Datasheet MCP6546, MCP6546R, MCP6546U, MCP6547, MCP6548 Datasheet

...
MCP6546/6R/6U/7/8/9
VIN+
V
IN
MCP6546
V
SS
V
DD
OUT
1
2 3 4
8 7 6 5
­+
NC
NC
NC
PDIP, SOIC, MSOP
4
1
2
3
-
+
5
SOT-23-5
V
DD
OUT
V
IN
+
V
SS
VIN–
MCP6546R MCP6547
V
INA
+
V
INA
V
SS
1
2 3 4
8 7 6 5
-
OUTA
+
-
+
V
DD
OUTB V
INB
V
INB
+
V
IN
+
V
IN
MCP6548
V
SS
V
DD
OUT
1 2 3 4
8 7 6 5
­+
NC
CS
NC
PDIP, SOIC, MSOP
PDIP, SOIC, MSOP
MCP6549
V
INA
+
V
INA
V
SS
1
2
3
4
14
13
12
11
-
OUTA
+-+
V
DD
OUTD
V
IND
V
IND
+
10
9
8
5
6
7
OUTB
V
INB
V
INB
+
V
INC
+
V
INC
OUTC
+
-
-
+
PDIP, SOIC, TSSOP
4
1
2
3
-
+
5
SOT-23-5, SC-70-5
V
SS
OUT
V
IN
+
V
DD
VIN–
MCP6546
4
1
2
3
5
SOT-23-5
V
SS
VIN+
VIN–
V
DD
OUT
MCP6546U
-
+
Open-Drain Output Sub-Microamp Comparators
Features
• Low Quiescent Current: 600 nA/comparator (typ.)
• Rail-to-Rail Input: V
• Open-Drain Output: V
- 0.3V to V
SS
OUT
10V
DD
• Propagation Delay: 4 µs (typ., 100 mV Overdrive)
• Wide Supply Voltage Range: 1.6V to 5.5V
• Single available in SOT-23-5, SC-70-5 * packages
• Available in Single, Dual and Quad
• Chip Select (CS
) with MCP6548
• Low Switching Current
• Internal Hysteresis: 3.3 mV (typ.)
• Temperature Range:
- Industrial: -40°C to +85°C
- Extended: -40°C to +125°C
Typical Applications
• Laptop Computers
• Mobile Phones
• Metering Systems
• Hand-held Electronics
• RC Timers
• Alarm and Monitoring Circuits
• Windowed Comparators
• Multi-vibrators
Description
The Microchip Technology Inc. MCP6546/6R/6U/7/8/9 family of comparators is offered in single (MCP6546, MCP6546R, MCP6546U), single with chip select (CS) (MCP6548), dual (MCP6547) and quad (MCP6549) configurations. The outputs are open-drain and are capable of driving heavy DC or capacitive loads.
These comparators are optimized for low power, single-supply application with greater than rail-to-rail input operation. The output limits supply current surges and dynamic power consumption while switching. The open-drain output of the MCP6546/6R/6U/7/8/9 family can be used as a level-shifter for up to 10V using a pull­up resistor. It can also be used as a wired-OR logic. The internal Input hysteresis eliminates output switch­ing due to internal noise voltage, reducing current draw. These comparators operate with a single-supply voltage as low as 1.6V and draw a quiescent current of less than 1 µA/comparator.
The related MCP6541/2/3/4 family of comparators from Microchip has a push-pull output that supports rail-to­rail output swing and interfaces with CMOS/TTL logic.
* SC-70-5 E-Temp parts not avaliable at this release
the data sheet
.
MCP6546U SOT-23-5 is E-Temp only.
of
Related Devices
• CMOS/TTL-Compatible Output: MCP6541/2/3/4
Package Types
© 2007 Microchip Technology Inc. DS21714F-page 1
MCP6546/6R/6U/7/8/9

1.0 ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings †
VDD - VSS.........................................................................7.0V
Open-Drain output............................................... V
Analog Input (V
All other inputs and outputs ........... V
+, VIN-)††............. VSS - 1.0V to VDD + 1.0V
IN
– 0.3V to VDD + 0.3V
SS
Difference Input voltage ...................................... |V
+ 10.5V
SS
DD
– VSS|
† Notice: Stresses above those listed under “Absolute Maxi­mum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
†† See Section 4.1.2 “Input Voltage and Current
Limits”
Output Short-Circuit Current .................................continuous
Current at Input Pins ....................................................±2 mA
Current at Output and Supply Pins ............................±30 mA
Storage temperature .....................................-65°C to +150°C
Maximum Junction Temperature (T
) .......................... +150°C
J
ESD protection on all pins:
(HBM;MM) .....................................2 kV;200V (MCP6546U)
(HBM;MM) ................................ 4 kV; 200V (all other parts)
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VDD = +1.6V to +5.5V, VSS = GND, TA = 25°C, VIN+ = VDD/2, VIN– = VSS,
R
=2.74kΩ to VPU = VDD (Refer to Figure 1-3).
PU
Parameters Sym Min Typ Max Units Conditions
Power Supply
Supply Voltage V
Quiescent Current (per comparator)
DD
I
Q
Input
Input Voltage Range V
CMRVSS
Common Mode Rejection Ratio CMRR 55 70 dB V
Common Mode Rejection Ratio CMRR 50 65 dB V
Common Mode Rejection Ratio CMRR 55 70 dB V
Power Supply Rejection Ratio PSRR 63 80 dB V
Input Offset Voltage V
Drift with Temperature ΔV
Input Hysteresis Voltage V
Linear Temp. Co. TC
Quadratic Temp. Co. TC
Input Bias Current I
At Temperature (I-Temp parts) I
At Temperature (E-Temp parts) I
Input Offset Current I
Common Mode Input Impedance Z
Differential Input Impedance Z
OS
OS
HYST
B
B
B
OS
CM
DIFF
/ΔT
1
2
Note 1: The input offset voltage is the center of the input-referred trip points. The input hysteresis is the difference between the
input-referred trip points.
2: V
at differential temperatures is estimated using: V
HYST
3: Input bias current at temperature is not tested for the SC-70-5 package 4: Do not short the output above V
V
test limit was VDD before Dec. 2004 (week code 52).
PU
1.6 5.5 V VPU V
0.3 0.6 1 µA I
0.3 V
+ 0.3 V
DD
-7.0 ±1.5 +7.0 mV VCM = V
±3 µV/°C TA = -40°C to +125°C, VCM = V
A
1.5 3.3 6.5 mV VCM = V
—6.7 —µV/°CT
-0.035 µV/°C2TA = -40°C to +125°C, VCM = V
—1 —pAV
25 100 pA TA = +85°C, VCM = V
1200 5000 pA TA = +125°C, VCM = V — ±1 pA V
DD
= 0
OUT
= 5V, VCM = -0.3V to 5.3V
DD
= 5V, VCM = 2.5V to 5.3V
DD
= 5V, VCM = -0.3V to 2.5V
DD
= V
CM
SS
(Note 1)
SS
SS
(Note 1)
SS
= -40°C to +125°C, VCM = VSS (Note 2)
A
(Note 2)
SS
CM = VSS
(Note 3)
SS
(Note 3)
SS
CM = VSS
—1013||4 Ω||pF
—1013||2 Ω||pF
(TA) = V
HYST
+ 10V. Limit the output current to Absolute Maximum Rating of 30 mA. The minimum
SS
+ (TA -25°C) TC1 + (TA - 25°C)2TC2.
HYST
DS21714F-page 2 © 2007 Microchip Technology Inc.
MCP6546/6R/6U/7/8/9
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, VDD = +1.6V to +5.5V, VSS = GND, TA = 25°C, VIN+ = VDD/2, VIN– = VSS,
R
=2.74kΩ to VPU = VDD (Refer to Figure 1-3).
