event output condition (output
set for T
T

only), read Event output status and set Event

CRIT

UPPER

and T

temperature boundary or

LOWER

Conversion or Shutdown mode is selected using bit 8.
In Shutdown mode, the band gap temperature sensor
circuit stops converting temperature and the Ambient
Temperature register (TA) holds the previous
successfully converted temperature data (see

Section 5.2.1 “Shutdown Mode”). Bits 7 and 6 are

used to lock the user-specified boundaries T
T

LOWER

and T

to prevent an accidental rewrite.

CRIT

UPPER

Bits 5 thru 0 are used to configure the temperature
Event output pin. All functions are described in

Register 5-3 (see Section 5.2.3 “Event Output

Configuration”).

output polarity and mode (Comparator Output or
Interrupt Output mode).

The temperature hysteresis bits 10 and 9 can be used
to prevent output chatter when the ambient
temperature gradually changes beyond the user-

specified temperature boundary (see Section 5.2.2

“Temperature Hysteresis (T

REGISTER 5-3: CONFIGURATION REGISTER (CONFIG)  ADDRESS ‘0000 0001’b

)”. The Continuous

HYST

U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-0 R/W-0

————— T

HYST

SHDN

bit 15 bit 8

,

R/W-0 R/W-0 R/W-0 R-0 R/W-0 R/W-0 R/W-0 R/W-0

Crit. Lock Win. Lock Int. Clear Event Stat. Event Cnt. Event Sel. Event Pol. Event Mod.

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-11 Unimplemented: Read as ‘0’
bit 10-9 T

UPPER

and T

Limit Hysteresis (T

LOWER

HYST

):

00 = 0°C (power-up default)
01 = 1.5°C
10 = 3.0°C
11 = 6.0°C

(Refer to Section 5.2.3 “Event Output Configuration”)

This bit can not be altered when either of the lock bits are set (bit 6 and bit 7).

This bit can be programmed in Shutdown mode.

bit 8 Shutdown Mode (SHDN):

0 = Continuous Conversion (power-up default)
1 = Shutdown (Low-Power mode)

In shutdown, all power-consuming activities are disabled, though all registers can be written to or read.
Event output will deassert.

This bit cannot be set ‘1’ when either of the lock bits is set (bit 6 and bit 7). However, it can be cleared
‘0’ for Continuous Conversion while locked (Refer to Section5.2.1 “Shutdown Mode”).

DS22327C-page 16  2012-2013 Microchip Technology Inc.

MCP98244

REGISTER 5-3: CONFIGURATION REGISTER (CONFIG)  ADDRESS ‘0000 0001’b

(CONTINUED)

bit 7 T

Lock Bit (Crit. Lock):

CRIT

0 = Unlocked. T
1 =Locked. T

CRIT

register can be written (power-up default)

CRIT

register can not be written

When enabled, this bit remains set ‘1’ or locked until cleared by internal reset (Section 5.4 “Summary

of Power-On Default”). This bit does not require a double-write.

This bit can be programmed in Shutdown mode.

bit 6 T

and T

UPPER

0 = Unlocked. T
1 =Locked. T

Window Lock Bit (Win. Lock):

LOWER

UPPER

UPPER

and T

and T

LOWER

registers can be written (power-up default)

LOWER

registers can not be written

When enabled, this bit remains set ‘1’ or locked until cleared by power-on Respell (Sec tion 5.4 “Sum-

mary of Power-On Default”). This bit does not require a double-write.

This bit can be programmed in Shutdown mode.

bit 5 Interrupt Clear (Int. Clear) Bit:

0 = No effect (power-up default)
1 = Clear interrupt output. When read this bit returns ‘0’

This bit clears the Interrupt flag which deasserts Event output. In shutdown mode, the Event output is
always deasserted. Therefore, setting this bit in Shutdown mode clears the interrupt after the device
returns to normal operation.

bit 4 Event Output Status (Event Stat.) Bit:

0 = Event output is not asserted by the device (power-up default)
1 = Event output is asserted as a comparator/Interrupt or critical temperature output

In shutdown mode this bit will clear because Event output is always deasserted in Shutdown mode.

bit 3 Event Output Control (Event Cnt.) Bit:

0 = Event output Disabled (power-up default)
1 = Event output Enabled

This bit can not be altered when either of the lock bits is set (bit 6 and bit 7).

This bit can be programmed in Shutdown mode, but Event output will remain deasserted.

bit 2 Event Output Select (Event Sel.) Bit:

0 = Event output for T
1 = T

A

≥ T

CRIT

only. (T

UPPER

UPPER

, T

LOWER

and T

LOWER

When the Alarm Window Lock bit is set, this bit cannot be altered until unlocked (bit 6).

This bit can be programmed in Shutdown mode, but Event output will remain deasserted.

bit 1 Event Output Polarity (Event Pol.) Bit:

0 = Active low (power-up default. Pull-up resistor required)
1 = Active-high

This bit cannot be altered when either of the lock bits is set (bit 6 and bit 7).

This bit can be programmed in Shutdown mode, but Event output will remain deasserted, see

Section 5.2.3 “Event Output Configuration”

bit 0 Event Output Mode (Event Mod.) Bit:

0 = Comparator output (power-up default)
1 = Interrupt output

This bit cannot be altered when either of the lock bits is set (bit 6 and bit 7).

This bit can be programmed in Shutdown mode, but Event output will remain deasserted.

and T

(power-up default)

CRIT

temperature boundaries are disabled.)

 2012-2013 Microchip Technology Inc. DS22327C-page 17

MCP98244

• Writing to the CONFIG Register to Enable the Event Output pin <0000 0000 0000 1000>b.

SDA

A
C
K

0011

A

0000

A
C
K

S

2A1A0

12345678 12345678

SCL

0

Address Byte

W

MCP98244

MCP98244

MSB Data

A
C
K

A
C
K

P

12345678 12345678

LSB Data

Configuration Pointer

MCP98244 MCP98244

001

00000

000 00001

000

Note: this is an example routine:

i2c_start(); // send START command

i2c_write(AddressByte & 0xFE); //WRITE Command

//also, make sure bit 0 is cleared ‘0’

i2c_write(0x01); // Write CONFIG Register

i2c_write(0x00); // Write data

i2c_write(0x08); // Write data

i2c_stop(); // send STOP command

FIGURE 5-3: Timing Diagram for Writing to the Configuration Register (See Section 4.0 “Serial

Communication”.

