Datasheet MCM67J618BFN5, MCM67J618BFN7, LF353N, LF353D, LF351N Datasheet (Motorola)

MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Product Preview

64K x 18 Bit BurstRAM
Synchronous Fast Static RAM

With Burst Counter and Registered Outputs

The MCM67J618B is a 1,179,648 bit synchronous static random access
memory designed to provide a burstable, high–performance, secondary cache
for the i486 and Pentium microprocessors. It is organized as 65,536 words
of 18 bits, fabricated with Motorola’s high–performance silicon–gate BiCMOS
technology. The device integrates input registers, a 2–bit counter, high speed
SRAM, and high drive registered output drivers onto a single monolithic circuit
for reduced parts count implementation of cache data RAM applications. Syn­chronous design allows precise cycle control with the use of an external clock (K).
BiCMOS circuitry reduces the overall power consumption of the integrated func­tions for greater reliability .

Addresses (A0 – A15), data inputs (D0 – D17), and all control signals except
output enable (G
inverting registers.

This device contains output registers for pipeline operations. At the rising edge
of K, the RAM provides the output data from the previous cycle.

Output enable (G

Burst can be initiated with either address status processor (ADSP) or address
status cache controller (ADSC
generated internally by the MCM67J618B (burst sequence imitates that of the
i486) and controlled by the burst address advance (ADV
pages provide more detailed information on burst controls.

Write cycles are internally self–timed and are initiated by the rising edge of the
clock (K) input. This feature eliminates complex off–chip write pulse generation
and provides increased flexibility for incoming signals.

Dual write enables (LW
bytes. L W
(the upper bits).

This device is ideally suited for systems that require wide data bus widths and
cache memory . See Figure 2 for applications information.

• Single 5 V

• Fast Access Time/Fast Cycle Time = 5 ns/100 MHz, 7 ns/80 MHz

• Byte Writeable via Dual Write Enables

• Internal Input Registers (Address, Data, Control)

• Output Registers for Pipelined Applications

• Internally Self–Timed Write Cycle

• ADSP

, ADSC, and ADV Burst Control Pins

• Asynchronous Output Enable Controlled Three–State Outputs

• Common Data Inputs and Data Outputs

• 3.3 V I/O Compatible

• High Board Density 52–Lead PLCC Package

• ADSP

) are clock (K) controlled through positive–edge–triggered non-

) is asynchronous for maximum system design flexibility.

) input pins. Subsequent burst addresses can be

) input pin. The following

and UW) are provided to allow individually writeable

controls DQ0 – DQ8 (the lower bits), while UW controls DQ9 – DQ17

± 5% Power Supply

Disabled with Chip Enable (E) — Supports Address Pipelining

DQ9

DQ10

V

CC

V

SS
DQ11
DQ12
DQ13
DQ14

V

SS

V

CC
DQ15

DQ16
DQ17

Order this document

by MCM67J618B/D

MCM67J618B

FN PACKAGE

PLASTIC

CASE 778–02

PIN NAMES

A0 – A15 Address Inputs. . . . . . . . . . . . . . . .

K Clock. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

ADV
LW
UW
ADSC
ADSP
E
G

DQ0 – DQ17 Data Input/Output. . . . . . . . . .

V

CC

V

SS

All power supply and ground pins must be
connected for proper operation of the device.

PIN ASSIGNMENT

A6A7E

7 6 5 4 3 2 1525150494847

8
9
10
11
12
13
14
15
16
17
18
19
20

21 22 23 24 25 26 2728 29 30 31 3233

A5

UW

A4A3A2

LW

A1

Lower Byte Write Enable. . . . . . . . . . . .

Upper Byte Write Enable. . . . . . . . . . . .

Controller Address Status. . . . . . . . .

Processor Address Status. . . . . . . . .

ADSP

ADSC

A0

SS

V

Burst Address Advance. . . . . . . . . . . .

+ 5 V Power Supply. . . . . . . . . . . . . . . .

ADV

CC

V

K

A15

Chip Enable. . . . . . . . . . . . . . . . . . . . . . . . .

Output Enable. . . . . . . . . . . . . . . . . . . . . .

G

A8A9A10

A13

A14

A12

Ground. . . . . . . . . . . . . . . . . . . . . . . . . .

