* Includes Exposed Thermal Pad (EP); see Ta b l e 1 -1 .
USB-to-SPI Protocol Converter with GPIO (Master Mode)
Features:
Universal Serial Bus (USB)
• Supports Full-Speed USB (12 Mb/s)
• Human Interface Device (HID) device
• 128-Byte Buffer to Handle Data Throughput:
- 64-byte transmit
- 64-byte receive
• Fully Configurable VID, PID Assignments and
String Descriptor (factory programming also available)
• Bus Powered (factory default) or Self-Powered
(can be selected through special USB
commands)
• USB 2.0 Compliant
USB Driver and Software Support
• Uses Standard HID Drivers (built-in support on
Windows
• Configuration Utility for Device’s Power-up
Configuration
• Utility for USB-SPI Communication, GPIO
Manipulation and Miscellaneous Features Usage
SPI Master Peripheral
• Supports all Four SPI modes (Mode 0, 1, 2, 3)
• Bit Rates from 1500 bps up to 12 Mbps
• Configurable Delays for SPI Transactions:
- Chip Select (assert) to 1
- Data to data delay
- Data to Chip Select (de-assert) delay
• SPI Transactions Lengths of up to 65535 Bytes
Long
• Up to 9 Chip Select lines – to be used in any
combination for a given SPI transaction (the Chip
Select lines are shared between GPIOs and
alternate function pins; certain GPs – up to 9 of
them – can be assigned with the Chip Select
functionality)
General Purpose Input/Output (GPIO) Pins
• Nine General Purpose I/O Pins
EEPROM
• 256 Bytes of User EEPROM (accessible through
certain USB commands)
®
XP, Vista, 7, Linux and Mac OS®)
st
byte of data delay
Package Types:
The device will be offered in the following packages:
• 20-lead QFN (5 x 5 mm)
• 20-lead SOIC
• 20-lead SSOP
Other
• USB Activity LED Output
• SSPND
• USBCFG
enumeration is completed)
• Operating Voltage: 3.3-5.5V
• Oscillator Input: 12 MHz
• Industrial Operating Temperature: -40°C to +85°C
Output Pin (to signal USB Suspend state)
Output Pin (indicates when the
2011 Microchip Technology Inc.DS22288A-page 1
MCP2210
GPIO
Control
USB
Protocol
Controller
USB
XCVR
VSS
OSC
State
Clock
USB
Clock
Reset
3.3V
LDO
256-Byte
EEPROM
Configuration
and Control
Regs
SPI
(Master)
Baud
Generator
Chip
Select
Control
GP8-GP0
D+
D-
V
USB
VDDRSTOSC1OSC2Vss
MOSI
MISO
SCK
CS8:0
Dedicated
function pins
Block Diagram
DS22288A-page 2 2011 Microchip Technology Inc.
MCP2210
1.0FUNCTIONAL DESCRIPTION
The MCP2210 device is a USB-to-SPI Master
converter which enables USB connectivity in
applications that have an SPI interface. The device
reduces external components by integrating the USB
termination resistors.
The MCP2210 also has 256 bytes of integrated user
EEPROM.
The MCP2210 has nine general purpose input/output
pins. Seven pins have alternate functions to indicate
USB and communication status. See Tab l e 1 -1 and
Section 1.6 “GP Module” for details about the pin
functions.
TABLE 1-1:PINOUT DESCRIPTION
MCP2210
QFN
SOIC,
SSOP
14RSTI— ——
25GP0I/OGPIO0CS0—General Purpose I/O
36GP1I/OGPIO1CS1—General Purpose I/O
47GP2I/OGPIO2CS2USB SuspendGeneral Purpose I/O
58GP3I/OGPIO3CS3SPI Transfer Traffic LED General Purpose I/O
1215GP7I/OGPIO7CS7SPI Bus Release ACKGeneral Purpose I/O
1316GP8I/OGPIO8CS8SPI Bus Release REQGeneral Purpose I/O
1417V
1518D-USB———USB D-
1619D+USB———USB D+
1720V
181VDDP— ——Power
192OSC1I———Oscillator input
203OSC2O———Oscillator output
SymbolType
(GPIO)
Standard Function
USBUSB———USB Regulator output
SSGND———Ground
(Chip Selects)
Alternate Function 1
Alternate Function 2
(dedicated functions)
Description
Reset input
2011 Microchip Technology Inc.DS22288A-page 3
MCP2210
1.1Supported Operating Systems
The following operating systems are supported:
• Windows XP/Vista/7
•Linux
•Mac OS
1.1.1ENUMERATION
The MCP2210 will enumerate as a USB device after
Power-on Reset (POR). The device enumerates as a
Human Interface Device (HID) only.
1.1.1.1Human Interface Device (HID)
The MCP2210 enumerates as an HID, so the device
can be configured and all the other functionalities can
be controlled. A DLL package that facilitates I/O control
through a custom interface is supplied by Microchip
and is available on the product landing page.
1.2Control Module
The control module is the heart of the MCP2210. All
other modules are tied together and controlled via the
control module. The control module manages the data
transfers between the USB and the SPI, as well as
command requests generated by the USB host
controller, and commands for controlling the function of
the SPI and I/O.
1.2.1SPI INTERFACE
The control module interfaces to the SPI and USB
modules.
1.2.2INTERFACING TO THE DEVICE
The MCP2210 can be accessed for reading and writing
via USB host commands. The device cannot be
accessed and controlled via the SPI interface.
1.3SPI Module
The MCP2210 SPI module provides the MOSI, MISO
and SCK signals to the outside world. The module has
the ability to control the GP pins (as Chip Select) only if
these pins are configured for Chip Select operation.
1.3.1SPI MODULE FEATURES
The SPI module has the following configurable
features:
All the above features are available for customization
using certain USB commands.
1.3.2SPI MODULE POWER-UP
CONFIGURATION
Default parameters:
•1Mbit
• 4 bytes to transfer per SPI transaction
• GP1 as Chip Select line
1.4USB Protocol Controller
The USB controller in the MCP2210 is full-speed USB
2.0 compliant.
• HID only device used for:
- SPI transfers
- I/O control
- EEPROM access
- Chip configuration manipulation
• 128-byte buffer to handle data for SPI transfers
- 64-byte transmit
- 64-byte receive
• Fully configurable VID, PID assignments, string
descriptors (stored on-chip) and chip power-up
settings (default chip settings and SPI transfer
parameters)
• Bus powered or self-powered
1.4.1DESCRIPTORS
The string descriptors are stored internally in the
MCP2210 and they can be changed so when the chip
enumerates, the host gets the customer’s own product
and manufacturer names. They can be customized to
the user’s needs by using the Microchip provided configuration utility or a custom built application that will
send the proper USB commands for storing the new
descriptors into the chip.
