64K x 18 Bit Synchronous
Dual I/O, Dual Address SRAM
The MCM69D618 is a 1M–bit static random access memory , organized as 64K
words of 18 bits. It features common data input and data output buffers and
incorporates input and output registers on–board with high speed SRAM.
The MCM69D618 allows the user to concurrently perform reads, writes, or
pass–through cycles in combination on the two data ports. The two address ports
(AX, AY) determine the read or write locations for their respective data ports
(DQX, DQY).
The synchronous design allows for precise cycle control with the use of an
external single clock (K). All signal pins except output enables (GX
registered on the rising edge of clock (K).
The pass–through feature allows data to be passed from one port to the other,
in either direction. The PTX
port Y. The PTY
operation takes precedence over a read operation.
For the case when AX and A Y are the same, certain protocols are followed. If
both ports are read, the reads occur normally . If one port is written and the other
is read, the read from the array will occur before the data is written. If both ports
are written, only the data on DQY will be written to the array .
• Single 3.3 V ± 5% Power Supply
• Fast Access Times: 6/8 ns Max
• Throughput of 1.49 Gigabits/Second
• Single Clock Operation
• Address, Data Input, E1
On–Chip
• 83 MHz Maximum Clock Frequency
• Self Timed Write
• Two Bi–Directional Data Buses
• Can be Configured as Separate I/O
• Pass–Through Feature
• Asynchronous Output Enables (GX
• L VTTL Compatible I/O
• Concurrent Reads and Writes
• 100–Pin TQFP Package
Suggested Applications
— A TM— Ethernet Switches— Routers
— Cell/Frame Buffers — SNA Switches— Shared Memory
will likewise pass data from port Y to port X. A pass–through
input must be asserted to pass data from port X to
, E2, PTX, PTY, WX, WY, and Data Output Registers
, GY)
, GY) are
MCM69D618
TQ PACKAGE
100 LEAD TQFP
CASE 983A–01
Product Family Configurations
Part
Number
MCM69D536
MCM69D618
MCM67Q709A
MCM67Q909
NOTES:
1. Tie AX and AY address ports together for the part to function as a single address part.
2. Tie GX
REV 5
1/16/98
Motorola, Inc. 1998
MOTOROLA FASTSRAM
high for DQX to be inputs and tie WY high and GY low for DQY to be outputs.
90E1InputSynchronous Chip Enable: Active low.
91E2InputSynchronous Chip Enable: Active high.
92GXInputAsynchronous Output Enable Port X Input:
93GYInputAsynchronous Output Enable Port Y Input:
96KInputClock: This signal registers the address, data in, and all control signals
86PTXInputPass–Through Port X.
87PTYInputPass–Through Port Y.
88WXInputSynchronous Write Enable Port X.
89WYInputSynchronous Write Enable Port Y.
1, 7, 13, 19, 25, 41, 54, 60, 66, 72, 78, 95V
2, 8, 14, 20, 26, 55, 61, 67, 73, 79, 94V
AX0 –
AX15
AY0 –
AY15
DQX0 –
DQX17
DQY0 –
DQY17
DD
SS
TypeDescription
InputAddress Port X. Never allow floating addresses for inputs AX0 – AX15.
InputAddress Port Y. Never allow floating addresses for inputs AY0 – AY15.
Supply + 3.3 V Power Supply.
Supply Ground.
A pullup resistor is needed.
A pullup resistor is needed.
I/OData Input/Output Port X.
I/OData Input/Output Port Y.
Low — enables output buffers (DQXx pins).
High — DQXx pins are high impedance.
Low — enables output buffers (DQYx pins).
High — DQYx pins are high impedance.
except G
.
MCM69D618
4
MOTOROLA FAST SRAM
Page 5
TRUTH TABLE (See Notes 1 through 5)
Input at tn Clock
Operation Number
1HXXXXXDeselected
2XLXXXXDeselected
3LH0XXXWrite X Port
4LHX0XXWrite Y Port
5LHXX0XPass–Through X to Y
6LHXXX0Pass–Through Y to X
7LH1X11Read X
8LHX111Read Y
NOTES:
1. GX
/GY must be controlled to avoid bus contention issues during write and pass–through cycles.