DS22327C-page 18  2012-2013 Microchip Technology Inc.

SDA

A
C
K

0011

A

Configuration Pointer

0000

A
C
K

S

2A1A0

12345678 12345678

SCL

0

Address Byte

A
C
K

0011

A

MSB Data

A
C
K

N
A
K

S P

2A1A0

12345678 12345678 12345678

Address Byte

LSB Data

R

MCP98244

MCP98244

MCP98244

Master

Master

W

SDA

SCL

001

00000

000 00001

000

• Reading the CONFIG Register.

Note: It is not necessary to

select the register
pointer if it was set from
the previous read/write.

Note: this is an example routine:

i2c_start(); // send START command

i2c_write(AddressByte & 0xFE); //WRITE Command

//also, make sure bit 0 is cleared ‘0’

i2c_write(0x01); // Write CONFIG Register

i2c_start(); // send Repeat START command

i2c_write(AddressByte | 0x01); //READ Command

//also, make sure bit 0 is set ‘1’

UpperByte = i2c_read(ACK); // READ 8 bits

//and Send ACK bit

LowerByte = i2c_read(NAK); // READ 8 bits

//and Send NAK bit

i2c_stop(); // send STOP command

MCP98244

FIGURE 5-4: Timing Diagram for Reading from the Configuration Register (See Section 4.0

“Serial Communication”).

 2012-2013 Microchip Technology Inc. DS22327C-page 19

MCP98244

5.1.3 UPPER/LOWER/CRITICAL
TEMPERATURE LIMIT REGISTERS
(T

UPPER/TLOWER/TCRIT

The MCP98244 device has a 16-bit read/write Event
output Temperature Upper-Boundary Trip register
(T
(T
(T

), a 16-bit Lower-Boundary Trip register

UPPER

) and a 16-bit Critical Boundary Trip register

LOWER

) that contains 11-bit data in two’s complement

CRIT

format (0.25°C). This data represents the maximum
and minimum temperature boundary or temperature
window that can be used to monitor ambient

temperature. If this feature is enabled (Section 5.1.2

“Sensor Configuration Register (CONFIG)”) and the

ambient temperature exceeds the specified boundary
or window, the MCP98244 asserts an Event output.

(Refer to Section 5.2.3 “Event Output

Configuration”).

REGISTER 5-4: UPPER/LOWER/CRITICAL TEMPERATURE LIMIT REGISTER (T

T

)  ADDRESS ‘0000 0010’b/‘0000 0011’b/‘0000 0100’b (Note 1)

CRIT

U-0 U-0 U-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0

———Sign2

bit 15 bit 8

)

UPPER/TLOWER

7

°C 26°C 25°C 24°C

/

R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 R/W-0 U-0 U-0

3

°C 22°C 21°C 20°C 2-1°C 2-2°C — —

2

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15-13 Unimplemented: Read as ‘0’
bit 12 Sign:

0 =T
1 =T

bit 11-2 T

0°C

A

 0°C

A

UPPER/TLOWER/TCRIT

:

Temperature boundary trip data in two’s complement format.

bit 1-0 Unimplemented: Read as ‘0’

Note 1: This table shows two 16-bit registers for T

UPPER

, T

LOWER

and T

located at ‘0000 0010b’,

CRIT

‘0000 0011b’ and ‘0000 0100b’, respectively.

DS22327C-page 20  2012-2013 Microchip Technology Inc.

MCP98244

SDA

A
C
K

0011

A

T

UPPER

Pointer

0000

A
C
K

S

2A1A0

12345678 12345678

SCL

0

Address Byte

A
C
K

0011

A

MSB Data

A
C
K

N
A
K

S P

2A1A0

12345678 12345678 1 2345678

Address Byte

LSB Data

R

MCP98244

MCP98244

MCP98244

Master

Master

W

SDA

SCL

010

00000

101 10100

000

• Reading from the T

UPPER

Register.

• Writing 90°C to the T

UPPER

Register <0000 0101 1010 0000>b.

SDA

A
C
K

0011

A

0000

A
C
K

S

2A1A0

12345678 12345678

SCL

0

Address Byte

W

MCP98244

MCP98244

MSB Data

A
C
K

A
C
K

P

12345678 12345678

LSB Data

T

UPPER

Pointer

MCP98244

MCP98244

010

00000

101 10100

000

Note: It is not necessary to

select the register
pointer if it was set from
the previous read/write.

FIGURE 5-5: Timing Diagram for Writing and Reading from the T

“Serial Communication”).

 2012-2013 Microchip Technology Inc. DS22327C-page 21

UPPER

Register (See Section 4.0

MCP98244

5.1.4 AMBIENT TEMPERATURE
REGISTER (T

The MCP98244 device uses a band gap temperature
sensor circuit to output analog voltage proportional to
absolute temperature. An internal  ADC is used to
convert the analog voltage to a digital word. The
converter resolution is set to 0.25°C + sign (11-bit
data). The digital word is loaded to a 16-bit read-only
Ambient Temperature register

)

A

(TA) that contains 11-bit

In addition, the TA register uses three bits (bits 15, 14
and 13) to reflect the Event pin state. This allows the
user to identify the cause of the Event output trigger

(see Section 5.2.3 “Event Output Configuration”);
bit 15 is set to ‘1’ if T
bit 14 is set to ‘1’ if T
is set to ‘1’ if T

The T

register bit assignment and boundary

A

is greater than or equal to T

A

is greater than T

A

is less than T

A

LOWER

UPPER

.

CRIT

and bit 13

conditions are described in Register 5-5.

temperature data in two’s complement format.

register bits (bits 12 through 0) are double-buff-

The T

A

ered. Therefore, the user can access the register while,
in the background, the MCP98244 performs an analog­to-digital conversion. The temperature data from the 
ADC is loaded in parallel to the T

register at t

A

CONV

refresh rate.