46
45
44
43
42
41
40
39
38
37
36
35
34

A11

DQ8
DQ7
DQ6
V

CC

V

SS

DQ5
DQ4
DQ3

DQ2
V

SS

V

CC

DQ1
DQ0

BurstRAM is a trademark of Motorola, Inc.
i486 and Pentium are trademarks of Intel Corp.

This document contains information on a new product under development. Motorola reserves the right to change or discontinue this product without notice.

7/96

 Motorola, Inc. 1996

MOTOROLA FAST SRAM

MCM67J618B

1

BLOCK DIAGRAM (See Note)

ADV

K

ADSC

ADSP

A0 – A15

UW

LW

E

G

DQ0 – DQ8

DQ9 – DQ17

NOTE: All registers are positive–edge triggered. The ADSC or ADSP signals control the duration of the burst and the start of the

9
9

next burst. When ADSP

ADDRESS

REGISTER

WRITE

REGISTER

ENABLE

REGISTER

is sampled low, any ongoing burst is interrupted and a read (independent of W and ADSC) is per-

CLR

BURST LOGIC

Q0

BINARY

COUNTER

Q1

A1 – A0

16

A0

A1

2

A2 – A15

A0

A1

′

′

INTERNAL
ADDRESS

16

18

DATA–IN

REGISTERS

9 9

64K x 18

MEMORY

ARRAY

9

DATA–OUT

REGISTERS

OUTPUT
BUFFER

9

formed using the new external address. Alternatively , an ADSP–initiated two cycle WRITE can be performed by negating
both ADSP
CYCLES timing diagram). When ADSC

and ADSC and asserting L W and/or UW with valid data on the second cycle (see Single Write cycle in WRITE

is sampled low (and ADSP is sampled high), any ongoing burst is interrupted and
a read or write (dependent on W) is performed using the new external address. Chip enable (E) is sampled only when a
new base address is loaded. After the first cycle of the burst, ADV

controls subsequent burst cycles. When ADV is sampled
low, the internal address is advanced prior to the operation. When ADV is sampled high, the internal address is not ad­vanced, thus inserting a wait state into the burst sequence accesses. Upon completion of a burst, the address will wrap
around to its initial state. See BURST SEQUENCE TABLE. Write refers to either or both byte write enables (LW

, UW).

MCM67J618B
2

BURST SEQUENCE TABLE

External Address A15 – A2
1st Burst Address A15 – A2 A1 A0
2nd Burst Address A15 – A2 A1 A0
3rd Burst Address A15 – A2 A1 A0

NOTE: The burst wraps around to its initial state upon

completion.

(See Note)

A1 A0

MOTOROLA FAST SRAM

SYNCHRONOUS TRUTH TABLE (See Notes 1, 2, and 3)

ADSP ADSC ADV UW or LW K Address Used Operation

E

H X L X X L–H N/A Deselected
L L X X X L–H External Address Read Cycle, Begin Burst
L H L X L L–H External Address Write Cycle, Begin Burst
L H L X H L–H External Address Read Cycle, Begin Burst
X H H L L L–H Next Address Write Cycle, Continue Burst
X H H L H L–H Next Address Read Cycle, Continue Burst
X H H H L L–H Current Address Write Cycle, Suspend Burst
X H H H H L–H Current Address Read Cycle, Suspend Burst
H X H L L L–H Next Address Write Cycle, Continue Burst
H X H L H L–H Next Address Read Cycle, Continue Burst
H X H H L L–H Current Address Write Cycle, Suspend Burst
H X H H H L–H Current Address Read Cycle, Suspend Burst

NOTES:

1. X means Don’t Care.

2. All inputs except G

3. Wait states are inserted by suspending burst.

must meet setup and hold times for the low–to–high transition of clock (K).

ASYNCHRONOUS TRUTH TABLE (See Notes 1 and 2)

Operation

Read L Data Out
Read H High–Z
Write X High–Z — Data In

Deselected X High–Z

NOTES:

1. X means Don’t Care.

2. For a write operation following a read operation, G
required setup time and held high through the input data hold time.

G I/O Status

must be high before the input data

ABSOLUTE MAXIMUM RATINGS (Voltages Referenced to V

Rating

Power Supply Voltage V
Voltage Relative to VSS for Any

Pin Except V
Output Current (per I/O) I
Power Dissipation P
Temperature Under Bias T
Operating Temperature T
Storage Temperature T

NOTE: Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are

CC

exceeded. Functional operation should be restricted to RECOMMENDED OPER­ATING CONDITIONS. Exposure to higher than recommended voltages for
extended periods of time could affect device reliability.