1.4.2USB EVENTS
The MCP2210 provides support for signaling important
USB-related events such as:
• USB Suspend and Resume – these states are
signaled on the GP2, if the pin is configured for its
dedicated function
- USB Suspend mode is entered when a
suspend signaling event is detected on the
USB bus
- USB Resume is signaled when one of the
following events is occurring:
a) Resume signaling is detected or generated
b) A USB Reset signal is detected
c)A device Reset occurs
• USB device enumerated successfully (this state is
signaled if the GP4 is configured for its dedicated
function)
• USB Low-Power mode
DS22288A-page 4 2011 Microchip Technology Inc.
MCP2210
LDO
3.3V
USB
Transceiver
D+
V
DD
VUSB
D-
IN
OUT
VDD
VUSB
VSS
VBUS
1.5USB Transceiver
The MCP2210 has a built-in, USB 2.0, full-speed
FIGURE 1-1:MCP2210 INTERNAL
POWER SUPPLY DETAILS
transceiver internally connected to the USB module.
The USB transceiver obtains power from the V
USB pin,
which is internally connected to a 3.3V internal
regulator. The best electrical signal quality is obtained
when V
USB is locally bypassed with a high-quality
ceramic capacitor.
The internal 3.3V regulator draws power from the V
DD
pin. In certain scenarios, where VDD is lower than
3.3V+ internal LDO dropout, the V
USB pin must be tied
to an external regulated 3.3V. This will allow the USB
transceiver to work correctly, while the I/O voltage in
the rest of the system can be lower than 3.3V. As an
example, in a system where the MCP2210 is used and
the I/O required is of 2.2V, the V
tied to the 2.2V digital power rail, while the V
DD of the chip will be
USB pin
must be connected to a regulated 3.3V power supply.
1.5.1INTERNAL PULL-UP RESISTORS
The MCP2210 device has built-in pull-up resistors
designed to meet the requirements for full-speed USB.
1.5.2MCP2210 POWER OPTIONS
The following are the main power options for the
MCP2210:
• USB Bus Powered (5V)
• Self Powered (from 3.3V to 5V), while the V
pin is supplied with 3.3V (regulated). If the V
powered with 5V, then the V
by the internal regulator and the V
USB will be powered
USB pin will
USB
DD is
need only a decoupling capacitor
1.5.2.1Internal Power Supply Details
MCP2210 offers various options for power supply. To
meet the required USB signaling levels, MCP2210
device incorporates an internal LDO used solely by the
USB transceiver, in order to present the correct D+/D
voltage levels.
Figure 1-1 shows the internal connections of the USB
transceiver LDO in relation with the V
rail. The output of the USB transceiver LDO is tied to
USB line.
the V
A capacitor connected to the V
USB transceiver LDO provides the 3.3V supply to the
transceiver.
DD power supply
USB pin is required if the
The provided VDD voltage has a direct influence on the
voltage levels present on the GPIO and SPI module
pins (GP8-GP0, MOSI, MISO and SCK). When VDD is
5V, all of these pins will have a logical ‘1’ around 5V
with the variations specified in Section 4.1 “DC Char-
acteristics”.
For applications that require a 3.3V logical ‘1’ level,
DD must be connected to a power supply providing
V
the 3.3V voltage. In this case, the internal USB
transceiver LDO cannot provide the required 3.3V
power. It is necessary to also connect the V
USB pin of
the MCP2210 to the 3.3V power supply rail. This way,
the USB transceiver is powered up directly from the
3.3V power supply.
1.5.2.2USB Bus Powered (5V)
In Bus Power Only mode, the entire power for the
application is drawn from the USB (see Figure 1-2).
This is effectively the simplest power method for the
device.
FIGURE 1-2:BUS POWER ONLY
2011 Microchip Technology Inc.DS22288A-page 5
MCP2210
LDO
3.3V
USB
Transceiver
D+
V
DD
VUSB
D-
IN
OUT
5V (USB Bus)
or external
power supply
LDO
3.3V
D+
V
DD
VUSB
D-
IN
OUT
5V (USB Bus)
or external
power supply
External
USB
Transceiver
3.3V
LDO
In order to meet the inrush current requirements of the
USB 2.0 specifications, the total effective capacitance
appearing across VBUS and ground must be no more
than 10 µF.If it is more than 10 µF, some kind of inrush
limiting is required. For more details on Inrush Current
Limiting, see the current Universal Serial Bus Specifi-cation.
According to the USB 2.0 specification, all USB devices
must also support a Low-Power Suspend mode. In the
USB Suspend mode, devices must consume no more
than 500 µA (or 2.5 mA for high powered devices that
are remote wake-up capable) from the 5V V
BUS line of
the USB cable.
The host signals the USB device to enter Suspend
mode by stopping all USB traffic to that device for more
than 3 ms.
The USB bus provides a 5V voltage. However, the USB
transceiver requires 3.3V for the signaling (on D+ and
D- lines).
During USB Suspend mode, the D+ or D- pull-up resistor must remain active, which will consume some of the
allowed suspend current budget (500 µA/2.5 mA).
USB pin is required to have an external bypass
The V
capacitor. It is recommended that the capacitor be a
ceramic cap, between 0.22 and 0.47 µF.
Figure 1-3 shows a circuit where the MCP2210 internal
LDO is used to provide 3.3V to the USB transceiver.
The voltage on the V
DD affects the voltage levels onto
the GP and SPI module pins (GP8-GP0, MOSI, MISO
and SCK). With V
DD at 5V, these pins will have a logic
‘1’ of 5V with the variations specified in Section 4.1
“DC Characteristics”.
1.5.2.33.3V – Self Powered
Typically, many embedded applications are using 3.3V
or lower power supplies. When such an option is available in the target system, MCP2210 can be powered
DD) from the existing power supply rail. The typi-
up (V
cal connections for MCP2210 powered from 3.3V rail
are shown in Figure 1-4.
In this example MCP2210 has both V
DD and VUSB lines
tied to the 3.3V rail. These tied connections disable the
internal USB transceiver LDO of the MCP2210 to
regulate the power supply on V
USB pin. Another
consequence is that the ‘1’ logical level on the GP and
SPI pins will be at the 3.3V level, in accordance with the
variations specified in Section 4.1 “DC
Characteristics”.