PU
Parameters Sym Min Typ Max Units Conditions
Open-Drain Output
Output Pull-Up Voltage V
High-Level Output Current I
Low-Level Output Voltage V
Short-Circuit Current I
Output Pin Capacitance C
PU
OH
OL
SC
I
SC
OUT
Note 1: The input offset voltage is the center of the input-referred trip points. The input hysteresis is the difference between the
input-referred trip points.
2: V
at differential temperatures is estimated using: V
HYST
3: Input bias current at temperature is not tested for the SC-70-5 package 4: Do not short the output above V
V
test limit was VDD before Dec. 2004 (week code 52).
PU
AC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, V
Step = 200 mV, Overdrive = 100 mV, R
Parameters Sym Min Typ Max Units Conditions
Fall Time t
Propagation Delay (High-to-Low) t
Propagation Delay (Low-to-High) t
Propagation Delay Skew t
Maximum Toggle Frequency f
Input Noise Voltage E
Note 1: t
and t
R
depend on the load (RL and CL); these specifications are valid for the indicated load only.
PLH
2: Propagation Delay Skew is defined as: t
=2.74kΩ to VPU = VDD, and CL = 36 pF (Refer to Figure 1-2 and Figure 1-3).
PU
F
PHL
PLH
PDS
MAX
f
MAX
ni
1.6 10 V (Note 4)
-100 nA VDD = 1.6V to 5.5V, VPU = 10V (Note 4)
V
SS
—V
SS
+ 0.2 V I
= 2 mA, VPU = VDD = 5V
OUT
—±1.5 — mAVPU = VDD = 1.6V (Note 4)
–30—mAV
= VDD = 5.5V (Note 4)
PU
—8 —pF
(TA) = V
HYST
+ 10V. Limit the output current to Absolute Maximum Rating of 30 mA. The minimum
SS
= +1.6V to +5.5V, VSS = GND, TA = 25°C, VIN+ = VDD/2,
DD
+ (TA -25°C) TC1 + (TA - 25°C)2TC2.
HYST
—0.7—µs(Note 1)
—4.08.s
—3.08.s(Note 1)
—-1.0— µs(Notes 1 and 2)
225 kHz VDD = 1.6V
165 kHz VDD = 5.5V
200 µV
= t
- t
PDS
PLH
PHL
.
10 Hz to 100 kHz
P-P
© 2007 Microchip Technology Inc. DS21714F-page 3
MCP6546/6R/6U/7/8/9
V
IL
High-Z
t
ON
V
IH
CS
t
OFF
V
OUT
-20 pA (typ.)
High-Z
I
SS
I
CS
-20 pA (typ.)-0.6 µA (typ.)
1 pA (typ.) 1 pA (typ.)5 pA (typ.)
V
OL
t
PLH
V
OUT
VIN–
100 mV
100 mV
t
PHL
V
OL
VIN+ = VDD/2
V
OH
MCP6548 CHIP SELECT (CS) CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VDD = +1.6V to +5.5V, VSS = GND, TA = 25°C, VIN+ = VDD/2, VIN– = VSS,
R
=2.74kΩ to VPU = VDD, and CL = 36 pF (Refer to Figures 1-1 and 1-3).
PU
Parameters Sym Min Typ Max Units Conditions
CS Low Specifications
CS
Logic Threshold, Low V
CS Input Current, Low I
CS High Specifications
CS
Logic Threshold, High V
CS Input Current, High I
CS Input High, VDD Current I
CS Input High, GND Current I
Comparator Output Leakage I
CS
Dynamic Specifications
CS
Low to Comparator Output Low
O(LEAK)
Turn-on Time
CS High to Comparator Output High Z Turn-off Time
CS Hysteresis V
CS_HYST
CSL
CSH
DD
SS
t
ON
t
OFF
IL
IH
V
SS
—5—pACS = V
0.8 V
—1—pACS = V
—18—pACS = V
—-20—pACS = V
—1—pAV
0.2 V
—VDDV
DD
DD
V
SS
DD
DD
DD
= VSS+10V, CS = V
OUT
—250msCS = 0.2VDD to V
V
– = V
IN
DD
—10—µsCS = 0.8VDD to V
V
– = V
IN
DD
—0.6— VVDD = 5V
OUT
OUT
DD
= VDD/2,
= VDD/2,
FIGURE 1-1: Timing Diagram for the CS pin on the MCP6548.
DS21714F-page 4 © 2007 Microchip Technology Inc.
FIGURE 1-2: Propagation Delay Timing Diagram.
MCP6546/6R/6U/7/8/9
V
DD
VSS = 0V
200 kΩ
200 kΩ
100 kΩ
V
OUT
VIN = V
SS
36 pF
MCP654X
R
PU
=
VPU = V
DD
(2 mA)/ V
DD
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VDD = +1.6V to +5.5V and VSS = GND.
Parameters Sym Min Typ Max Units Conditions
Temperature Ranges
Specified Temperature Range T
Operating Temperature Range T
Storage Temperature Range T
A
A
A
Thermal Package Resistances
Thermal Resistance, 5L-SC-70 θ Thermal Resistance, 5L-SOT-23 θ Thermal Resistance, 8L-PDIP θ Thermal Resistance, 8L-SOIC θ Thermal Resistance, 8L-MSOP θ Thermal Resistance, 14L-PDIP θ Thermal Resistance, 14L-SOIC θ Thermal Resistance, 14L-TSSOP θ
JA
JA
JA
JA
JA
JA
JA
JA
Note: The MCP6546/6R/6U/7/8/9 I-temp family operates over this extended temperature range, but with reduced
performance. In any case, the Junction Temperature (T specification of +150°C.
-40 +85 °C
-40 +125 °C Note
-65 +150 °C
331 °C/W
256 °C/W
—85—°C/W
163 °C/W
206 °C/W
—70—°C/W
120 °C/W
100 °C/W
) must not exceed the absolute maximum
J
1.1 Test Circuit Configuration
This test circuit configuration is used to determine the AC and DC specifications.
FIGURE 1-3: AC and DC Test Circuit for the Open-Drain Output Comparators.
© 2007 Microchip Technology Inc. DS21714F-page 5
MCP6546/6R/6U/7/8/9
0%
2%
4%
6%
8%
10%
12%
14%
-7-6-5-4-3-2-101234567
Input Offset Voltage (mV)
Percentage of Occurrences
1200 Samples V
CM
= V
SS
0%
2%
4%
6%
8%
10%
12%
14%
16%
-14
-12
-10
-8-6-4
-2
02468
101214
Input Offset Voltage Drift (µV/°C)
Percentage of Occurrences
1200 Samples V
CM
= V
SS
TA = -40°C to +125°C
-1
0
1
2
3
4
5
6
7
012345678910
Time (1 ms/div)
Inverting Input, Output
Voltage (V)
V
OUT
VIN–
VDD = 5.5V
0%
2%
4%
6%
8%
10%
12%
14%
16%
18%
1.62.02.42.83.23.64.04.44.85.25.66.0
Input Hysteresis Voltage (mV)
Percentage of Occurrences
1200 Samples V
CM
= V
SS
0%
5%
10%
15%
20%
25%
4.6
5.0
5.4
5.8
6.2
6.6
7.0
7.4
7.8
8.2
8.6
9.0
9.4
Input Hysteresis Voltage –
Linear Temp. Co.; TC
1
(µV/°C)
Percentage of Occurrences
596 Samples
V
CM
= V
SS
TA = -40°C to +125°C
VDD = 1.6VVDD = 5.5V
0%
2%
4%
6%
8%
10%
12%
14%
16%
18%
20%
-0.060
-0.056
-0.052
-0.048
-0.044
-0.040
-0.036
-0.032
-0.028
-0.024
-0.020
-0.016
Input Hysteresis Voltage –
Quadratic Temp. Co.; TC
2
(µV/°C2)
Percentage of Occurrences
596 Samples V
CM
= V
SS
TA = -40°C to +125°C
VDD = 5.5V
VDD = 1.6V

2.0 TYPICAL PERFORMANCE CURVES

Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, VDD = +1.6V to +5.5V, VSS = GND, TA = +25°C, VIN+ = VDD/2, VIN– = GND, R
= 2.74 kΩ to VPU=VDD, and CL = 36 pF.