Symbol Value Unit

CC

Vin, V

out

bias

– 0.5 to VCC + 0.5 V

out

D

A

stg

= 0 V)

SS

– 0.5 to + 7.0 V

+ 30 mA

1.6 W

– 10 to + 85 °C

0 to + 70 °C

– 55 to + 125 °C

This device contains circuitry to protect the
inputs against damage due to high static volt­ages or electric fields; however, it is advised
that normal precautions be taken to avoid
application of any voltage higher than maxi­mum rated voltages to this high–impedance
circuit.

This BiCMOS memory circuit has been
designed to meet the dc and ac specifications
shown in the tables, after thermal equilibrium
has been established.

This device contains circuitry that will
ensure the output devices are in High–Z at
power up.

MOTOROLA FAST SRAM

MCM67J618B

3

DC OPERA TING CONDITIONS AND CHARACTERISTICS

(VCC = 5.0 V ± 5%, TA = 0 to + 70°C, Unless Otherwise Noted)

RECOMMENDED OPERATING CONDITIONS

Parameter

Supply Voltage (Operating Voltage Range) V
Input High Voltage V
Input Low Voltage V

*VIL (min) = – 0.5 V dc; VIL (min) = – 2.0 V ac (pulse width ≤ 20 ns) for I ≤ 20.0 mA.

**VIH (max) = VCC + 0.3 V dc; VIH (max) = VCC + 2.0 V ac (pulse width ≤ 20 ns) for I ≤ 20.0 mA.

(Voltages Referenced to VSS = 0 V)

Symbol Min Max Unit

CC

IH

IL

4.75 5.25 V

2.2 VCC + 0.3** V

– 0.5* 0.8 V

DC CHARACTERISTICS

Parameter Symbol Min Max Unit

Input Leakage Current (All Inputs, Vin = 0 to VCC) I
Output Leakage Current (G = VIH) I
AC Supply Current (G = VIH, E = VIL, I

VIL = 0.0 V and VIH ≥ 3.0 V, Cycle Time ≥ t
AC Standby Current (E = VIH, I

VIH ≥ 3.0 V, Cycle Time ≥ t
Output Low Voltage (IOL = + 8.0 mA) V
Output High Voltage (IOH = – 4.0 mA) V

NOTE: Good decoupling of the local power supply should always be used. DC characteristics are guaranteed for all possible i486, Pentium bus

cycles.

out

KHKH

CAPACITANCE (f = 1.0 MHz, dV = 3.0 V, T

Input Capacitance (All Pins Except DQ0 – DQ17) C
Input/Output Capacitance (DQ0 – DQ17) C

= 0 mA, All Inputs = VIL or VIH,

out

= 0 mA, All Inputs = VIL and V

min)

Parameter

min)

KHKH

= 25°C, Periodically Sampled Rather Than 100% Tested)

A

IH, VIL

= 0.0 V and

lkg(I)

lkg(O)

I

CCA5

I

CCA7

I

SB1

OL
OH

Symbol Typ Max Unit

in

I/O

— ± 1.0 µA
— ± 1.0 µA
— 310

290

— 75 mA

— 0.4 V

2.4 3.3 V

4 5 pF
6 8 pF

mA

MCM67J618B
4

MOTOROLA FAST SRAM

AC OPERA TING CONDITIONS AND CHARACTERISTICS

(VCC = 5.0 V ± 5% TA = 0 to + 70°C, Unless Otherwise Noted)

Input Timing Measurement Reference Level 1.5 V. . . . . . . . . . . . . . .

Input Pulse Levels 0 to 3.0 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input Rise/Fall Time 3 ns. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Output Timing Reference Level 1.5 V. . . . . . . . . . . . . . . . . . . . . . . . . .

Output Load See Figure 1A Unless Otherwise Noted. . . . . . . . . . . .

READ/WRITE CYCLE TIMING (See Notes 1, 2, 3, and 4)

MCM67J618B–5 MCM67J618B–7

Parameter Symbol Min Max Min Max Unit Notes

Cycle Time t
Clock Access Time t
Output Enable to Output Valid t
Clock High to Output Active t
Clock High to Output Change t
Output Enable to Output Active t
Output Disable to Q High–Z t
Clock High to Q High–Z t
Clock High Pulse Width t
Clock Low Pulse Width t
Setup Times: Address

Hold Times: Address

NOTES:

1. In setup and hold times, W (write) refers to either one or both byte write enables LW

2. A read cycle is defined by UW
ADSP

3. All read and write cycle timings are referenced from K or G

4. G

5. Maximum access times are guaranteed for all possible i486 and Pentium external bus cycles.

6. Transition is measured ± 500 mV from steady–state voltage with load of Figure 1B. This parameter is sampled rather than 100% tested.