FIGURE 1-4:USING AN EXTERNALLY
PROVIDED 3.3V POWER
SUPPLY
FIGURE 1-3:TYPICAL POWER SUPPLY
OPTION USING THE 5V
PROVIDED BY THE USB
DS22288A-page 6 2011 Microchip Technology Inc.
MCP2210
1.6GP Module
The GP module features nine I/O lines.
1.6.1CONFIGURABLE PIN FUNCTIONS
The pins can be configured as:
• GPIO – individually configurable, general purpose
input or output
• Chip Select pins – used by the SPI module
• Alternate function pins – used for miscellaneous
features such as:
- SSPND
- USBCFG – indicates USB configuration
status
-LOWPWR
accept the requirements (presented during
enumeration) and the chip is not configured.
In this mode, the whole system powered from
the USB host should draw up to 100 mA.
- External Interrupt Input – used to count
external events
- SPI bus Release Request – used to request
SPI bus access from the MCP2210
- SPI bus Release Acknowledge – used to
acknowledge when the MCP2210 has
released the SPI bus
- LED – indicates SPI traffic led
1.6.1.1GPIO Pins Function
The GP pins (if enabled for GPIO functionality) can be
used as digital inputs/outputs.
These pins can be read (both inputs and outputs) and
written (only the outputs).
1.6.1.2Chip Select Pins Function
The GP pins (if enabled for the Chip Select functionality) are controlled by the SPI module. Their Idle/Active
value is determined by the SPI transfer parameters.
1.6.1.3SSPND Pin Function
The GP2 pin (if enabled for this functionality) reflects
the USB state (Suspend/Resume). The pin is active
‘low’ when the Suspend state has been issued by the
USB host.
Likewise, the pin drives ‘high’ after the Resume state is
achieved.
This pin allows the application to go into Low-Power
mode when USB communication is suspended, and
switches to a full active state when USB activity is
resumed.
– USB Suspend and Resume states
– signals when the host does not
1.6.1.4USBCFG Pin Function
The GP5 pin (if enabled for this functionality) starts out
‘high’ during power-up or after Reset, and goes ‘low’
after the device successfully configures to the USB.
The pin will go ‘high’ when in Suspend mode and ‘low’
when the USB resumes.
1.6.1.5LOWPWR Pin Function
The GP4 pin (if enabled for this functionality) starts out
‘low’ during power-up or after Reset, and goes ‘high’
after the device successfully configures to the USB.
The pin will go ‘low’ when in Suspend mode and ‘high’
when the USB resumes.
1.6.1.6External Interrupt Input Pin Function
The GP4 pin (if enabled for this functionality) is used as
an interrupt input pin and it will count interrupt events
such as:
• Falling edges
• Rising edges
• Low-logic pulses
• High-logic pulses
1.6.1.7SPI Bus Release Request Pin
Function
The GP8 pin (if enabled for this functionality) is used by
an external device to request the MCP2210 to release
the SPI bus. This way, more than one SPI master can
have access to the SPI slave chips on the bus. When
this pin is driven ‘low’, the MCP2210 will examine the
request and, based on the conditions and internal logic,
it might release the SPI bus. If there is an ongoing SPI
transfer taking place at the moment when an external
device requests the bus, MCP2210 will release it after
the transfer is completed or if the USB host cancels the
current SPI transfer.
1.6.1.8SPI Bus Release Acknowledge Pin
Function
The GP7 pin (if enabled for this functionality) is used by
the MCP2210 to signal back if the SPI bus was
released. When a SPI bus release request is registered
by the MCP2210, based on the condition and internal
logic, the chip might release the bus. The bus is
released immediately if there is no SPI transfer taking
place, or it will do so after the current SPI transfer is
finished or cancelled by the USB host.
1.6.1.9LED Pin Function
The GP3 pin (if enabled for this functionality) is used as
an SPI traffic indication. When an SPI transfer is taking
place (active state for this pin), this pin will be driven
‘low’. When there is no SPI traffic taking place, the pin
is in its inactive state or logic ‘high’.
2011 Microchip Technology Inc.DS22288A-page 7
MCP2210
Quartz Crystal
12 MHz
OSC1
OSC2
R
S
(1)
R
F
(2)
MCP2210
Note 1: A series resistor (RS) may be required for
quartz crystals with high drive level.
2: The value of R
F
is typically between 2 M to
10 M..
Example: muRata®
CSTCE12M0G15L
OSC1
OSC2
Resonator
12 MHz
MCP2210
1.7EEPROM Module
The EEPROM module is a 256-byte array of nonvolatile memory. The memory locations are accessed for
read/write operations solely via USB host commands.
The memory cells for data EEPROM are rated to
endure thousands of erase/write cycles, up to 100K for
EEPROM.
Data retention without refresh is conservatively
estimated to be greater than 40 years.
1.8Reset/POR
1.8.1RESET PIN
The RST pin provides a method for triggering an
external Reset of the device. A Reset is generated by
holding the pin low. MCP2210 has a noise filter in the
Reset path which detects and ignores small pulses.
1.8.2POR
A POR pulse is generated on-chip whenever VDD rises
above a certain threshold. This allows the device to
start in the initialized state when VDD is adequate for
operation.
To take advantage of the POR circuitry, tie the RST
through a resistor (1 k to 10 k) to V
eliminate external RC components usually needed to
create a POR delay.
When the device starts normal operation (i.e., exits the
Reset condition), the device operating parameters
(voltage, frequency, temperature, etc.) must be met to
ensure operation. If these conditions are not achieved,
the device must be held in Reset until the operating
conditions are met.
DD. This will
pin
1.9Oscillator
The input clock must be 12 MHz to provide the proper
frequency for the USB module. USB full-speed is
nominally 12 Mb/s. The clock input accuracy is ±0.25%
(2,500 ppm maximum).
FIGURE 1-5:QUARTZ CRYSTAL
OPERATION
FIGURE 1-6:CERAMIC RESONATOR
OPERATION
DS22288A-page 8 2011 Microchip Technology Inc.
MCP2210
T
CS2DATA
CS
SCK
MOSI
MISO
2.0MCP2210 FUNCTIONAL
DESCRIPTION
The MCP2210 uses NVRAM to store relevant chip
settings. These settings are loaded by the chip during
the power-up process and they are used for GP
designation and SPI transfers.