PU
FIGURE 2-1: Input Offset Voltage at V
CM=VSS
.
FIGURE 2-2: Input Offset Voltage Drift at V
CM=VSS
.
FIGURE 2-4: Input Hysteresis Voltage at V
CM=VSS
.
FIGURE 2-5: Input Hysteresis Voltage Linear Temp. Co. (TC
) at VCM=VSS.
1
FIGURE 2-3: The MCP6546/6R/6U/7/8/9 comparators show no phase reversal.
DS21714F-page 6 © 2007 Microchip Technology Inc.
FIGURE 2-6: Input Hysteresis Voltage Quadratic Temp. Co. (TC
) at VCM=VSS.
2
MCP6546/6R/6U/7/8/9
-1.0
-0.8
-0.6
-0.4
-0.2
0.0
0.2
0.4
0.6
0.8
1.0
-50 -25 0 25 50 75 100 125
Ambient Temperature (°C)
Input Offset Voltage (mV)
VDD = 1.6V
VDD = 5.5V
VCM = V
SS
-2.0
-1.5
-1.0
-0.5
0.0
0.5
1.0
1.5
2.0
-0.4
-0.2
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Common Mode Input Voltage (V)
Input Offset Voltage (mV)
VDD = 1.6V
TA = +125°C T
A
= +85°C
T
A
= +25°C
T
A
= -40°C
TA = +125°C
-2.0
-1.5
-1.0
-0.5
0.0
0.5
1.0
1.5
2.0
-0.5
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Common Mode Input Voltage (V)
Input Offset Voltage (mV)
VDD = 5.5V
TA = +85°C
T
A
= +125°C
T
A
T
A
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
-50-250 255075100125 Ambient Temperature (°C)
Input Hysteresis Voltage (mV)
VDD = 1.6V
VDD = 5.5V
VCM = V
SS
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
-0.4
-0.2
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Common Mode Input Voltage (V)
Input Hysteresis Voltage (mV)
TA = +25°C T
A
= -40°C
TA = +125°C T
A
= +85°C
VDD = 1.6V
TA = +125°C
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
-0.5
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
Common Mode Input Voltage (V)
Input Hysteresis Voltage (mV)
VDD = 5.5V TA = +125°C
T
A
= +85°C
T
A
= +25°C
T
A
= -40°C
Note: Unless otherwise indicated, VDD= +1.6V to +5.5V, VSS= GND, TA= +25°C, VIN+=VDD/2, VIN– = GND,
RPU=2.74kΩ to VPU=VDD, and CL=36pF.
FIGURE 2-7: Input Offset Voltage vs. Ambient Temperature at V
CM=VSS
.
FIGURE 2-8: Input Offset Voltage vs. Common Mode Input Voltage at V
DD
= -40°C
= +25°C
=1.6V.
FIGURE 2-10: Input Hysteresis Voltage vs. Ambient Temperature at V
CM=VSS
.
FIGURE 2-11: Input Hysteresis Voltage vs. Common Mode Input Voltage at V
DD
=1.6V.
FIGURE 2-9: Input Offset Voltage vs. Common Mode Input Voltage at V
© 2007 Microchip Technology Inc. DS21714F-page 7
FIGURE 2-12: Input Hysteresis Voltage vs.
= 5.5V.
DD
Common Mode Input Voltage at V
DD
=5.5V.
MCP6546/6R/6U/7/8/9
55
60
65
70
75
80
85
90
-50 -25 0 25 50 75 100 125 Ambient Temperature (°C)
CMRR, PSRR (dB)
Input Referred
PSRR, VIN+ = VSS, VDD = 1.6V to 5.5V
CMRR, VIN+ = -0.3 to 5.3V, VDD = 5.0V
0.1
1
10
100
1000
55 65 75 85 95 105 115 125
Ambient Temperature (°C)
Input Bias, Offset Currents
(pA)
I
B
| IOS |
VDD = 5.5V V
CM
= V
DD
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
Common Mode Input Voltage (V)
Quiescent Current
per Comparator (µA)
VDD = 1.6V
Sweep VIN+, VIN– = VDD/2
Sweep VIN–, VIN+ = VDD/2
IQ does not include pull-up resistor current
0.1
1
10
100
1000
10000
0.00.51.01.52.02.53.03.54.04.55.05.5
Common Mode Input Voltage (V)
Input Bias, Offset Currents
(A)
VDD = 5.5V
100f
100p
1p
10p
1n
10n
IB, TA = +125°C
IB, TA = +85°C
IOS, TA = +125°C
IOS, TA = +85°C
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.00.51.01.52.02.53.03.54.04.55.05.5
Power Supply Voltage (V)
Quiescent Current
per Comparator (µA)
TA = +125°C
T
A
= +85°C
T
A
= +25°C
T
A
= -40°C
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Common Mode Input Voltage (V)
Quiescent Current
per Comparator (µA)
VDD = 5.5V
Sweep VIN+, VIN– = VDD/2
Sweep VIN–, VIN+ = VDD/2
IQ does not include pull-up resistor current
Note: Unless otherwise indicated, VDD= +1.6V to +5.5V, VSS= GND, TA= +25°C, VIN+=VDD/2, VIN– = GND,
RPU=2.74kΩ to VPU=VDD, and CL=36pF.
FIGURE 2-13: CMRR,PSRR vs. Ambient Temperature.
FIGURE 2-14: Input Bias Current, Input Offset Current vs. Ambient Temperature.
FIGURE 2-16: Input Bias Current, Input Offset Current vs. Common Mode Input Voltage.
FIGURE 2-17: Quiescent Current vs. Power Supply Voltage.
FIGURE 2-15: Quiescent Current vs. Common Mode Input Voltage at V
DS21714F-page 8 © 2007 Microchip Technology Inc.
DD
=1.6V.
FIGURE 2-18: Quiescent Current vs. Common Mode Input Voltage at VDD=5.5V.
MCP6546/6R/6U/7/8/9
0.1
1
10
01234567891011
Pull-Up Voltage, V
PU
(V)
Supply Current
per Comparator (µA)
VDD = 2.1V V
DD
= 2.6V
V
DD
= 3.6V
V
DD
= 4.6V
V
DD
= 5.6V
IDD spike near VPU = 1.3V
VDD = 1.6V
0.1
1
10
0.1 1 10 100 Toggle Frequency (kHz)
Supply Current
per Comparator (µA)
VDD = 5.5V V
DD
= 1.6V
100 mV Overdrive V
CM
= VDD/2
I
DD
does not include
pull-up resistor current
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 Output Current (mA)
Output Voltage Headroom (V)
VDD = 1.6V
VOL–VSS: T
A
= +125°C
T
A
= +85°C
T
A
= +25°C
T
A
= -40°C
0.1
1
10
-4-3-2-10123456789
Pull-up to Supply Voltage Difference,
V
PU
– VDD (V)
Supply Current
per Comparator (µA)
VDD = 5.6V V
DD
= 4.6V
V
DD
= 3.6V
V
DD
= 2.6V
VPU = 1.6V to 10.5V
VDD = 1.6V V
DD
= 2.1V
0
5
10
15
20
25
30
35
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Power Supply Voltage (V)
Output Short Circuit Current
Magnitude (mA)
TA = -40°C
T
A
= +25°C
T
A
= +85°C
T
A
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0 5 10 15 20 25
Output Current (mA)
Output Voltage Headroom (V)
VDD = 5.5V
TA = +125°C T
A
= +85°C
T
A
= +25°C
T
A
= -40°C
VOL – VSS:
Note: Unless otherwise indicated, VDD= +1.6V to +5.5V, VSS= GND, TA= +25°C, VIN+=VDD/2, VIN– = GND,
RPU=2.74kΩ to VPU=VDD, and CL=36pF.