REGISTER 5-5: AMBIENT TEMPERATURE REGISTER (TA)  ADDRESS ‘0000 0101’b (Note 1)

R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0

T

vs. T

A

CRITTA

vs. T

UPPERTA

vs. T

LOWER

SIGN 27 °C 26 °C 25 °C 24 °C

bit 15 bit 8

R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0

3

°C 22 °C 21 °C 20 °C 2

2

-1

°C 2

-2

°C 2

-3

°C 2

-4

°C

bit 7 bit 0

,

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

CRIT

UPPER

T

A

LOWER

CRIT

CRIT

UPPER

UPPER

LOWER

LOWER

Bit: (Note 1)

Bit (Note 1):

Bit (Note 1):

bit 15 T

vs. T

A

0 =TA T
1 =TA T

bit 14 TA vs. T

0 =T

1 =TA T

bit 13 TA vs. T

0 =TA T
1 =TA T

bit 12 SIGN Bit:

0 =T
1 =T

bit 11-0 Ambient Temperature (T

0°C

A

 0°C

A

) Bits: (Note 2)

A

12-bit Ambient Temperature data in two’s complement format.

Note 1: Bits 15, 14 and 13 are not affected by the status of the Event output configuration (bits 5 to 0 of CONFIG)

(Register 5-3).

2: Bits 2, 1, and 0 may remain clear '0' depending on the status of the resolution register. The Power-up

default is 0.25°C/bit, bits 1 and 0 remain clear '0'.

DS22327C-page 22  2012-2013 Microchip Technology Inc.

MCP98244

Where:

T

A

= Ambient Temperature (°C)

UpperByte = T

A

bit 11 to bit 8

LowerByte = TA bit 7 to bit 0

Temperature  0°C (bit 12 or Sign bit = 0)

Temperature  0°C (bit 12 or Sign bit = 1)

T

A

UpperByte 24LowerByte 2

4–



+



=

T

A

UpperByte 24LowerByte 2

4–



+



256–=

i2c_start(); // send START command

i2c_write(AddressByte & 0xFE); //WRITE Command

//also, make sure bit 0 is cleared ‘0’

i2c_write(0x05); // Write T

A

Register Address

i2c_start(); //Repeat START

i2c_write(AddressByte | 0x01); // READ Command

//also, make sure bit 0 is Set ‘1’

UpperByte = i2c_read(ACK); // READ 8 bits

//and Send ACK bit

LowerByte = i2c_read(NAK); // READ 8 bits

//and Send NAK bit

i2c_stop(); // send STOP command

//Convert the temperature data

//First Check flag bits

if ((UpperByte & 0x80) == 0x80){ //T

A

T

CRIT

}

if ((UpperByte & 0x40) == 0x40){ //T

A

T

UPPER

}

if ((UpperByte & 0x20) == 0x20){ //T

A

T

LOWER

}

UpperByte = UpperByte & 0x1F; //Clear flag bits

if ((UpperByte & 0x10) == 0x10){ //T

A

 0°C

UpperByte = UpperByte & 0x0F; //Clear SIGN

Temperature = 256 - (UpperByte x 16 + LowerByte / 16);

}else //T

A

 0°C

Temperature = (UpperByte x 16 + LowerByte / 16);

//Temperature = Ambient Temperature (°C)

This example routine assumes the variables and I

2

C communication subroutines are predefined:

5.1.4.1 TA bits to Temperature Conversion

To convert the TA bits to decimal temperature, the
upper three boundary bits (15, 14 and 13) must be
masked out. Then determine the sign bit (bit 12) to
check positive or negative temperature, shift the bits
accordingly and combine the upper and lower bytes of
the 16-bit register. The upper byte contains data for
temperatures greater than 32°C, while the lower byte
contains data for temperature less than 32°C, including
fractional data. When combining the upper and lower
bytes, the upper byte must be Right-shifted by 4 bits (or
multiply by 2
by 4 bits (or multiply by 2
shifted values provides the temperature data in decimal
format; see Equation 5-1.

The temperature bits are in two’s complement format,
therefore, positive temperature data and negative tem­perature data are computed differently. Equation 5-1
shows the temperature computation. The example
instruction code outlined in Figure 5-6 shows the
communication flow, also see Figure 5-7 for timing
diagram.

4

) and the lower byte must be Left-shifted

-4

). Adding the results of the

EQUATION 5-1: BYTES TO

TEMPERATURE
CONVERSION

FIGURE 5-6: Example Instruction Code.

 2012-2013 Microchip Technology Inc. DS22327C-page 23

MCP98244

SDA

A
C
K

0011

A

TA Pointer

0000

A
C
K

S

2A1A0

12345678 12345678

SCL

0

Address Byte

A
C
K

0011

A

MSB Data

A
C
K

N
A
K

S P

2A1A0

12345678 12345678 12345678

Address Byte

LSB Data

R

MCP98244

MCP98244

MCP98244

Master

Master

W

SDA

SCL

101

00000

001 10010

100

Note: It is not necessary to

select the register
pointer if it was set from
the previous read/write.

FIGURE 5-7: Timing Diagram for Reading +25.25°C Temperature from the TA Register (See

Section 4.0 “Serial Communication”).

DS22327C-page 24  2012-2013 Microchip Technology Inc.

MCP98244

SDA

A
C
K

0011

A

Manuf. ID Pointer

0000

A
C
K

S

2A1A0

12345678 12345678

SCL

0

Address Byte

A
C
K

0011

A

MSB Data

A
C
K

N
A
K

S P

2A1A0

12345678 12345678 12345678

Address Byte

LSB Data

R

MCP98244

MCP98244

MCP98244

Master

Master

W

SDA

SCL

110

00000

000 01010

100

Note: It is not necessary to

select the register
pointer if it was set from
the previous read/write.

5.1.5 MANUFACTURER ID REGISTER

This register is used to identify the manufacturer of the
device in order to perform manufacturer specific
operation. The Manufacturer ID for the MCP98244 is
0x0054 (hexadecimal).

REGISTER 5-6: MANUFACTURER ID REGISTER (READ-ONLY)  ADDRESS

R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0

Manufacturer ID

bit 15 bit 8

R-0 R-1 R-0 R-1 R-0 R-1 R-0 R-0

Manufacturer ID

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

‘0000 0110’b

bit 15-0 Device Manufacturer Identification Number

.

FIGURE 5-8: Timing Diagram for Reading the Manufacturer ID Register (See Section 4.0 “Serial

Communication”).