7. This is a synchronous device. All addresses must meet the specified setup and hold times for

high for the setup and hold times.

is a don’t care when UW or LW is sampled low.

At any given voltage and temperature, t

ADSC

is low, and the chip is selected. All other synchronous inputs must meet the specified setup and hold times for
K when the chip is enabled.Chip enable must be valid at each rising edge of clock for the device (when ADSP
enabled.

Address Status

Data In

Write

Address Advance

Chip Enable

Address Status

Data In

Write

Address Advance

Chip Enable

and LW high or ADSP low for the setup and hold times. A write cycle is defined by LW or UW low and

KHKH

KHQV

GLQV
KHQX1
KHQX2

GLQX

GHQZ

KHQZ

KHKL

KLKH

t

AVKH

t

ADSVKH

t

DVKH

t

WVKH

t

ADVVKH

t

EVKH

t

KHAX

t

KHADSX

t

KHDX

t

KHWX

t

KHADVX

t

KHEX

max is less than t

KHQZ

10 — 12.5 — ns
— 5 — 7 ns 5
— 5 — 5 ns

0 — 0 — ns
2 — 2 — ns
0 — 0 — ns

— 6 — 6 ns 6

2 6 2 6 ns
4 — 5 — ns
4 — 5 — ns

2.5 — 2.5 — ns 7

0.5 — 0.5 — ns 7

and UW.

.

min for a given device and from device to device.

KHQZ1

ALL

rising edges of K whenever ADSP or

ALL

or ADSC is low) to remain

rising edges of

OUTPUT

MOTOROLA FAST SRAM

AC TEST LOADS

+ 5 V

OUTPUT

255

Z0 = 50

Ω

RL = 50

VL = 1.5 V

Ω

Figure 1A Figure 1B

Ω

480

5 pF

Ω

MCM67J618B

5

READ CYCLES

ADSP ST ARTS NEW BURST

ADSVKH

t

KMWX

t

WVKH

t

ADDR IGNORED

ADSP BLOCKED WITH E HIGH

(ADV SUSPENDS BURST)

GLQX

t

t

ADWKH

t

KHADVX

TO ITS INITIAL STATE)

(BURST WRAPS AROUND

KHQV

t

GHQZ

t

NEW BURST READ

Q (A2) Q (A3) Q(A3+1) Q(A3+2)

Q (A2+2)

Q(A2) Q(A2+1) Q(A2+3)

KHKH

t

MCM67J618B
6

KHQX2

KHQV

t

t

KHQX1

t

Q(A1)

SINGLE READ BURST READ

Q

KLKH

t

KHKL

t

ADSVKH

t

K

KHADSX

t

ADSP

ADSC

KHADSX

t

AVKH

t

KNAX

t

A1 A2 A3

A

LW, UW

EVKH

t

KHEX

t

E

ADV

G

MOTOROLA FAST SRAM

KHWX

t

KHADVX

t

KHDX

t

D(A3 + 2)D(A3 + 1)D(A3)D(A2 + 3)D(A2 + 2)D(A2 + 1)D(A2) D(A2 + 1)D(A1)

NEW BURST WRITEBURST WRITE

WRITE CYCLES

ADSC STAR TS NEW BURST

A3

WVKH

t

ADVVKH

t

DVKH

t

ADV SUSPENDS BURST

(WITH A SUSPENDED CYCLE)

KHKH

t

KHADSX

t

KLKH

t

ADSVKH

t

KHKL

KHADSX

t

t

ADSVKH

t

K

ADSP

ADSC

KHAX

t

AVKH

t

W IS IGNORED FOR FIRST CYCLE WHEN ADSP INITIATES BURST

A1 A2

ADDRESS

LW, UW

KHEX

t

t

EVKH

GHQZ

t

E

ADV

G

DATA IN

SINGLE WRITEBURST READ

Q(An – 1) Q(An)