FIGURE 2-19: Supply Current vs. Pull-Up Voltage.
FIGURE 2-20: Supply Current vs. Toggle Frequency.
FIGURE 2-22: Supply Current vs. Pull-Up to Supply Voltage Difference.
= +125°C
FIGURE 2-23: Output Short Circuit Current Magnitude vs. Power Supply Voltage.
FIGURE 2-21: Output Voltage Headroom vs. Output Current at V
© 2007 Microchip Technology Inc. DS21714F-page 9
DD
=1.6V.
FIGURE 2-24: Output Voltage Headroom vs. Output Current at VDD=5.5V.
MCP6546/6R/6U/7/8/9
0%
5%
10%
15%
20%
25%
30%
35%
40%
45%
50%
012345678
High-to-Low Propagation Delay (µs)
Percentage of Occurrences
408 Samples 100 mV Overdrive V
CM
= VDD/2
VDD = 5.5VVDD = 1.6V
0%
5%
10%
15%
20%
25%
30%
35%
40%
45%
50%
-2.0
-1.6
-1.2
-0.8
-0.4
0.0
0.4
0.8
1.2
1.6
2.0
Propagation Delay Skew (µs)
Percentage of Occurrences
VCM = VDD/2
VDD = 1.6V
VDD = 5.5V
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
1.52.02.53.03.54.04.55.05.5
Power Supply Voltage (V)
Propagation Delay (µs)
VCM = VDD/2
t
PHL
10 mV Overdrive
100 mV Overdrive
t
PLH
0%
5%
10%
15%
20%
25%
30%
35%
40%
45%
50%
55%
60%
65%
012345678
Low-to-High Propagation Delay (µs)
Percentage of Occurrences
408 Samples 100 mV Overdrive V
CM
= VDD/2
VDD = 5.5V
VDD = 1.6V
0
1
2
3
4
5
6
7
8
-50 -25 0 25 50 75 100 125
Ambient Temperature (°C)
Propagation Delay (µs)
100 mV Overdrive V
CM
= VDD/2
t
PHL
t
PLH
VDD = 5.5V
VDD = 1.6V
1
10
100
1 10 100 1000
Input Overdrive (mV)
Propagation Delay (µs)
VCM = VDD/2
t
PLH
VDD = 5.5V
t
PHL
VDD = 1.6V
Note: Unless otherwise indicated, VDD= +1.6V to +5.5V, VSS= GND, TA= +25°C, VIN+=VDD/2, VIN– = GND,
RPU=2.74kΩ to VPU=VDD, and CL=36pF.
FIGURE 2-25: High-to-Low Propagation Delay.
408 Samples
100 mV Overdrive
FIGURE 2-26: Propagation Delay Skew.
FIGURE 2-28: Low-to-High Propagation
Delay.
FIGURE 2-29: Propagation Delay vs. Ambient Temperature.
FIGURE 2-27: Propagation Delay vs. Power Supply Voltage.
DS21714F-page 10 © 2007 Microchip Technology Inc.
FIGURE 2-30: Propagation Delay vs. Input Overdrive.
MCP6546/6R/6U/7/8/9
0
1
2
3
4
5
6
7
8
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
Common Mode Input Voltage (V)
Propagation Delay (µs)
VDD = 1.6V 100 mV Overdrive
t
PLH
t
PHL
0
1
2
3
4
5
6
7
8
01234567891011
Pull-up Voltage (V)
Propagation Delay (µs)
VCM = VDD/2 V
IN
+ = V
CM
t
PHL
VIN– = 100 mV Overdrive
VDD = 5.5V
VDD = 1.6V t
PLH
0
1
2
3
4
5
6
7
8
0.00.51.01.52.02.53.03.54.04.55.05.5
Common Mode Input Voltage (V)
Propagation Delay (µs)
VDD = 5.5V 100 mV Overdrive
t
PHL
t
PLH
0
20
40
60
80
100
120
140
160
180
200
0 102030405060708090
Load Capacitance (nF)
Propagation Delay (µs)
100 mV Overdrive V
CM
= VDD/2
t
PLH
t
PHL
VDD = 1.6V
VDD = 5.5V
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
01234567891011
Output Voltage (V)
Output Leakage Current (A)
TA = +85°C
CS = V
DD
VIN+ = VDD/2 V
IN
– = V
SS
TA = +125°C
TA = +25°C
10n
1n
100p
10p
1p
100f
Note: Unless otherwise indicated, VDD= +1.6V to +5.5V, VSS= GND, TA= +25°C, VIN+=VDD/2, VIN– = GND,
RPU=2.74kΩ to VPU=VDD, and CL=36pF.
FIGURE 2-31: Propagation Delay vs. Common Mode Input Voltage at V
8
VIN– = 100 mV Overdrive
7
VCM = VDD/2
6
+ = V
V
IN
5
4
3
2
Propagation Delay (µs)
1
0
0 102030405060708090100
CM
Pull-up Resistor, R
VDD = 5.5V
VDD = 1.6V
PU
(k:)
DD
=1.6V.
t
PLH
t
PHL
FIGURE 2-32: Propagation Delay vs. Pull-up Resistor.
FIGURE 2-34: Propagation Delay vs. Common Mode Input Voltage at VDD=5.5V.
FIGURE 2-35: Propagation Delay vs. Load Capacitance.
FIGURE 2-33: Propagation Delay vs. Pull-up Voltage.
© 2007 Microchip Technology Inc. DS21714F-page 11
FIGURE 2-36: Output Leakage Current
=VDD) vs. Output Voltage (MCP6548 only).
(CS
MCP6546/6R/6U/7/8/9
1.E-11
1.E-10
1.E-09
1.E-08
1.E-07
1.E-06
1.E-05
1.E-04
1.E-03
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
Chip Select (CS) Voltage (V)
Supply Current
per Comparator (A)
r
f
Comparator Turns On
VDD = 1.6V
CS Hysteresis
CS
CS Low-to-High
1m
10µ
100n
1n
10n
100p
10p
100µ
0
5
10
15
20
25
30
01234567891011121314
Time (1 ms/div)
Supply Current (µA)
-8.1
-6.5
-4.9
-3.2
-1.6
0.0
1.6
Output Voltage,
Chip Select Voltage (V),
Start-up I
DD
Charging output
capacitance
VDD = 1.6V
V
OUT
CS
-0.5
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
012345678910
Time (ms)
Chip Select, Output Voltage
(V)
V
OUT
VDD = 5.5V
CS
1.E-11
1.E-10
1.E-09
1.E-08
1.E-07
1.E-06
1.E-05
1.E-04
1.E-03
0.00.51.01.52.02.53.03.54.04.55.05.5
Chip Select (CS) Voltage (V)
Supply Current
per Comparator (A)
r
f
Comparator Turns On
VDD = 5.5V
1m
10µ
100n
1n
10n
100p
10p
CS
Low-to-High
CS
Hysteresis
100µ
0
20
40
60
80
100
120
140
160
180
200
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 Time (0.5 ms/div)
Supply Current
per Comparator (µA)
-24
-21
-18
-15
-12
-9
-6
-3
0
3
6
Output Voltage,
Chip Select Voltage (V)
Start-up I
DD
Charging output
capacitance
VDD = 5.5V
V
OUT
CS
1.E-12
1.E-11
1.E-10
1.E-09
1.E-08
1.E-07
1.E-06
1.E-05
1.E-04
1.E-03
1.E-02
-1.0 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 0.0
Input Voltage (V)
Input Current Magnitude (A)
+125°C
+85°C +25°C
-40°C
10m
1m
100µ
10µ
100n
10n
1n
100p
10p
1p
Note: Unless otherwise indicated, VDD= +1.6V to +5.5V, VSS= GND, TA= +25°C, VIN+=VDD/2, VIN– = GND,
RPU=2.74kΩ to VPU=VDD, and CL=36pF.