 2012-2013 Microchip Technology Inc. DS22327C-page 25

MCP98244

5.1.6 DEVICE ID AND REVISION
REGISTER

There are two Device ID and Revision ID registers.
Address pointer 0x07 is specific to TSE2004av devices
and it is used to identify compliant devices. Address
Pointer 0x08 is a Microchip-specific register and it is
used to identify Microchip devices. The upper byte of
these registers is used to specify the device identifica­tion and the lower byte is used to specify device silicon
revision. The device ID for the MCP98244 is 0x22 (hex)
(same as TSE2004av).

The revision (Lower Byte) begins with 0x00 (hex) for
the first release, with the number being incremented as
revised versions are released.

REGISTER 5-7: TSE2004AV DEVICE ID AND DEVICE REVISION (READ-ONLY) 

ADDRESS

R-0 R-0 R-1 R-0 R-0 R-0 R-1 R-0

bit 15 bit 8

R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-1

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

‘0000 0111’b AND ‘0000 1000’b

Device ID

Device Revision

bit 15-8 Device ID: Bit 15 to bit 8 are used for device ID
bit 7-0 Device Revision: Bit 7 to bit 0 are used for device revision

DS22327C-page 26  2012-2013 Microchip Technology Inc.

MCP98244

5.1.7 RESOLUTION REGISTER

This register allows the user to change the sensor

resolution (see Section 5.2.4 “Temperature

Resolution”). The POR default resolution is 0.25°C.

The selected resolution is also reflected in the
Capability register (see Register 5-2).

Note: In order to prevent accidentally writing the

resolution register to higher resolution and
exceeding the maximum temperature
conversion time of t
Shutdown Command (using the CONFIG
register) is required to change the
resolution register. The device must be in
shutdown mode to change the resolution.

= 125 ms, a

CONV

REGISTER 5-8: RESOLUTION REGISTER  ‘0000 1001’b

R/W-1 U-0 U-0 U-0 U-0 U-0 U-0 U-0

—

bit 15 bit 8

U-0 U-0 U-0 U-0 U-0 U-0 R/W-0 R/W-1

Resolution

bit 7 bit 0

Legend:

R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’

-n = Value at POR ‘1’ = Bit is set ‘0’ = Bit is cleared x = Bit is unknown

bit 15 Unimplemented: Read as ‘1’
bit 14-2 Unimplemented: Read as ‘0’
bit 1-0 Resolution:

00 = LSB = 0.5°C (t
01 = LSB = 0.25°C (power up default, t
10 = LSB = 0.125°C (t
11 = LSB = 0.0625°C (t

= 23 ms typical)

CONV

= 75 ms typical)

CONV

= 150 ms typical)

CONV

= 46 ms typical)

CONV

 2012-2013 Microchip Technology Inc. DS22327C-page 27

MCP98244

5.2 SENSOR FEATURE DESCRIPTION

5.2.1 SHUTDOWN MODE

Shutdown mode disables all power-consuming
activities (including temperature sampling operations)
while leaving the serial interface active. This mode is
selected by setting bit 8 of CONFIG to ‘1’. In this mode,
the device consumes I
until bit 8 is cleared ‘0’ to enable Continuous
Conversion mode, or until power is recycled.

The Shutdown bit (bit 8) cannot be set to ‘1’ while bits
6 and 7 of CONFIG (Lock bits) are set to ‘1’. However,
it can be cleared ‘0’ or returned to Continuous
Conversion while locked.

In Shutdown mode, all registers can be read or written.
However, the serial bus activity increases the shutdown
current.

If the device is shutdown while the Event pin is
asserted, then the Event output will be deasserted
during shutdown. It will remain deasserted until the
device is enabled for normal operation. Once the
device is enabled, it takes t
reasserts the Event output.

5.2.2 TEMPERATURE HYSTERESIS
(T

A hysteresis of 0°C, 1.5°C, 3°C or 6°C can be selected
for the T
boundaries using bits 10 and 9 of CONFIG. The
hysteresis applies for decreasing temperature only (hot
to cold), or as temperature drifts below the specified
limit.

The hysteresis bits can not be changed if either of the
lock bits, bits 6 and 7 of CONFIG, are set to ‘1’.

The T
are described graphically in Figure 5-9.

UPPER

UPPER

, T

HYST

, T

LOWER

)

. It remains in this mode

SHDN

before the device

CONV

and T

LOWER

and T

CRIT

CRIT

boundary conditions

temperate

5.2.3 EVENT OUTPUT CONFIGURATION

The Event output can be enabled using bit 3 of
CONFIG (Event output control bit) and can be
configured as either a comparator output or as Interrupt
Output mode using bit 0 of CONFIG (Event mode). The
polarity can also be specified as an active-high or
active-low using bit 1 of CONFIG (Event polarity). The
Event output requires a pull-up resistor to function.

These configurations are designed to serve processors
with Low-to-High or High-to-Low edge triggered inputs.
With Active-High configuration, when the Event output
deasserts, power will be dissipated across the pull-up
resistor.

When the ambient temperature increases above the
critical temperature limit, the Event output is forced to a
comparator output (regardless of bit 0 of CONFIG).
When the temperature drifts below the critical
temperature limit minus hysteresis, the Event output
automatically returns to the state specified by bit 0 of
CONFIG.

The status of the Event output can be read using bit 4
of CONFIG (Event status). This bit can not be set to ‘1’
in shutdown mode.

Bits 7 and 6 of the CONFIG register can be used to lock

UPPER

, T

the T
prevent false triggers at the Event output due to an
accidental rewrite to these registers.

The Event output can also be used as a critical
temperature output using bit 2 of CONFIG (critical
output only). When this feature is selected, the Event
output becomes a comparator output. In this mode, the
interrupt output configuration (bit 0 of CONFIG) is
ignored.

LOWER

and T

registers. The bits

CRIT

DS22327C-page 28  2012-2013 Microchip Technology Inc.

MCP98244

5.2.3.1 Comparator Mode

Comparator mode is selected using bit 0 of CONFIG. In
this mode, the Event output is asserted as active-high
or active-low using bit 1 of CONFIG. Figure 5-9 shows
the conditions that toggle the Event output.

If the device enters Shutdown mode with asserted
Event output, the output will deassert. It will remain
deasserted until the device enters Continuous Conver­sion mode and after the first temperature conversion is
completed, t
sion, T

must satisfy the T

A

. After the initial temperature conver-

CONV

UPPER

or T

LOWER

boundary

conditions in order for Event output to be asserted.