The NVRAM settings at power-up (or Reset) are
loaded into the RAM portion of the chip and they can be
altered through certain USB commands. This is very
useful since it allows dynamic reconfiguring of the GPs
or SPI transfer parameters. A practical example to
illustrate this mechanism is a system which uses at
least two SPI slave chips and the GPs in the MCP2210
for various GPIO purposes. The default SPI settings
might be ok for one of the SPI slave chips, but not for
nd
. At first, the PC application will make an SPI
the 2
transfer to the firstchip, using the NVRAM copy of the
SPI settings. Then, by sending a certain USB
command, the SPI transfer settings residing in RAM
will be altered in order to fit the SPI transfer
requirements of the second chip.
Also, if the altered SPI transfer settings are needed to
be the default power-up (or Reset) settings for SPI, the
user can send a series of USB commands in order to
store the current (RAM) SPI settings into NVRAM. In
this way, these new settings will be the power-up
default SPI settings.
The NVRAM settings and EEPROM contents can be
protected by password access means, or they can be
permanently locked without any possible further
modification.
2.1MCP2210 NVRAM Settings
The chip settings that can be stored in the NVRAM
area are as follows:
• SPI transfer parameters:
- SPI bit rate
- SPI mode
- Idle Chip Select values
- Active Chip Select values
- SPI transfer configurable delays
- Number of bytes to read/write for the given
SPI transfer
• GP designation:
-GPIO
- Chip Select
- Dedicated function
• GPIO default direction (applies only to those GPs
designated as GPIOs)
• GPIO default output value (applies only to those
GPs designated as output GPIOs)
• Chip mode flags:
- Remote wake-up capability
- External Interrupt Pin mode (applies only
when GP6 is designated for this function)
- SPI bus release enable/disable – enable/
disable the release of the SPI bus when there
is no SPI transfer (useful when more than
one SPI master on the bus)
• NVRAM Access mode:
- Full access (no protection – factory default)
- Password protection
- Permanently locked
• Password (relevant when password protection
mechanism isactive)
The specified settings are loaded at power-up or Reset
moments, and they can be altered through certain USB
commands.
When a NVRAM conditional access method is already
in place, such as password protection, the NVRAM
settings modification is permitted only when the user
has supplied the correct password for the chip. The
RAM settings can be altered even when a password
protection or permanent lock mechanism are in place.
This allows the user to communicate with various SPI
slave chips without knowing the password, but it will not
allow the modification of the power-up default settings
in NVRAM.
2.2SPI Transfers
The MCP2210 device provides advanced SPI
communication features such as configurable delays
and multipleChip Select support.
The configurable delays are related to certain aspects
of the SPI transfer:
• The delay between the assertion of Chip Select(s)
and the first data byte (Figure 2-1)
FIGURE 2-1:CHIP SELECT TO DATA
DELAY
2011 Microchip Technology Inc.DS22288A-page 9
MCP2210
T
DATA2DATA
CS
SCK
MOSI
MISO
T
DATA2CS
CS
SCK
MOSI
MISO
• The delay between subsequent data bytes
(Figure 2-2)
FIGURE 2-2:DATA-TO-DATA DELAY
• The delay between the end of the last byte (of the
SPI transfer) and the de-assertion of the Chip
Select(s)
FIGURE 2-3:DATA TO CHIP SELECT
DELAY
For a particular SPI transfer, the user can choose any
number (out of the available ones) of Chip Select pins.
The SPI transfer parameters contain two fields where
the user will specify the Chip Select values when the
SPI transfer is active/idle. This mechanism allows the
user to specify any combination of Chip Select values
for the Idle mode and some other combination for the
Active mode (SPI transfer active).
DS22288A-page 10 2011 Microchip Technology Inc.
MCP2210
3.0USB COMMANDS/RESPONSES
DESCRIPTION
MCP2210 implements the HID interface for all the
device-provided functionalities. The chip uses a
command/response mechanism for the USB engine.
This means that for every USB command sent (by the
USB host) to the MCP2210, it will always replywith a
response packet.
The MCP2210 USB commands can be grouped by
their provided features as follows:
• NVRAM Settings
- Read/Write NVRAM related parameters
- Send access password
• Read/Write RAM Settings (copied from NVRAM
at power-up or Reset):
- Read/Write (volatile – RAM stored settings)
SPI transfer settings
- Read/Write (volatile – RAM stored settings)
chip settings
- Read/Write (volatile – RAM stored settings)
GPIO direction
- Read/Write (volatile – RAM stored settings)
GPIO output values
• Read/Write EEPROM Memory
• External Interrupt Pin (GP6) Event Status
• SPI Data Transfer:
- Read/Write SPI transfer data
- Cancels the ongoing SPI transfer
- SPI bus release manipulation
• Chip Status and Unsupported commands
3.1NVRAM Settings
The commands in this category are related to the NVRAM settings manipulation.
3.1.1SET CHIP SETTINGS POWER-UP DEFAULT
TABLE 3-1:COMMAND STRUCTURE
Byte IndexMeaning
00x60 – Set Chip NVRAM Parameters – command code
10x20 – Set Chip Settings Power-up Default – sub-command code
- 1 = SPI Bus is not released by the MCP2210 between transfers
18NVRAM Chip Parameters Access Control
• 0x00 – Chip Settings Not Protected
• 0x40 – Chip Settings Protected By Password Access
• 0x80 – Chip Settings Permanently Locked
19 - 63Don’t Care
Meaning
2011 Microchip Technology Inc.DS22288A-page 27
MCP2210
Get NVRAM
Chip Settings
Response 1
NVRAM
Chip Settings
Retrieved
FIGURE 3-7:GET POWER-UP CHIP SETTINGS LOGIC FLOW
DS22288A-page 28 2011 Microchip Technology Inc.
3.1.8GET USB KEY PARAMETERS
Get NVRAM USB
Key Parameters
Response 1
NVRAM USB
Key Parameters
Retrieved
TABLE 3-21:COMMAND STRUCTURE
Byte
Index
00x61 – Get NVRAM Settings – command code
10x30 – Get USB Key Parameters – sub-command code
20x00 – Reserved
3-630x00 – Reserved
Meaning
3.1.8.1Responses
TABLE 3-22:RESPONSE 1 STRUCTURE
Byte
Index
00x61 – Get NVRAM Settings – echos back the given command code
10x00 – Command Completed Successfully
20x30 – Sub-command Echoed Back for Get USB Key Parameters code
3-11Don’t care
12VID low byte
13VID high byte
14PID low byte
15PID high byte
16-28Don’t care
29Chip Power Option (as per USB specs – Chapter 9)
• Bit 7 – Host Powered
• Bit 6 – Self Powered
• Bit 5 – Remote Wake-up Capable
• Bit 4 – Don’t Care
• Bit 3 – Don’t Care
• Bit 2 – Don’t Care
• Bit 1 – Don’t Care
• Bit 0 – Don’t Care
30Requested Current Amount from USB Host (quanta of 2 mA)
Example
31-63Don’t Care
: For 100 mA this byte index will have a value of 50 (in decimal) or 0x32.