Comparato
Shuts Of
High-to-Low
FIGURE 2-37: Supply Current (shoot through current) vs. Chip Select (CS V
= 1.6V (MCP6548 only).
DD
) Voltage at
Comparato
Shuts Of
High-to-Low
CS
FIGURE 2-40: Supply Current (shoot through current) vs. Chip Select (CS V
= 5.5V (MCP6548 only).
DD
) Voltage at
FIGURE 2-38: Supply Current (charging current) vs. Chip Select (CS (MCP6548 only).
FIGURE 2-39: Chip Select (CS Response (MCP6548 only).
DS21714F-page 12 © 2007 Microchip Technology Inc.
) pulse at VDD=1.6V
) Step
FIGURE 2-41: Supply Current (charging current) vs. Chip Select (CS
) pulse at VDD=5.5V
(MCP6548 only).
FIGURE 2-42: Input Bias Current vs. Input Voltage.
MCP6546/6R/6U/7/8/9

3.0 PIN DESCRIPTIONS

Descriptions of the pins are listed in Table 3-1.
TABLE 3-1: PIN FUNCTION TABLE
MCP6546
PDIP,
SOIC,
MSOP
————5—5V
————6—6V
7 7 OUTB Digital Output (comparator B)
8 OUTC Digital Output (comparator C)
——————9V
—————10V
—————12V
—————13V
14 OUTD Digital Output (comparator D)
—————8—CS
1, 5, 8 1, 5 NC No Internal Connection
MCP6546
SOT-23-5,
SC-70-5
MCP6546R
MCP6546U
MCP6547
MCP6548
Symbol Description
MCP6549
6 1 1 4 1 6 1 OUT, OUTA Digital Output (comparator A)
2443222V
3331333V
IN
IN
–, V
– Inverting Input (comparator A)
INA
+, V
+ Non-inverting Input (comparator A)
INA
7525874VDDPositive Power Supply
+ Non-inverting Input (comparator B)
INB
Inverting Input (comparator B)
INB
Inverting Input (comparator C)
INC
+ Non-inverting Input (comparator C)
INC
42524411V
SS
IND
IND
Negative Power Supply
+ Non-inverting Input (comparator D)
Inverting Input (comparator D)
Chip Select
3.1 Analog Inputs
The comparator non-inverting and inverting inputs are high-impedance CMOS inputs with low bias currents.
3.2 CS Digital Input
This is a CMOS, Schmitt-triggered input that places the part into a low power mode of operation.
3.3 Digital Outputs
The comparator outputs are CMOS, open-drain digital outputs. They are designed to make level shifting and wired-OR easy to implement.
3.4 Power Supply (VSS and VDD)
The positive power supply pin (VDD) is 1.6V to 5.5V higher than the negative power supply pin (V normal operation, the other pins are at voltages between VSS and VDD, except the output pins which can be as high as 10V above V
SS
.
Typically, these parts are used in a single (positive) supply configuration. In this case, V
is connected to
SS
ground and VDD is connected to the supply. VDD will need a local bypass capacitor (typically 0.01 µF to
0.1 µF) within 2 mm of the V
pin. These can share a
DD
bulk capacitor with nearby analog parts (within 100 mm), but it is not required.
SS
). For
© 2007 Microchip Technology Inc. DS21714F-page 13
MCP6546/6R/6U/7/8/9
Bond
Pad
Bond
Pad
Bond
Pad
V
DD
VIN+
V
SS
Input
Stage
Bond
Pad
VIN–
V
1
MCP6G0X
R
1
V
DD
D
1
R
1
VSS– (minimum expected V1)
2mA
V
OUT
V
2
R
2
R
3
D
2
+
R
2
VSS– (minimum expected V2)
2mA

4.0 APPLICATIONS INFORMATION

The MCP6546/6R/6U/7/8/9 family of push-pull output comparators are fabricated on Microchip’s state-of-the­art CMOS process. They are suitable for a wide range of applications requiring very low power consumption.
4.1 Comparator Inputs
4.1.1 PHASE REVERSAL
The MCP6546/6R/6U/7/8/9 comparator family uses CMOS transistors at the input. They are designed to prevent phase inversion when the input pins exceed the supply voltages. Figure 2-3 shows an input voltage exceeding both supplies with no resulting phase inversion.
4.1.2 INPUT VOLTAGE AND CURRENT LIMITS
The ESD protection on the inputs can be depicted as shown in Figure 4-1. This structure was chosen to pro­tect the input transistors, and to minimize input bias current (IB). The input ESD diodes clamp the inputs when they try to go more than one diode drop below
. They also clamp any voltages that go too far
V
SS
above V allow normal operation, and low enough to bypass ESD events within the specified limits.
; their breakdown voltage is high enough to
DD
FIGURE 4-2: Protecting the Analog Inputs.
It is also possible to connect the diodes to the left of the resistors R the diodes D1 and D2 need to be limited by some other mechanism. The resistor then serves as in-rush current limiter; the DC current into the input pins (V VIN–) should be very small.
A significant amount of current can flow out of the inputs when the common mode voltage (V ground (V high impedance may need to limit the useable voltage range.
and R2. In this case, the currents through
1
+ and
IN
) is below
); see Figure 2-42. Applications that are
SS
CM
4.1.3 NORMAL OPERATION
The input stage of this family of devices uses two differential input stages in parallel: one operates at low input voltages and the other at high input voltages. With this topology, the input voltage is 0.3V above V and 0.3V below VSS. The input offset voltage is measured at both V
- 0.3V and V
SS
proper operation.
The MCP6546/6R/6U/7/8/9 family has internally-set
FIGURE 4-1: Simplified Analog Input ESD Structures.
In order to prevent damage and/or improper operation of these amplifiers, the circuits they are in must limit the currents (and voltages) at the V
+ and VIN– pins (see
IN
hysteresis that is small enough to maintain input offset accuracy (<7 mV), and large enough to eliminate output chattering caused by the comparator’s own input noise voltage (200 µV
P-P
this capability.
Absolute Maximum Ratings † at the beginning of Section 1.0 “Electrical Characteristics”). Figure 4-3 shows the recommended approach to protecting these inputs. The internal ESD diodes prevent the input pins
+ and VIN–) from going too far below ground, and
(V
IN
the resistors R1 and R2 limit the possible current drawn out of the input pin. Diodes D1 and D2 prevent the input pin (V
IN
When implemented as shown, resistors R limit the current through D1 and D2.
DS21714F-page 14 © 2007 Microchip Technology Inc.
and R2 also
1
+ and VIN–) from going too far above VDD.
+ 0.3V to ensure
DD
). Figure 4-3 illustrates
DD
FIGURE 4-3: The MCP6546/6R/6U/7/8/9
-3
-2
-1
0
1
2
3
4
5
6
7
8
Time (100 ms/div)
Output Voltage (V)
-30
-25
-20
-15
-10
-5
0
5
10
15
20
25
Input Voltage (10 mV/div)
V
OUT
VIN–
VDD = 5.0V
Hysteresis
V
IN
V
OUT
MCP654X
V
DD
R
2
R
F
R
3
V
PU
R
PU
V
DD
I
OL
I
RF
I
PU
V
OUT
High-to-LowLow-to-High
V
OH
V
OL
V
SS
V
SS
V
DD
V
TLHVTHL
V
IN
V
PU
V
TLH
= trip voltage from low to high
V
THL
= trip voltage from high to low
V
23
V
OUT
MCP654X
V
PU
R
23
R
F
+
-
R
PU
comparators’ internal hysteresis eliminates output chatter caused by input noise voltage.
4.2 Open-Drain Output
MCP6546/6R/6U/7/8/9
4.4.1 INVERTING CIRCUIT
Figure 4-4 shows an inverting circuit for a single-supply
application using three resistors, besides the pull-up resistor. The resulting hysteresis diagram is shown in
Figure 4-5.