Comparator mode is useful for thermostat-type
applications, such as turning on a cooling fan or
triggering a system shutdown when the temperature
exceeds a safe operating range.

5.2.3.2 Interrupt Mode

In the Interrupt mode, the Event output is asserted as
active-high or active-low (depending on the polarity
configuration) when T
and T

limits. The output is de asserted by setting

LOWER

bit 5 (Interrupt Clear) of CONFIG. If the device enters
Shutdown mode with asserted Event output, the output
will deassert. It will remain deasserted until the device
enters Continuous Conversion mode and after the first
temperature conversion is completed, t
rupt clear bit (Bit 5) is never set, then the Event output will
reassert after the first temperature conversion.

In addition, if T

A

Comparator mode and asserts until T
While the Event output is asserted, the user must send
the Clear Interrupt command (bit 5 of CONFIG) for Event
output to deassert, when temperature drops below the
critical limit, TA < T
remains asserted (see Figure 5-9 for a graphical descrip­tion). Switching from Interrupt mode to Comparator mode
also deasserts Event output.

This mode is designed for interrupt-driven microcontrol­ler-based systems. The microcontroller receiving the
interrupt will have to acknowledge the interrupt by setting
bit 5 of CONFIG register from the MCP98244.

drifts above or below T

A

≥ T

the Event output is forced as

CRIT

CRIT

- T

. Otherwise, Event output

HYST

CONV

< T

A

UPPER

. If the inter-

- T

CRIT

HYST

5.2.4 TEMPERATURE RESOLUTION

The MCP98244 device is capable of providing tem­perature data with 0.5°C to 0.0625°C resolution. The
Resolution can selected using the Resolution register
(Register 5-8) which is located in address
‘00001001’b. This address location is not specified in
JEDEC Standard JC42.4. However, it provides
additional flexibility while being functionally compatible
with JC42.4 and provides a 0.25°C resolution at
125 ms (max.). In order to prevent accidentally chang­ing the resolution and exceeding the 125 ms conver­sion time, the device must be in Shutdown mode to
change this register. The selected resolution can be
read by user using bit 4 and bit 3 of the Capability reg­ister (Register 5-2). A 0.25°C resolution is set as POR
default by factory.

TABLE 5-2: TEMPERATURE

CONVERSION TIME

t

Resolution

CONV

(ms)

0.5°C 30 33

0.25°C

65 15

(Power-up default)

0.125°C 130 8

0.0625°C 260 4

.

Samples/sec

(typical)

 2012-2013 Microchip Technology Inc. DS22327C-page 29

T

UPPER

T

LOWER

Event Output

T

CRIT

T

A

T

UPPER

- T

HYST

(Active-Low)

Comparator

Interrupt

S/w Int. Clear

Critical Only

T

CRIT

- T

HYST

1

2

3

4

5

7

TABLE 5-3: TEMPERATURE EVENT OUTPUT CONDITIONS

Note Output Boundary Conditions

Comparator Interrupt Critical TA Bits

Output State (Active Low/High) 15 14 13

1T

A

 T

LOWER

High/Low Low/High High/Low 0 0 0

2T

A

 T

LOWER

- T

HYST

Low/High Low/High High/Low 0 0 1

3T

A

 T

UPPER

Low/High Low/High High/Low 0 1 0

4 T

A

 T

UPPER

- T

HYST

High/Low Low/High High/Low 0 0 0

5 T

A

 T

CRIT

Low/High Low/High Low/High 1 1 0

6 When T

A

 T

CRIT

the Event output is forced to Comparator Mode and bits 0 of CONFIG (Event

output mode) is ignored until T

A

 T

CRIT

- T

HYST

. In the Interrupt Mode, if Interrupt is not cleared

(bits 5 of CONFIG) as shown in the diagram at Note 6, then Event will remain asserted at Note 7

until Interrupt is cleared by the controller.

7T

A

 T

CRIT

- T

HYST

Low/High High/Low High/Low 0 1 0

T

LOWER

- T

HYST

T

LOWER

-T

HYST

T

UPPER

- T

HYST

1

3

4

2

Note:

6

Event Output

(Active-High)

Comparator

Interrupt

S/w Int. Clear

Critical Only

MCP98244

FIGURE 5-9: Event Output Condition.

DS22327C-page 30  2012-2013 Microchip Technology Inc.

5.3 MCP98244 EEPROM FEATURE

SDA

A
C
K

1010

A

A
C
K

S

2A1A0

12345678 12345678

SCL

Address Byte

W

MCP98244

MCP98244

A
C
K

P

12345678

Data

Word Address

MCP98244

XXXXX

XX X X X X XX

XXX

DESCRIPTION

5.3.1 BYTE WRITE

To write a byte in the MCP98244 EEPROM, the master
has to specify the memory location or address. Once
the address byte is transmitted correctly followed by a
word address, the word address is stored in the
EEPROM address pointer. The following byte is data to
be stored in the specified memory location. Figure 5-10
shows the timing diagram.

MCP98244

FIGURE 5-10: Timing Diagram for Byte Write (See Section 4.0 “Serial Communication”).

 2012-2013 Microchip Technology Inc. DS22327C-page 31

MCP98244

SDA

A
C
K

1010

A

XXXX

A
C
K

S

2A1A0

12345678 12345678

SCL

X

Address Byte

W

MCP98244

MCP98244

Data at (n)

A
C
K

P

12345678 12345678

Data at (n+1)

Word Address (n)

MCP98244

MCP98244

XXX

XXXXX

XXX XXXXX

XXX

A
C
K

Data at (n+15)

MCP98244

XXX

XXX

A
C
K

Note: n is the initial address for a page.

5.3.2 PAGE WRITE

The write Address Byte, word address and the first data
byte are transmitted to the MCP98244 in the same way
as in a byte write. Instead of generating a Stop
condition, the master transmits up to 15 additional data
bytes to the MCP98244, which are temporarily stored
in the on-chip page buffer and will be written into the
memory after the master has transmitted a Stop
condition. Upon receipt of each word, the four lower
order address pointer bits are internally incremented by
one. The higher order four bits of the word address
remain constant. If the master should transmit more
than 16 bytes prior to generating the Stop condition, the
address counter will roll over and the previously
received data will be overwritten. As with the byte write
operation, once the Stop condition is received, an
internal write cycle will begin (Figure 5-11).