Meaning
MCP2210
FIGURE 3-8:GET USB KEY PARAMETERS LOGIC FLOW
2011 Microchip Technology Inc.DS22288A-page 29
MCP2210
Get NVRAM USB
Manufacturer Name
Response 1
NVRAM USB
Manufacturer
Name Retrieved
3.1.9GET USB MANUFACTURER NAME
TABLE 3-23:COMMAND STRUCTURE
Byte
Index
00x61 – Get NVRAM Settings – command code
10x50 – Get USB Manufacturer Name – sub-command code
20x00 – Reserved
3-630x00 – Reserved
3.1.9.1Responses
TABLE 3-24:RESPONSE 1 STRUCTURE
Byte
Index
00x61 – Get NVRAM Settings – echos back the given command code
10x00 – Command Completed Successfully
20x50 – Sub-command Echoed Back for Get USB Manufacturer Name code
3Don’t Care
4Total USB String Descriptor Length (this is the length of the Manufacturer string multiplied by 2 + 2)
Example
- The retrieved value is: (25 x 2) + 2 = 52 (decimal) = 0x34
5USB String Descriptor ID – always 0x03
6Unicode Character Low Byte
Example
- This byte index will have a value of 0x4D
7Unicode Character High Byte
Example: For the “Microchip Technology Inc.” Unicode string, there will be the high byte of the
- This byte index will have a value of 0x00
8-63Remaining Unicode Characters
: “Microchip Technology Inc.” has 25 Unicode characters.
: For the “Microchip Technology Inc.” Unicode string, there will be the low byte of the Unicode
for character “M”.
Unicode for character “M”.
Meaning
Meaning
FIGURE 3-9:GET USB MANUFACTURER NAME LOGIC FLOW
DS22288A-page 30 2011 Microchip Technology Inc.
MCP2210
Get NVRAM USB
Product Name
Response 1
NVRAM USB
Product Name
Retrieved
3.1.10GET USB PRODUCT NAME
TABLE 3-25:COMMAND STRUCTURE
Byte
Index
00x61 – Get NVRAM Settings – command code
10x40 – Get USB Product Name – sub-command code
20x00 – Reserved
3-630x00 – Reserved
3.1.10.1Responses
TABLE 3-26:RESPONSE 1 STRUCTURE
Byte
Index
00x61 – Get NVRAM Settings – echos back the given command code
10x00 – Command Completed Successfully
20x40 – Sub-command Echoed Back for Get USB Product Name code
3Don’t Care
4Total USB String Descriptor Length (this is the length of the Product string multiplied by 2 + 2)
Example
- The retrieved value is: (25 x 2) + 2 = 52 (decimal) = 0x34
5USB String Descriptor ID – always 0x03
6Unicode Character Low byte
Example
- This byte index will have a value of 0x4D
7Unicode Character High byte
Example: For the “MCP2210 USB to SPI Master” Unicode string, there will be the high byte of the
- This byte index will have a value of 0x00
8-63Remaining Unicode Characters
: “MCP2210 USB to SPI Master” has 25 Unicode characters
: For the “MCP2210 USB to SPI Master” Unicode string, there will be the low byte of the
Unicode for character “M”.
Unicode for character “M”.
Meaning
Meaning
FIGURE 3-10:GET USB PRODUCT NAME LOGIC FLOW
2011 Microchip Technology Inc.DS22288A-page 31
MCP2210
3.1.11SEND ACCESS PASSWORD
TABLE 3-27:COMMAND STRUCTURE
Byte
Index
00x70 – SEND ACCESS Password – command code
10x00 – Reserved
20x00 – Reserved
30x00 – Reserved
4Password Character 0
5Password Character 1
6Password Character 2
7Password Character 3
8Password Character 4
9Password Character 5
10Password Character 6
11Password Character 7
12-630x00 – Reserved
3.1.11.1Responses
Meaning
TABLE 3-28:RESPONSE 1 STRUCTURE
Byte
Index
00x70 – SEND ACCESS Password – echos back the given command code
10x00 – Command Completed Successfully – chip settings not protected
2Don’t Care
3-63Don’t Care
Meaning
TABLE 3-29:RESPONSE 2 STRUCTURE
Byte
Index
00x70 – SEND ACCESS Password – echos back the given command code
10xFC – Access Not Allowed – access rejected
2Don’t Care
3-63Don’t Care
Meaning
TABLE 3-30:RESPONSE 3 STRUCTURE
Byte
Index
00x70 – SEND ACCESS Password – echos back the given command code
10xFD – Access Not Allowed – Chip conditional access is on, the password does not match and the
number of attempts is less than the accepted threshold of 5.
2Don’t Care
3-63Don’t Care
Meaning
DS22288A-page 32 2011 Microchip Technology Inc.
MCP2210
Send Access
Password
FALSETRUE
FALSE
FALSE
FALSE
TRUE
TRUE
TRUE
Response 1
Response 2
Response 4
Response 3Response 5
Chip Settings
Protected
Chip Settings
Not Protected
Access Granted
Permanent Lock
Password
Protected
Password
Attempts
< 5
Password
Matched
Access Granted
Chip Access Rejected
Chip Access Rejected
Chip Access Rejected
Increment
the Number of Attempts
Temporarily
Chip Access Lock
TABLE 3-31:RESPONSE 4 STRUCTURE
Byte
Index
00x70 – SEND ACCESS Password – echos back the given command code
10xFB – Access Not Allowed – Chip conditional access is on, the password does not match and the
number of attempts is above the accepted threshold of 5. The Access Password mechanism is
temporarily blocked and no further password access will be accepted until the next power-up.
2Don’t Care
3-63Don’t Care
TABLE 3-32:RESPONSE 5 STRUCTURE
Byte
Index
00x70 – SEND ACCESS Password – echos back the given command code
10x00 – Command Completed Successfully – Chip conditional access is on, the supplied password is
matching the one stored in the chip’s NVRAM.
2Don’t Care
3-63Don’t Care
Meaning
Meaning
FIGURE 3-11:SEND ACCESS PASSWORD LOGIC FLOW
2011 Microchip Technology Inc.DS22288A-page 33
MCP2210
3.2Read/Write RAM Settings
The set of commands/responses described in this section relates to the manipulation of the RAM settings (volatile).