The open-drain output is designed to make level­shifting and wired-OR logic easy to implement. The output can go as high as 10V for 9V battery-powered applications. The output stage minimizes switching cur­rent (shoot-through current from supply-to-supply) when the output changes state. See Figures 2-15, 2-18 and 2-37 through 2-41, for more information.
4.3 MCP6548 Chip Select (CS)
The MCP6548 is a single comparator with a Chip Select (CS current consumption drops to 20 pA (typ.). 1 pA (typ.) flows through the CS pin, 1 pA (typ.) flows through the output pin and 18 pA (typ.) flows through the V as shown in Figure 1-1. When this happens, the comparator output is put into a high-impedance state. By pulling CS pin is left floating, the comparator will not operate properly. Figure 1-1 shows the output voltage and supply current response to a CS
The internal CS glitches when cycling the CS power, which is especially important in battery-powered applications.
) pin. When CS is pulled high, the total
pin,
DD
low, the comparator is enabled. If the CS
pulse.
circuitry is designed to minimize
pin. This helps conserve
FIGURE 4-4: Inverting Circuit with Hysteresis.
FIGURE 4-5: Hysteresis diagram for the inverting circuit.
In order to determine the trip voltages (V for the circuit shown in Figure 4-4, R2 and R3 can be simplified to the Thevenin equivalent circuit with respect to V
, as shown in Figure 4-6.
DD
THL
and V
TLH
)
4.4 Externally Set Hysteresis
Greater flexibility in selecting hysteresis, or input trip points, is achieved by using external resistors.
Input offset voltage (V (input-referred) low-high and high-low trip points. Input hysteresis voltage (V the same trip points. Hysteresis reduces output chattering when one input is slowly moving past the other, thus reducing dynamic supply current. It also helps in systems where it is best not to cycle between states too frequently (e.g., air conditioner thermostatic control).
© 2007 Microchip Technology Inc. DS21714F-page 15
) is the center (average) of the
OS
) is the difference between
HYST
FIGURE 4-6: Thevenin Equivalent Circuit.
MCP6546/6R/6U/7/8/9
R
23
R2R
3
R2R3+
------------------
=
V
23
R
3
R2R3+
------------------
VDD×=
V
THL
V
PU
R
23
R23RFR
PU
++
----------------------------------------
⎝⎠
⎜⎟
⎛⎞
V
23
RFRPU+
R
23RFRPU
++
---------------------------------------
⎝⎠
⎛⎞
+=
V
TLH
V
OL
R
23
R23RF+
---------------------- -
⎝⎠
⎜⎟
⎛⎞
V
23
R
F
R23RF+
--------------------- -
⎝⎠
⎛⎞
+=
V
TLH
= trip voltage from low to high
V
THL
= trip voltage from high to low
I
OLIPUIRF
+=
I
OL
VPUVOL–
R
PU
--------------------------
⎝⎠
⎛⎞
V
23VOL
R
23RF
+
------------------------
⎝⎠
⎛⎞
+=
V
OH
VPUV23–()
R
23RF
+
R
23RFRPU
++
--------------------------------------
⎝⎠
⎛⎞
×=
Guard Ring
V
SS
VIN-V
IN
+
EQUATION 4-1:
Using this simplified circuit, the trip voltage can be calculated using the following equation:
EQUATION 4-2:
Figure 2-21 and Figure 2-24 can be used to determine
typical values for V
. This voltage is dependent on the
OL
output current IOL as shown in Figure 4-4. This current can be determined using the equation below:
EQUATION 4-3:
4.6 Capacitive Loads
Reasonable capacitive loads (e.g., logic gates) have little impact on propagation delay (see Figure 2-27). The supply current increases with increasing toggle frequency (Figure 2-30), especially with higher capacitive loads.
4.7 Battery Life
In order to maximize battery life in portable applications, use large resistors and small capacitive loads. Avoid toggling the output more than necessary. Do not use Chip Select (CS
) too frequently in order to conserve power. Capacitive loads will draw additional power at start-up.
4.8 PCB Surface Leakage
In applications where low input bias current is critical, PCB (Printed Circuit Board) surface leakage effects need to be considered. Surface leakage is caused by humidity, dust or other contamination on the board. Under low-humidity conditions, a typical resistance between nearby traces is 10 would cause 5 pA of current to flow. This is greater than the MCP6546/6R/6U/7/8/9 family’s bias current at 25°C (1 pA, typ.).
The easiest way to reduce surface leakage is to use a guard ring around sensitive pins (or traces). The guard ring is biased at the same voltage as the sensitive pin. An example of this type of layout is shown in
Figure 4-7.
12
Ω. A 5V difference
VOH can be calculated using the equation below:
EQUATION 4-4:
As explained in Section 4.1 “Comparator Inputs”, it is important to keep the non-inverting input below
+0.3V when VPU > VDD.
V
DD
4.5 Supply Bypass
With this family of comparators, the power supply pin
for single supply) should have a local bypass
(V
DD
capacitor (i.e., 0.01 µF to 0.1 µF) within 2 mm for good edge rate performance.
DS21714F-page 16 © 2007 Microchip Technology Inc.
FIGURE 4-7: Example Guard Ring Layout for Inverting Circuit.
1. Inverting Configuration (Figures 4-4 and 4-7):
a. Connect the guard ring to the non-inverting
input pin (V to the same reference voltage as the comparator (e.g., V
b. Connect the inverting pin (V
pad without touching the guard ring.
+). This biases the guard ring
IN
/2 or ground).
DD
–) to the input
IN
MCP6546/6R/6U/7/8/9
¼ MCP6549
V
DD
+
V
REF
V
DD
V
DD
R
1
R
2
V
OUT
V
IN
V
REF
V
PU
R
PU
MCP6546
MCP6041
V
RT
1/2
V
RB
V
IN
V
PU
R
PU
V
OUT
MCP6547
1/2 MCP6547
4.9 Unused Comparators
An unused amplifier in a quad package (MCP6549) should be configured as shown in Figure 4-8. This circuit prevents the output from toggling and causing crosstalk. It uses the minimum number of components and draws minimal current (see Figure 2-15 and
Figure 2-18).
FIGURE 4-8: Unused Comparators.
4.10 Typical Applications
4.10.1 PRECISE COMPARATOR
Some applications require higher DC precision. An easy way to solve this problem is to use an amplifier (such as the MCP6041) to gain-up the input signal before it reaches the comparator. Figure 4-9 shows an example of this approach.
FIGURE 4-9: Precise Inverting Comparator.
4.10.2 WINDOWED COMPARATOR
Figure 4-10 shows one approach to designing a
windowed comparator. The wired-OR connection produces a high output (logic 1) when the input voltage is between V
and VRT (where VRT > VRB).
RB
FIGURE 4-10: Windowed Comparator.
© 2007 Microchip Technology Inc. DS21714F-page 17
MCP6546/6R/6U/7/8/9
XXXXXXXX XXXXXNNN
YYWW
8-Lead PDIP (300 mil)
Example:
8-Lead SOIC (150 mil)
Example:
XXXXXXXX XXXXYYWW
NNN
MCP6546
I/P256
0729
MCP6546
I/SN0729
256
8-Lead MSOP
Example:
XXXXXX
YWWNNN
6546I
729256
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available characters for customer-specific information.
3
e
5-Lead SOT-23 (MCP6546, MCP6546R, MCP6546U)
Example: (I-temp)
XXNN AC25
5-Lead SC-70 (MCP6546)
Example: (I-temp)
XXNN (Front) YWW (Back)
AC25(Front) 729 (Back)
Device
I-Temp
Code
E-Temp
Code
MCP6546 ACNN GWNN
MCP6546R AHNN GXNN
MCP6546U AWNN
Note: Applies to 5-Lead SOT-23
Device
I-Temp
Code
E-Temp
Code
MCP6546 ACNN Note 2
Note 1: I-Temp parts prior to March
2005 are marked “ACN”
2: SC-70-5 E-Temp parts not
available at this release of the data sheet.