Note: Page write operations are limited to writing

bytes within a single physical page,
regardless of the number of bytes actually
being written. Physical page boundaries
start at addresses that are integer
multiples of the page buffer size (or ‘page
size’) and end at addresses that are
integer multiples of [page size - 1]. If a
Page Write command attempts to write
across a physical page boundary, the
result is that the data wraps around to the
beginning of the current page (overwriting
data previously stored there), instead of
being written to the next page, as might be
expected. It is therefore necessary for the
application software to prevent page write
operations that would attempt to cross a
page boundary.

FIGURE 5-11: Timing Diagram for Page Write (See Section 4.0 “Serial Communication”).

DS22327C-page 32  2012-2013 Microchip Technology Inc.

MCP98244

SDA

A
C
K

0110

A
C
K

S

12345678 12345678

SCL

Address Byte

W

MCP98244

MCP98244

A
C
K

P

12345678

Data

Word Address

MCP98244

XXXXX

XXX XXXXX

XXX

11X

5.3.3 BANK OR PAGE SELECTION FOR
EEPROM READ/WRITE OPERATION

There are two 256 byte banks or pages in this device
(512 bytes total). The pages are selected using I2C
Set Page Address (SPA) command byte of ‘0110
1100’ for bank/page 0 and ‘0110 1110’ for bank/page
1, see Ta b le 5 -5 .

The current page status can be read using the Read
Page Address (RPA) Command. If the device ACK or
NAK the command, then the current page is 0 or 1,
respectively.

TABLE 5-4: SELECTING 256 BYTE BANKS OR PAGES FOR EEPROM READ/WRITE

Address Byte

EEPROM
Function

Set Bank/Page Address 0 (SPA0)

Set Bank/Page Address 1 (SPA1)

Read Bank/Page Address (RPA)

Operation

WRITE

WRITE

READ

Address

Note 1: A0, A1, A2 address pin states are ignored.

Code

0110 1 1 0 0
0110 1 1 1 0
0110 1 1 0 1

Slave Address 1

A2 A1 A0

A0 PIN Voltage

R/W

VDD, VSS, VHVACK, Page 0 Set

VDD, VSS, VHVACK, Page 1 Set

VDD, VSS, VHVACK for Page 0

NAK for Page 1

MCP98244

output

FIGURE 5-12: Timing Diagram for Bank/Page Selection (See Se ction 4.0 “Serial

Communication”)

 2012-2013 Microchip Technology Inc. DS22327C-page 33

MCP98244

SDA

A
C
K

0110

A
C
K

S

12345678 12345678

SCL

Address Byte

W

MCP98244

MCP98244

A
C
K

P

12345678

Data

Word Address

MCP98244

XXXXX

XXX XXXXX

XXX

XXX

5.3.4 WRITE PROTECTION

The MCP98244 has a Software Write-Protect (SWP)
feature that allows a 128-byte block to be write-pro­tected. There are four 128-byte blocks. Each block is
write protected individually. The write-protected area
can be cleared by sending Clear Write Protect (CWP)
commands for each block.

To access write protection, the device address code of

5.3.4.1 SWP/RPS

The SWP (Software Write Protect) feature is invoked
by writing a command byte as shown on Tab le 5 - 5. It
can be cleared using the CWP command. In this mode,
the Slave Address pins are ignored. A high voltage V
needs to be applied to the A0 pin. RPS (Read Protec­tion Status) can be executed to read protection status.

5.3.4.2 CWP (Clear Write Protect)

the Address Byte is set to ‘0110’ instead of ‘1010’. In
this mode, the Slave Address pins are ignored. Once
the device is write protected it will not acknowledge any
write commands to the protected block. Table 5-5
shows the corresponding Address Bytes for the write­protect feature.

The CWP feature is invoked by writing clear write-pro­tect command. A high voltage VHV needs to be applied
to the A0 pin and once the command is executed bank/
Page 0 and bank/Page 1 are cleared. Tab le 5- 5 shows
the bit configuration.

TABLE 5-5: DEVICE SLAVE ADDRESS DURING WRITE PROTECTION (SWP/CWP)

Address Byte 23

EEPROM Function Operation

SWP

/RPS0 — Bank/Page 0, Block 0

0

00h to 7Fh

SWP1/RPS1 — Bank/Page 0, Block 1

SWP2/RPS2 — Bank/Page 1, Block 2

SWP3/RPS3 — Bank/Page 1, Block 3

80h to FFh

00h to 7Fh

80h to FFh

CWP (Clear all Pages) WRITE

SWP

RPS

SWP

RPS

SWP

RPS

SWP

RPS

 WRITE

0

 READ 4

0

 WRITE

1

 READ 4

1

 WRITE

2

 READ 4

2

 WRITE

3

 READ 4

3

Address

Code 2

0110 0 0 1 0

0110 1 0 0 0

0110 1 0 1 0

0110 0 0 0 0

0110 0 1 1 0

Note 1: The slave address bits for each block are not binary increments for compatibility.

2: For Address Code <0110> the A0, A1, A2 states are ignored.
3: All address bytes, other than those indicated below, are ignored by the device.
4: The device will NAK if protected and ACK if it is unprotected.

Slave Address 1,2

R/W

A2 A1 A0

1

1

1

1

A0 PIN Voltage

V

HV

VDD, VSS, V

V

HV

VDD, VSS, V

V

HV

VDD, VSS, V

V

HV

VDD, VSS, V

V

HV

HV

HV

HV

HV

HV

FIGURE 5-13: Timing Diagram for Setting Software Write Protect (See Section 4.0 “Serial

Communication”).

DS22327C-page 34  2012-2013 Microchip Technology Inc.

MCP98244

TABLE 5-6: DEVICE RESPONSE WHEN WRITING DATA OR ACCESSING SWPN/CWP/SPAN2

Status Command ACK Address ACK Data Byte ACK

Not Protected SWP

/CWPACK————Yes Yes

n

SWPn/CWP ACK 0xXX

1

ACK——Yes Yes

SWPn/CWP ACK 0xXX ACK 0xXX ACK Yes Yes

Page/byte write ACK Address ACK Data ACK Yes Yes

Protected SWP

n

NAK 0xXX NAK 0xXX NAK — No

CWP ACK————Yes Yes

CWP ACK 0xXX ACK — — Yes Yes

CWP ACK 0xXX ACK 0xXX ACK Yes Yes

Page/byte write ACK Address ACK Data NAK Yes No

Protected or

Not protected

SPA

SPA

SPA

0,1

0,1

0,1

ACK — — — — Yes/No 4 No

ACK 0xXX ACK — — No

ACK 0xXX ACK 0xXX ACK No

Note 1: 0xXX is defined as ‘don’t care’ byte.