3.2.1 GET (VM) SPI TRANSFER SETTINGS
TABLE 3-33:COMMAND STRUCTURE
Byte
Index
00x41 – Get (VM) SPI Transfer Settings – command code
10x00 – Reserved
20x00 – Reserved
3-630x00 – Reserved
3.2.1.1Responses
TABLE 3-34:RESPONSE 1 STRUCTURE
Byte
Index
00x41 – Get SPI Transfer Settings (volatile memory)
10x00 – Command Completed Successfully
2Size in Bytes of the SPI Transfer Structure: 17 (in decimal) = 0x11
5Read Back Actual GPIO Pin Value – 16-bit value (high byte):
• MSB – – – – – – LSB
x x x x x x x GP8VAL
6-63Don’t Care
Meaning
Meaning
FIGURE 3-19:SET GPIO CURRENT PIN VALUE LOGIC FLOW
2011 Microchip Technology Inc.DS22288A-page 49
MCP2210
Read EEPROM
Memory Location
Response 1
EEPROM
Memory Location
Content Retrieved
3.3Read/Write EEPROM Memory
This set of commands/responses described in this section relates to the manipulation of the EEPROM memory.
3.3.1READ EEPROM MEMORY
TABLE 3-50:COMMAND STRUCTURE
Byte
Index
00x50 – READ EEPROM Memory – command code
1EEPROM Memory Address to be read
20x00 – Reserved
3-630x00 – Reserved
3.3.1.1Responses
TABLE 3-51:RESPONSE 1 STRUCTURE
Byte
Index
00x50 – READ EEPROM Memory – echos back the given command code
10x00 – Command Completed Successfully
2EEPROM Memory Address
3EEPROM Memory content at the requested address
4-63Don’t Care
Meaning
Meaning
FIGURE 3-20:READ EEPROM MEMORY LOGIC FLOW
DS22288A-page 50 2011 Microchip Technology Inc.
3.3.2WRITE EEPROM MEMORY
TABLE 3-52:COMMAND STRUCTURE
Byte
Index
00x51 – WRITE EEPROM Memory – command code
1EEPROM Memory Address to be written
2The value to be written to at the given address
3-630x00 – Reserved
Meaning
3.3.2.1Responses
TABLE 3-53:RESPONSE 1 STRUCTURE
Byte
Index
00x51 – WRITE EEPROM Memory – echos back the given command code
10x00 – Command Completed Successfully
2Don’t Care
3-63Don’t Care
Meaning
MCP2210
TABLE 3-54:RESPONSE 2 STRUCTURE
Byte
Index
00x51 – WRITE EEPROM Memory – echos back the given command code
10xFA – EEPROM Write Failure
2Don’t Care
3-63Don’t Care
Meaning
TABLE 3-55:RESPONSE 3 STRUCTURE
Byte
Index
00x51 – WRITE EEPROM Memory – echos back the given command code
10xFB – EEPROM is password protected or permanently locked
2Don’t Care
3-63Don’t Care
Meaning
2011 Microchip Technology Inc.DS22288A-page 51
MCP2210
FALSE
TRUE
FALSE
FALSE
FALSETRUE
TRUE
TRUE
Response 1
Response 2
Response 3
Response 3
Write EEPROM
Memory Location
Conditional
Access
Password
Protected
Was access
password previously
entered correctly?
EEPROM
Write Failure
Permanent Lock
Requested EEPROM
Memory Location
Not Written
Wrong Password
Requested EEPROM
Memory Location
Not Written
Requested NVRAM SPI
Settings Not Written
EEPROM
Memory Location
Written
FIGURE 3-21:WRITE EEPROM MEMORY LOGIC FLOW
DS22288A-page 52 2011 Microchip Technology Inc.
MCP2210
Get External
Interrupt Pin Events
Counter
Response 1
External Interrupt
Pin Event Counter
Value Retrieved
3.4External Interrupt Pin (GP6) Event Status
The External Interrupt pin event status command is used by the USB host to query the external interrupt events recorded
by the MCP2210. In order to have the MCP2210 record the number of external interrupt events, GP6 must be configured
to have its dedicated function active.
3.4.1GET (VM) THE CURRENT NUMBER OF EVENTS FROM THE INTERRUPT PIN
TABLE 3-56:COMMAND STRUCTURE
Byte
Index
00x12 – Get (VM) the Current Number of Events From the Interrupt Pin
1Reset or Not the Event Counter
• 0x00 – reads, then resets the event counter
• Any other value – the event counter is read, however, the counter is not reset
2-630x00 - Reserved
3.4.1.1Responses
TABLE 3-57:RESPONSE 1 STRUCTURE
Byte
Index
00x12 – Get (VM) the Current Number of Events from the Interrupt Pin – echos back the given
command code
10x00 – Command Completed Successfully
2Don’t Care
3Don’t Care
4Interrupt Event Counter – 16-bit value (low byte)
5Interrupt Event Counter – 16-bit value (high byte)
63-63Don’t Care
Meaning
Meaning
FIGURE 3-22:GET (VM) THE CURRENT NUMBER OF EVENTS FROM THE INTERRUPT PIN
LOGIC FLOW
2011 Microchip Technology Inc.DS22288A-page 53
MCP2210
3.5SPI Data Transfer
The set of commands/responses described in this section relates to the SPI data transfer functionality.
3.5.1TRANSFER SPI DATA
TABLE 3-58:COMMAND STRUCTURE
Byte
Index
00x42 – Transfer SPI Data – command code
1The number of bytes to be transferred in this packet (from 0 to 60 inclusively)
20x00 – Reserved
30x00 – Reserved
4-63The SPI Data to be sent on the data transfer
3.5.1.1Responses
TABLE 3-59:RESPONSE 1 STRUCTURE
Byte
Index
00x42 – Transfer SPI Data – echos back the given command code
10xF7 – SPI Data Not Accepted – SPI bus not available (the external owner has control over it)
2Don’t Care
3-63Don’t Care
Meaning
Meaning
TABLE 3-60:RESPONSES 2 STRUCTURE
Byte
Index
00x42 – Transfer SPI Data – echos back the given command code
10x00 – SPI Data accepted – Command Completed Successfully – SPI data accepted
2How many SPI received data bytes the chip is sending back to the host
3SPI Transfer Engine Status
• 0x20 – SPI transfer started – no data to receive
4-63SPI Received Data Bytes. The number of data bytes is specified at byte index 2
Meaning
TABLE 3-61:RESPONSE 3 STRUCTURE
Byte
Index
00x42 – Transfer SPI Data – echos back the given command code
10xF8 – SPI Data Not Accepted – SPI transfer in progress – cannot accept any data for the moment
2Don’t Care
3-63Don’t Care
Meaning
DS22288A-page 54 2011 Microchip Technology Inc.
