Datasheet MCM6926AWJ8R, MCM6926AWJ12R, MCM6926AWJ8, MCM6926AWJ10R, MCM6926AWJ12 Datasheet (Motorola)

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Page 1
MCM6926A
1
MOTOROLA FAST SRAM
Advance Information
128K x 8 Bit Fast Static Random Access Memory
The MCM6926A is a 1,048,576 bit static random access memory organized as 131,072 words of 8 bits. Static design eliminates the need for external clocks or timing strobes.
Output enable (G
) is a special control feature that provides increased system
flexibility and eliminates bus contention problems.
This device meets JEDEC standards for functionality and revolutionary pinout, and is available in a 400 mil plastic small–outline J–leaded package.
Single 3.3 V Power Supply
Fully Static — No Clock or Timing Strobes Necessary
All Inputs and Outputs Are TTL Compatible
Three State Outputs
Fast Access Times: 8, 10, 12, 15 ns
Center Power and I/O Pins for Reduced Noise
Fully 3.3 V BiCMOS
BLOCK DIAGRAM
ROW
DECODER
MEMORY
MATRIX
512 ROWS x 256 x 8
COLUMNS
INPUT
DATA
CONTROL
COLUMN I/O
COLUMN DECODER
A A A A A A A A
DQ
AA A A
E
W
V
DD
V
SS
A
A A A A
DQ
G
This document contains information on a new product. Motorola reserves the right to change or discontinue this product without notice.
Order this document
by MCM6926A/D
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
PIN ASSIGNMENT
MCM6926A
WJ PACKAGE
400 MIL SOJ
CASE 857A–02
32 31 30 29 28 27
26 25 24 23 22 21
2 3
1
5 6
4
7
9 10
8
12 13
11
14
20
15 16
19 18
17
A A A E
A
W
A A
A
V
DD
A
A A
A
DQ
DQ
A G
A
A
V
SS
DQ
DQ
AA
A
DQ
DQ
DQ
DQ
A Address Input. . . . . . . . . . . . . . . . . . . . . . .
E
Chip Enable. . . . . . . . . . . . . . . . . . . . . . . .
W
Write Enable. . . . . . . . . . . . . . . . . . . . . . .
G
Output Enable. . . . . . . . . . . . . . . . . . . . .
DQ Data Input/Output. . . . . . . . . . . . . . . . .
V
DD
+ 3.3 V Power Supply. . . . . . . . . . . . .
V
SS
Ground. . . . . . . . . . . . . . . . . . . . . . . . .
PIN NAMES
V
SS
V
DD
REV 1 2/25/97
Motorola, Inc. 1997
Page 2
MCM6926A 2
MOTOROLA FAST SRAM
TRUTH TABLE (X = Don’t Care)
E G W Mode VDD Current Output Cycle
H X X Not Selected I
SB1
, I
SB2
High–Z
L H H Output Disabled I
DDA
High–Z
L L H Read I
DDA
D
out
Read Cycle
L X L Write I
DDA
High–Z Write Cycle
ABSOLUTE MAXIMUM RATINGS (See Note)
Rating
Symbol Value Unit
Power Supply Voltage V
DD
– 0.5 to + 4.6 V
Voltage Relative to VSS for Any Pin Except V
DD
Vin, V
out
– 0.5 to VDD + 0.5 V
Output Current I
out
± 30 mA
Power Dissipation P
D
0.6 W
Temperature Under Bias T
bias
– 10 to + 85 °C
Operating Temperature T
A
0 to + 70 °C
Storage Temperature — Plastic T
stg
– 55 to + 125 °C
NOTE: Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are
exceeded. Functional operation should be restricted to RECOMMENDED OPER­ATING CONDITIONS. Exposure to higher than recommended voltages for extended periods of time could affect device reliability.