2. Operation numbers 3 – 6 can be used in any combination.
3. Operation numbers 4 and 7, 3 and 8, 7 and 8 can be combined.
4. Operation number 5 can not be combined with operation number 7 or 8 because pass–through takes precedence over a read operation.
5. Operation number 6 can not be combined with operation number 7 or 8 because pass–through takes precedence over a read operation.
E1E2WXWYPTXPTYOperation
K
ADDRESS & CONTROL
DATA INPUT D
DATA OUTPUT Q
t
n
VALID
VALID
PASS–THROUGH
tn +
PIPELINED READ ACCESS
ABSOLUTE MAXIMUM RATINGS (See Note)
Rating
Power Supply VoltageV
Voltage Relative to VSS for Any Pin
Except V
Output CurrentI
Power DissipationP
Temperature Under BiasT
Operating TemperatureT
Storage Temperature — PlasticT
NOTE: Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are
DD
exceeded. Functional operation should be restricted to RECOMMENDED OPERATING CONDITIONS. Exposure to higher than recommended voltages for extended
periods of time could affect device reliability.
SymbolValueUnit
DD
Vin, V
out
bias
stg
out
D
A
– 0.5 to + 4.6V
– 0.5 to VDD + 0.5V
± 20mA
TBDW
– 10 to + 85°C
0 to + 70°C
– 55 to + 125°C
1
VALID
This is a synchronous device. All synchronous inputs must meet specified setup and hold
times with stable logic levels for
edges of clock (K) while the device is selected.
This device contains circuitry to protect the
inputs against damage due to high static voltages or electric fields; however, it is advised
that normal precautions be taken to avoid
application of any voltage higher than maximum rated voltages to these high–impedance
circuits.
ALL
rising
MOTOROLA FAST SRAM
MCM69D618
5
Page 6
PACKAGE THERMAL CHARACTERISTICS (See Note 1)
Rating
Junction to Ambient (@ 200 lfm)Single–Layer Board
Four–Layer Board
Junction to Board (Bottom)R
Junction to Case (Top)R
NOTES:
1. Junction temperature is a function of on–chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, board population, and board thermal resistance.
2. Per SEMI G38–87.
3. Indicates the average thermal resistance between the die and the printed circuit board.
4. Indicates the average thermal resistance between the die and the case top surface via the cold plate method (MIL SPEC–883 Method 1012.1).
SymbolTQFPUnitNotes
R
θJA
θJB
θJC
40
25
17°C/W3
9°C/W4
°C/W2
DC OPERA TING CONDITIONS AND CHARACTERISTICS
(VDD = 3.3 V ± 5%, TA = 0 to 70°C, Unless Otherwise Noted)
RECOMMENDED OPERATING CONDITIONS AND SUPPLY CURRENTS
ParameterSymbolMinMaxUnit
Supply Voltage (Operating Voltage Range)V
Input High VoltageV
Input Low VoltageV
Input Leakage Current (All Inputs, Vin = 0 to VDD)I
Output Leakage Current (E = VIH, V
AC Supply Current (I
CMOS Standby Supply Current (Deselected, Clock (K)MCM69D618–6 ns
Cycle Time ≥ t
Vin ≤ VSS + 0.2 V or ≥ VDD – 0.2 V)
Output Low Voltage (IOL = + 8.0 mA)V
Output High Voltage (IOH = – 4.0 mA)V
*VIL ≥ –1.5 V for t ≤ t
**VIH ≤ VDD + 1.0 V for t ≤ t
KHKH
= 0 mA) (VDD = max, f = f
out
, All Inputs Toggling at CMOS Levels MCM69D618–8 ns
/2.
KHKH
KHKH
= 0 to VDD)I
out
)MCM69D618–6 ns
max
/2.