TABLE 3-62:RESPONSE 4 STRUCTURE
Transfer SPI Data
FALSETRUE
TRUE
TRUE
TRUE
FALSE
FALSE
FALSE
Ongoing
SPI Transfer
Response 1Response 2
Response 3
Response 5
Response 4
SPI Bus
used by Extern al Master
SPI Bus owned
by an External Master
SPI Data Accepted
The SPI Transfer
will start afterwa rds
SPI Transfer Ended
SPI Transfer
Waiting for More Data
SPI Engine waiting
for more data packets
to complete the SPI T ransfer
SPI Transfer Ended
The response will contain
the last received SPI data
packet of the SPI Transfer
Ongoing SPI Transfer
cannot accept any data now
Byte IndexMeaning
00x42 – Transfer SPI Data – echos back the given command code
10x00 – SPI Data accepted – Command Completed Successfully – SPI data accepted
2How many SPI received data bytes the chip is sending back to the host
30x30 – SPI Transfer Engine Status: SPI transfer not finished; received data available
4-63SPI received data bytes. The number of data bytes is specified at byte index 2
TABLE 3-63:RESPONSE 5 STRUCTURE
Byte IndexMeaning
00x42 – Transfer SPI Data – echos back the given command code
10x00 – SPI Data accepted – Command Completed Successfully – SPI data accepted
2How many SPI received data bytes the chip is sending back to the host
30x10 – SPI Transfer Engine Status: SPI transfer finished – no more data to send
4-63SPI received data bytes. The number of data bytes is specified at byte index 2
FIGURE 3-23:TRANSFER SPI DATA LOGIC FLOW
MCP2210
2011 Microchip Technology Inc.DS22288A-page 55
MCP2210
Cancel Current
SPI Transfer
Response 1
SPI Transfer
Cancelled
3.5.2CANCEL THE CURRENT SPI TRANSFER
TABLE 3-64:COMMAND STRUCTURE
Byte IndexMeaning
00x11 – CANCEL the current SPI transfer – command code
10x00 – Reserved
20x00 – Reserved
3-630x00 – Reserved
3.5.2.1Responses
TABLE 3-65:RESPONSE 1 STRUCTURE
Byte
Index
00x11 – CANCEL the current SPI transfer – echos back the given command code
10x00 – Command Completed Successfully
2SPI Bus Release External Request Status
• 0x01 – No External Request for SPI Bus Release
• 0x00 – Pending External Request for SPI Bus Release
3SPI Bus Current Owner
• 0x00 – No Owner
• 0x01 – USB Bridge
• 0x02 – External Master
4Attempted Password Accesses – informs the USB host on how many times the NVRAM password
was tried
5Password Guessed
• 0x00 – Password Not Guessed
• 0x01 – Password Guessed
6-63Don’t Care
Meaning
FIGURE 3-24:CANCEL THE CURRENT SPI TRANSFER LOGIC FLOW
DS22288A-page 56 2011 Microchip Technology Inc.
MCP2210
3.5.3REQUEST SPI BUS RELEASE
TABLE 3-66:COMMAND STRUCTURE
Byte
Index
00x80 – Request SPI bus Release – command code
1The value of the SPI Bus Release ACK pin (only if GP7 is assigned to this dedicated function)
20x00 – Reserved
3-630x00 – Reserved
3.5.3.1Responses
TABLE 3-67:RESPONSE 1 STRUCTURE
Byte
Index
00x80 – Request SPI bus Release – echos back the given command code
10x00 – Command Completed Successfully – SPI bus released
2Don’t Care
3-63Don’t Care
Meaning
Meaning
TABLE 3-68:RESPONSES 2 STRUCTURE
Byte
Index
00x80 – Request SPI bus Release – echos back the given command code
10xF8 – SPI Bus Not Released – SPI transfer in process
2Don’t Care
3-63Don’t Care
Meaning
2011 Microchip Technology Inc.DS22288A-page 57
MCP2210
Request
SPI Bus Release
SPI Transfer
Ongoing
FALSETRUE
Response 2Response 1
SPI Bus Release
Accepted
SPI Bus Release Not Accepted
SPI Transfer Ongoing
FIGURE 3-25:REQUEST SPI BUS RELEASE LOGIC FLOW
DS22288A-page 58 2011 Microchip Technology Inc.
MCP2210
Get MCP2210
Status
Response 1
MCP2210 Status
Information
Retrieved
3.6Chip Status
The chip status command is used to retrieve status information regarding the state of the SPI transfer engine.
3.6.1GET MCP2210 STATUS
TABLE 3-69:COMMAND STRUCTURE
Byte IndexMeaning
00x10 – Get MCP2210 Status – command code
10x00 – Reserved
20x00 – Reserved
3-630x00 – Reserved
3.6.1.1Responses
TABLE 3-70:RESPONSE 1 STRUCTURE
Byte
Index
00x10 – Get MCP2210 Status – echos back the given command code
10x00 – Command Completed Successfully
2SPI Bus Release External Request Status
• 0x01 – No External Request for SPI Bus Release
• 0x00 – Pending External Request for SPI Bus Release
3SPI Bus Current Owner
• 0x00 – No Owner
• 0x01 – USB Bridge
• 0x02 – External Master
4Attempted Password Accesses – informs the USB host on how many times the NVRAM password
was tried
5Password Guessed
• 0x00 – Password Not Guessed
• 0x01 – Password Guessed
6-63Don’t Care
Meaning
FIGURE 3-26:GET MCP2210 STATUS LOGIC FLOW
2011 Microchip Technology Inc.DS22288A-page 59
MCP2210
3.6.2UNSUPPORTED COMMAND CODES
TABLE 3-71:COMMAND STRUCTURE
Byte
Index
0UsupportedCommand Code
1Don’t Care
2-63Don’t Care
3.6.2.1Responses
TABLE 3-72:RESPONSE 1 STRUCTURE
Byte
Index
0Unsupported Command Code Sent – echos back the given command code
10xF9 – Unknown Command – No effect
2-63Don’t Care
Meaning
Meaning
DS22288A-page 60 2011 Microchip Technology Inc.