DC OPERA TING CONDITIONS AND CHARACTERISTICS
(VDD = 3.3 V + 10%, – 5%, TA = 0 to 70°C, Unless Otherwise Noted)
RECOMMENDED OPERATING CONDITIONS
Parameter Symbol Min Typ Max Unit
Supply Voltage (Operating Voltage Range) V
DD
3.135 3.3 3.6 V
Input High Voltage V
IH
2.2
VDD + 0.3**
V
Input Low Voltage V
IL
– 0.5*
0.8 V
*VIL (min) = – 0.5 V dc; VIL (min) = – 2.0 V ac (pulse width 2.0 ns) for I 20.0 mA.
**VIH (max) = VDD + 0.3 V dc; VIH (max) = VDD + 2 V ac (pulse width 2.0 ns) for I 20.0 mA.
DC CHARACTERISTICS
Parameter Symbol Min Max Unit
Input Leakage Current (All Inputs, Vin = 0 to VDD) I
lkg(I)
± 1.0 µA
Output Leakage Current (E = VIH, V
out
= 0 to VDD) I
lkg(O)
± 1.0 µA
Output Low Voltage (IOL = + 8.0 mA) V
OL
0.4 V
Output High Voltage (IOH = – 4.0 mA) V
OH
2.4 V
This device contains circuitry to protect the inputs against damage due to high static volt­ages or electric fields; however, it is advised that normal precautions be taken to avoid application of any voltage higher than maxi­mum rated voltages to these high–impedance circuits.
This BiCMOS memory circuit has been de­signed to meet the dc and ac specifications shown in the tables, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow of at least 500 linear feet per minute is maintained.
Page 3
MCM6926A
3
MOTOROLA FAST SRAM
POWER SUPPLY CURRENTS (See Note 1)
6926A–8 6926A–10 6926A–12 6926A–15
Parameter Symbol
Typ Max Typ Max Typ Max Typ Max
Unit Notes
AC Active Supply Current
(I
out
= 0 mA) (VDD = max, f = f
max
)
I
DDA
150 130 120 110 mA 2, 3, 4
Active Quiescent Current
(E
= VIL, VDD = max, f = 0 MHz)
I
DD2
80 80 80 80 mA
AC Standby Current
(E
= VIH, VDD = max, f = f
max
)
I
SB1
50 45 40 35 mA 2, 3, 4
CMOS Standby Current
(VDD = max, f = 0 MHz, E
VDD – 0.2 V,
Vin VSS + 0.2 V, or VDD – 0.2 V)
I
SB2
20 20 20 20 mA
NOTES:
1. Typical current = 25°C @ 3.3 V.
2. Reference AC Operating Conditions and Characteristics for input and timing (VIH/VIL, tr/tf, pulse level 0 to 3.0 V , VIH = 3.0 V).
3. All address transition simultaneously low (LSB) and then high (MSB).
4. Data states are all zero.
CAPACITANCE (f = 1.0 MHz, dV = 3.0 V, T
A
= 25°C, Periodically Sampled Rather Than 100% Tested)
Parameter Symbol Typ Max Unit
Address Input Capacitance C
in
6 pF
Control Pin Input Capacitance C
in
6 pF
Input/Output Capacitance C
I/O
8 pF
Page 4
MCM6926A 4
MOTOROLA FAST SRAM
AC OPERA TING CONDITIONS AND CHARACTERISTICS
(VDD = 3.3 V + 10%, – 5%, TA = 0 to +70°C, Unless Otherwise Noted)
Input Timing Measurement Reference Level 1.5 V. . . . . . . . . . . . . . .
Input Pulse Levels 0 to 3.0 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input Rise/Fall Time 2 ns. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output Timing Measurement Reference Level 1.5 V. . . . . . . . . . . . .