MCM69D618–8 ns
lkg(O)
I
DD
IH
IL
lkg(I)
DDA
I
SB1
OL
OH
3.1353.465V
2.0VDD + 0.5**V
– 0.5*0.8V
—± 1.0µA
—± 1.0µA
—
—
—
—
—0.4V
2.4V
300
300
100
100
DD
mA
mA
V
CAPACITANCE (f = 1.0 MHz, dV = 3.0 V, T
Address and Data Input CapacitanceC
Control Pin Input CapacitanceC
Output CapacitanceC
= 0 to + 70°C, Periodically Sampled Rather Than 100% Tested)
A
Parameter
SymbolMaxUnit
in
in
out
6pF
6pF
8pF
MCM69D618
6
MOTOROLA FAST SRAM
Page 7
AC OPERA TING CONDITIONS AND CHARACTERISTICS
(VDD = 3.3 V ± 5%, TA = 0 to 70°C, Unless Otherwise Noted)
Cycle Timet
Clock Access Timet
Clock Low Pulse Widtht
Clock High Pulse Widtht
Clock High to Data Output Activet
Clock High to Data Output Invalidt
Clock High to Data Output High–Zt
Output Enable Low to Data Output Validt
Output Enable Low to Data Output Low–Zt
Output Enable High to Data Output High–Zt
Setup Times:AWR0 – AWR14
Hold Times:AWR0 – AWR14
NOTES:
1. All read and write cycles are referenced from K.
2. This parameter is sampled and not 100% tested.
3. This is a synchronous device. All synchronous inputs must meet the specified setup and hold times with stable logic levels for
edges of clock (K) while the device is selected.
4. t
minimum for Port Y only extends to 4.0 ns only for the special case when the Y– and X–address are identical on the same rising
KHDX
clock edge.
ARD0 – ARD14
W
PT
E1, E2
D0 – D35
ARD0 – ARD14
W
PT
E1, E2
D0 – D35
KHKH
KHQV
KLKH
KHKL
KHQX1
KHQX2
KHQZ
GLQV
GLQX
GHQZ
t
AVKH
t
AVKH
t
WVKH
t
PTVKH
t
EVKH
t
DVKH
t
KHAX
t
KHAX
t
KHWX
t
KHPTX
t
KHEX
t
KHDX
MinMaxMinMax
12—15—ns1
—6—8ns
4—6—ns
4—6—ns
0—0—ns
2—2—ns
—5—5ns2
—6—8ns
0
—5—8ns2
2.5—3—ns3
0.5—1—ns3
—
0—ns
UnitNotes
3
3
3
3
3, 4
ALL
rising
MOTOROLA FAST SRAM
OUTPUT
Z0 = 50
Figure 1. AC Test Load
Ω
RL = 50
Ω
VL = 1.5 V
MCM69D618
7
Page 8
READ CYCLE TIMING FROM BOTH PORTS (WX, WY, PTX, PTY HIGH)
t
KHKHt
K
KLKH
t
KHKL
PORT X
PORT Y
AX
GX
DQX
AY
GY
t
AVKH
1
t
KHQX1
E
12
23456789
t
KHQV
Q(1)Q(2)Q(3)Q(5)Q(6)
t
EVKH
t
KHEX
13141516671920
t
KHAX
t
GHQZ
Q(7)
t
GLQX
t
GLQV
DQY
NOTE: E Low = E1 Low and E2 High. E High = E1 High or E2 Low.
Q(12)Q(13)Q(14)Q(16)Q(6)Q(7)
t
KHQZ
t
KHQV
MCM69D618
8
MOTOROLA FAST SRAM
Page 9
WRITE CYCLE TIMING TO BOTH PORTS (PTX, PTY HIGH)
PORT X
AX
WX
GX
DQX
t
KHKH
K
123456789
t
t
WVKH
D(2)D(3)D(4)
E
KHWX
t
DVKH
t
KLKH
t
KHDX
t
KHKL
D(8)D(9)
AY
WY
PORT Y
GY
DQY
NOTE: E Low = E1 Low and E2 High. E High = E1 High or E2 Low.
121314
D(14)D(15)D(19)D(18)
15
56181920
D(5)D(6)
PORT Y TAKES PRECEDENCE
OVER PORT X WHEN AX = AY
AND WRITING BOTH PORTS.
MOTOROLA FAST SRAM
MCM69D618
9
Page 10
WRITE TO PORT X AND PASS–THROUGH TO PORT Y (See Note)
PORT X
AX
WX
GX
PTX
DQX
E
t
KHKH
K
123456789
t
KHPTX
t
DVKH
D(2)D(3)D(X)D(Y)D(6)
t
KLKH
t
KHDX
t
PTVKH
t
KHKL
AY
WY
PORT Y
E Low = E1 Low and E2 High. E High = E1 High or E2 Low.