2: N or n = 1, 2, 3, and 4 which describes the EEPROM Block number as shown in Tab le 5 -5 .

2

C stop command is necessary to execute the instructions.

3: I
4: The device responds SPA

Commands with ACK, therefore STOP command is not necessary.

0,1

STOP

Cmd 3

Write/Clear

Cycle

TABLE 5-7: DEVICE RESPONSE WHEN RPA/RPSN1

1

Status Command ACK Address ACK Data Byte ACK STOP Cmd 2

Not Protected

Protected RPS

Protected or

Not protected

RPS

RPA

RPA

n

n

0

1

ACK 0xFF NAK 0xFF NAK Yes/No

NAK 0xFF NAK 0xFF NAK Yes/No

ACK 0xFF NAK 0xFF NAK Yes/No

NAK 0xFF NAK 0xFF NAK Yes/No

Note 1: N or n = 1, 2, 3, and 4 which describes the EEPROM Block number as shown in Tab le 5 -5 .

2: Since the responses to these read commands are output on the 9th bit, STOP command is not necessary.

 2012-2013 Microchip Technology Inc. DS22327C-page 35

MCP98244

1010

A

A
C
K

N
A
K

S P

2A1A0

12345678 12345678

Address Byte

Current Word Address

R

MCP98244

Master

SDA

SCL

00000

000

Note: In this example, the current word address is the

previously accessed address location n plus 1.

5.3.5 READ OPERATION

Read operations are initiated in the same way as write
operations, with the exception that the R/W
slave address is set to ‘1’. There are three basic types
of read operations: current address read, random read
and sequential read.

bit of the

5.3.5.1 Current Address Read

The MCP98244 contains an address counter that
maintains the address of the last word accessed,
internally incremented by ‘1’. Therefore, if the previous
access (either a read or write operation) was to
address
would access data from address
the slave address with R/W
issues an acknowledge and transmits the 8-bit data
word. The master will not acknowledge (NAK) the
transfer but does generate a Stop condition and the
MCP98244 discontinues transmission (Figure 5-14).

n, the next current address read operation

n+1. Upon receipt of

bit set to ‘1’, the MCP98244

FIGURE 5-14: Reading Current Word Address (See Section 4.0 “Serial Communication”).

DS22327C-page 36  2012-2013 Microchip Technology Inc.

MCP98244

SDA

A
C
K

1010

A

Word Address (n)

0000

A
C
K

S

2A1A0

12345678 12345678

SCL

0

Address Byte

MCP98244

MCP98244

W

000

1010

A

A
C
K

N
A
K

S P

2A1A0

12345678 12345678

Address Byte

Data at (n)

R

MCP98244

Master

SDA

SCL

XXXXX

XXX

Note: In this example, ‘n’ is the current Address Word which ‘00’h and the data is the byte at address ‘n’.

5.3.5.2 Random Read

Random read operations allow the master to access
any memory location in a random manner. To perform
this type of read operation, the word address must first
be set. This is done by sending the word address to the
MCP98244 as part of a write operation. Once the word
address is sent, the master generates a start condition
following the acknowledge. This terminates the write
operation, but not before the internal address pointer is

set. The master then issues the Address Byte again,
but with the R/W

bit set to a ‘1’. The MCP98244 then

issues an acknowledge and transmits the 8-bit data
word. The master will not acknowledge the transfer but
does generate a stop condition and the MCP98244
discontinues transmission (Figure 5-15).

FIGURE 5-15: Timing Diagram for Random Read (See Section 4.0 “Serial Communication”).

 2012-2013 Microchip Technology Inc. DS22327C-page 37

MCP98244

SDA

A
C
K

1010

A

XXXX

A
C
K

S

2A1A0

12345678 12345678

SCL

X

Address Byte

R

MCP98244

Master

Data at (n+1)

A
C
K

12345678 12345678

Data at (n+2)

Data (n)

1

Master Master

XXX

XXXXX

XXX XX XXX

XXX

Data at (n+m)

(1)

XXX

XXX

A
C
K

Note 1: ‘n’ is the initial address location and ‘m’ is the final address location (‘n+m’ < 256)

N
A
K

P

Master

5.3.5.3 Sequential Read

Sequential reads are initiated in the same way as a
random read, with the exception that after the
MCP98244 transmits the first data byte, the master
issues an acknowledge, as opposed to a stop condition
in a random read. This directs the MCP98244 to
transmit the next sequentially addressed 8-bit word
(Figure 5-16).

To provide sequential reads, the MCP98244 contains
an internal address pointer, which is incremented by
one at the completion of each operation. This address
pointer allows the entire memory contents to be serially
read during one operation.

FIGURE 5-16: Timing Diagram for Sequential Read (See Section 4.0 “Serial Communication”).

5.3.6 STANDBY MODE

The design will incorporate a low-power Standby mode
(I

). Standby mode will be entered after a normal

SHDN

termination of any operation and after all internal
functions are complete. This would include any error
conditions occurring, such as improper number of clock
cycles or improper instruction byte as defined
previously.

DS22327C-page 38  2012-2013 Microchip Technology Inc.

MCP98244

5.4 Summary of Power-On Default

The MCP98244 has an internal Power-On Reset
(POR) circuit. If the power supply voltage V
down to the V

POR_TS

and V

thresholds, the

POR_EE

device resets the registers to the power-on default
settings.

Table 5-8 shows the power-on default summary for the

temperature sensor. The EEPROM resets the address
pointer to 0x00 hex.