Output Load See Figure 1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
READ CYCLE TIMING (See Notes 1 and 2)
6926A–8 6926A–10 6926A–12 6926A–15
Parameter Symbol
Min Max Min Max Min Max Min Max
Unit Notes
Read Cycle Time t
AVAV
8 10 12 15 ns 3
Address Access Time t
AVQV
8 10 12 15 ns
Enable Access Time t
ELQV
8 10 12 15 ns
Output Enable Access Time t
GLQV
4 5 6 7 ns
Output Hold from Address Change t
AXQX
3 3 3 3 ns
Enable Low to Output Active t
ELQX
3 3 3 3 ns 4, 5, 6
Output Enable Low to Output Active t
GLQX
0 0 0 0 ns 4, 5, 6
Enable High to Output High–Z t
EHQZ
4 5 6 7 ns 4, 5, 6
Output Enable High to Output High–Z t
GHQZ
4 5 6 7 ns 4, 5, 6
NOTES:
1. W
is high for read cycle.
2. For common I/O applications, minimization or elimination of bus contention conditions is necessary during read and write cycles.
3. All read cycle timings are referenced from the last valid address to the first transitioning address.
4. At any given voltage and temperature, t
EHQZ
max < t
ELQX
min, and t
GHQZ
max < t
GLQX
min, both for a given device and from device
to device.
5. Transition is measured 200 mV from steady–state voltage.
6. This parameter is sampled and not 100% tested.
7. Device is continuously selected (E
= VIL, G = VIL).
8. Addresses valid prior to or coincident with E
going low.
The table of timing values shows either a minimum or a maximum limit for each parameter. Input require­ments are specified from the external system point of view. Thus, address setup time is shown as a mini­mum since the system must supply at least that much time. On the other hand, responses from the memory are specified from the device point of view. Thus, the access time is shown as a maximum since the device never provides data later than that time.
TIMING LIMITS
OUTPUT
Z0 = 50
RL = 50
VL = 1.5 V
Figure 1. AC Test Load
Page 5
MCM6926A
5
MOTOROLA FAST SRAM
Q (DATA OUT)
A (ADDRESS)
DATA VALIDPREVIOUS DATA VALID
t
AVAV
t
AXQX
t
AVQV
READ CYCLE 1 (See Note 7)
t
EHQZ
DATA VALID
t
GHQZ
t
AVAV
t
ELQX
t
ELQV
E (CHIP ENABLE)
Q (DATA OUT)
A (ADDRESS)
t
AVQV
t
GLQX
t
GLQV
G (OUTPUT ENABLE)
READ CYCLE 2 (See Note 8)
Page 6
MCM6926A 6
MOTOROLA FAST SRAM
WRITE CYCLE 1 (W Controlled, See Notes 1 and 2)
6926A–8 6926A–10 6926A–12 6926A–15
Parameter Symbol
Min Max Min Max Min Max Min Max
Unit Notes
Write Cycle Time t
AVAV
8 10 12 15 ns 3
Address Setup Time t
AVWL
0 0 0 0 ns
Address Valid to End of W rite t
AVWH
8 9 10 12 ns
Address Valid to End of W rite, G High t
AVWH
7 8 9 10 ns
Write Pulse Width t
WLWH
,
t
WLEH
8 9 10 12 ns
Write Pulse Width, G High t
WLWH
,
t
WLEH
7 8 9 10 ns
Data Valid to End of W rite t
DVWH
4 5 6 7 ns
Data Hold Time t
WHDX
0 0 0 0 ns
Write Low to Data High–Z t
WLQZ
4 5 6 7 ns 4,5,6
Write High to Output Active t
WHQX
3 3 3 3 ns 4,5,6
Write Recovery Time t
WHAX
0 0 0 0 ns
NOTES:
1. A write occurs during the overlap of E
low and W low.
2. For common I/O applications, minimization or elimination of bus contention conditions is necessary during read and write cycles.
3. All write cycle timings are referenced from the last valid address to the first transitioning address.
4. Transition is measured 200 mV from steady–state voltage.
5. This parameter is sampled and not 100% tested.
6. At any given voltage and temperature, t
WLQZ
max < t
WHQX
min both for a given device and from device to device.