MCP6546
I/P^^256
0729
MCP6546I SN^^0729
256
3
e
OR
OR
Example: (I-temp)
AC25
OR

5.0 PACKAGING INFORMATION

5.1 Package Marking Information
3
e
DS21714F-page 18 © 2007 Microchip Technology Inc.
3
e
Package Marking Information (Continued)
14-Lead PDIP (300 mil) (MCP6549) Example:
14-Lead TSSOP (MCP6549)
Example:
14-Lead SOIC (150 mil) (MCP6549)
Example:
XXXXXXXXXXXXXX XXXXXXXXXXXXXX
YYWWNNN
XXXXXXXXXX
YYWWNNN
XXXXXXXX
YYWW
NNN
MCP6549-I/P
0729256
MCP6549I
0729
256
XXXXXXXXXX
MCP6549ISL
0729256
XXXXXXXXXX
MCP6549-E/P
0729256
OR
MCP6549
0729256
E/SL^^
OR
3
e
MCP6549
I/P^^
0729256
OR
MCP6546/6R/6U/7/8/9
3
e
3
e
© 2007 Microchip Technology Inc. DS21714F-page 19
MCP6546/6R/6U/7/8/9
5-Lead Plastic Small Outline Transistor (LT) [SC70]
Notes:
1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side.
2. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units MILLIMETERS
Dimension Limits MIN NOM MAX Number of Pins N 5 Pitch e 0.65 BSC Overall Height A 0.80 1.10 Molded Package Thickness A2 0.80 1.00 Standoff A1 0.00 0.10 Overall Width E 1.80 2.10 2.40 Molded Package Width E1 1.15 1.25 1.35 Overall Length D 1.80 2.00 2.25 Foot Length L 0.10 0.20 0.46 Lead Thickness c 0.08 0.26 Lead Width b 0.15 0.40
D
b
1
23
E1
E
4
5
ee
c
L
A1
AA2
Microchip Technology Drawing C04-061B
DS21714F-page 20 © 2007 Microchip Technology Inc.
MCP6546/6R/6U/7/8/9
5-Lead Plastic Small Outline Transistor (OT) [SOT-23]
Notes:
1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side.
2. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units MILLIMETERS
Dimension Limits MIN NOM MAX Number of Pins N 5 Lead Pitch e 0.95 BSC Outside Lead Pitch e1 1.90 BSC Overall Height A 0.90 1.45 Molded Package Thickness A2 0.89 1.30 Standoff A1 0.00 0.15 Overall Width E 2.20 3.20 Molded Package Width E1 1.30 1.80 Overall Length D 2.70 3.10 Foot Length L 0.10 0.60 Footprint L1 0.35 0.80 Foot Angle φ 30° Lead Thickness c 0.08 0.26 Lead Width b 0.20 0.51
φ
N
b
E
E1
D
1
2
3
e
e1
A
A1
A2
c
L
L1
Microchip Technology Drawing C04-091B
© 2007 Microchip Technology Inc. DS21714F-page 21
MCP6546/6R/6U/7/8/9
8-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units INCHES
Dimension Limits MIN NOM MAX Number of Pins N 8 Pitch e .100 BSC Top to Seating Plane A .210 Molded Package Thickness A2 .115 .130 .195 Base to Seating Plane A1 .015 – Shoulder to Shoulder Width E .290 .310 .325 Molded Package Width E1 .240 .250 .280 Overall Length D .348 .365 .400 Tip to Seating Plane L .115 .130 .150 Lead Thickness c .008 .010 .015 Upper Lead Width b1 .040 .060 .070 Lower Lead Width b .014 .018 .022 Overall Row Spacing § eB .430
N
E1
NOTE 1
D
12
3
A
A1
A2
L
b1
b
e
E
eB
c
Microchip Technology Dra wing C04-018B
DS21714F-page 22 © 2007 Microchip Technology Inc.
MCP6546/6R/6U/7/8/9
8-Lead Plastic Small Outline (SN) – Narrow, 3.90 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units MILLIMETERS
Dimension Limits MIN NOM MAX Number of Pins N 8 Pitch e 1.27 BSC Overall Height A 1.75 Molded Package Thickness A2 1.25 – Standoff
§ A1 0.10 0.25
Overall Width E 6.00 BSC Molded Package Width E1 3.90 BSC Overall Length D 4.90 BSC Chamfer (optional) h 0.25 0.50 Foot Length L 0.40 1.27 Footprint L1 1.04 REF Foot Angle φ Lead Thickness c 0.17 0.25 Lead Width b 0.31 0.51 Mold Draft Angle Top α 15° Mold Draft Angle Bottom β 15°
D
N
e
E
E1
NOTE 1
12 3
b
A
A1
A2
L
L1
c
h
h
φ
β
α
Microchip Technology Drawing C04-057B
© 2007 Microchip Technology Inc. DS21714F-page 23
MCP6546/6R/6U/7/8/9
8-Lead Plastic Micro Small Outline Package (MS) [MSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units MILLIMETERS
Dimension Limits MIN NOM MAX Number of Pins N 8 Pitch e 0.65 BSC Overall Height A 1.10 Molded Package Thickness A2 0.75 0.85 0.95 Standoff A1 0.00 0.15 Overall Width E 4.90 BSC Molded Package Width E1 3.00 BSC Overall Length D 3.00 BSC Foot Length L 0.40 0.60 0.80 Footprint L1 0.95 REF Foot Angle φ Lead Thickness c 0.08 0.23 Lead Width b 0.22 0.40
D
N
E
E1
NOTE 1
1
2
e
b
A
A1
A2
c
L1
L
φ
Microchip Technology Drawing C04-111B
DS21714F-page 24 © 2007 Microchip Technology Inc.
MCP6546/6R/6U/7/8/9
14-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units INCHES
Dimension Limits MIN NOM MAX Number of Pins N 14 Pitch e .100 BSC Top to Seating Plane A .210 Molded Package Thickness A2 .115 .130 .195 Base to Seating Plane A1 .015 – Shoulder to Shoulder Width E .290 .310 .325 Molded Package Width E1 .240 .250 .280 Overall Length D .735 .750 .775 Tip to Seating Plane L .115 .130 .150 Lead Thickness c .008 .010 .015 Upper Lead Width b1 .045 .060 .070 Lower Lead Width b .014 .018 .022 Overall Row Spacing § eB .430
N
E1
D
NOTE 1
12
3
E
c
eB
A2
L
A
A1
b1
b e
Microchip Technology Drawing C04-005B
© 2007 Microchip Technology Inc. DS21714F-page 25
MCP6546/6R/6U/7/8/9
14-Lead Plastic Small Outline (SL) – Narrow, 3.90 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units MILLIMETERS
Dimension Limits MIN NOM MAX Number of Pins N 14 Pitch e 1.27 BSC Overall Height A 1.75 Molded Package Thickness A2 1.25 – Standoff § A1 0.10 0.25 Overall Width E 6.00 BSC Molded Package Width E1 3.90 BSC Overall Length D 8.65 BSC Chamfer (optional) h 0.25 0.50 Foot Length L 0.40 1.27 Footprint L1 1.04 REF Foot Angle φ Lead Thickness c 0.17 0.25 Lead Width b 0.31 0.51 Mold Draft Angle Top α 15° Mold Draft Angle Bottom β 15°
NOTE 1
N
D
E
E1
1
2 3
b
e
A
A1
A2
L
L1
c
h
h
α
β
φ
Microchip Technology Drawing C04-065B
DS21714F-page 26 © 2007 Microchip Technology Inc.