NOTE: The timing diagram is valid for the opposite case as well, i.e., writing to Port Y and passing through to Port X.
GY
PTY
DQY
121314
t
KHQV
t
KHQX2
15
1617181920
t
KHQZ
D(3)D(X)
D(Y)
D(17)
MCM69D618
10
MOTOROLA FAST SRAM
Page 11
COMBINATION READ/WRITE WITH SAME ADDRESS ON EACH PORT
PORT X
AX
WX
GX
DQX
AY
K
TRY TO
WRITE
D(ABC)D(DEF)
WRITEWRITE
t
KHKH
TRY TO
WRITE
1
12123
2123
READREADREADREADREADREAD
READREADREADWRITEREADREAD
t
KLKH
23
t
KHKL
Q(XYZ)Q(JKL)Q(PQR)
WY
PORT Y
GY
DQY
PTX = PTY = high.
D(Value) = Value is the input to the data port.
Q(Value) = Value is the output from the data port.
D(PQR)D(XYZ)Q(PQR)D(JKL)Q(JKL)
PORT Y TAKES PRECEDENCE
OVER PORT X WHEN AX = AY
AND WRITING BOTH PORTS.
Q3
MOTOROLA FAST SRAM
MCM69D618
11
Page 12
Motorola Memory Prefix
Part Number
ORDERING INFORMATION
(Order by Full Part Number)
MCM 69D618 XX XXX
Shipping Method (R = Tape and Reel,
Blank = Rails)
Speed (6 = 6ns, 8 = 8 ns)
Package (TQ = TQFP)
Full Part Numbers — MCM69D618TQ6MCM69D618TQ8
MCM69D618TQ6R MCM69D618TQ8R
MCM69D618
12
MOTOROLA FAST SRAM
Page 13
P ACKAGE DIMENSIONS
4X
A–B0.20 (0.008) H
D
8051
–D–
TQFP PACKAGE
100 PIN
CASE 983A–01
2X 30 TIPS
A–B0.20 (0.008) CD
e
e/2
–A–
–H–
–C–
SEATING
PLANE
0.05 (0.002)
81
100
S
2X 20 TIPS
A
A2
A1
D1/2
CD
S
R1
VIEW AB
50
E/2
–B–
E1
E
E1/2
31
301
BASE
METAL
B
B
–X–
X=A, B, OR D
VIEW Y
PLATING
b1
c
c1
D/2
D1
D
A–B0.20 (0.008)
q
2
q
3
0.10 (0.004)
NOTES:
C
VIEW AB
q
1
0.25 (0.010)
GAGE PLANE
R2
L2
L
q
L1
0.13 (0.005)D
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M,
1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF LEAD
AND IS COINCIDENT WITH THE LEAD WHERE THE
LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF
THE PARTING LINE.
4. DATUMS –A–, –B– AND –D– TO BE DETERMINED AT
DATUM PLANE –H–.
5. DIMENSIONS D AND E TO BE DETERMINED AT
SEATING PLANE –C–.
6. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS D1 AND B1 DO
INCLUDE MOLD MISMATCH AND ARE DETERMINED AT
DATUM PLANE –H–.
7. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL NOT
CAUSE THE b DIMENSION TO EXCEED 0.45 (0.018).
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty , representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “T ypical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
Opportunity/Affirmative Action Employer.
How to reach us:
USA/EUROPE /Locations Not Listed: Motorola Literature Distribution;JAPAN: Nippon Motorola Ltd.: SPD, Strategic Planning Office, 141,
P.O. Box 5405, Denver , Colorado, 80217. 1-303-675-2140 or 1-800-441-2447 4-32-1 Nishi-Gotanda, Shagawa-ku, Tokyo, Japan. 03-5487-8488
Mfax: RMFAX0@email.sps.mot.com – TOUCHTONE 1-602-244-6609ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B T ai Ping Industrial Park,
Motorola Fax Back System– US & Canada ONLY 1-800-774-1848 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852-26629298
– http://sps.motorola.com/mfax/
HOME PAGE: http://motorola.com/sps/CUSTOMER FOCUS CENTER: 1-800-521-6274
Mfax is a trademark of Motorola, Inc.
MCM69D61814
◊
MOTOROLA FASTSRAM
MCM69D618/D
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