DATA VALID
t
DVWH
t
AVWL
t
AVWH
t
AVAV
t
WHAX
t
WLWH
t
WHDX
t
WLQZ
t
WHQX
HIGH–Z
HIGH–Z
A (ADDRESS)
W
(WRITE ENABLE)
E
(CHIP ENABLE)
Q (DATA OUT)
D (DATA IN)
t
WLEH
WRITE CYCLE 1
Page 7
MCM6926A
7
MOTOROLA FAST SRAM
WRITE CYCLE 2 (E Controlled, See Notes 1 and 2)
6926A–8 6926A–10 6926A–12 6926A–15
Parameter Symbol
Min Max Min Max Min Max Min Max
Unit Notes
Write Cycle Time t
AVAV
8 10 12 15 ns 3
Address Setup Time t
AVEL
0 0 0 0 ns
Address Valid to End of W rite t
AVEH
7 8 9 10 ns
Enable to End of Write t
ELEH
,
t
ELWH
7 8 9 10 ns 4,5
Data Valid to End of W rite t
DVEH
4 5 6 7 ns
Data Hold Time t
EHDX
0 0 0 0 ns
Write Recovery Time t
EHAX
0 0 0 0 ns
NOTES:
1. A write occurs during the overlap of E
low and W low.
2. For common I/O applications, minimization or elimination of bus contention conditions is necessary during read and write cycles.
3. All write cycle timings are referenced from the last valid address to the first transitioning address.
4. If E
goes low coincident with or after W goes low, the output will remain in a high impedance condition.
5. If E
goes high coincident with or before W goes high, the output will remain in a high impedance condition.
t
EHDX
t
DVEH
t
EHAX
t
ELWH
t
ELEH
t
AVEL
t
AVEH
DATA VALID
t
AVAV
HIGH–Z
A (ADDRESS)
W
(WRITE ENABLE)
E
(CHIP ENABLE)
Q (DATA OUT)
D (DATA IN)
WRITE CYCLE 2
Page 8
MCM6926A 8
MOTOROLA FAST SRAM
P ACKAGE DIMENSIONS
32–LEAD
400 MIL SOJ
CASE 857A–02
T
0.25 (0.010) A B
S S S
T
0.17 (0.007) A B
S S S
T
0.17 (0.007) B A
S S S
T
0.17 (0.007) B A
S S S
L
32
17
16
1
MIN MINMAX MAX
INCHES MILLIMETERS
DIM
A B C D E
F G K L N P R S
20.83
10.03
3.26
0.41
2.24
0.67
0.89
0.76
11.05
9.27
0.77
21.08
10.29
3.75
0.50
2.48
0.81
1.14
1.14
11.30
9.52
1.01
0.820
0.395
0.128
0.016
0.088
0.026
0.035
0.030
0.435
0.365
0.030
0.830
0.405
0.148
0.020
0.098
0.032
0.045
0.045
0.445
0.375
0.040
1.27 BSC
0.64 BSC
0.050 BSC
0.025 BSC
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. TO BE DETERMINED AT PLANE -T-.
4. DIMENSION A & B DO NOT INCLUDE MOLD PROTRUSION. MOLD PROTRUSION SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
5. DIMENSION A & B INCLUDE MOLD MISMATCH AND ARE DETERMINED AT THE PARTING LINE.
G
K
D
32 PL
DETAIL Z
S RADIUS
R
-B-
P
F
32 PL
N
NOTE 3
NOTE 3
DETAIL Z
C
E
-A-
0.10 (0.004)
SEATING PLANE
-T-
ORDERING INFORMATION
(Order by Full Part Number)
Motorola Memory Prefix Part Number
Package (WJ = 400 mil SOJ)
Full Part Numbers — MCM6926AWJ8 MCM6926AWJ10 MCM6926AWJ12 MCM6926AWJ15
MCM6926AWJ8R MCM6926AWJ10R MCM6926AWJ12R MCM6926AWJ15R
Shipping Method (R = Tape and Reel, Blank = Rails) Speed (8 = 8 ns, 10 = 10 ns, 12 = 12 ns, 15 = 15 ns)
MCM 6926A WJ XX X
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty , representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “T ypical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.
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MCM6926A/D
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