MCP6546/6R/6U/7/8/9
14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units MILLIMETERS
Dimension Limits MIN NOM MAX Number of Pins N 14 Pitch e 0.65 BSC Overall Height A 1.20 Molded Package Thickness A2 0.80 1.00 1.05 Standoff A1 0.05 0.15 Overall Width E 6.40 BSC Molded Package Width E1 4.30 4.40 4.50 Molded Package Length D 4.90 5.00 5.10 Foot Length L 0.45 0.60 0.75 Footprint L1 1.00 REF Foot Angle φ Lead Thickness c 0.09 0.20 Lead Width b 0.19 0.30
NOTE 1
D
N
E
E1
1
2
e
b
c
A
A1
A2
L1
L
φ
Microchip Technology Drawing C04-087B
© 2007 Microchip Technology Inc. DS21714F-page 27
MCP6546/6R/6U/7/8/9
NOTES:
DS21714F-page 28 © 2007 Microchip Technology Inc.
APPENDIX A: REVISION HISTORY
Revision F (September 2007)
The following is the list of modifications:
1. Corrected polarity of MCP6546U SOT-23-5 pin out diagram on front page.
2. Section 5.1 “Package Marking Information”: Updated package outline drawings per marcom.
Revision E (September 2006)
The following is the list of modifications:
1. Added MCP6546U pinout for the SOT-23-5 package.
2. Clarified Absolute Maximum Analog Input Voltage and Current Specifications.
3. Added applications writeups on unused comparators.
4. Added disclaimer to package outline drawings.
Revision D (May 2006)
MCP6546/6R/6U/7/8/9
The following is the list of modifications:
1. Added E-temp parts.
2. Changed minimum pull-up voltage specification
) to 1.6V for parts starting Dec. 2004 (week
(V
PU
code 52); previous parts are specified at a minimum of V
3. Changed V linear and quadratic temperature coefficients.
4. Changed specifications and plots to include E­Temp parts.
5. Added Section 3.0 “Pin Descriptions”.
6. Corrected package markings (Section 5.1 “Package Marking Information”).
7. Added Appendix A: “Revision History”.
.
DD
temperature specifications to
HYST
Revision C (May 2003)
Revision B (December 2002)
Revision A (February 2002)
• Original Release of this Document.
© 2007 Microchip Technology Inc. DS21714F-page 29
MCP6546/6R/6U/7/8/9
NOTES:
DS21714F-page 30 © 2007 Microchip Technology Inc.
MCP6546/6R/6U/7/8/9
Device: MCP6546: Single Comparator
MCP6546T: Single Comparator (Tape and Reel)
(SC-70, SOT-23, SOIC, MSOP)
MCP6546RT: Single Comparator (Rotated - Tape and
Reel) (SOT-23 only)
MCP6546UT: Single Comparator (Tape and Reel)
(SOT-23-5 is E-Temp only)
MCP6547: Dual Comparator MCP6547T: Dual Comparator
(Tape and Reel for SOIC and MSOP) MCP6548: Single Comparator with CS MCP6548T: Single Comparator with CS
(Tape and Reel for SOIC and MSOP) MCP6549: Quad Comparator MCP6549T: Quad Comparator
(Tape and Reel for SOIC and TSSOP)
Temperature Range: I = -40°C to +85°C
E * = -40°C to +125°C
* SC-70-5 E-Temp parts not available at this release of the data sheet.
Package: LT = Plastic Package (SC-70), 5-lead
OT = Plastic Small Outline Transistor (SOT-23), 5-lead MS = Plastic MSOP, 8-lead P = Plastic DIP (300 mil Body), 8-lead, 14-lead SN = Plastic SOIC (150 mil Body), 8-lead SL = Plastic SOIC (150 mil Body), 14-lead (MCP6549) ST = Plastic TSSOP (4.4mm Body), 14-lead (MCP6549)
PART NO. –X /XX
PackageTemperature
Range
Device
Examples:
a) MCP6546T-I/LT: Tape and Reel,
Industrial Temperature, 5LD SC-70.
b) MCP6546T-I/OT: Tape and Reel,
Industrial Temperature, 5LD SOT-23.
c) MCP6546-E/P: Extended Temperature,
8LD PDIP.
d) MCP6546RT-I/OT: Tape and Reel,
Industrial Temperature, 5LD SOT23.
e) MCP6546-E/SN: Extended Temperature,
8LD SOIC.
f) MCP6546UT-E/OT:Tape and Reel,
Extended Temperature, 5LD SOT23.
a) MCP6547-I/MS: Industrial Temperature,
8LD MSOP.
b) MCP6547T-I/MS: Tape and Reel,
Industrial Temperature, 8LD MSOP.
c) MCP6547-I/P: Industrial Temperature,
8LD PDIP.
d) MCP6547-E/SN: Extended Temperature,
8LD SOIC.
a) MCP6548-I/SN: Industrial Temperature,
8LD SOIC.
b) MCP6548T-I/SN: Tape and Reel,
Industrial Temperature, 8LD SOIC.
c) MCP6548-I/P: Industrial Temperature,
8LD PDIP.
d) MCP6548-E/SN: Extended Temperature,
8LD SOIC.
a) MCP6549T-I/SL: Tape and Reel,
Industrial Temperature, 14LD SOIC.
b) MCP6549T-E/SL: Tape and Reel,
Extended Temperature, 14LD SOIC.
c) MCP6549-I/P: Industrial Temperature,
14LD PDIP.
d) MCP6549-E/ST: Extended Temperature,
14LD TSSOP.
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
© 2007 Microchip Technology Inc. DS21714F-page 31
NOTES:
MCP6546/6R/6U/7/8/9
© 2007 Microchip Technology Inc. DS21714F-page 32
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron, dsPIC, K
EELOQ, KEELOQ logo, microID, MPLAB, PIC,
PICmicro, PICSTART, PRO MATE, rfPIC and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
AmpLab, FilterLab, Linear Active Thermistor, Migratable Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their respective companies.
© 2007, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
®
MCUs and dsPIC® DSCs, KEELOQ
®
code hopping
© 2007 Microchip Technology Inc. DS21714F-page 33
WORLDWIDE SALES AND SERVICE
AMERICAS
Corporate Office
2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com
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Tel: 86-24-2334-2829 Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8203-2660 Fax: 86-755-8203-1760
China - Shunde
Tel: 86-757-2839-5507 Fax: 86-757-2839-5571
China - Wuhan
Tel: 86-27-5980-5300 Fax: 86-27-5980-5118
China - Xian
Tel: 86-29-8833-7252 Fax: 86-29-8833-7256
ASIA/PACIFIC
India - Bangalore
Tel: 91-80-4182-8400 Fax: 91-80-4182-8422
India - New Delhi
Tel: 91-11-4160-8631 Fax: 91-11-4160-8632
India - Pune
Tel: 91-20-2566-1512 Fax: 91-20-2566-1513
Japan - Yokohama
Tel: 81-45-471- 6166 Fax: 81-45-471-6122
Korea - Daegu
Tel: 82-53-744-4301 Fax: 82-53-744-4302
Korea - Seoul
Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934
Malaysia - Penang
Tel: 60-4-646-8870 Fax: 60-4-646-5086
Philippines - Manila
Tel: 63-2-634-9065 Fax: 63-2-634-9069
Singapore
Tel: 65-6334-8870 Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-572-9526 Fax: 886-3-572-6459
Taiwan - Kaohsiung
Tel: 886-7-536-4818 Fax: 886-7-536-4803
Taiwan - Taipei
Tel: 886-2-2500-6610 Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351 Fax: 66-2-694-1350
EUROPE
Austria - Wels
Tel: 43-7242-2244-39 Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828 Fax: 45-4485-2829
France - Paris
Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Germany - Munich
Tel: 49-89-627-144-0 Fax: 49-89-627-144-44
Italy - Milan
Tel: 39-0331-742611 Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399 Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-708-08-90 Fax: 34-91-708-08-91
UK - Wokingham
Tel: 44-118-921-5869 Fax: 44-118-921-5820
06/25/07
DS21714F-page 34 © 2007 Microchip Technology Inc.
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