DATA OUT

MOTOROLA FAST SRAM

MCM67J618B

7

KHKH

t

KLKH

t

KHWX

t

WVKH

t

KHADVX

t

ADVVKH

t

KHDX

t

DVKH

t

GLQX

t

D(A2)

t

KHQV

t

t

KHQX2

GHQZ

COMBINATION READ/WRITE CYCLES (E Low, ADSC High

MCM67J618B
8

K

KHKL

t

KHADSX

t

ADSVKH

t

ADSP

AVKH

t

KHAX

t

A1 A2 A3

A

LW, UW

ADV

Q(A1) Q(A3) Q(A3 + 1) Q(A3 + 2)

READ BURST READWRITE

KHQV

t

KHQX1

t

DESELECT

G

D

Q

MOTOROLA FAST SRAM

APPLICATION EXAMPLE

ADDRESS

Pentium

CONTROL

DATA

CLK

NA

ADS

CLOCK

K

DATA BUS

ADDRESS BUS

ADDR

CACHE

CONTROL LOGIC

ADDR DATA
K
ADSC
W

E
G

ADV ADSP

512K Byte Burstable, Secondary Cache Using

Four MCM67J618BFN7s with a 75 MHz (Bus Speed) Pentium

16 72

MCM67J618B

MOTOROLA FAST SRAM

MCM67J618B

9

Motorola Memory Prefix
Part Number

ORDERING INFORMATION

(Order by Full Part Number)

MCM 67J618B XX X

Speed (5 = 5 ns, 7 = 7 ns)

Package (FN = PLCC)

Full Part Numbers — MCM67J618BFN5 MCM67J618BFN7

MCM67J618B
10

MOTOROLA FAST SRAM

P ACKAGE DIMENSIONS

FN PACKAGE

52–LEAD PLCC

CASE 778–02

0.007 (0.180) T L

B

–M

SNSM

-L­LEADS

ACTUAL

(NOTE 1)

52

Z

C

(NOTE 1)

52

0.010 (0.250) T L

G1

52

-N-

Y BRK

0.007 (0.180) T L

U

–M

SNSM

D

-M-

Z

W

1

V

A

0.007 (0.180) T L

R

0.007 (0.180) T L

E

G

-T-

J

VIEW S

D

0.004 (0.100)

SEATING
PLANE

–M

–M

X

VIEW D-D

SNSM

SNSM

G1

0.010 (0.250) T L

H

0.007 (0.180) T L

–M

–M

SNSS

SNSM

K1

K

F

0.007 (0.180) T L

–M

SNSM

VIEW S

SNSS

–M

NOTES:

1. DUE TO SPACE LIMITATION, CASE 778-02 SHALL BE
REPRESENTED BY A GENERAL (SMALLER) CASE
OUTLINE DRAWING RATHER THAN SHOWING ALL 52
LEADS.

2. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF
LEAD SHOULDER EXITS PLASTIC BODY AT MOLD
PARTING LINE.

3. DIM G1, TRUE POSITION TO BE MEASURED AT DATUM -T-,
SEATING PLANE.

4. DIM R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.

5. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M,

1982.

6. CONTROLLING DIMENSION: INCH.

7. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS
R AND U ARE DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD
FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE
TOP AND BOTTOM OF THE PLASTIC BODY.

8. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO
BE SMALLER THAN 0.025 (0.635).

INCHES MILLIMETERS

MIN MINMAX MAX

DIM

A

0.785

0.785

0.165

0.090

0.013

0.026

0.020

0.025

0.750

0.750

0.042

0.042

0.042
—

°

2

0.710

0.040

0.795

0.795

0.180

0.110

0.019

0.032
—
—

0.756

0.756

0.048

0.048

0.056

0.020

°

10

0.730
—

G1
K1

B
C
E
F
G
H

J
K
R
U
V
W
X
Y
Z

19.94

20.19

19.94

20.19

4.20

4.57

2.29

2.79

0.33

0.48

1.27 BSC0.050 BSC

0.66

0.81

0.51

—

0.64

—

19.05

19.20

19.05

19.20

1.07

1.21

1.07

1.21

1.07

1.42

—

0.50

°

2

18.04

1.02

°

10

18.54
—

Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty , representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “T ypical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
Opportunity/Affirmative Action Employer.

MOTOROLA FAST SRAM

MCM67J618B

11

How to reach us:

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INTERNET: http://Design–NET.com 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298

MCM67J618B
12

◊

MOTOROLA FAST SRAM

MCM67J618B/D

*MCM67J618B/D*