TABLE 5-8: MCP98244 TEMPERATURE SENSOR POWER-ON RESET DEFAULTS

Registers

Address

(Hexadecimal)

0x00 Capability 0x00EF Event output deasserts in Shutdown

0x01 CONFIG 0x0000 Comparator mode

0x02 T

0x03 T

0x04 T

0x05 T

0x06 Manufacturer ID 0x0054 —

0x07 TSE2004av

0x08 Microchip

0x09 Resolution 0x0001 0.25°C Measurement Resolution

Register Name

UPPER

LOWER

CRIT

A

Device ID/ Device Revision

Device ID/ Device Revision

glitches

DD

Default Register

Data (Hexadecimal)

2

I

C time out 25 ms to 35 ms

Accepts V

0.25°C Measurement Resolution
Measures temperature below 0°C
±1°C accuracy over active range
Temperature event output

Active-Low output
Event and critical output
Output disabled
Event not asserted
Interrupt cleared
Event limits unlocked
Critical limit unlocked
Continuous conversion
0°C Hysteresis

0x0000 0°C

0x0000 0°C

0x0000 0°C

0x0000 0°C

0x2201 —

0x2201 —

Power-Up Default

Register Description

at A0 pin

HV

 2012-2013 Microchip Technology Inc. DS22327C-page 39

MCP98244

NOTES:

DS22327C-page 40  2012-2013 Microchip Technology Inc.

MCP98244

T





JAVDDIDDVOL_EventIOL_EventVOL_SDAIOL_SDA



+



+



=

Where:

T=T

J - TA

TJ= Junction Temperature

TA= Ambient Temperature



JA

= Package Thermal Resistance

V

OL_Event, SDA

= Event and SDA Output V

OL

(0.4 V

max

)

I

OL_Event, SDA

= Event and SDA Output I

OL

(3 mA

max

and 20 mA

max,

respectively)

A0

A1

A2

GND

V

DD

Event

SCL

SDA

EP9

6.0 APPLICATIONS INFORMATION

6.1 Layout Considerations

The MCP98244 device does not require any additional
components besides the master controller in order to
measure temperature. However, it is recommended
that a decoupling capacitor of 0.1 µF to 1 µF be used
between the V
ceramic capacitor is recommended. It is necessary for
the capacitor to be located as close as possible to the
power and ground pins of the device in order to provide
effective noise protection.

In addition, good PCB layout is key for better thermal
conduction from the PCB temperature to the sensor
die. For good temperature sensitivity, add a ground
layer under the device pins as shown in Figure 6-1.

and GND pins. A high-frequency

DD

6.2 Thermal Considerations

A potential for self-heating errors can exist if the
MCP98244 SDA, SCLK and Event lines are heavily
loaded with pull-ups (high current). Typically, the self­heating error is negligible because of the relatively
small current consumption of the MCP98244. A
temperature accuracy error of approximately 0.5°C
could result from self-heating if the communication pins
sink/source the maximum current specified.

For example, if the Event output is loaded to maximum

, Equation 6-1 can be used to determine the effect

I

OL

of self-heating.

EQUATION 6-1: EFFECT OF SELF-

HEATING

FIGURE 6-1: DFN Package Layout.

 2012-2013 Microchip Technology Inc. DS22327C-page 41

At room temperature (TA = +25°C) with maximum
I

= 500 µA and VDD = 3.6V, the self-heating due to

DD

power dissipation T

is 0.58°C for the TDFN-8 pack-



age.

MCP98244

NOTES:

DS22327C-page 42  2012-2013 Microchip Technology Inc.

7.0 PACKAGING INFORMATION

Legend: XX...X Customer-specific information

Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)

* This package is Pb-free. The Pb-free JEDEC designator ( )

can be found on the outer packaging for this package.

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available
characters for customer-specific information.

3

e

3

e

Example:

8-Lead 2x3 TDFN

ABR

244

25

Part Number Code

MCP98244T-BE/MNY ABR

7.1 Package Marking Information

MCP98244

 2012-2013 Microchip Technology Inc. DS22327C-page 43

MCP98244

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

DS22327C-page 44  2012-2013 Microchip Technology Inc.

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

MCP98244

 2012-2013 Microchip Technology Inc. DS22327C-page 45

MCP98244

 !""#$%&'

( !"#$%&"'""($)%

*++&&&!!+$

DS22327C-page 46  2012-2013 Microchip Technology Inc.

APPENDIX A: REVISION HISTORY

Revision C (May 2013)

The following is the list of modifications:

1. Updated the operating voltage range from

= 2.2V to 3.6V to VDD= 1.7V to 3.6V.

V

DD

2. Updated the verbiage throughout the document

relevant to the change in V

3. Updated Figure 2-1 and Figure 2-4.

4. Incremented the silicon revision ID from 0x00 to

0x01.

Revision B (December 2012)

The following is the list of modification:

• Updated the temperature range in the Serial

Interface Timing Specifications table.

Revision A (December 2012)

• Original Release of this Document.

DD

range.

MCP98244

 2012-2013 Microchip Technology Inc. DS22327C-page 47

MCP98244

NOTES:

DS22327C-page 48  2012-2013 Microchip Technology Inc.

PRODUCT IDENTIFICATION SYSTEM

Device: MCP98244T: Temperature Sensor (Tape and Reel)

Temperature Range: E = -40°C to +125°C (Extended)

Package: MNY = Plastic Dual Flat, No Lead, (2x3 TDFN),

8-lead (TDFN)

PART NO. /XX

Package

Temperature

Range

Device

Examples:

a) MCP98244T-BE/MNY: Tape and Reel,

Extended Temp.,
8LD 2x3 TDFN package

X

Grade

-X

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

MCP98244

 2012-2013 Microchip Technology Inc. DS22327C-page 49

MCP98244

NOTES:

DS22327C-page 50  2012-2013 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices:

YSTEM

CERTIFIED BY DNV

== ISO/TS 16949 ==

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
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devices in life support and/or safety applications is entirely at
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suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, K
PICSTART, PIC
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.

FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.

Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.

Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
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and Z-Scale are trademarks of Microchip Technology
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SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.

GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. KG, a subsidiary of
Microchip Technology Inc., in other countries.

All other trademarks mentioned herein are property of their
respective companies.

© 2012-2013, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.

Printed on recycled paper.

ISBN: 978-1-62077-220-1

EELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,

32

logo, rfPIC, SST, SST Logo, SuperFlash

QUALITY MANAGEMENT S

 2012-2013 Microchip Technology Inc. DS22327C-page 51

Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.

®

MCUs and dsPIC® DSCs, KEELOQ

®

code hopping

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DS22327C-page 52  2012-2013 Microchip Technology Inc.