NOTES:
MCP2210
2011 Microchip Technology Inc.DS22288A-page 61
MCP2210
4.0ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
Ambient temperature under bias.........................................................................................................-40°C to +85°C
Storage temperature ........................................................................................................................ -65°C to +150°C
Voltage on V
Voltage on MCLR
Voltage on V
Voltage on D+ and D- pins with respect to V
Voltage on all other pins with respect to V
Total power dissipation
Maximum current out of V
Maximum current into V
Clamp current, I
Maximum output current sunk by any I/O pin....................................................................................................25 mA
Maximum output current sourced by any I/O pin...............................................................................................25 mA
Maximum current sunk by all ports....................................................................................................................90 mA
Maximum current sourced by all ports ............................................................................................................. 90 mA
Note 1: Power dissipation is calculated as follows: P
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for
extended periods may affect device reliability.
DD with respect to VSS ................................................................................................... -0.3V to +6.0V
with respect to Vss ................................................................................................. -0.3V to +9.0V
USB pin with respect to VSS ............................................................................................ -0.3V to +4.0V
The timing parameter symbols have been created in one of the following formats:
1. TppS2ppS2. TppS
T
FFrequencyTTime
EError
Lowercase letters (pp) and their meanings:
pp
ioInput or Output pinoscOscillator
rxReceivetxTransmit
bitclkRX/TX BITCLK RSTReset
drtDevice Reset Timer
Uppercase letters and their meanings:
S
FFallPPeriod
HHighRRise
IInvalid (high-impedance)VValid
LLowZHigh-impedance
4.2.2TIMING CONDITIONS
The operating temperature and voltage specified in
Table 4-3 apply to all timing specifications unless other-
wise noted. Figure 4-2 specifies the load conditions for
the timing specifications.
TABLE 4-3:TEMPERATURE AND VOLTAGE SPECIFICATIONS – AC
Standard Operating Conditions (unless otherwise stated)
AC CHARACTERISTICS
Operating temperature -40C T
Operating voltage V
Section 4.1 “DC Characteristics”.
DD range as described in DC spec,
A +85C
FIGURE 4-2:LOAD CONDITIONS
FOR DEVICE TIMING
SPECIFICATIONS
DS22288A-page 66 2011 Microchip Technology Inc.
MCP2210
4.2.3TIMING DIAGRAMS AND
SPECIFICATIONS
TABLE 4-4:RESET, OSCILLATOR START-UP TIMER AND POWER-UP TIMER PARAMETERS
Standard Operating Conditions (unless otherwise stated)
Operating Temperature -40°C T
Param
No.
30T
31T
32TOSTOscillator start-up time—1024—TOST
SymCharacteristicMinTyp
RST
MCLR Pulse Width (low)
PWRT Power-up timer4065140ms
* These parameters are characterized but not tested.
† Data in “Typ” column is at 5V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
A+85°C
†
Max UnitsConditions
2——μs
2011 Microchip Technology Inc.DS22288A-page 67
MCP2210
Legend: XX...XCustomer-specific information
YYear code (last digit of calendar year)
YYYear code (last 2 digits of calendar year)
WWWeek code (week of January 1 is week ‘01’)
NNNAlphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ()
can be found on the outer packaging for this package.
Note:In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
20-Lead SOICExample
20-Lead 5x5 QFN
Example
20-Lead SSOP Example
PIN 1PIN 1
MCP2210
I/MQ ^^
1146256
3
e
MCP2210
I/SO ^^
1146256
MCP2210
I/SS ^^
1146256
3
e
5.0PACKAGING INFORMATION
5.1Package Marking Information
3
e
3
e
DS22288A-page 68 2011 Microchip Technology Inc.
20-Lead Plastic Quad Flat, No Lead Package (MQ) 5x5x0.9 mm Body [QFN]
Note:For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
MicrochipTechnologyDrawingC04-120A
MCP2210
2011 Microchip Technology Inc.DS22288A-page 69
MCP2210
Note:For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS22288A-page 70 2011 Microchip Technology Inc.
Note:For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
MCP2210
2011 Microchip Technology Inc.DS22288A-page 71
MCP2210
Note:For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS22288A-page 72 2011 Microchip Technology Inc.
Note:For the most current package drawings, please see the Microchip Packaging Specification located at
Note:For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
MCP2210
2011 Microchip Technology Inc.DS22288A-page 75
MCP2210
NOTES:
DS22288A-page 76 2011 Microchip Technology Inc.
APPENDIX A:REVISION HISTORY
Revision A (December, 2011)
• Original Release of this Document.
MCP2210
2011 Microchip Technology Inc.DS22288A-page 77
MCP2210
NOTES:
DS22288A-page 78 2011 Microchip Technology Inc.
PRODUCT IDENTIFICATION SYSTEM
Device:MCP2210:USB to SPI Protocol Converter with GPIO
MCP2210T:USB to SPI Protocol Converter with GPIO
(Tape and Reel)
Temperature
Range:
I= -40C to +85C (Industrial)
Package:MQ = Plastic Quad Flat, No Lead Package
5x5x0.9 mm Body (QFN), 20-Lead
SO= Plastic Small Outline - Wide, 7.50 mm Body (SO),
20-Lead
SS= Plastic Shrink Small Outline - 5.30 mm Body (SS)
20-Lead
Examples:
a)MCP2210- I/MQ: Industrial temperature,
20LD QFN Package.
b)MCP2210T- I/MQ: Tape and Reel,
Industrial temperature,
20LD QFN Package.
a)MCP2210- I/SO: Industrial temperature,
20LD SOIC Package.
b)MCP2210T- I/SO: Tape and Reel,
Industrial temperature,
20LD SOIC Package.
a)MCP2210- I/SS: Industrial temperature,
20LD SSOP Package.
b)MCP2210T- I/SS: Tape and Reel,
Industrial temperature,
20LD SSOP Package.
PART NO.X/XX
PackageTemperature
Range
Device
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
MCP2210
2011 Microchip Technology Inc.DS22288A-page 79
MCP2210
NOTES:
DS22288A-page 80 2011 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•Microchip products meet the specification contained in their particular Microchip Data Sheet.
•Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•Microchip is willing to work with the customer who is concerned about the integrity of their code.
•Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
K
logo, rfPIC and UNI/O are registered trademarks of
PIC
Microchip Technology Incorporated in the U.S.A. and other
countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, chipKIT,
chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net,
dsPICworks, dsSPEAK, ECAN, ECONOMONITOR,
FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP,
Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB,
MPLINK, mTouch, Omniscient Code Generation, PICC,
PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE,
rfLAB, Select Mode, Total Endurance, TSHARC,
UniWinDriver, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
®
MCUs and dsPIC® DSCs, KEELOQ
®
code hopping
2011 Microchip Technology Inc.DS22288A-page 81
Worldwide Sales and Service
AMERICAS
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088